CN205752163U - The framework of diode (led) module - Google Patents
The framework of diode (led) module Download PDFInfo
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- CN205752163U CN205752163U CN201620644806.9U CN201620644806U CN205752163U CN 205752163 U CN205752163 U CN 205752163U CN 201620644806 U CN201620644806 U CN 201620644806U CN 205752163 U CN205752163 U CN 205752163U
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- framework
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Abstract
The framework of diode (led) module.Propose a kind of delicate structure, connective stability is good and reliability high so that diode (led) module entirety has the framework of the diode (led) module of bigger structural stress.Described diode (led) module includes framework, some chips, some wire jumpers and packaging body, and described framework includes some bodies；The surface of described body is provided with the square boss being connected as a single entity with body, and described chip fits on the end face of described square boss.This utility model provide an enhancing framework to be connected the square region of effect with packaging body by square projection in the surrounding that chip welds, chip can be positioned over during use the center of square projection, thus when product is stressed extruding, promote the adhesive capacity between packaging body and framework further, it is to avoid impact chip produced because of layering.
Description
Technical field
This utility model relates to diode (led) module field, and the structure particularly relating to its middle frame is improved.
Background technology
At present, diode (led) module is generally encapsulated by some base plates, some chips and some wire jumpers and forms, the N of its chips
Face and contacts baseplate, and make the two be relatively fixed after being encapsulated by black glue.Continuous increasing along with current photovoltaic module demand
Adding, photovoltaic industry is in the trend risen, and countries in the world demand sharply increases, therefore, to existing modular product
The optimization, the performance boost that are designed then are badly in need of carrying out important supplementing.Specifically, owing to module product volume is relatively big, interior
Portion's copper piece is more, how to make to design more rationally, makes it have more preferable structural stress and become those skilled in the art urgently
Solve the technical problem that.
Summary of the invention
This utility model is for problem above, it is proposed that a kind of delicate structure, connective stability be good and reliability height so that
Diode (led) module entirety has the framework of the diode (led) module of bigger structural stress.
The technical solution of the utility model is: described diode (led) module includes framework, some chips, some wire jumpers and envelope
Dress body, described framework includes some bodies；The surface of described body is provided with the square boss being connected as a single entity with body, described core
Sheet fits on the end face of described square boss.
The groove of a loop is offered on the end face of described square boss.
The cross section of described groove is in the shape of the letter V.
The cross section of described groove is dovetail-shape.
The end face of described square boss is in the arc surfaced upwards swelled.
This utility model provide an enhancing framework to be connected effect with packaging body by square projection in the surrounding that chip welds
The square region of fruit, can be positioned over chip the center of square projection, thus when product is stressed extruding, enter during use
One step promotes the adhesive capacity between packaging body and framework, it is to avoid the impact produced chip because of layering.This utility model from
Diode (led) module original internal performance it is effectively ensured on the whole, and has been effectively improved the application performance of diode (led) module, made
It has bigger structural stress.
Accompanying drawing explanation
Fig. 1 is the structural representation of this case,
Fig. 2 is the profile of square boss；
In figure, 1 is framework, and 10 is square boss, and 11 is groove, and 2 is chip.
Detailed description of the invention
Described diode (led) module includes framework 1, some chips 2, some wire jumpers and packaging body, if described framework 1 includes
Dry body；The surface of described body is provided with the square boss 10 being connected as a single entity with body, and described chip 2 fits in described square
On the end face of boss 10.
The groove 11 of a loop is offered on the end face of described square boss 10.So, can be simple by groove, effectively
The bond strength of each body of lifting and packaging body (the most black glue), thus under the requirement meeting original design, effectively
Add the adhesiveness between packaging body and framework, it is to avoid the problem of the layering caused because of framework or the deformation of copper material, greatly
Width improves the structural stress of chip.
Cross sectional shape below for groove carries out representative explanation with two kinds of embodiments:
One is: the cross section of described groove 11 is in the shape of the letter V.
It two is: the cross section of described groove 11 is dovetail-shape.
The end face of described square boss 10 is in the arc surfaced upwards swelled.So, after encapsulation, the design of arc surfaced
The elastic deformability coordinating body self will make to keep between chip with square projection the best, stable contacting, from
And it is effectively improved the overall structural stability of diode (led) module and product quality.
Claims (5)
1. the framework of diode (led) module, described diode (led) module includes framework, some chips, some wire jumpers and packaging body, institute
State framework and include some bodies；It is characterized in that, the surface of described body is provided with the square boss being connected as a single entity with body, institute
State chip to fit on the end face of described square boss.
The framework of diode (led) module the most according to claim 1, it is characterised in that offer on the end face of described square boss
There is the groove of a loop.
The framework of diode (led) module the most according to claim 2, it is characterised in that the cross section of described groove is in the shape of the letter V.
The framework of diode (led) module the most according to claim 2, it is characterised in that the cross section of described groove is dovetail-shape.
The framework of diode (led) module the most according to claim 1, it is characterised in that the end face of described square boss is in upwards
The arc surfaced of protuberance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620644806.9U CN205752163U (en) | 2016-06-24 | 2016-06-24 | The framework of diode (led) module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620644806.9U CN205752163U (en) | 2016-06-24 | 2016-06-24 | The framework of diode (led) module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205752163U true CN205752163U (en) | 2016-11-30 |
Family
ID=57381496
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620644806.9U Active CN205752163U (en) | 2016-06-24 | 2016-06-24 | The framework of diode (led) module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205752163U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111965520A (en) * | 2020-07-24 | 2020-11-20 | 武汉锐科光纤激光技术股份有限公司 | Chip testing equipment |
| CN111965519A (en) * | 2020-07-24 | 2020-11-20 | 武汉锐科光纤激光技术股份有限公司 | Chip testing equipment |
-
2016
- 2016-06-24 CN CN201620644806.9U patent/CN205752163U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111965520A (en) * | 2020-07-24 | 2020-11-20 | 武汉锐科光纤激光技术股份有限公司 | Chip testing equipment |
| CN111965519A (en) * | 2020-07-24 | 2020-11-20 | 武汉锐科光纤激光技术股份有限公司 | Chip testing equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |