CN209626213U - A kind of display screen paster LED bracket structure - Google Patents
A kind of display screen paster LED bracket structure Download PDFInfo
- Publication number
- CN209626213U CN209626213U CN201920383151.8U CN201920383151U CN209626213U CN 209626213 U CN209626213 U CN 209626213U CN 201920383151 U CN201920383151 U CN 201920383151U CN 209626213 U CN209626213 U CN 209626213U
- Authority
- CN
- China
- Prior art keywords
- metal base
- display screen
- functional areas
- bracket structure
- paster led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The utility model discloses a kind of display screen paster LED bracket structures, including rack body, metal base and plastic packaging bowl, metal base is set on the rack body, the metal base includes die bond functional areas, several recessed points are provided on the die bond functional areas, the recessed point being distributed on each die bond functional areas is arranged in array;The structure design of the utility model is reasonable, increases conductive silver glue contact surface Nian Jie with metallic substrate surface, is applied to display encapsulation, will substantially improve the risk of the red failure of display LED caused by conductive silver glue removing.
Description
Technical field
A kind of the utility model display screen paster LED bracket structure, belongs to LED support technical field.
Background technique
LED due to its long service life, small in size, high brightness, it is low in calories the advantages that be used widely in lighting area.
Classification mainly has imitative lumen type, patch type, integrated high-power type and four kinds of LAMP type.Existing LED generally includes to be installed with
Rack body, chip and the packaging plastic composition of metal electrode.
Current paster LED bracket be usually in crystal bonding area, crystal bonding area be typically all it is flat, to adhere on this bracket
One lens, lens bottom can only be fixed on the platform of crystal bonding area.The LED of the plastic stent insertion of existing LED patch shines
For device than shallower, the silica gel amount of injection is less, and will not design inner support and reinforce fixing, so illuminator is easy to fall off, influences
The whole service life of LED patch.
Utility model content
To solve the shortcomings of the prior art, the utility model discloses a kind of display screen paster LED bracket structure,
Reasonable in design, increase conductive silver glue contact surface Nian Jie with rack surface, is applied to display encapsulation, will substantially improve conductive silver
The risk of the red failure of display LED caused by glue removing.
The utility model is achieved through the following technical solutions:
A kind of display screen paster LED bracket structure, including rack body, metal base and plastic packaging bowl, the bracket
Metal base is set in main body, and the metal base includes die bond functional areas, is provided on the die bond functional areas several recessed
Point, each recessed point diameter are 0.01 ~ 0.08mm, and depth is 0.02 ~ 0.06mm, on each die bond functional areas
The recessed point quantity of distribution is 3-25, is arranged in array;
Primer is laid in die bond functional areas surface and recessed point;
LED chip is bonded on the primer.The primer is conductive silver glue.
Preferably, the metal base is copper, iron or its alloying metal sheet material.
Preferably, the metal base is with a thickness of 0.12 ~ 0.2mm.
The metal base further includes the conductive feet connecting with die bond functional areas.
Preferably, the recessed point shape is lower spill, including but not limited to regular circle shapes, triangle, quadrangle, five
Side shape or hexagon.
Preferably, backbone metal structure division encapsulating ambroin and form bowl, the ambroin include but
It is not limited to PPA or EMC material.
Preferably, the mode of the recessed point array arrangement is rectangular array or annular array.
The utility model has the following beneficial effects:
This implementation is novel to arrange recessed point on metallic support die bond functional areas, and the recessed point is equal in each unit
Have arrangement, carry out a conductive silver glue in the recessed area, be filled into conductive silver glue in recessed point, increase conductive silver glue with
Rack surface is bonded contact surface.Recessed point is set as different shape, to be suitble to use under different condition, the recessed fiber crops of polygon
Point can effectively increase the contact surface of conductive silver glue, and effectively fixed conductive silver glue is applied to display encapsulation, can substantially improve conduction
The risk of the red failure of display LED caused by elargol removing.
Detailed description of the invention
Fig. 1 is the utility model bracket finished figure;
Fig. 2 is the utility model bracket using sectional view;
Fig. 3 is functional areas implementation diagram;
Fig. 4 is the recessed point shape graph of the utility model bracket;
Fig. 5 is that the array of the recessed point of the utility model bracket arranges figure.
Fig. 6 is 1 bump location schematic diagram of the utility model embodiment.
In figure: 1 is rack body, and 2 be metal base, and 3 be die bond functional areas, and 4 be recessed point, and 5 be primer, and 6 be branch
PPA the or EMC plastic material of frame outer encapsulating, 7 be salient point, and 8 be conductive feet, and 9 be LED chip.
Specific embodiment
The utility model is described in further detail with attached drawing combined with specific embodiments below, but the utility model
Protection scope be not limited to these examples, it is all without departing substantially from the utility model design change or equivalent substitute be included in
Within the protection scope of the utility model.
Embodiment 1
This bracket uses PPA or EMC material, but is not limited to PPA and EMC material, can be other resinae insulating materials;
The backbone metal substrate is copper, iron or its alloying metal sheet material, thickness about 0.12-0.2mm, in punch forming
When die bond functional areas utilize the recessed point of mould punching, length and width dimensions 0.01-0.08mm, depth 0.02-0.06mm, recessed fiber crops
Point quantity 3-25 are lined up array;
Primer is laid in die bond functional areas surface and recessed point;LED chip is bonded on the primer.The primer is to lead
Electric elargol.
The recessed point shape is the recessed of the regular shapes such as recessed rectangle, triangle, circle, pentagon, hexagon
The cross section in hole, the recessed point is trapezoidal, inverted trapezoidal, but is not limited to above several shapes, as long as in die bond functional areas
The concave shape of production array arrangement belongs to protection scope;
Transverse groove or salient point can also be arranged in the recessed point side wall, it is therefore intended that increase the knot of primer and recessed point
With joint efforts, the transverse groove is one or more, and the salient point is multiple.As shown in Figure 6.
The recessed point is arranged as array arrangement, and array manner is rectangular array, annular array, linear array or interlocks
Array, but above several array arrangements are not limited to, all concave shape arrangements for making 1 or more in die bond functional areas are equal
Belong to protection scope.
It after the backbone metal substrate punches recessed point first, then completes functional areas punching, stretch, be then electroplated,
Form bracket material.Injection step is carried out again, forms the encapsulating of plastic packaging bowl, is finally carried out pin bending and is formed bracket finished product;
Embodiment 2
For all-colour LED bracket, using copper, iron or its alloying metal substrate, using the recessed point of punching press, punching function
Area, stretches the processes such as step, plating, injection molding, pin bending at punching pin, and Surface Mount all-colour LED bracket is made.
It is critical that in advance in several recessed points of chip die bond functional areas punching press of full-color metal base, point
Functional areas punching is carried out after the completion of punching press again.In metal base punching press, is used in die bond functional areas and stamp out the recessed fiber crops of array
Then point is produced according still further to normal bracket production process.
When producing all-colour LED, the recessed point region of primer filling die bond functional areas simultaneously stacks certain altitude, and primer is solid
Surely be adhesively fixed LED chip.Increase the bonded area of primer and metallic support using the primer filled in recessed point, and increases
Binding force.As shown in figure 3, being filled into the signal after recessed point for primer.
Recessed point shape is in the regular shape such as rectangle, circle, triangle, quadrangle, pentagon, hexagon as shown in Figure 4
Shape;
The plastic materials such as rack body outer encapsulating PPA or EMC, as shown in Figure 1.
Realizing route:
Using sheet metals such as copper material or iron materials as metal base, thickness about 0.12-0.2mm is rushed using stamping die
The recessed point in die bond functional areas out, point length and width dimensions about 0.01-0.08mm, depth about 0.02-0.06mm, recessed point quantity
About 3-25 are lined up array, recessed point shape rounded, triangle, quadrangle, pentagon, hexagon isotactic as shown in Figure 4
Then shape, but above several shapes are not limited to, the arrangement of recessed point is in rectangle or annular array;Be punched again each functional areas and
Pin and carry out stretch form bracket material;Bracket material is subjected to plate surface processing again, then using the modeling such as PPA or EMC
Glue material is encapsulated to form bowl, finally carries out pin bending and forms bracket finished product.
The utility model is not limited by embodiment illustrated herein, and is to fit to and principles disclosed herein and new
The consistent widest range of newness feature.
Claims (7)
1. a kind of display screen paster LED bracket structure, including rack body, metal base and plastic packaging bowl, which is characterized in that
Metal base is set on the rack body, and the metal base includes die bond functional areas, is provided on the die bond functional areas
Several recessed points, each recessed point diameter are 0.01 ~ 0.08mm, and depth is 0.02 ~ 0.06mm, each die bond
The recessed point quantity being distributed on functional areas is 3-25, is arranged in array.
2. a kind of display screen paster LED bracket structure according to claim 1, which is characterized in that the metal base
For copper, iron or its alloying metal sheet material.
3. a kind of display screen paster LED bracket structure according to claim 1, which is characterized in that the metal base
With a thickness of 0.12 ~ 0.2mm.
4. a kind of display screen paster LED bracket structure according to claim 1, which is characterized in that the recessed point
Shape is lower spill, including but not limited to regular circle shapes, triangle, quadrangle, pentagon or hexagon.
5. a kind of display screen paster LED bracket structure according to claim 1, which is characterized in that the metal base
Encapsulating ambroin simultaneously forms bowl, and the ambroin includes but is not limited to PPA or EMC material.
6. a kind of display screen paster LED bracket structure according to claim 1, which is characterized in that the recessed point
The mode of array arrangement is rectangular array or annular array.
7. a kind of display screen paster LED bracket structure according to claim 1, which is characterized in that the metal base
It further include the conductive feet being connect with die bond functional areas.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201920383151.8U CN209626213U (en) | 2019-03-25 | 2019-03-25 | A kind of display screen paster LED bracket structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201920383151.8U CN209626213U (en) | 2019-03-25 | 2019-03-25 | A kind of display screen paster LED bracket structure |
Publications (1)
Publication Number | Publication Date |
---|---|
CN209626213U true CN209626213U (en) | 2019-11-12 |
Family
ID=68457816
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201920383151.8U Active CN209626213U (en) | 2019-03-25 | 2019-03-25 | A kind of display screen paster LED bracket structure |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN209626213U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112216780A (en) * | 2020-10-13 | 2021-01-12 | 深圳市中顺半导体照明有限公司 | Processing method of reinforced LED bracket |
-
2019
- 2019-03-25 CN CN201920383151.8U patent/CN209626213U/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112216780A (en) * | 2020-10-13 | 2021-01-12 | 深圳市中顺半导体照明有限公司 | Processing method of reinforced LED bracket |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2020502779A (en) | QFN surface mount type RGB-LED package module and method of manufacturing the same | |
CN106972094A (en) | A kind of integral LED band light source support and preparation method | |
WO2008138183A1 (en) | Side emission type led | |
CN101207170A (en) | LED lead frame and method for manufacturing LED using the lead frame | |
CN102738366A (en) | Light emitting diode (LED) support for surface mounting, manufacturing method and LED lamp | |
CN209626213U (en) | A kind of display screen paster LED bracket structure | |
CN204966534U (en) | High -power LED support | |
CN202736970U (en) | LED support for surface mounting and LED lamp | |
CN201780991U (en) | One-piece formed encapsulating structure for LED nixietube | |
CN103531671A (en) | Production process of light-emitting diode and light-emitting diode | |
CN209133532U (en) | LED encapsulation module | |
CN109037183A (en) | A kind of semiconductor chip packaging array and semiconductor chip packaging device | |
CN205752163U (en) | The framework of diode (led) module | |
CN205004351U (en) | LED support and LED packaging structure | |
CN103038878B (en) | Improve diode bag and the manufacture method thereof of lead-in wire | |
CN103594604A (en) | LED support with electrodes being fully wrapped and packaged, SMD LED lamp and manufacturing method thereof | |
CN205488205U (en) | Piece formula support, piece formula device array and piece formula device | |
CN212695170U (en) | Support structure for preventing silver colloid from peeling off | |
CN208580767U (en) | A kind of high intensity LED lamp holder | |
CN204375733U (en) | A kind of Double-lead-frame | |
CN207909863U (en) | A kind of package module of pin crimping | |
CN204216070U (en) | Electrode is by the LED support of full wrapping and encapsulating and patch-type LED | |
CN103594602A (en) | SMD-LED support with insulating material pasted, SMD-LED with insulating material pasted, and manufacturing methods of SMD-LED support with insulating material and SMD-LED with insulating material pasted | |
CN201927634U (en) | Surface-mounted LED for decorative lamp | |
CN101303980B (en) | Surface adhesion type diode support and method for manufacturing the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |