CN112216780A - Processing method of reinforced LED bracket - Google Patents
Processing method of reinforced LED bracket Download PDFInfo
- Publication number
- CN112216780A CN112216780A CN202011089231.6A CN202011089231A CN112216780A CN 112216780 A CN112216780 A CN 112216780A CN 202011089231 A CN202011089231 A CN 202011089231A CN 112216780 A CN112216780 A CN 112216780A
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- CN
- China
- Prior art keywords
- metal
- support
- led
- reinforced
- processing method
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Abstract
The invention discloses a processing method of a reinforced LED bracket, and relates to the technical field of LEDs. The method comprises the following steps: the die bonding pad is formed by punching a die-bonding support in a metal material belt mode, then the extending metal on the edge of the pad is bent and shaped at a certain angle through a shaping die, after a plating layer is formed, the extending metal is wrapped in a plastic body, and the strength of the whole frame is enhanced by the extending metal to form the reinforced LED support. According to the invention, the process circuit is added in the original LED support processing process, so that the external force resistance intensity of the manufactured LED support is increased, and the structural intensity of the LED lamp bead is enhanced.
Description
Technical Field
The invention relates to the technical field of LEDs, in particular to a processing method of a reinforced LED bracket.
Background
At present, most of the existing patch type LED supports are formed on a lead frame by injection molding. Because the thickness and the size of the current LED lamp bead are smaller and smaller, the LED support is made smaller and smaller, the mechanical strength of the LED support is not enough, the plastic body is prone to being cracked in a dark mode when the LED support is stressed in the production process, and the broken surface mounted LED is prone to being dead if the LED support is deformed in the using process. The common method in the market is to increase the thickness of the plastic body in the gap of the welding pad to strengthen the strength of the bracket, firstly, the welding of the LED lamp bead packaging lead is obstructed, and the strengthening effect of the bracket is weak.
In summary, the invention designs a processing method of a reinforced LED bracket.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a processing method of a reinforced LED support, wherein a process line is added in the original processing process of the LED support, so that the external force resistance intensity of the manufactured LED support is increased, and the structural strength of an LED lamp bead is enhanced.
In order to achieve the purpose, the invention is realized by the following technical scheme: a processing method of a reinforced LED bracket comprises the following steps: the die bonding pad is formed by punching a die-bonding support in a metal material belt mode, then the extending metal on the edge of the pad is bent and shaped at a certain angle through a shaping die, after a plating layer is formed, the extending metal is wrapped in a plastic body, and the strength of the whole frame is enhanced by the extending metal to form the reinforced LED support.
Preferably, the metal material belt is formed by punching and molding a copper material belt.
Preferably, the shaping mold is an extension metal bending shaping mold at the edge of the bonding pad, and the bending angle is set according to actual requirements. The extension metal can be hidden in the plastic body of the original LED support structure.
Preferably, the plating layer adopts a metal plating process of electrolytic plating or chemical plating, and the plating material is silver or silver nickelate.
Preferably, the extending metal is wrapped in the plastic body by injection molding through an LED bracket appearance mold, the pad extending metal is contained in the bracket plastic body, the appearance of the bracket is the same as that of a conventional bracket, an original injection mold is not changed, and the injection molded plastic is PPA, PCT, UP or EMC plastic for the LED bracket.
Preferably, the reinforced LED support is a pin for dividing each support to form an independent LED support.
The invention has the beneficial effects that: the process line for wrapping the extending metal in the plastic body is added in the original LED bracket processing process, so that the external force resistance strength of the manufactured LED bracket is enhanced.
Drawings
The invention is described in detail below with reference to the drawings and the detailed description;
FIG. 1 is a partial front view of an LED support of the present invention;
FIG. 2 is a front view of the cradle unit of the present invention;
FIG. 3 is a right side elevational view of the cradle of the present invention being greatly warmed;
FIG. 4 is a front view of an LED support punch-formed die bond pad of the present invention;
FIG. 5 is a right side view of an LED support punch formed die bond pad of the present invention;
FIG. 6 is a front view of an extended metal bend pattern of the edge of the pad of the LED support of the present invention;
FIG. 7 is a right side view of the extended metal bend pattern of the LED support pad edge of the present invention;
FIG. 8 is a front view of an injection molded LED support of the present invention;
FIG. 9 is a right side view of an injection molded LED support of the present invention;
fig. 10 is a finished outline view of a single LED mount of the present invention.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
Referring to fig. 1 to 10, the following technical solutions are adopted in the present embodiment: a processing method of a reinforced LED bracket comprises the following steps: the die bonding pad is formed by punching a die-bonding support in a metal material belt mode, then the extending metal on the edge of the pad is bent and shaped at a certain angle through a shaping die, after a plating layer is formed, the extending metal is wrapped in a plastic body, and the strength of the whole frame is enhanced by the extending metal to form the reinforced LED support.
It is worth noting that the metal material belt is formed by punching the copper material belt, and the parts of the extension metal are designed and reserved at the two sides of the bonding pad.
It is worth noting that the shaping mold is an extending metal bending shaping mold at the edge of the bonding pad, and the bending angle is set according to actual requirements. The extension metal can be hidden in the plastic body of the original LED support structure.
It is noted that the plating layer adopts a metal plating process of electrolytic plating or chemical plating, and the plating material is silver or silver nickelate.
It is worth noting that the extending metal is wrapped in the plastic body by adopting an LED bracket appearance mold for injection molding, the pad extending metal is contained in the bracket plastic body, the appearance of the bracket is the same as that of a conventional bracket, the original injection mold is not changed, and the injection molded plastic is one of PPA, PCT, UP and EMC plastic for the LED bracket.
In addition, the reinforced LED support is a pin for dividing each support to form an independent LED support.
The technical structure of the specific embodiment is reasonable in design, and the appearance of the processed reinforced LED support is the same as that of a common LED support. The LED device produced based on the LED support has stronger mechanical stamping resistance, and is not easy to break and die due to stress deformation.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. A processing method of a reinforced LED bracket is characterized by comprising the following steps: the die bonding pad is formed by punching a die-bonding support in a metal material belt mode, then the extending metal on the edge of the pad is bent and shaped at a certain angle through a shaping die, after a plating layer is formed, the extending metal is wrapped in a plastic body, and the strength of the whole frame is enhanced by the extending metal to form the reinforced LED support.
2. The reinforced LED bracket processing method according to claim 1, wherein the metal material belt is formed by stamping a copper material belt.
3. The processing method of the reinforced LED bracket of claim 1, wherein the shaping mold is an extended metal bending shaping mold for the edge of the bonding pad, and the bending angle is set according to actual requirements.
4. The processing method of the reinforced LED bracket according to claim 1, wherein the plating layer is a metal plating process of electrolytic plating or chemical plating, and the plating material is silver or silver-nickel plating.
5. The method as claimed in claim 1, wherein the step of encapsulating the metal extensions in the plastic body is performed by injection molding using an LED support profile mold, the metal extensions of the bonding pads are contained in the plastic body of the support, and the injection molded plastic is one of PPA, PCT, UP, and EMC.
6. The method of claim 1, wherein the reinforced LED support is a pin that divides each support to form an independent LED support.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011089231.6A CN112216780A (en) | 2020-10-13 | 2020-10-13 | Processing method of reinforced LED bracket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011089231.6A CN112216780A (en) | 2020-10-13 | 2020-10-13 | Processing method of reinforced LED bracket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112216780A true CN112216780A (en) | 2021-01-12 |
Family
ID=74054554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011089231.6A Pending CN112216780A (en) | 2020-10-13 | 2020-10-13 | Processing method of reinforced LED bracket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112216780A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102456828A (en) * | 2010-10-26 | 2012-05-16 | 钰桥半导体股份有限公司 | Heat spreader with bump/base and semiconductor chip assembly |
| CN108231977A (en) * | 2018-01-09 | 2018-06-29 | 东莞智昊光电科技有限公司 | LED support and its manufacturing method |
| CN208240715U (en) * | 2018-03-30 | 2018-12-14 | 东莞市良友五金制品有限公司 | A kind of waterproof side light source LED support |
| CN209626213U (en) * | 2019-03-25 | 2019-11-12 | 山西高科华兴电子科技有限公司 | A kind of display screen paster LED bracket structure |
| CN210110831U (en) * | 2019-07-10 | 2020-02-21 | 深圳市明华光电有限公司 | Device for protecting wafer LED |
| CN111092144A (en) * | 2018-10-24 | 2020-05-01 | 铜陵国展电子有限公司 | LED bracket with welding leg at cup opening and manufacturing method thereof |
| CN111584701A (en) * | 2020-04-16 | 2020-08-25 | 慧明光电(深圳)有限公司 | Novel LED lamp bead packaging method |
-
2020
- 2020-10-13 CN CN202011089231.6A patent/CN112216780A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102456828A (en) * | 2010-10-26 | 2012-05-16 | 钰桥半导体股份有限公司 | Heat spreader with bump/base and semiconductor chip assembly |
| CN108231977A (en) * | 2018-01-09 | 2018-06-29 | 东莞智昊光电科技有限公司 | LED support and its manufacturing method |
| CN208240715U (en) * | 2018-03-30 | 2018-12-14 | 东莞市良友五金制品有限公司 | A kind of waterproof side light source LED support |
| CN111092144A (en) * | 2018-10-24 | 2020-05-01 | 铜陵国展电子有限公司 | LED bracket with welding leg at cup opening and manufacturing method thereof |
| CN209626213U (en) * | 2019-03-25 | 2019-11-12 | 山西高科华兴电子科技有限公司 | A kind of display screen paster LED bracket structure |
| CN210110831U (en) * | 2019-07-10 | 2020-02-21 | 深圳市明华光电有限公司 | Device for protecting wafer LED |
| CN111584701A (en) * | 2020-04-16 | 2020-08-25 | 慧明光电(深圳)有限公司 | Novel LED lamp bead packaging method |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210112 |