CN108231977A - LED support and its manufacturing method - Google Patents
LED support and its manufacturing method Download PDFInfo
- Publication number
- CN108231977A CN108231977A CN201810019585.XA CN201810019585A CN108231977A CN 108231977 A CN108231977 A CN 108231977A CN 201810019585 A CN201810019585 A CN 201810019585A CN 108231977 A CN108231977 A CN 108231977A
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- Prior art keywords
- terminal
- section
- die bond
- bond portion
- electrical connection
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 238000003466 welding Methods 0.000 claims abstract description 36
- 238000005452 bending Methods 0.000 claims description 44
- 239000000919 ceramic Substances 0.000 claims description 32
- 239000002184 metal Substances 0.000 claims description 24
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 239000011265 semifinished product Substances 0.000 claims description 22
- 238000009413 insulation Methods 0.000 claims description 11
- 239000000047 product Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 3
- 150000002739 metals Chemical class 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 13
- 230000017525 heat dissipation Effects 0.000 abstract description 10
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 11
- 238000001746 injection moulding Methods 0.000 description 9
- 239000000084 colloidal system Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The present invention relates to a kind of LED support, including：The insulating body of terminal group and connecting pin subgroup.Terminal group includes：The first terminal and Second terminal being arranged in pairs；First terminal includes：Die bond portion and at least three first welding disks；Die bond portion is used to install LED chip and is electrically connected wherein one end of LED chip；Second terminal includes：Electrical connection section and the second welding disk；Electrical connection section is used to be electrically connected the other end of LED chip；Insulating body is by being molded in terminal group；The top of insulating body is equipped with the accommodating cavity for accommodating LED chip；Die bond portion and electrical connection section all extend to the bottom of accommodating cavity.Meanwhile provide a kind of manufacturing method for the LED support.Beneficial effects of the present invention are：So that LED chip is installed concentratedly on a terminal wherein, and sets at least three welding disks to radiate, increase the heat dissipation area of LED support, improving radiating effect reduces the brightness decay of LED.
Description
Technical field
The present invention relates to LED light source technical field, more particularly to a kind of LED support and its manufacturing method.
Background technology
LED light source is current more one of light source type of mainstream.And LED chip is when in use, usually mounted on LED
On stent.Because heat dissipation area is small, the heat that LED chip is sent out is more difficult to be conducted traditional LED support, leads to LED chip
On colloid turn yellow due to heat radiation so that the brightness decay of LED.
Invention content
Based on this, the present invention provides a kind of LED support, and LED chip is installed concentratedly on a terminal wherein, and
And at least three welding disks of setting radiate, and increase the heat dissipation area of LED support, improving radiating effect reduces the brightness of LED
Attenuation.
A kind of LED support, including：
Terminal group；Terminal group includes：The first terminal and Second terminal being arranged in pairs；First terminal includes：Die bond portion and
At least three connect first welding disk in die bond portion respectively；Die bond portion be used for install LED chip and be electrically connected LED chip its
Middle one end；Each first welding disk includes：First pad section of the first bending section of the first bending section and connection；First bending section
The periphery in one end connection die bond portion, the other end of the first bending section connect the first pad section；First pad section is parallel with die bond portion；
Second terminal includes：Second welding disk of electrical connection section and connection electrical connection section；Electrical connection section is used to be electrically connected the another of LED chip
One end；Second welding disk includes：Second pad section of the second bending section of the second bending section and connection；One end of second bending section connects
The periphery of electrical connection section is connect, the other end of the second bending section connects the second pad section；Second pad section is parallel with electrical connection section；With
And
The insulating body of connecting pin subgroup；Insulating body is by being molded in terminal group；It is set at the top of insulating body
It is useful for the accommodating cavity of receiving LED chip；Die bond portion and electrical connection section all extend to the bottom of accommodating cavity；First bending section and
Two bending sections are wrapped in insulating body；First pad section and the second pad section all extend to the bottom surface of insulating body.
Above-mentioned LED support, for insulating body by being molded in terminal group, terminal group includes be arranged in pairs first
Terminal and Second terminal, wherein, first terminal is used to install LED chip and is electrically connected one end of LED chip, and Second terminal is used
In the electrical connection of the other end of LED chip.In use, LED chip is all in the die bond portion of first terminal, and die bond portion
At least three first welding disks are connected, the heat that LED chip generates when working is transmitted to the first all pads by die bond portion
In portion, meanwhile, first terminal is also electrically connected with wherein one end of LED chip, to be connected to power supply.Second terminal is then electrically connected
The other end of LED chip plays conductive effect.Pass through above-mentioned design so that LED chip installs a terminal wherein concentratedly
On, and at least three welding disks is set to radiate, increase the heat dissipation area of LED support, improving radiating effect reduces LED
Brightness decay.
The first pad portion is the first pad group and the second pad group in one of the embodiments,；First pad group
First pad section extends from outside to inside；First pad section of the second pad group extends from inside to outside；Second pad section is from outside to inside
Extension.The pad of different directions is set so that the posture mutually held tightly is formed between terminal group and insulating body, is conducive to be promoted
Resultant force is grabbed between terminal group and insulating body.
Die bond portion and/or electrical connection section are equipped with through-hole in one of the embodiments,.In injection molding, insulating body
The connection strap being threaded through on the through-hole is formed in through hole, is promoted and grabs resultant force between insulating body and terminal group.
Die bond portion and/or electrical connection section are equipped with blind hole in one of the embodiments,.In injection molding, insulating body
It is formed at blind hole and stretches into the card column in the blind hole, promoted and grab resultant force between insulating body and terminal group.
The first bending section and the second bending section are equipped with through-hole in one of the embodiments,.In injection molding, insulation master
Body forms the connection strap being threaded through on the through-hole in through hole, is promoted and grabs resultant force between insulating body and terminal group.
The LED support further includes in one of the embodiments,：The insulating ceramic film being embedded on plastic body；Insulation pottery
One end of tile extends to the outer surface of insulating body；The other end of insulating ceramic film extends to the inside of insulating body and company
Meet die bond portion.When LED chip works, heat in die bond portion can be for delivery on insulating ceramic film and being dispersed into insulating body
Outside, improving radiating effect.
Die bond portion offers the card slot for connecting insulating ceramic film in one of the embodiments,；Insulating ceramic film is set
There is the Plug Division of matching card slot.It is connected by the way of clamping between die bond portion and insulating ceramic film, assembling mode is easy to be fast
It is prompt.
Meanwhile also provide a kind of manufacturing method for the LED support.
A kind of LED support manufacturing method, including step：
First sheet metal and the second sheet metal are provided, wherein, the area of the first sheet metal is more than the area of the second sheet metal；
Respectively to the first sheet metal and the second sheet metal is punched out and bending process, respectively obtain the half of first terminal into
The semi-finished product of product and Second terminal；Wherein, the semi-finished product of first terminal include：Die bond portion and at least three is vertically connected on die bond
First extension of the periphery in portion；Die bond portion is used to install LED chip and is electrically connected one end of LED chip；The half of Second terminal
Finished product includes：Second extension of electrical connection section and at least one periphery for being vertically connected on electrical connection section；Electrical connection section is used for
It is electrically connected the other end of LED chip；
The semi-finished product of the semi-finished product of first terminal and Second terminal are put into mold be molded encapsulated processing with into
Type goes out insulating body；Wherein, when being molded encapsulated, the end of the end of the first extension and the second extension is extended into insulation
The bottom surface of main body；
The end of first extension and the end of the second extension are subjected to bending, obtain LED support finished product.
Above-mentioned LED support manufacturing method, manufactured LED support out include terminal group and insulating body, insulation
For main body by being molded in terminal group, terminal group includes the first terminal being arranged in pairs and Second terminal, wherein, first end
Son is for installing LED chip and being electrically connected one end of LED chip, and Second terminal is for the electrical connection of the other end of LED chip.
In use, LED chip is all in the die bond portion of first terminal, and die bond portion connects at least three first welding disks, LED
The heat generated during chip operation is transmitted to by die bond portion on the first all welding disks, meanwhile, first terminal also with LED core
Wherein one end electrical connection of piece, to be connected to power supply.Second terminal is then electrically connected the other end of LED chip, plays conductive work
With.Pass through above-mentioned design so that LED chip is installed concentratedly on a terminal wherein, and set at least three welding disks into
Row heat dissipation, increases the heat dissipation area of LED support, and improving radiating effect reduces the brightness decay of LED.
In one of the embodiments, when the first sheet metal and the second sheet metal are punched out processing, in die bond portion and
Through-hole is punched on electrical connection section.In injection molding, insulating body forms the connection strap being threaded through on the through-hole in through hole,
It is promoted and grabs resultant force between insulating body and terminal group.
Several insulating ceramic films are provided in one of the embodiments, and one end of insulating ceramic film is extended internally
And it is connected in die bond portion；The semi-finished product of insulating ceramic film, the semi-finished product of first terminal, Second terminal are put into mould together
It carries out being molded encapsulated processing in tool；The other end of insulating ceramic film is extended down to the outer surface of insulating body outward.It works in LED chip
When, heat in die bond portion can be for delivery on insulating ceramic film and being dispersed into the outside of plastic body, improving radiating effect.
Description of the drawings
Fig. 1 is a kind of schematic diagram one of the LED support of embodiment of the present invention；
Fig. 2 is the schematic diagram two of LED support shown in FIG. 1；
Fig. 3 is the schematic diagram three of LED support shown in FIG. 1；
Fig. 4 is the half-section diagram of LED support shown in FIG. 1；
Fig. 5 is the decomposition diagram of LED support shown in FIG. 1；
Fig. 6 is the schematic diagram of the terminal group in LED support shown in fig. 5；
Fig. 7 is the schematic diagram at another visual angle of terminal group shown in fig. 6；
Fig. 8 is the schematic diagram of the insulating body in LED support shown in fig. 5；
Fig. 9 is the schematic diagram at another visual angle of insulating body shown in Fig. 8；
Figure 10 is insulating body shown in Fig. 9 along the sectional view crossed by line A-A；
Figure 11 is insulating body shown in Fig. 9 along the sectional view crossed by line B-B；
Figure 12 is the schematic diagram of the LED support of another embodiment of the present invention.
The meaning of each label is in attached drawing：
(100,100a)-LED support；
10- terminal groups, 11- first terminals, 12- Second terminals, 13- die bonds portion, the first welding disks of 14-, the first bendings of 15-
Section, 16- the first pad sections, 17- electrical connection sections, the second welding disks of 18-, the second bending sections of 19-, 110- the second pad sections；
20- insulating bodies, 21- accommodating cavities；
30- insulating ceramic films.
Specific embodiment
For the ease of understanding the present invention, the present invention is described more fully below with reference to relevant drawings.In attached drawing
Give presently preferred embodiments of the present invention.But the present invention can realize in many different forms, however it is not limited to this paper institutes
The embodiment of description.On the contrary, the purpose for providing these embodiments is to make the understanding to the disclosure more thorough
Comprehensively.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.
Unless otherwise defined, all of technologies and scientific terms used here by the article is with belonging to technical field of the invention
The normally understood meaning of technical staff is identical.Term used in the description of the invention herein is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.
It is a kind of schematic diagram of LED support 100 of the present embodiment referring to Fig. 1 to Figure 11.
As shown in Figures 1 to 5, which includes：The insulating body 20 of terminal group 10 and connecting pin subgroup 10.
As shown in Figure 6 and Figure 7, terminal group 10 includes：The first terminal 11 and Second terminal 12 being arranged in pairs.
First terminal 11 includes：Die bond portion 13 and at least three connects first welding disk 14 in die bond portion 13 (at this respectively
In embodiment, the quantity of the first welding disk 14 is four, and in other embodiments, the quantity of the first welding disk 14 can also be three
It is a, five, six or it is more).Die bond portion 13 is used to install LED chip and is electrically connected wherein one end of LED chip.Each
First welding disk 14 includes：First pad section 16 of the first bending section 15 of the first bending section 15 and connection.First bending section 15
The periphery in one end connection die bond portion 13, the other end of the first bending section 15 connect the first pad section 16.First pad section 16 is with consolidating
Brilliant portion 13 is parallel.
Second terminal 12 includes：Second welding disk 18 of electrical connection section 17 and connection electrical connection section 17 is (in the present embodiment,
The quantity of second welding disk 18 is two, in other embodiments, the quantity of the second welding disk 18 can also be one, three or
Person is more).Electrical connection section 17 is used to be electrically connected the other end of LED chip.Second welding disk 18 includes：Second bending section 19 and company
Connect the second pad section 110 of the second bending section 19.The periphery of one end connection electrical connection section 17 of second bending section 19, the second bending
The other end of section 19 connects the second pad section 110.Second pad section 110 is parallel with electrical connection section 17.
As shown in Figs. 8 to 11, in the present embodiment, which is insulated plastic colloid, in other embodiments,
Can also be composite material, such as insulated plastic powder and the mixture injection molding of insulating ceramics powder obtain.Insulating body
20 top is equipped with the accommodating cavity 21 for accommodating LED chip, which is cupulate bowl shape structure setting.Die bond portion 13 and electricity
Connecting portion 17 all extends to the bottom of accommodating cavity 21, and in being originally embodiment, die bond portion 13 extends to the area in accommodating cavity 21
The area in accommodating cavity 21 is extended to more than electrical connection section 17.First bending section 15 and the second bending section 19 are wrapped in insulation master
In body 20.First pad section 16 and the second pad section 110 all extend to the bottom surface of insulating body 20.
In addition, in the present embodiment, terminal group 10 can also be improved, to enhance terminal group 10 and insulating body 20
Between stable connection.
For example, the first welding disk 14 divides for the first pad group and the second pad group.First pad section 16 of the first pad group
Extend from outside to inside.First pad section 16 of the second pad group extends from inside to outside.Second pad section 110 extends from outside to inside.
The pad of different directions is set so that the posture mutually held tightly is formed between terminal group 10 and insulating body 20, is conducive to be promoted
Resultant force is grabbed between terminal group 10 and insulating body 20.
For example, die bond portion 13 and/or electrical connection section 17 are equipped with through-hole.In injection molding, insulating body 20 is in through hole
The connection strap being threaded through on the through-hole is formed, is promoted and grabs resultant force between insulating body 20 and terminal group 10.
For example, die bond portion 13 and/or electrical connection section 17 are equipped with blind hole.In injection molding, insulating body 20 is at blind hole
The card column in the blind hole is stretched into formation, is promoted and grabs resultant force between insulating body 20 and terminal group 10.
For example, the first bending section 15 and the second bending section 19 are equipped with through-hole.In injection molding, insulating body 20 is in through-hole
Place forms the connection strap being threaded through on the through-hole, is promoted and grabs resultant force between insulating body 20 and terminal group 10.
In another example in other embodiments, first terminal 11 can be set using copper sheet, then on first terminal 11
The groove of line style is opened up, which extends to since die bond portion 13 on each first welding disk 14, and is filled out in the groove
Conductivity and the preferable material of thermal conductivity, such as gold or silver are filled, conductivity higher circuit is formed after these material solidifications, is had
Conducive to the electric conductivity and heat dissipation performance for promoting first terminal 11.
Above-mentioned LED support 100, by being molded in terminal group 10, terminal group 10 includes pairs of insulating body 20
The first terminal 11 of setting and Second terminal 12, wherein, first terminal 11 is used to install LED chip and is electrically connected LED chip
One end, and Second terminal 12 is for the electrical connection of the other end of LED chip.In use, LED chip is all mounted on first terminal
In 11 die bond portion 13, and die bond portion 13 connects at least three first welding disks 14, and the heat that LED chip generates when working passes through
Die bond portion 13 is transmitted on the first all welding disks 14, meanwhile, first terminal 11 is also electrically connected with wherein one end of LED chip
It connects, to be connected to power supply.Second terminal 12 is then electrically connected the other end of LED chip, plays conductive effect.It is set by above-mentioned
Meter so that LED chip is installed concentratedly on a terminal wherein, and at least three welding disks is set to be radiated (each
Welding disk all constitutes a heat dissipation channel), the heat dissipation area of increase LED support 100, improving radiating effect reduces the bright of LED
Degree attenuation.
In addition, in other embodiments, LED support 100 can also be improved with improving radiating effect, for example, such as
Shown in Figure 12, LED support 100a further includes the insulating ceramic film 30 being embedded on insulating body 20.The one of insulating ceramic film 30
End extends to the outer surface of insulating body 20, and (in the present embodiment, one end of insulating ceramic film 30 is pierced by insulating body 20
It behind outer surface, is looped around on the outer surface of insulating body 20 with increasing heat radiation area).The other end of insulating ceramic film 30 extends to
The inside of plastic body and connect die bond portion 13.When LED chip works, the heat in die bond portion 13 can make pottery for delivery to insulation
On tile 30 and it is dispersed into the outside of insulating body 20, improving radiating effect.
Further, die bond portion 13 can also offer the card slot for connecting insulating ceramic film 30.Insulating ceramic film 30
Plug Division equipped with matching card slot.It is connected by the way of clamping between die bond portion 13 and insulating ceramic film 30, assembling mode
It is simple and efficient.
Further, the fin protruded out outwardly can also be set on insulating ceramic film 30, which is distributed in insulation
Potsherd 30 extends to one end of the outer surface of plastic body.
Meanwhile also provide a kind of manufacturing method for above-mentioned LED support 100.
The LED support manufacturing method includes step：
S10：First sheet metal and the second sheet metal are provided, wherein, the area of the first sheet metal is more than the second sheet metal
Area.
S20：Respectively to the first sheet metal and the second sheet metal is punched out and bending process, first terminal 11 is respectively obtained
Semi-finished product and Second terminal 12 semi-finished product.Wherein, the semi-finished product of first terminal 11 include：It hangs down in die bond portion 13 and at least three
First extension of the direct-connected periphery for being connected on die bond portion 13.Die bond portion 13 is used to install the one of LED chip and electrical connection LED chip
End.The semi-finished product of Second terminal 12 include：The of electrical connection section 17 and at least one periphery for being vertically connected on electrical connection section 17
Two extensions.Electrical connection section 17 is used to be electrically connected the other end of LED chip.
S30：The semi-finished product of the semi-finished product of first terminal 11 and Second terminal 12 are put into mold be molded it is encapsulated
It handles to mold insulating body 20.Wherein, when being molded encapsulated, by the end of the first extension and the end of the second extension
Extend to the bottom surface of insulating body 20.
S40：The end of first extension and the end of the second extension are subjected to bending, obtain 100 finished product of LED support.
Above-mentioned LED support manufacturing method, manufactured LED support 100 out include terminal group 10 and insulating body 20,
For its insulating body 20 by being molded in terminal group 10, terminal group 10 includes the first terminal 11 being arranged in pairs and second end
Son 12, wherein, first terminal 11 is used to install LED chip and is electrically connected one end of LED chip, and Second terminal 12 is used for LED
The electrical connection of the other end of chip.In use, LED chip is all in the die bond portion 13 of first terminal 11, and die bond portion
13 at least three first welding disks 14 of connection, the heat that generates is transmitted to all the by die bond portion 13 when LED chip works
On one welding disk 14, meanwhile, first terminal 11 is also electrically connected with wherein one end of LED chip, to be connected to power supply.Second terminal
12 other ends for being electrically connected LED chip play conductive effect.Pass through above-mentioned design so that LED chip is installed concentratedly at it
In on a terminal, and at least three welding disks is set to radiate, increases the heat dissipation area of LED support 100, heat radiation
Effect reduces the brightness decay of LED.
In other embodiments, when the first sheet metal and the second sheet metal are punched out processing, in die bond portion 13 and electricity
Through-hole is punched on connecting portion 17.In injection molding, insulating body 20 forms the connection being threaded through on the through-hole in through hole
Item is promoted and grabs resultant force between insulating body 20 and terminal group 10.
In other embodiments, several insulating ceramic films 30 are provided, and one end of insulating ceramic film 30 is extended internally
And it is connected in die bond portion 13.By insulating ceramic film 30, the semi-finished product of first terminal 11, Second terminal 12 semi-finished product together
It is put into mold and carries out being molded encapsulated processing.The other end of insulating ceramic film 30 is extended down to the outer surface of insulating body 20 outward.
When LED chip works, heat in die bond portion 13 can for delivery on insulating ceramic film 30 and being dispersed into the outside of plastic body,
Improving radiating effect.
Each technical characteristic of above example can be combined arbitrarily, to make description succinct, not to above-described embodiment
In each technical characteristic it is all possible combination be all described, as long as however, the combination of these technical characteristics be not present lance
Shield is all considered to be the range of this specification record.
Above example only expresses the preferred embodiments of the present invention, and description is more specific and detailed, but not
It can therefore be construed as limiting the scope of the patent.It should be pointed out that for those of ordinary skill in the art,
Without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection model of the present invention
It encloses.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of LED support, it is characterised in that：Including：
Terminal group；The terminal group includes：The first terminal and Second terminal being arranged in pairs；The first terminal includes：Die bond
Portion and at least three the first welding disks for connecting the die bond portion respectively；The die bond portion is used to install LED chip and be electrically connected
Connect wherein one end of LED chip；Each first welding disk includes：First bending section and connect the of first bending section
One pad section；One end of first bending section connects the periphery in the die bond portion, the other end connection of first bending section
The first pad section；The first pad section is parallel with the die bond portion；The Second terminal includes：Electrical connection section and connection
Second welding disk of the electrical connection section；The electrical connection section is used to be electrically connected the other end of LED chip；Second welding disk
Including：Second bending section and the second pad section for connecting second bending section；Described in one end connection of second bending section
The periphery of electrical connection section, the other end of second bending section connect the second pad section；The second pad section with it is described
Electrical connection section is parallel；And
Connect the insulating body of the terminal group；The insulating body is by being molded in the terminal group；The insulation
The top of main body is equipped with the accommodating cavity for accommodating LED chip；The die bond portion and the electrical connection section all extend to the appearance
Put the bottom of chamber；First bending section and second bending section are wrapped in the insulating body；First pad
Section and the second pad section all extend to the bottom surface of the insulating body.
2. LED support according to claim 1, which is characterized in that first pad portion is the first pad group and the
Two pad groups；The first pad section of the first pad group extends from outside to inside；First pad of the second pad group
Section extends from inside to outside；The second pad section extends from outside to inside.
3. LED support according to claim 1, which is characterized in that the die bond portion and/or the electrical connection section are equipped with and lead to
Hole.
4. LED support according to claim 1, which is characterized in that the die bond portion and/or the electrical connection section are equipped with blind
Hole.
5. LED support according to claim 1, which is characterized in that first bending section and second bending section are set
There is through-hole.
6. LED support according to claim 1, which is characterized in that further include：The insulation pottery being embedded on the plastic body
Tile；One end of the insulating ceramic film extends to the outer surface of the insulating body；The other end of the insulating ceramic film prolongs
It extends to the inside of the insulating body and connects the die bond portion.
7. LED support according to claim 1, which is characterized in that the die bond portion offers to connect the insulation
The card slot of potsherd；The insulating ceramic film is equipped with the Plug Division for matching the card slot.
8. a kind of LED support manufacturing method, which is characterized in that including step：
First sheet metal and the second sheet metal are provided, wherein, the area of first sheet metal is more than second sheet metal
Area；
Respectively to first sheet metal and second sheet metal is punched out and bending process, first terminal is respectively obtained
The semi-finished product of semi-finished product and Second terminal；Wherein, the semi-finished product of the first terminal include：Die bond portion and at least three vertically connects
It is connected on the first extension of the periphery in the die bond portion；The die bond portion is used to install the one of LED chip and electrical connection LED chip
End；The semi-finished product of the Second terminal include：Electrical connection section and at least one periphery for being vertically connected on the electrical connection section
Second extension；The electrical connection section is used to be electrically connected the other end of LED chip；
The semi-finished product of the semi-finished product of the first terminal and the Second terminal are put into mold and carry out being molded encapsulated processing
To mold insulating body；Wherein, when being molded encapsulated, by the end of first extension and the end of second extension
End extends to the bottom surface of the insulating body；
The end of first extension and the end of second extension are subjected to bending, obtain LED support finished product.
9. LED support manufacturing method according to claim 8, which is characterized in that in first sheet metal and described
When two sheet metals are punched out processing, through-hole is punched into the die bond portion and the electrical connection section.
10. LED support manufacturing method according to claim 8, which is characterized in that several insulating ceramic films are provided, and
One end of the insulating ceramic film is extended internally and is connected in the die bond portion；By the insulating ceramic film, described
The semi-finished product of one terminal, the Second terminal semi-finished product be put into together in mold and carry out being molded encapsulated processing；The insulation
The other end of potsherd is extended down to the outer surface of the insulating body outward.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810019585.XA CN108231977A (en) | 2018-01-09 | 2018-01-09 | LED support and its manufacturing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810019585.XA CN108231977A (en) | 2018-01-09 | 2018-01-09 | LED support and its manufacturing method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112216780A (en) * | 2020-10-13 | 2021-01-12 | 深圳市中顺半导体照明有限公司 | Processing method of reinforced LED bracket |
| WO2023103158A1 (en) * | 2021-12-07 | 2023-06-15 | 东莞市欧思科光电科技有限公司 | Led base module, led module, and led light strip |
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| EP1174921A2 (en) * | 2000-07-21 | 2002-01-23 | Hitachi, Ltd. | Semiconductor device |
| CN204834692U (en) * | 2015-06-25 | 2015-12-02 | 广东长盈精密技术有限公司 | LED support |
| CN206460970U (en) * | 2016-12-23 | 2017-09-01 | 博罗承创精密工业有限公司 | A kind of flange-cooled ultra-thin LED support |
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- 2018-01-09 CN CN201810019585.XA patent/CN108231977A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1174921A2 (en) * | 2000-07-21 | 2002-01-23 | Hitachi, Ltd. | Semiconductor device |
| CN204834692U (en) * | 2015-06-25 | 2015-12-02 | 广东长盈精密技术有限公司 | LED support |
| CN206460970U (en) * | 2016-12-23 | 2017-09-01 | 博罗承创精密工业有限公司 | A kind of flange-cooled ultra-thin LED support |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112216780A (en) * | 2020-10-13 | 2021-01-12 | 深圳市中顺半导体照明有限公司 | Processing method of reinforced LED bracket |
| WO2023103158A1 (en) * | 2021-12-07 | 2023-06-15 | 东莞市欧思科光电科技有限公司 | Led base module, led module, and led light strip |
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