CN208835057U - A kind of LED light - Google Patents

Abstract

The utility model relates to a kind of LED light, electrodeless substrate, electrode is embedded in packaging plastic, and as not having blocking for substrate accompanying by traditional electrode, luminous efficiency is higher, and the chip product structure is simpler, production efficiency is higher, cost is lower.Due to the structure using stripping type encapsulating carrier plate, more simply, more environmentally friendly, and the wires design of chip product, there has also been bigger freedom degree, the efficiency of subsequent encapsulation, which also obtains, to be greatly improved, and it is more reliable to produce quality, using wider array of product.

Description

A kind of LED light

Technical field

The utility model belongs to field of LED illumination, is specifically related to a kind of LED light.

Background technique

LED industry is the important foundation of Energy-saving Society, and the composition of LED illuminator is usually that luminescence chip is covered in printing electricity On the plate of road, the products such as complete cycle light product filament lamp or G9 are then that illuminator is constituted in the form of COB, the i.e. luminous core of COB illuminator Piece is to directly fall on circuit board and be packaged into an entirety (chip on board), the base of substrate currently used in the market Material is either PI or is ceramics, and PI material has certain light absorptive and can make material under prolonged high-temperature work environment Expect further aging aggravation light absorption, influences the light extraction efficiency of illuminator；And ceramic substrate be then material brittleness it is big, structure list One, the modal shift of product is difficult and assembling is complicated.

Just because of many disadvantages of the prior art, currently, need to obtain it is a kind of have more change shapes, high photosynthetic efficiency and The simple LED light product of structure；And need to obtain a kind of fabrication processing it is more simple and environmentally-friendly, and can reduce production cost, Improve the LED light manufacture craft of packaging efficiency；This promotes core competitiveness, all has for actively promoting the development of China's LED industry There is important role.

Utility model content

In view of the defects existing in the prior art, the utility model provides a kind of LED light and preparation method thereof, the LED light, Due to electrodeless substrate, chip finished size is small, and required precision is high, and light-out effect is more preferably；Correspondingly, the LED light production side Method, due to the processing technology using stripping type encapsulating carrier plate, fabrication processing is also simpler, more environmentally friendly, and chip product There has also been bigger freedom degree, the efficiency of subsequent encapsulation also obtains to be greatly improved wires design.

Technical solutions of the utility model are as follows:

A kind of LED light, wherein electrodeless substrate, including electrode, LED luminescence chip element and packaging plastic, wherein it is described LED luminescence chip element is formed on the electrode by die bond, and the packaging plastic is packaged above-mentioned electrode and chip component, institute Electrode is stated to be embedded in packaging plastic.

Preferably, the connecting terminal of the two ends connection external circuit of the electrode.

Preferably, the LED luminescence chip element is made of more than one sub- chips, sub- chip chamber passes through electrode or bonding The direction that line connects the sub- chip is consistent, alternatively, the direction of the bonding line is consistent.

Preferably, the electrode is flexible, longitudinal section is " T " shape structure or " work " shape structure.

Preferably, the electrode is single-layer metal material composition, the single-layer metal includes following any or its alloy: Aluminium, gold, silver, nickel, copper；Alternatively, the electrode is multiple layer metal composition, kernel is copper, and surface metal includes including as follows It is any or any combination thereof: gold, silver, nickel, copper.

Preferably, the distribution of electrodes be cable architecture, that is, the LED luminescence chip element be distributed as space curve or Lineal layout；Alternatively, the distribution of electrodes be face structure, that is, the LED luminescence chip element be distributed as geometric curved surfaces or Geometrical plane；Alternatively, the distribution of electrodes is body structure, that is, the LED luminescence chip element is distributed as curved-surface structure combination Made of solid.

Preferably, it further includes rectification chip element and constant current chip element；The LED luminescence chip element is single group The sub- chip portfolio of monochromatic sub- chip or multiple groups, each group of electric current are individually controlled to control luminous colour temperature.

Corresponding with the technical solution of above-mentioned LED light, which also discloses a kind of LED light production methods, include the following steps:

Step 1) prepares copper foil A, adhesive layer B and carrying tablet C；

Step 2) selective electroplating on copper foil forms top electrode D and hearth electrode E；

Step 3) is bonded copper foil A, adhesive layer B and carrying tablet C；

Step 4) etching removes the copper foil that do not protected by top electrode D, obtains independent package carrier；

Step 5) die bond, bonding wire, sealing on the electrode；

Step 6) removes carrying tablet C.

Preferably, the adhesive layer B is peelable glue resistant to high temperature.

Preferably, in step 2) selective electroplating formed top electrode D and hearth electrode E, wherein the surface hearth electrode E be copper, Nickel, silver, gold or their alloy；The full surface top electrode E or part of the surface are copper, nickel, silver, gold or their alloy；Electrode body For the good metal of electric conductivity.

As it can be seen that LED light provided by the utility model, due to electrodeless substrate, chip finished size is small, and required precision is high, And light-out effect is more preferably；Correspondingly, it also offers a kind of LED light production method, due to adding using stripping type encapsulating carrier plate Work technique, fabrication processing is also simpler, more environmentally friendly, and the wires design of chip product is there has also been bigger freedom degree, subsequent The efficiency of encapsulation, which also obtains, to be greatly improved.

Detailed description of the invention

Fig. 1 is the top view of LED light in the utility model；

Fig. 2 is the cross-sectional view of LED light in the utility model；

Fig. 3 is the main flow of LED light production method in the utility model；

Fig. 4 is conventional LED light formal dress chip package overall picture in the utility model；

Fig. 5 is conventional LED light formal dress chip package partial enlarged view in the utility model；

Fig. 6 is Wide frame LED light formal dress chip package partial enlarged view in the utility model；

Fig. 7 is the linear single-row positive cartridge chip of LED light in the utility model；

Fig. 8 is LED light Flip-Chip Using overall picture in the utility model；

Fig. 9 is LED light Flip-Chip Using partial enlarged view in the utility model；

Figure 10 is the positive cartridge chip of the basic moulding surface structure of LED light in the utility model；

Figure 11 is the positive cartridge chip partial enlarged view of the basic moulding surface structure of LED light in the utility model；

Figure 12 is the positive cartridge chip partial enlarged view of LED light soaking moulding surface structure in the utility model；

Figure 13 is LED light face structure flip-chip in the utility model.

Description of symbols: 1: current constant control chip, 2: illuminator boundary, 3: rectification chip, 4,5: bonding line, 6: hair Optical chip, 7: equal thermode, 8: current electrode, 9: illuminator extraction electrode, 11: top electrode D1,22: copper foil A, 33: hearth electrode E, 44: adhesive layer B, carrying tablet C.

Specific embodiment

It is hereafter the more specific detail of the preferred embodiment in the utility model shown in attached drawing 1 to attached drawing 13, passes through this A little explanations, the feature and advantage of the utility model will be evident.

In the utility model one embodiment, electrodeless substrate in the LED light comprising electrode, LED luminescence chip Element and packaging plastic, wherein the LED luminescence chip element is formed on the electrode by die bond, and the packaging plastic is to above-mentioned electricity Pole and chip component are packaged, and the electrode is embedded in packaging plastic.

In this embodiment, the LED light is as depicted in figs. 1 and 2, as not having the screening of substrate accompanying by traditional electrode Gear, the luminous efficiency of the LED light is higher, light decay is smaller, and chip product structure is simpler, finished size is small, required precision height, Production efficiency is higher and cost is lower.

In certain embodiments, the electrode two ends connection external circuit connecting terminal, the connecting terminal with The electrically conductive gluing of the connection of electrode, welding and add glue protection or Resistance Welding connecting terminal, terminal material be usually iron nickel alloy Or iron nickel plating；Iron-nickel alloy is usually kovar alloy.

In some specific embodiments, further design has been carried out to the electrode, has used flexible " draw (pull-back) electrode afterwards ", that is, electrode electrode in packaging plastic is up big and down small (" T " structure) or intermediate small both ends are big (" I " Structure), thus, electrode can be locked firmly into packaging plastic；Wherein, electrode can be made of single-layer metal, be also possible to Multiple layer metal is constituted: when for single-layer metal material composition, the single-layer metal includes following any or its alloy --- aluminium, Gold, silver, nickel, copper；When for multiple layer metal composition comprising the multilayered structure that core metal and surface metal are constituted, wherein kernel Metal and surface metal include any or any combination thereof as follows --- silver, gold, nickel, copper etc., it is preferred that core metal is copper.

Preferably, the distribution of electrodes can be cable architecture, that is, the LED luminescence chip element is distributed as space curve Or lineal layout；Alternatively, the distribution of electrodes can be face structure, that is, the LED luminescence chip element is distributed as geometry song Face or geometrical plane；Alternatively, the distribution of electrodes can be body structure, that is, the LED luminescence chip element is distributed as curved surface The solid that structure is composed.

In addition, when specifically designing the electrode, it is also contemplated that the hot transmitting of chip, the influence to light blocking or absorption, Electrode impedance and pole strength:

Consider heat transmitting, chip bottom distributed conductive as much as possible divides even around LED luminescence chip element The some heat sink electrodes of cloth；

Consider influence of the electrode to light blocking or absorption, it is preferably silver-plated to be used as electrode surface metal, to reduce light absorption；

Consider influence of the electrode to light blocking or absorption, preferred single layer metal is aluminium or its alloy.Metal is aluminium or its conjunction Gold is in addition to there is preferable reflective function, and there are also good supersonic bonding performances, can become the table electrode of Direct Bonding.

Consider electrode impedance, it is preferably silver-plated to be used as electrode surface metal, to reduce impedance；Further, can also lead to The thickness for improving electrode is crossed, to reduce impedance；

Consider that pole strength is widened, adds, thickeies some regions under the premise of not light-blocking as far as possible (not extinction) Electrode area can also cover tin to increase the intensity of electrode, so that the moulding for improving illuminator is strong improving outside thermally conductive ability Degree, allows the moulding of illuminator to be maintained.

In certain embodiments, further preferable design has been carried out to the chip component in the LED light, preferably , it further include rectification chip element and constant current chip element；Preferably, the LED luminescence chip element is the monochrome of single group Sub- chip, or, the sub- chip portfolio of multiple groups, when for the sub- chip portfolio of multiple groups, sub- chip chamber is connected by electrode or bonding line It connects, each group of electric current is individually controlled to control luminous colour temperature.Preferably, the direction of the sub- chip is consistent or bonding line Direction it is consistent, the efficiency of die bond bonding wire and the yield of post-processing can be conducive in this way.

In addition, the packaging plastic is protective colloid, usually epoxide-resin glue, silica gel or fluorescent glue.

Corresponding, in one embodiment, the invention also discloses a kind of LED light production methods, as shown in figure 3, It includes the following steps:

Step 1) prepares copper foil A, adhesive layer B and carrying tablet C；

Step 2) selective electroplating on copper foil forms top electrode D and hearth electrode E；

Step 3) is bonded copper foil A, adhesive layer B and carrying tablet C；

Step 4) etching removes the copper foil that do not protected by top electrode D, obtains independent package carrier；

Step 5) die bond, bonding wire, sealing on the electrode；

Step 6) removes carrying tablet C.

In the particular embodiment, the restriction above-mentioned each step being optimized:

In some embodiments, in step 1), the copper foil A be specific thicknesses copper foil, according to product precision and set Meter requires to select corresponding copper thick；The adhesive layer is peelable glue resistant to high temperature, is embedded on the electrode of packaging body after packaging body removing It can will not be conductive peelable glue or the peelable glue of other oxide powders filling there are residue glue, adhesive layer；The carrying tablet C To there is the sheet metal of certain thickness and rigidity, it is also possible to synthetic resin such as FR4, Plastic, concrete foundation harmomegathus coefficient The principle matched is selected；

In certain embodiments, in step 2), the selective electroplating forms top electrode D and hearth electrode E, selection Property plating can use the exposure development of photosensitive material, then the mode of graphic plating can also use template mask galvanoplastic, institute State top electrode and hearth electrode be can directly bonding or welding the coat of metal；

In certain embodiments, in step 4), the etching removes the copper that do not protected by top electrode D, obtains solely Vertical package carrier；Wherein resist layer can be top electrode coating, can also be obtained using the pattern transfer of photosensitive material；Etching Method is removing extra copper foil simultaneously, also can generate lateral erosion to the copper below electrode layer, have T-shaped shape in cross-wise direction electrode layer At, that is, " after drawing " (pull-back) electrode is formed, the binding force with subsequent encapsulating material is increased；

In certain embodiments, in step 5), glue used in the encapsulation is protective colloid, usually epoxy Resin glue, silica gel or fluorescent glue；And preferably, the LED luminescence chip element of die bond can be designed as the figure point of arbitrary shape Cloth, is also possible to the three-dimensional combination of arbitrary graphic, which can be a variety of photochromic LED hair photon chips Combination；

In certain embodiments, it further includes step S8 that the technique is subsequent, is split, surveys to the processed goods of acquisition Examination；More preferably, it may also include step S7 before step S8, the electrode bottom surface sealing again to removing post-processing product.To obtain Obtain finally qualified chip package product.

The technique with LED light product be above it is corresponding, by the processing technology, can obtain previously described each With the LED light product of the electrode structure without substrate in embodiment.

Based on the characteristics of manufacture craft, the wires design of chip product has bigger freedom degree, institute in the utility model Stating the distribution of LED luminescence chip element can be designed as the figure of arbitrary shape, be also possible to the three-dimensional combination of arbitrary graphic；To Form different chip product structures, such as comprising: positive cartridge chip, flip-chip；Narrow frame, Wide frame；Line style single-row；Face The arrangement of structure basic model, the arrangement of face structure-improved, the arrangement of face structure even-heating.

All kinds of chip product structures have the advantages that different design feature and: formal dress, inverted structure, it is ensured that chip Direction is consistent, improves packaging efficiency and light efficiency；The design of Wide frame is can effectively to increase side because without substrate in packaging body Frame, bold border can make the lamp bar after encapsulation have better intensity, the speciality of moulding kept after available lamp bar bending, this It outside can also be by metallic tin being coated on frame to reinforce frame intensity；Linear single-row chip, can be under given conditions Narrower design is provided, led illuminator can be packaged into various geometry shape dress with this structure by the basic cake core of face structure, The recombinant of i.e. various geometric surfaces and geometric surface；Face structure-improved chip increases the length of heat sink electrodes, and heat dissipation effect is more It is good；Face structure soaking cake core, increased heat sink electrodes are evenly distributed in chip surrounding, and heat dissipation effect is more evenly.

In some specific embodiments, above-mentioned various chips can be obtained using the manufacture craft production in the utility model Product structure: as illustrated in figures 4-5, production obtains the LED light of formal dress chip package；As shown in fig. 6, production obtains Wide frame formal dress The LED light of chip package；As shown in fig. 7, production obtains the LED light of linear single-row formal dress chip package；As Figure 8-9, raw Produce the LED light for obtaining Flip-Chip Using；As shown in figs. 10-11, production obtains basic moulding surface structure formal dress chip package LED light；As shown in figure 12, production obtains the LED light of soaking moulding surface structure formal dress chip package；As shown in figure 13, production obtains The LED light of face structure Flip-Chip Using.

As it can be seen that production method provided by the utility model is not necessarily to cost due to the processing technology using stripping type carrying tablet Higher PI material, product is thinner after encapsulation removing, and the extinction of no dielectric layer, light-out effect is good, and fabrication processing is also more Simply, more environmentally friendly；In addition, the wires design of chip product, there has also been bigger freedom degree, the efficiency of subsequent encapsulation also obtains pole Big to improve, it is more reliable to produce quality, using wider array of product.

The above is only the preferred embodiment of the present invention, is not intended to limit the utility model, the skill of this field Art personnel carry out common variations and alternatives within the scope of technical solutions of the utility model should be included in the guarantor of the utility model It protects in range.

Claims (7)

1. a kind of LED light, which is characterized in that electrodeless substrate in the LED light comprising electrode, LED luminescence chip element and Packaging plastic, wherein the LED luminescence chip element is formed on the electrode by die bond, and the packaging plastic is to above-mentioned electrode and core Piece element is packaged, and the electrode is embedded in packaging plastic.

2. LED light according to claim 1, which is characterized in that the terminals of the two ends connection external circuit of the electrode Son.

3. LED light according to claim 1, which is characterized in that the LED luminescence chip element is by more than one sub- chips It constitutes, sub- chip chamber is connected by electrode or bonding line, and the direction of the sub- chip is consistent, alternatively, the direction of the bonding line Unanimously.

4. LED light according to claim 1, which is characterized in that the electrode is flexible, and longitudinal section is " T " shape structure Or " I " shape structure.

5. LED light according to claim 1, which is characterized in that the electrode is single-layer metal material composition, the single layer Metal includes following any or its alloy: aluminium, gold, silver, nickel, copper；Alternatively, the electrode is multiple layer metal composition comprising interior The multilayered structure that core metal and surface metal are constituted, wherein core metal and surface metal include following any or its any group It closes: silver, gold, nickel, copper.

6. LED light according to claim 1, which is characterized in that the distribution of electrodes is cable architecture, that is, the LED shines Chip component is distributed as space curve or lineal layout；Alternatively, the distribution of electrodes is face structure, that is, the LED shines core Piece element is distributed as geometric curved surfaces or geometrical plane；Alternatively, the distribution of electrodes is body structure, that is, the LED shines core The solid for being distributed as curved-surface structure and being composed of piece element.

7. LED light according to claim 1, which is characterized in that it further includes rectification chip element and constant current chip element； The LED luminescence chip element is the sub- chip of monochrome of single group or the sub- chip portfolio of multiple groups, and each group of electric current individually controls To control luminous colour temperature.