CN201017901Y - Packaging structure of LED - Google Patents

Packaging structure of LED Download PDF

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Publication number
CN201017901Y
CN201017901Y CNU2007200480146U CN200720048014U CN201017901Y CN 201017901 Y CN201017901 Y CN 201017901Y CN U2007200480146 U CNU2007200480146 U CN U2007200480146U CN 200720048014 U CN200720048014 U CN 200720048014U CN 201017901 Y CN201017901 Y CN 201017901Y
Authority
CN
China
Prior art keywords
base plate
packaging
lamp cup
conductive electrode
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNU2007200480146U
Other languages
Chinese (zh)
Inventor
樊邦弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Heshan Lide Electronic Enterprise Co Ltd
Original Assignee
Heshan Lide Electronic Enterprise Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heshan Lide Electronic Enterprise Co Ltd filed Critical Heshan Lide Electronic Enterprise Co Ltd
Priority to CNU2007200480146U priority Critical patent/CN201017901Y/en
Application granted granted Critical
Publication of CN201017901Y publication Critical patent/CN201017901Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93Batch processes
    • H01L24/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
    • H01L2924/12041LED

Abstract

The utility model discloses a light-emitting diode package structure, which comprises a packaging substrate and a LED chip. At least one cup-shaped lamp cup is arranged on the packaging substrate, and a reflecting surface is formed in the lamp cup, a first conducting electrode is arranged at one side edge of the lamp cup, a conducting wire connecting block is arranged on the first conducting electrode, an insulating layer isolating the electrical connection between the first conducting electrode and the packaging substrate is arranged between the first conducting electrode and the packaging substrate, the packaging substrate is a second conducting electrode, the conducting wire connecting block is arranged at the edge of the lamp cup opposite to the first conducting electrode, and at least one LED chip is arranged on the surface of the bottom part of the lamp cup. Based on the structure and characters of the utility model, the utility model has a good reflection effect, and a good heat conducting and electric conducting performance, and phosphor powders are arranged on the packaging substrate, the light brightness is increased, and simultaneously a color effect is produced.

Description

The encapsulating structure of light-emitting diode
Affiliated technical field
The utility model relates to a kind of encapsulating structure of light-emitting diode, particularly relates to a kind of with the encapsulating structure of whole base plate for packaging as the light-emitting diode of a conductive electrode.
Background technology
The mostly development and differentiation on the Discrete device packaging technical foundation of LED encapsulation technology, but very big particularity is arranged.Generally speaking, the tube core of discrete device is sealed in the packaging body, and the effect of encapsulation mainly is the protection tube core and finishes electric interconnection.LED encapsulation then is to finish the output signal of telecommunication, protection tube core operate as normal, and the function of output visible light, existing electrical quantity has the design and the specification requirement of optical parameter again, can't be simply the encapsulation of discrete device be used for LED.
Along with the development of LED technology, making LED progressively replace traditional incandescent lamp in a lot of applications has become inevitable trend, and how effectively solving self-radiating has become a stubborn problem.LED encapsulation technology in the market exists very big problem aspect self-radiating.As China Patent No.: " 200510097114.3 ", name is called: " manufacture method of LED package ", this patent have proposed optionally anodic oxidation and be divided into two encapsulated electrode portions that are separated from each other of base plate for packaging.
Fig. 1 shows the cutaway view that this patent is made the LED encapsulation, by 109 oxidations of mask pattern or etching base plate for packaging 101, has the recess 103 of reflecting surface 101c with formation, utilizes simultaneously such as by Al 2O 3The anode oxide film 102 oxidation base plate for packaging 101 made of insulator, two 101a of encapsulated electrode portion, 101b base plate for packaging 101 being divided into be separated from each other, again led chip 107 is mounted an encapsulated electrode 101a to two encapsulated electrode 101a that separate and the 101b, and by lead 108 wire bonds to another encapsulated electrode 101b.Though this technology can play certain photothermy, but because base plate for packaging 101 is separated into two, certainly will reduce the area of Heat Conduction Material, even if the anode oxide film 102 in the middle of being filled in can heat conduction, because this anode oxide film 102 and base plate for packaging 101 are matrixes of two kinds of different materials, its heat conductivility is difference to some extent also, thereby further influenced the heat transfer efficiency of led chip 107.
Fig. 2 shows the cutaway view that another kind of embodiment makes the LED encapsulation, led chip 107 is passed through flip bonded, two pins is welded on respectively on separately two the encapsulated electrode 101a and 101b, because the protuberance of scolding tin, will certainly make between led chip 107 and the base plate for packaging 101 and form the slit, and only depend on bump to contact heat radiation with base plate for packaging 101, its heat radiation contact area is too little, just because of this reason, the hungry heat that makes led chip 107 send can not all pass to base plate for packaging 101 soon, thereby has influenced the speed of heat transferred and the efficient that heat distributes.
In sum, can be applied to extensive fields in order to make led chip, the heat dissipation problem of self certainly will will obtain better solve more.
Summary of the invention
The purpose of this utility model is in order to solve the above-mentioned problem that proposes, and provides that a kind of heat transfer rate is fast, radiating efficiency is high, and electric conductivity is good, and reflecting effect is good, and light luminance is strong, also can produce the encapsulating structure of the light-emitting diode of color effect simultaneously.
To achieve these goals, the technical scheme that the utility model adopted is the encapsulating structure of light-emitting diode, comprise base plate for packaging and led chip, it is characterized in that: described base plate for packaging is provided with the Lamp cup of at least one bowl cup-shaped, and in this Lamp cup, form reflecting surface, described Lamp cup one end margin place is provided with first conductive electrode, and the lead contiguous block is set on first conductive electrode, between described first conductive electrode and described base plate for packaging, the insulating barrier that is electrically connected between isolated first conductive electrode and the base plate for packaging is set, described base plate for packaging is second conductive electrode, and the lead contiguous block that second conductive electrode is set in the Lamp cup edge relative with first conductive electrode, on the surface of described Lamp cup bottom at least one led chip is installed.
Described base plate for packaging top is provided with cover plate, and above the described base plate for packaging Lamp cup of following covering of this cover plate, and the face that parallels of this cover plate and Lamp cup bottom is provided with the mixture of fluorescent material and glue.
Described base plate for packaging bottom is provided with base plate, the whole bottom of the described base plate for packaging of top covering of this base plate.
The surface of described Lamp cup bottom is provided with led chip, and described led chip is electrically connected with first conductive electrode and second conductive electrode respectively.
According to an embodiment of the present utility model, be electrically connected between described led chip one electrode and described first conductive electrode, another electrode is connected with the bottom electrical of Lamp cup.
The side of described Lamp cup is provided with metallic reflective coating.
According to another embodiment of the present utility model, be provided with the mixture of fluorescent material and glue in the described Lamp cup, this mixture coats the electric connecting wire of whole LED chip and chip chamber, and described mixture is provided with packing colloid.
Described base plate for packaging is made up of an above independent LED encapsulating structure.
More than one led chip is electrically connected with series, parallel or connection in series-parallel mixed form in the described Lamp cup.
The utility model compared with prior art its beneficial effect is: the utility model is provided with first conductive electrode at an end margin place of base plate for packaging Lamp cup, and between first conductive electrode and base plate for packaging, insulating barrier is set, with whole base plate for packaging as second conductive electrode, led chip is arranged on the bottom of Lamp cup by the mode that mounts, and the bottom surface of chip combines with the bottom of Lamp cup is complete.Preferably, in the side and the bottom electrical silver-plated (Ag) of Lamp cup, based on the structure of present technique and the material of being got, make reflecting effect good, and the heat of chip can promptly pass to base plate for packaging, well dissipate by base plate for packaging again, its heat transfer rate is fast, the height of radiating efficiency; And because the effect of silver-plated (Ag), its electric conductivity is good, and it is oxidized to have guaranteed that also base plate for packaging is difficult for; Simultaneously at the top of base plate for packaging in conjunction with encapsulation cover plate, the face that encapsulation cover plate parallels with the Lamp cup bottom is provided with the mixture of fluorescent material and glue, increased the intensity of light, and can adopt the chip of different colours light to match, reach the effect that produces colour with the fluorescent material of different colours.
Description of drawings
Fig. 1 makes the cutaway view of package structure for LED for prior art;
Fig. 2 makes the cutaway view of package structure for LED for another embodiment of prior art;
Fig. 3 makes the cutaway view of package structure for LED for the utility model first embodiment;
Fig. 4 is the utility model P-P cutaway view shown in Figure 3;
Fig. 5 is the utility model is made the package structure for LED process according to first embodiment a cutaway view to Fig. 8;
Fig. 9 makes the cutaway view of package structure for LED for the utility model second embodiment;
Figure 10 makes the cutaway view of package structure for LED for the utility model the 3rd embodiment;
Figure 11 makes the cutaway view of package structure for LED array according to first embodiment for the utility model;
Figure 12 makes the cutaway view of package structure for LED array according to the 3rd embodiment for the utility model;
Embodiment
Below the content of the encapsulating structure of the utility model light-emitting diode is further described in conjunction with the accompanying drawings and embodiments:
With reference to Fig. 3, Fig. 4, Fig. 3 make the cutaway view of package structure for LED for the utility model first embodiment; Fig. 4 is the utility model P-P cutaway view shown in Figure 3.This encapsulating structure comprises base plate for packaging 10 and led chip 13, the base plate for packaging of being made by the alloy of metallic aluminium (Al) or aluminium (Al) 10 comprises the Lamp cup 10a of bowl cup-shaped and is formed at the interior reflecting surface 10b of described Lamp cup, described led chip 13 is by pasting or the mode of fusing scolding tin is installed in the bottom of Lamp cup 10a, and institute's mounted LEDs chip 13 is at least more than one.Preferably; the used led chip 13 of the utility model is three; and be electrically connected in series by lead 14a between the chip; described base plate for packaging 10 is to form by the pressing mold of metal or the mode of injection molding; comprising the Lamp cup 10a of bowl cup-shaped and be formed at the interior reflecting surface 10b of described Lamp cup, all is that integral production forms.That selects in monomer that is made of silver (Ag), gold (Au) and aluminium (Al) or alloy simultaneously is a kind of, preferably, the utility model adopts electrosilvering (Ag) to come reflecting surface 10b and the bottom of the described Lamp cup 10a of surface treatment, thereby to form the mirrored sides of reflection ray better, again because bottom silver-plated (Ag), make this plane smooth, smooth, led chip 13 can be corrected be placed on above.
The Lamp cup 10a one end margin place of the base plate for packaging of being made by metal 10 is provided with first conductive electrode 12, and the contiguous block 15a of lead 14b is set on first conductive electrode 12, between described first conductive electrode 12 and described base plate for packaging 10, the insulating barrier 11 that is electrically connected between isolated first conductive electrode 12 and the base plate for packaging 10 is set, described base plate for packaging 10 is second conductive electrode, and the contiguous block 15b of the second conductive electrode lead 14c is set in the Lamp cup 10a edge relative with first conductive electrode 12.And be provided with cover plate 16 at described base plate for packaging 10 tops, above the described base plate for packaging 10 Lamp cup 10a of the following covering of this cover plate 16, and be coated with the mixture 17 of fluorescent material and glue on this cover plate 16 and the face that Lamp cup 10a bottom surface parallels; Base plate for packaging 10 bottoms are provided with base plate 161, the whole bottom of the described base plate for packaging 10 of top covering of this base plate 161.Electrogilding (Au) or silver (Ag) also can be passed through in the bottom of base plate for packaging 10, and the mode of the utility model preferably silver-plated (Ag) is come the bottom of the described base plate for packaging of surface treatment.
Fig. 5 is the utility model is made the package structure for LED process according to first embodiment a cutaway view to Fig. 8.At first,, make the base plate for packaging 10 that constitutes by metallic aluminium (Al) or aluminium (Al) alloy, and flat bottom that led chip 13 is installed and the reflecting surface 10b that is used for reflection ray are set on base plate for packaging 10 by the mode of pressing mold or injection molding with reference to Fig. 5.
Secondly, with reference to Fig. 6, at described base plate for packaging 10 Lamp cup 10a one end margin place first conductive electrode 12 is set, and the electric connection block 15a of external wire is set near the edge of base plate for packaging 10 on first conductive electrode 12, this contiguous block 15a pastes copper sheet or some scolding tin.Then between described first conductive electrode 12 and described base plate for packaging 10, the insulating barrier 11 that is electrically connected between isolated fully first conductive electrode 12 and the base plate for packaging 10 is set, this insulating barrier 11 is by such as Al 2O 3Insulator make.Described whole base plate for packaging 10 is as second conductive electrode, and the electric connection block 15b of the second conductive electrode outer lead is set in the Lamp cup 10a edge relative with first conductive electrode 12.
Once more, with reference to Fig. 7, on the 10b of the side of described Lamp cup 10a, form metallic reflective coating, this metallic reflective coating is a kind of made by what select in the monomer of silver (Ag), gold (Au) and aluminium (Al) formation or the alloy, use a kind of bottom of electroplating the described Lamp cup 10a of surface treatment of selecting from the monomer that is made of silver (Ag), gold (Au) and aluminium (Al) or alloy simultaneously, the utility model is the mode of preferably silver-plated (Ag) all.Led chip 13 is mounted on the bottom of Lamp cup 10a, and does being electrically connected between chip and the chip, be electrically connected with first and second conductive electrode respectively with the mode of wire bond lead two electrodes again chip with lead 14a.
At last, with reference to Fig. 8, on described base plate for packaging 10 Lamp cup 10a, a cover plate 16 is set by the mode of pasting, this cover plate 16 can be poly (methyl methacrylate) plate, convex lens or the concavees lens that resin is made, and on this cover plate 16 and face that Lamp cup 10a bottom surface parallels, be coated with the mixture of fluorescent material and glue, to increase the intensity of light, can also adopt the chip of different colours light to match with the fluorescent material of different colours, reach the effect that produces colour.Simultaneously also come the bottom of the described base plate for packaging of surface treatment, and the whole bottom that a base plate 161 is sealed base plate for packaging 10 is set, so that led chip can better be fixed on the lamp plate by the mode of electrosilvering (Ag).
With reference to Fig. 9, this figure is the cutaway view that the utility model second embodiment makes package structure for LED.Its external structure and shown in Figure 3 basic identical, just the led chip 13 of inside is taked mode in parallel to be electrically connected, mode by lead 14a wire bond is welded to each electrode respectively on first conductive electrode 12 again, and with insulating barrier 11 separately, another electrode is welded direct on the bottom surface of base plate for packaging 10 Lamp cup 10a each other.
According to above first, second embodiment, cover plate 16 of the present utility model plays the effect of sealing LED chip 13, also can be as the usefulness of astigmatism or optically focused.And in fact, also can not need this cover plate.With reference to Figure 10, this figure is the cutaway view that the 3rd embodiment makes package structure for LED, structure is same as shown in Figure 3 basically, unique different be that cover plate 16 and base plate 161 are not set among this figure, but in Lamp cup 10a, apply the mixture 17 of fluorescent material and glue, this mixture coats the welding lead 14a of whole LED chip 13 and chip chamber, more a kind of transparent packaging plastic 18 is coated in to carry out surface encapsulation on the mixture 17 and get final product.
Shown in the above first and the 3rd embodiment, the utility model easily just can be used to produce in enormous quantities LED encapsulating structure array.With reference to Figure 11 and Figure 12, on this base plate for packaging 10, make the Lamp cup 10a that comprises bowl cup-shaped more than, and in each Lamp cup 10a, form reflecting surface 10b; End margin place at described each Lamp cup 10a is provided with first conductive electrode 12, and the contiguous block of outer lead is set on first conductive electrode 12, between described first conductive electrode 12 and described base plate for packaging 10, the insulating barrier 11 that is electrically connected between fully isolated first conductive electrode 12 and the base plate for packaging 10 is set, described whole base plate for packaging 10 is second conductive electrode, and the lead contiguous block of second conductive electrode is set in the Lamp cup 10a edge relative with first conductive electrode 12; At last on the surface of described each Lamp cup 10a bottom, more than one led chip is installed, is electrically connected with series, parallel or connection in series-parallel hybrid mode by lead 14a wire bond between chip and the chip.The LED array of packages can be used for such as many fields such as display screen, wall body decoration, billboard; Also can described LED array of packages be divided into an above independent LED encapsulating structure along transversal A1 and A2 or B1 and B2.

Claims (9)

1. the encapsulating structure of light-emitting diode, comprise base plate for packaging and led chip, it is characterized in that: described base plate for packaging is provided with the Lamp cup of at least one bowl cup-shaped, and in this Lamp cup, form reflecting surface, described Lamp cup one end margin place is provided with first conductive electrode, and the lead contiguous block is set on first conductive electrode, between described first conductive electrode and described base plate for packaging, the insulating barrier that is electrically connected between isolated first conductive electrode and the base plate for packaging is set, described base plate for packaging is second conductive electrode, and the lead contiguous block that second conductive electrode is set in the Lamp cup edge relative with first conductive electrode, on the surface of described Lamp cup bottom at least one led chip is installed.
2. the encapsulating structure of light-emitting diode according to claim 1, it is characterized in that: described base plate for packaging top is provided with cover plate, above the described base plate for packaging Lamp cup of following covering of this cover plate, and the face that parallels of this cover plate and Lamp cup bottom is provided with the mixture of fluorescent material and glue.
3. the encapsulating structure of light-emitting diode according to claim 1 is characterized in that: be provided with base plate, the whole bottom of the described base plate for packaging of top covering of this base plate bottom the described base plate for packaging.
4. the encapsulating structure of light-emitting diode according to claim 1 is characterized in that: the surface of described Lamp cup bottom is provided with led chip, and described led chip is electrically connected with first conductive electrode and second conductive electrode respectively.
5. the encapsulating structure of light-emitting diode according to claim 1 is characterized in that: be electrically connected between described led chip one electrode and described first conductive electrode, another electrode is connected with the bottom electrical of Lamp cup.
6. the encapsulating structure of light-emitting diode according to claim 1, it is characterized in that: the side of described Lamp cup is provided with metallic reflective coating.
7. the encapsulating structure of light-emitting diode according to claim 1, it is characterized in that: the mixture that is provided with fluorescent material and glue in the described Lamp cup, this mixture coats the electric connecting wire of whole LED chip and chip chamber, and described mixture is provided with packing colloid.
8. the encapsulating structure of light-emitting diode according to claim 1, it is characterized in that: described base plate for packaging is made up of an above independent LED encapsulating structure.
9. the encapsulating structure of light-emitting diode according to claim 1 is characterized in that: more than one led chip is electrically connected with series, parallel or connection in series-parallel mixed form in the described Lamp cup.
CNU2007200480146U 2007-01-29 2007-01-29 Packaging structure of LED Expired - Fee Related CN201017901Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2007200480146U CN201017901Y (en) 2007-01-29 2007-01-29 Packaging structure of LED

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2007200480146U CN201017901Y (en) 2007-01-29 2007-01-29 Packaging structure of LED

Publications (1)

Publication Number Publication Date
CN201017901Y true CN201017901Y (en) 2008-02-06

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101867004A (en) * 2010-06-07 2010-10-20 李骋翔 Light source module based on remote fluorescent powder
CN102983126A (en) * 2012-11-30 2013-03-20 杨夏芳 Led luminous chip array packaging structure
CN104613379A (en) * 2015-02-06 2015-05-13 东莞佰鸿电子有限公司 Sapphire printed circuit board LED lamp and manufacture method thereof
TWI489657B (en) * 2012-04-12 2015-06-21 Lextar Electronics Corp Light-emitting diode package
CN104779245A (en) * 2014-01-12 2015-07-15 广东天下行光电有限公司 Contiguous automobile reading lamp

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101867004A (en) * 2010-06-07 2010-10-20 李骋翔 Light source module based on remote fluorescent powder
CN101867004B (en) * 2010-06-07 2013-04-03 李骋翔 Light source module based on remote fluorescent powder
TWI489657B (en) * 2012-04-12 2015-06-21 Lextar Electronics Corp Light-emitting diode package
CN102983126A (en) * 2012-11-30 2013-03-20 杨夏芳 Led luminous chip array packaging structure
CN102983126B (en) * 2012-11-30 2015-04-01 余姚德诚科技咨询有限公司 Led luminous chip array packaging structure
CN104779245A (en) * 2014-01-12 2015-07-15 广东天下行光电有限公司 Contiguous automobile reading lamp
CN104613379A (en) * 2015-02-06 2015-05-13 东莞佰鸿电子有限公司 Sapphire printed circuit board LED lamp and manufacture method thereof
CN104613379B (en) * 2015-02-06 2017-12-26 东莞佰鸿电子有限公司 A kind of sapphire printed circuit board (PCB) LED lamp and preparation method thereof

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GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20080206

Termination date: 20100129