CN102983126A - Led luminous chip array packaging structure - Google Patents
Led luminous chip array packaging structure Download PDFInfo
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- CN102983126A CN102983126A CN2012105132012A CN201210513201A CN102983126A CN 102983126 A CN102983126 A CN 102983126A CN 2012105132012 A CN2012105132012 A CN 2012105132012A CN 201210513201 A CN201210513201 A CN 201210513201A CN 102983126 A CN102983126 A CN 102983126A
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- heat conduction
- led luminescence
- closed cavity
- chip array
- substrate
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Abstract
The invention provides an LED luminous chip array packing structure which comprises a substrate for arranging LED luminous chips, a plurality of LED luminous chips arranged on the substrate in a matrix manner, a frame body wrapping the substrate on the peripheral side of the substrate, a heat conduction filling material arranged among the plurality of LED luminous chips, and a cover part arranged on the frame body, wherein the substrate, the frame body and the cover part form a closed cavity together, and inert gas is filled in the closed cavity; the LED luminous chip array packaging structure further comprises a fluorescent powder layer arranged on the inner surface of the cover part facing the closed cavity; the cover part is transparent; the frame body is made of a heat conduction material; the heat conduction filling material is a heat conduction material; and a reflecting material is coated on the surface of the heat conduction filling material facing the closed cavity and the frame body. The material of the packaging structure can dissipate heat effectively.
Description
Technical field
The present invention relates to lighting field, more particularly, the present invention relates to a kind of LED luminescence chip array encapsulation structure.
Background technology
LED (Light Emitting Diode) is a kind of solid-state semiconductor device, and it can be electric energy conversion luminous energy directly.The heart of LED is a semiconductor wafer, and an end of semiconductor wafer is attached on the support (as negative pole), and the other end of semiconductor wafer connects the positive pole of power supply, and whole wafer is got up by epoxy encapsulation.
Semiconductor wafer is comprised of two parts, and a part is P type semiconductor, occupies an leading position in its hole, the inside, and the other end of semiconductor wafer is N type semiconductor, mainly is electronics here.When these two kinds of semiconductors couple together, just form one " P-N knot " between them.
When electric current acted on this wafer by wire, electronics will be pushed to the P district, and then electronics will send energy with the form of photon, the luminous principle of LED that Here it is with hole-recombination in the P district.And light wavelength determines the color of light, determines by forming P-N knot material.
Correspondingly, the LED illumination utilizes the solid semiconductor chip as luminescent material, by charge carrier compound energy of emitting surplus occuring causes photo emissions in semiconductor, directly send red, yellow, blue, green light, on this basis, utilize the principle of three primary colours, add fluorescent material, can send the light of the random color such as red, yellow, blue, green, blue or green, orange, purple, white.The LED illuminating product utilizes LED as the produced ligthing paraphernalia of light source exactly.
When the LED luminescence chip is assembled into LED luminescence chip array structure, because LED luminescence chip meeting heating itself, so when being packaged together in a large number, can produce a large amount of heatings, thus the life-span of LED luminescence chip array shortened.
Therefore, hope can provide a kind of LED luminescence chip array encapsulation structure that can effectively improve the radiating effect of LED luminescence chip array.
Summary of the invention
Technical problem to be solved by this invention is for having defects in the prior art, a kind of LED luminescence chip array encapsulation structure that can effectively improve the radiating effect of LED luminescence chip array being provided.
According to a first aspect of the invention, a kind of LED luminescence chip array encapsulation structure is provided, and it comprises: be used for to arrange the LED luminescence chip substrate, with matrix-style be arranged in described suprabasil a plurality of LED luminescence chips, the peripheral sidepiece of described substrate wrap up described substrate framework, be arranged in the heat conduction packing material between described suprabasil described a plurality of LED luminescence chips and be arranged in cover part on the described framework; Wherein, described substrate, described framework and described cover part have formed a closed cavity jointly, and are filled with inert gas in the described closed cavity; Described LED luminescence chip array encapsulation structure also comprises the phosphor powder layer on the inner surface of described closed cavity that is arranged in described cover part; And wherein, the uncoated phosphor powder layer of the outer surface of described a plurality of LED luminescence chips; Wherein, described cover part is printing opacity; Wherein, the material of described framework is Heat Conduction Material; Wherein, described heat conduction packing material is Heat Conduction Material; And wherein, described framework and described heat conduction packing material has applied reflectorized material on the surface of described closed cavity.
The inert gas of preferably, filling can be a kind of gas in helium, neon, argon gas, Krypton, xenon and the radon gas or the combination of a plurality of gases.
Preferably, the material of described framework and the material of described heat conduction packing material are identical Heat Conduction Material.
Preferably, the material of the material of described framework and described heat conduction packing material is metal.
According to the present invention, include the described closed cavity of inert gas, formed the reflectorized material that on the surface of described closed cavity, applies of solid conductive heat path and described framework and described heat conduction packing material by described framework and described heat conduction packing material, can advantageously generate a heat radiation circulation system that contacts with the LED luminescence chip, thereby can effectively dispel the heat.
Description of drawings
By reference to the accompanying drawings, and by with reference to following detailed description, will more easily to the present invention more complete understanding be arranged and more easily understand its advantage of following and feature, wherein:
Fig. 1 schematically shows the plane graph according to the LED luminescence chip array encapsulation structure of the embodiment of the invention.
Fig. 2 schematically shows the cutaway view according to the LED luminescence chip array encapsulation structure of the embodiment of the invention.
Need to prove that accompanying drawing is used for explanation the present invention, and unrestricted the present invention.Notice that the accompanying drawing of expression structure may not be to draw in proportion.And in the accompanying drawing, identical or similar element indicates identical or similar label.
Embodiment
In order to make content of the present invention more clear and understandable, below in conjunction with specific embodiments and the drawings content of the present invention is described in detail.
Fig. 1 schematically shows the plane graph according to the LED luminescence chip array encapsulation structure of the embodiment of the invention, and Fig. 2 schematically shows the cutaway view according to the LED luminescence chip array encapsulation structure of the embodiment of the invention.
As depicted in figs. 1 and 2, the LED luminescence chip array encapsulation structure according to the embodiment of the invention comprises: be used for to arrange LED luminescence chip 1 substrate 3, with matrix-style arrange a plurality of LED luminescence chips 1, the peripheral sidepiece of described substrate 3 wrap up described substrate 3 framework 2, be arranged in heat conduction packing material 5 between the described a plurality of LED luminescence chips 1 in the described substrate 3, be arranged in the cover part 4 on the described framework 2 and be arranged in phosphor powder layer 41 on the inner surface of described cover part 4.
Like this, the outer surface of a plurality of LED luminescence chip 1 need not also not apply phosphor powder layer.
Wherein, described substrate 3, described framework 2 and described cover part 4 have formed a closed cavity 6 jointly, and are filled with inert gas in the described closed cavity 6.The inert gas of for example, filling can be a kind of gas in helium, neon, argon gas, Krypton, xenon and the radon gas or the combination of a plurality of gases.
Wherein, described cover part 4 is printing opacities.
Wherein, the material of described framework 2 is Heat Conduction Material.
Preferably, the material of described framework 2 and the material of described heat conduction packing material 5 are identical Heat Conduction Material, for example metal.
Further with reference to figure 2, Fig. 2 schematically shows the cutaway view according to the LED luminescence chip array encapsulation structure of the embodiment of the invention.
Wherein, along the cutaway view of dotted line A-A intercepting shown in Figure 1, also be simultaneously along the cutaway view of dotted line B-B intercepting shown in Figure 1, because two cutaway views are unanimous on the whole, so a cutaway view only is shown the present invention is described.And, may only be quantity different of LED luminescence chip 1 along cutaway view and the difference of the cutaway view that intercepts along dotted line B-B shown in Figure 1 of dotted line A-A shown in Figure 1 intercepting.
Need to prove, have 8 LED luminescence chips 1 and have in the horizontal direction the situation of 9 LED luminescence chips 1 although Fig. 1 shows in the vertical direction, but clearly describe the present invention in order to simplify diagram, in cutaway view shown in Figure 2, only be illustrated in the situation that only comprises 4 LED luminescence chips 1 in the single dimension.
As shown in Figure 2, owing to described phosphor powder layer 41 directly is not arranged on the LED luminescence chip 1, so be conducive to the heat radiation of LED luminescence chip 1.
In addition, because the material of described framework 2 and the material of described heat conduction packing material 5 all are Heat Conduction Materials, thereby described framework 2 can advantageously generate a solid conductive heat path that contacts with LED luminescence chip 1 with described heat conduction packing material 5.
And, owing to be filled with inert gas in the described closed cavity 6, so described closed cavity 6 can advantageously generate a heat conduction circulation path that contacts with LED luminescence chip 1 with above-mentioned solid conductive heat path (described framework 2 and described heat conduction packing material 5).
And, described framework 2 and described heat conduction packing material 5 on the surface of described closed cavity 6, applied reflectorized material.
Thus, since described framework 2 and described heat conduction packing material 5 on the surface of described closed cavity 6, applied reflectorized material, so the light (shown in the arrow of Fig. 2) that sends from LED luminescence chip 1 framework as described in inciding 2 and as described in heat conduction packing material 5 towards as described on the surface of closed cavity 6 time, can reflect more, thereby prevent owing to light absorption produces heat.Thus, further be conducive to heat radiation according to the LED luminescence chip array encapsulation structure of the embodiment of the invention.
That is to say, according to the abovementioned embodiments of the present invention, owing to be filled with inert gas in the described closed cavity 6, so described closed cavity 6, formed the reflectorized material that on the surface of described closed cavity 6, applies of solid conductive heat path and described framework 2 and described heat conduction packing material 5 by described framework 2 and described heat conduction packing material 5, can advantageously generate a heat radiation circulation system that contacts with LED luminescence chip 1, thereby can effectively dispel the heat.
Be understandable that although the present invention with the preferred embodiment disclosure as above, yet above-described embodiment is not to limit the present invention.For any those of ordinary skill in the art, do not breaking away from the technical solution of the present invention scope situation, all can utilize the technology contents of above-mentioned announcement that technical solution of the present invention is made many possible changes and modification, or be revised as the equivalent embodiment of equivalent variations.Therefore, every content that does not break away from technical solution of the present invention according to any simple modification, equivalent variations and the modification that technical spirit of the present invention is done above embodiment, all still belongs in the scope of technical solution of the present invention protection.
Claims (4)
1. LED luminescence chip array encapsulation structure is characterized in that comprising:
Be used for arranging the substrate of LED luminescence chip;
Be arranged in described suprabasil a plurality of LED luminescence chips with matrix-style;
Wrap up the framework of described substrate at the peripheral sidepiece of described substrate;
Be arranged in the heat conduction packing material between described suprabasil described a plurality of LED luminescence chips; And
Be arranged in the cover part on the described framework;
Wherein, described substrate, described framework and described cover part have formed a closed cavity jointly;
And wherein, be filled with inert gas in the described closed cavity;
In addition, described LED luminescence chip array encapsulation structure also comprises the phosphor powder layer on the inner surface of described closed cavity that is arranged in described cover part;
And wherein, the uncoated phosphor powder layer of the outer surface of described a plurality of LED luminescence chips;
Wherein, described cover part is printing opacity;
Wherein, the material of described framework is Heat Conduction Material;
Wherein, described heat conduction packing material is Heat Conduction Material;
And wherein, described framework and described heat conduction packing material has applied reflectorized material on the surface of described closed cavity.
2. LED luminescence chip array encapsulation structure according to claim 1 is characterized in that, the inert gas of filling can be a kind of gas in helium, neon, argon gas, Krypton, xenon and the radon gas or the combination of a plurality of gases.
3. LED luminescence chip array encapsulation structure according to claim 1 and 2 is characterized in that, the material of described framework and the material of described heat conduction packing material are identical Heat Conduction Material.
4. LED luminescence chip array encapsulation structure according to claim 1 and 2 is characterized in that, the material of the material of described framework and described heat conduction packing material is metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210513201.2A CN102983126B (en) | 2012-11-30 | 2012-11-30 | Led luminous chip array packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210513201.2A CN102983126B (en) | 2012-11-30 | 2012-11-30 | Led luminous chip array packaging structure |
Publications (2)
| Publication Number | Publication Date |
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| CN102983126A true CN102983126A (en) | 2013-03-20 |
| CN102983126B CN102983126B (en) | 2015-04-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210513201.2A Expired - Fee Related CN102983126B (en) | 2012-11-30 | 2012-11-30 | Led luminous chip array packaging structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114352954A (en) * | 2022-01-18 | 2022-04-15 | 宁波纬智光电科技有限公司 | Intelligent colorful LED |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201017901Y (en) * | 2007-01-29 | 2008-02-06 | 鹤山丽得电子实业有限公司 | Packaging structure of LED |
| CN101577304A (en) * | 2008-05-05 | 2009-11-11 | 台湾积体电路制造股份有限公司 | Package structure for LED |
| US20120012865A1 (en) * | 2010-07-19 | 2012-01-19 | Jianhua Li | Led array package with a high thermally conductive plate |
-
2012
- 2012-11-30 CN CN201210513201.2A patent/CN102983126B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201017901Y (en) * | 2007-01-29 | 2008-02-06 | 鹤山丽得电子实业有限公司 | Packaging structure of LED |
| CN101577304A (en) * | 2008-05-05 | 2009-11-11 | 台湾积体电路制造股份有限公司 | Package structure for LED |
| US20120012865A1 (en) * | 2010-07-19 | 2012-01-19 | Jianhua Li | Led array package with a high thermally conductive plate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114352954A (en) * | 2022-01-18 | 2022-04-15 | 宁波纬智光电科技有限公司 | Intelligent colorful LED |
| CN114352954B (en) * | 2022-01-18 | 2023-11-28 | 宁波纬智光电科技有限公司 | Colorful LED is dazzled to intelligence |
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| Publication number | Publication date |
|---|---|
| CN102983126B (en) | 2015-04-01 |
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