CN212848471U - Small-angle light-emitting device - Google Patents
Small-angle light-emitting device Download PDFInfo
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- CN212848471U CN212848471U CN202021822012.XU CN202021822012U CN212848471U CN 212848471 U CN212848471 U CN 212848471U CN 202021822012 U CN202021822012 U CN 202021822012U CN 212848471 U CN212848471 U CN 212848471U
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Abstract
The utility model discloses a small-angle light emitting device, including flip-chip substrate, luminous wafer, shading part and filler, flip-chip substrate surface is equipped with the conducting wire, luminous wafer through electrically conductive tie coat set up in electrically conductive wire is last and realize electric connection, be equipped with the leaded light passageway that runs through on the shading part, shading part laminating is in on the flip-chip substrate, the messenger luminous wafer is located leaded light passageway's inside, the filler is filled in the leaded light passageway, light emitting device only the passway mouth of leaded light passageway forms the light emitting area. The utility model provides a small-angle illuminator can change luminous angle and light emitting area size conveniently, used equipment when compatible present traditional LED produces, and the radiating effect is good.
Description
Technical Field
The utility model relates to a light emitting device field especially relates to a small-angle light emitting device.
Background
The light emitting diode LED is used as a new light source of the fourth generation, the advantages of the light emitting diode LED are highlighted in the application fields of landscape, indication, display, backlight, special illumination and the like, and the light emitting diode LED has the great effects of energy conservation, long service life, high response speed and the like. In the centuries of the development of lighting technology, LEDs have developed for decades and have previously been dominated by low-power LED applications. The LED is easy to dynamically control the brightness and the color, has small outline dimension, long service life, no infrared ray and ultraviolet ray in light beams, strong light emitting directivity and the like, so that the LED can be applied to the field of general illumination on a large scale. However, in order to fully exert the performance advantages of the LED and enter some special use markets, the special advantages of the light emitting diode must be exerted, and the color consistency, the angle diversification and the stable reliability are improved.
The LED production process in the current market mainly takes the structure of substrate mould pressing and PLCC as a main part, namely, the two modes of mould pressing or glue dispensing are directly used on carriers such as a bracket or a substrate, the luminous angle of a wafer cannot exceed 180 degrees, so the structure is influenced by the angle of the wafer and the light blocking of a plane substrate, and the appearance colloid structure, the luminous angle of the LED of the structure is generally 60-120 degrees, the minimum angle can only be 15 degrees, and the whole size of the LED cannot be miniaturized or ultra-thinned, so the LED of the structure can meet the requirements after the characteristics of a small angle or a small luminous surface are required to be designed in a special market or a mode such as adding a light shield. The LED packaging structure is produced by adopting a common substrate and a secondary die-pressing process, the LED is manufactured by adopting a normal LED process and a primary die-pressing process, and then the light-shielding colloid is used for covering the colloid of the finished LED of the primary die-pressing by adopting the secondary die-pressing process to reserve the light-emitting surface part required by the LED. Secondly, the product of the secondary die pressing process is difficult to be thinner due to the limit reason of equipment, and the process has the defects that the color consistency of the white light LED cannot be better, the concentration cannot be better, and the brightness cannot be higher.
SUMMERY OF THE UTILITY MODEL
In order to solve the problems of the prior art, the utility model provides a small-angle light-emitting device, technical scheme is as follows:
the utility model provides a low-angle light-emitting device, include
The flip substrate is provided with a conducting circuit on the surface;
the light-emitting wafer is arranged on the conductive circuit through a conductive bonding layer and is electrically connected;
the light shielding part is provided with a light guide channel which penetrates through the light shielding part, and the light shielding part is attached to the flip substrate so that the light-emitting chip is positioned in the light guide channel;
the filler is filled in the light guide channel;
the light emitting device only forms a light emitting surface at the channel opening of the light guide channel.
Furthermore, the light shielding part is made of opaque materials or light absorption materials, and the filler is made of light transmitting materials or fluorescent materials.
Further, the conductive bonding layer is a die bond adhesive.
Further, the axis of the light guide channel is perpendicular to or obliquely intersected with the plane where the flip substrate and the light shielding part are attached.
Further, the light guide channel is in a contraction structure or a straight structure.
Further, the light guide channel is in a regular shape or an irregular shape.
Further, the flip-chip substrate is made of an insulating material capable of being directly welded with a circuit or is provided with a weldable support made of a material with heat dissipation performance.
Furthermore, the light shielding part is provided with a plurality of light guide channels which are not communicated with each other.
Further, the axial directions of the light guide channels are the same or different.
Furthermore, a plurality of groups of light emitting chips are arranged on the conductive circuit, and each group of light emitting chips is positioned in a different light guide channel.
The utility model provides a beneficial effect that technical scheme brought as follows:
a. the clock error between the terminal transformer and the power station is very small, so that the accurate control and monitoring are facilitated;
b. the structure is simple, the installation is convenient, and the modification cost is low;
c. the stability is high, and anti-risk ability is strong, and when external IRIG signal was interrupted suddenly, power equipment still can normally operate.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is an exploded schematic view of a small-angle light-emitting device according to an embodiment of the present invention;
fig. 2 is a schematic view illustrating an assembly effect of the small-angle light-emitting device according to an embodiment of the present invention;
FIG. 3 is a cross-sectional view of the small angle light emitting device of FIG. 2;
fig. 4 is a diagram illustrating a conductive trace distribution for a small-angle lighting device according to an embodiment of the present invention;
fig. 5 is a diagram illustrating a conductive trace distribution for a small-angle lighting device according to an embodiment of the present invention;
fig. 6 is a schematic view of a vertical direction of a conductive circuit of a small-angle light-emitting device according to an embodiment of the present invention.
Wherein the reference numerals include: 1-flip substrate, 11-conductive circuit, 2-conductive bonding layer, 3-light emitting chip, 4-light shielding part, 41-light guide channel and 5-filler.
Detailed Description
In order to make the technical solution of the present invention better understood, the technical solution of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the invention described herein are capable of operation in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, apparatus, article, or device that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or device.
In one embodiment of the present invention, a small angle light emitting device is provided, see fig. 1 and 2, comprising a flip-chip substrate 1, a light emitting chip 3, a light shielding member 4 and a filler 5, the surface of the flip substrate 1 is provided with a conductive circuit 11, the light-emitting chip 3 is arranged on the conductive circuit 11 through a conductive bonding layer 2 under a high temperature condition and is electrically connected, the conductive adhesive layer 2 can be used as a polarity lead-out on the conductive line 11, and can also be used for adhering the light emitting chip 3, the conductive adhesive layer 2 is preferably a solid crystal adhesive, and the light shielding member 4 is made of a light-proof material or a light-absorbing material, such as epoxy, silicone, PC, PPA, PMMA, etc., as shown in fig. 3, a light guide channel 41 is arranged on the light shielding part 4, the light shielding part 4 is attached to the flip substrate 1, and the light emitting chip 3 is positioned in the light guide channel 41; the filler 5 is filled in the light guide channel 41, the filler 5 may be filled in the light guide channel 41 in the form of liquid colloid, and after the filler 5 is cured, the filler 5 and the light shielding member 4 form an integral body, and the filler 5 may also be a solid body with a shape corresponding to the light guide channel 41 and directly inserted into the light guide channel 41. The filler 5 is preferably capable of over-wrapping the light emitting die 3 to provide protection and light guiding for the light emitting die 3.
The light emitting device is only in the opening of light guide 41 forms the light emitting surface, when filler 5 is made by translucent material, such as epoxy, silica gel, UV glue etc., luminous wafer 3 sends out after circular telegram and only can see through filler 5 from light guide 41's opening sends out, when filler 5 is made by the material that has fluorescent substance and similar fluorescent substance, filler 5 absorbs luminous wafer 3's illumination after and sends out light, the light that filler 5 sent out is followed light guide 41's opening sends out.
In an embodiment of the present invention, the axis of the light guide channel 41 and the plane where the flip-chip substrate 1 and the light shielding member 4 are attached may be perpendicular or may intersect obliquely to obtain different light emitting angles. The light guide channel 41 may be a contraction structure, that is, the cross section of the light guide channel 41 is gradually smaller or larger, and the light guide channel 41 may also be a straight structure, that is, the cross section of the light guide channel 41 at different positions is not changed, so as to obtain different light emitting areas. The light guide channel 41 may be regular or irregular, and is determined according to design requirements. It should be noted that, the light shielding member 4 may further have a plurality of light guiding channels 41 that are not intercommunicated, and the light shielding member 4 is attached to the flip substrate 1, so that the plurality of light guiding channels 41 can be respectively aligned to the light emitting chips 3 at different positions, that is, the light emitting chips 3 are respectively located in the corresponding light guiding channels 41, and further, the shapes and axial directions of the plurality of light guiding channels 41 that are not intercommunicated may be different, so as to present different light emitting effects as a whole.
In one embodiment of the present invention, the flip-chip substrate 1 is made of an insulating material to which direct bonding wires can be directly bonded, the flip-chip substrate 1 has a solderable holder made of a heat-dissipating material, the insulating layer with a bonding wire of the substrate is provided with a bonding pad serving as an electrode pin, and a metal layer for preventing oxidation and soldering is plated on the surface thereof, the flip substrate 1 is provided with a conductive circuit 11, the conducting circuit 11 is fixedly provided with one or more groups of light-emitting chips 3 on the exposed metal surface of the flip substrate 1, the cathodes and the anodes of the light-emitting chips 3 are led out to be connected to the conducting circuit 11 on the flip substrate 1 so as to realize the series connection or the parallel connection of the light-emitting chips 3, thus, the electrical connection can be solved, and the heat of the light emitting chip 3 can be conducted out through the plane contacted by the conductive traces 11, and the arrangement of the conductive traces 11 is various, as shown in fig. 4 to 5. Further, the flip-chip substrate 1 is preferably a flat plate with an insulating layer and a metal solid crystal plane, the insulating layer is provided with a solderable wire, the flat plate is provided with a metal solid crystal plane, one surface of the flip-chip substrate 1 provided with a conductive circuit 11 is a horizontal solid crystal plane, the number of the light emitting chips arranged on the solid crystal plane is not limited, the flat plate is set according to requirements, the solid crystal plane is preferably a plane with a smooth surface and a high light reflecting surface degree, and the surface is plated or printed with a solderable metal layer, so that the heat dissipation of the light emitting chips 3 is.
In one embodiment of the present invention, in the process of manufacturing the small-angle light emitting device, one or more groups of light emitting chips are first fixed on a flip substrate, and specifically, the light emitting chips are fixed on the flip substrate through a die attach adhesive; then, a light shielding part which is prepared in advance and provided with a light guide channel is attached to the inverted substrate, so that the light emitting chip is positioned in the light guide channel, the light shielding part is made of a light-proof material or a light-absorbing material, and specifically, the light shielding part is attached to the inverted substrate through a compression molding or injection molding process, so that the light shielding part and the inverted substrate are integrated; and finally, filling a filler into the light guide channel of the light shielding part, wherein the filler is made of a light-transmitting material or a fluorescent material.
The utility model provides a low-angle illuminator utilizes plane flip-chip substrate thermal resistance little, compares with traditional base plate and support, and this base plate need not the connecting substance can be directly to this base plate to the luminous wafer welding on, need not the lead wire and does electrical connection, and according to the base plate material and the semiconductor illuminant that use the difference, power can reach 1W, 3W or higher. Because the utility model discloses a light-emitting device's special character and design make its equipment can share in encapsulation product production technology, and can be compatible with the equipment that uses traditional LED in the product is used, and need not the lead welding, have improved the stability of product greatly to fretwork optical component does not influence in the middle of luminous effect can be changed at any time according to using the product needs difference. The utility model discloses a design of base plate structure makes its production time and traditional LED's equipment compatibility, all very convenient, and can do the formal dress product under certain condition, improves the production mobility of product greatly. And the special substrate characteristics enable the heat dissipation effect of the LED packaging substrate to be better than that of the traditional LED packaging substrate in the practical application process, and the heat resistance is small. The utility model discloses the special technological characteristic who utilizes light guide channel and filler changes luminous angle and light emitting area size, and this product can utilize traditional LED encapsulation equipment and technology simultaneously, can greatly increased production yield and product stability and light shape saturation, the uniformity of color and luster. The production yield and the color consistency are better than those of the prior art, and the LED color consistency can be comparable to that of the traditional LED.
The utility model discloses a shading parts design and processing procedure technology have broken traditional LED low-angle product and have satisfied the requirement with the substrate of taking optics or adopt secondary optics design scheme, and this scheme angle is hardly accomplished low-angle, little light emitting area. The utility model discloses a do the shading part again behind the solid crystal, this shading part adopts the mode mould pressing of fretwork or the manufacturing of injection moulding process, remains the space of LED wafer simultaneously, and this shading part adopts lightproof or extinction material to directly form the integration after the pressfitting to the flip-chip substrate after solid crystal innovatively, and the luminous wafer of cladding in the fretwork optical component is poured into to rethread printing opacity filler or fluorescence filler. The shading part is easy to produce in volume, can be changed into a wide angle and a large light-emitting surface at any time according to the requirements of terminal customers, and has better compatibility, stronger universality and smaller light-emitting surface. The design scheme and the process are simpler in production, higher in yield and better in product color consistency, the overall production efficiency of the product is improved, and the cost is saved.
The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.
Claims (9)
1. A small angle light emitting device, comprising
The flip chip comprises a flip chip substrate (1), wherein a conducting circuit (11) is arranged on the surface of the flip chip substrate (1);
the light-emitting chip (3) is arranged on the conductive circuit (11) through the conductive bonding layer (2) and is electrically connected with the conductive circuit;
the light shielding part (4), a light guide channel (41) which penetrates through the light shielding part (4) is arranged on the light shielding part (4), the light shielding part (4) is attached to the flip substrate (1), and the light emitting chip (3) is positioned in the light guide channel (41);
a filler (5), wherein the filler (5) is filled in the light guide channel (41);
the light-emitting device forms a light-emitting surface only at the channel opening of the light guide channel (41).
2. The small-angle lighting device according to claim 1, wherein the light shielding member (4) is made of opaque material or light absorbing material, and the filler (5) is made of transparent material or fluorescent material.
3. The small angle lighting device according to claim 1, wherein the conductive adhesive layer (2) is a die bond adhesive.
4. The small-angle light emitting device according to claim 1, wherein the axis of the light guide channel (41) intersects the plane where the flip substrate (1) and the light shielding member (4) are attached perpendicularly or obliquely.
5. The small angle lighting device according to claim 1, characterized in that the light guiding channel (41) is a constricted structure or a straight structure.
6. The small angle lighting device according to claim 1, characterized in that the flip-chip substrate (1) is made of insulating material that can be directly soldered to a wire or a solderable holder with heat-dissipating material.
7. The small-angle lighting device according to claim 1, wherein the light shielding member (4) is provided with a plurality of light guiding channels (41) which are not communicated with each other.
8. The small angle lighting device according to claim 7, wherein the axial directions of the light guide channels (41) are the same or different.
9. The small-angle light emitting device according to claim 7, wherein the conductive circuit (11) is provided with a plurality of groups of light emitting chips (3), and each group of light emitting chips (3) is located in a different light guide channel (41).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021822012.XU CN212848471U (en) | 2020-08-27 | 2020-08-27 | Small-angle light-emitting device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202021822012.XU CN212848471U (en) | 2020-08-27 | 2020-08-27 | Small-angle light-emitting device |
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| CN212848471U true CN212848471U (en) | 2021-03-30 |
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| CN202021822012.XU Active CN212848471U (en) | 2020-08-27 | 2020-08-27 | Small-angle light-emitting device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111969089A (en) * | 2020-08-27 | 2020-11-20 | 昆山兴协和光电科技有限公司 | Small-angle light-emitting device and manufacturing method thereof |
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- 2020-08-27 CN CN202021822012.XU patent/CN212848471U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111969089A (en) * | 2020-08-27 | 2020-11-20 | 昆山兴协和光电科技有限公司 | Small-angle light-emitting device and manufacturing method thereof |
| WO2022041721A1 (en) * | 2020-08-27 | 2022-03-03 | 昆山兴协和科技股份有限公司 | Small-angle light-emitting device and manufacturing method therefor |
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