CN212695170U

CN212695170U - Support structure for preventing silver colloid from peeling off

Info

Publication number: CN212695170U
Application number: CN202021304891.7U
Authority: CN
Inventors: 龚文; 梅雄
Original assignee: Suzhou Kinglight Optoelectronics Co ltd
Current assignee: Suzhou Kinglight Optoelectronics Co ltd
Priority date: 2020-07-06
Filing date: 2020-07-06
Publication date: 2021-03-12
Anticipated expiration: 2030-07-06

Abstract

The utility model relates to a LED support field especially relates to a supporting structure who prevents that elargol from peeling off, which comprises a bracket body, the support body is equipped with the functional area, the functional area is L shape structure, be equipped with the bonding region that is used for placing the chip on the functional area, be equipped with a plurality of vertically and horizontally staggered's recess in the bonding region. The support structure not only increases the contact area of the chip and the silver colloid, but also enhances the bonding strength of the chip and the silver colloid, so that the functional area bonding of the silver colloid and the support is better, and the bonding force of the silver colloid and the bottom bonding pad is enhanced.

Description

Support structure for preventing silver colloid from peeling off

Technical Field

The utility model relates to a LED support field especially relates to a prevent bearing structure that elargol peeled off.

Background

The current packaging technology of the SMD device tends to be mature, but due to the size of the functional area, when the packaging, crystal fixing and filling of the conductive silver adhesive are carried out, the adhesive amount and area cannot be enlarged, so that the bonding force between the cured conductive silver adhesive and a bottom bonding pad is poor, and the phenomenon that the SMD device is easily stripped by the silver adhesive due to thermal expansion is caused. Certainly, starting from the aspect of the preferred conductive silver paste or silver plating layer, the cost of the raw material is inevitably increased, and dread is developed in the market trend of the LED, i.e. the cost level is considered to be more ideal. For example, patent CN209626213U discloses a patch LED bracket structure for a display screen, which increases concave pits in a die bonding area to enhance contact between the silver paste of a red LED chip, but the area for mounting the red LED chip is small, which cannot provide a larger contact area for the silver paste, and the bonding stability is poor. Therefore, how to improve the bonding force between the conductive silver paste and the functional region in terms of structural design is a problem that needs to be solved by those skilled in the art.

SUMMERY OF THE UTILITY MODEL

The utility model provides a prevent supporting structure that elargol peeled off, this supporting structure have not only increased the area of contact of chip and elargol, still strengthen the bonding strength of chip and elargol, make the functional area associativity of elargol and support better, make the cohesion reinforcing of elargol and bottom pad.

The technical scheme of the utility model is that:

the utility model provides a prevent supporting structure that elargol peeled off, includes the support body, the support body is equipped with the functional area, the functional area is L shape structure, be equipped with the bonding region that is used for placing the chip on the functional area, be equipped with a plurality of vertically and horizontally staggered's recess in the bonding region.

Further, the groove of the bonding area is filled with silver adhesive, and the chip is fixed on the bonding area through the silver adhesive.

Further, the groove width of the adhesive region was 0.03 mm.

Further, the chip placed on the bonding area is a red chip.

Further, the functional region is formed by punching through a punch press.

Further, the groove of the bonding area is formed by punching through a punch.

Further, the support body is electroplated and injection-molded into a reflection cup body, and the functional area is arranged in the reflection cup body.

Further, the plastic material filled by injection molding is PPA.

Further, the support body is a thin strip made of copper.

Further, the support body is a thin strip made of iron.

The utility model has the advantages that:

the utility model discloses a function area that the pressure was formed L shape structure on the support body reaches the bonding region of forming by the recess constitution of a plurality of vertically and horizontally staggered in the function area, and the silver colloid is all filled to recess in the function area surface of L shape structure and bonding region, has enlarged the packing area and the degree of depth that the silver was glued, and when making the chip pass through the silver and glue to be fixed on the function area, not only increased the area of contact with the silver is glued through the function area of L shape structure, still strengthens the bonding strength with the silver is glued through the bonding region of compriseing a plurality of vertically and horizontally staggered's recess, the utility model discloses a support structure makes the silver glue better with the function area associativity, makes the cohesion reinforcing of silver glue and bottom pad.

Drawings

Fig. 1 is a schematic view of the bracket structure of the present invention;

FIG. 2 is a schematic representation of the groove in the adhesive region before filling with silver paste;

FIG. 3 is a schematic view of the groove in the adhesive region after filling with silver paste;

FIG. 4 is a schematic cross-sectional view of a groove in an adhesive region;

FIG. 5 is a schematic view of the mount body forming a reflective cup;

in the figure: the support comprises a support body 1, a functional area 2, an adhesive area 3, a groove 4 and a reflection cup body 5.

Detailed Description

The drawings are for illustrative purposes only and are not to be construed as limiting the patent; for the purpose of better illustrating the embodiments, certain features of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted. The positional relationships depicted in the drawings are for illustrative purposes only and are not to be construed as limiting the present patent.

Example 1:

as shown in fig. 1-4, a support structure for preventing silver colloid from peeling off, including support body 1, support body 1 is equipped with functional area 2, and functional area 2 is L shape structure, is equipped with bonding area 3 that is used for placing ruddiness chip on the functional area 2, is equipped with a plurality of vertically and horizontally staggered's recess 4 in the bonding area 3, packs the silver colloid in bonding area 3's recess 4, and ruddiness chip accessible silver colloid is fixed on bonding area 3.

In the present embodiment, the width of the groove 4 is 0.03 mm.

In this embodiment, the groove 4 in the bonding region 3 is formed by punching the bracket body 1 through a punch press by adding a groove-type punch to a hardware die.

In this embodiment, the stent body 1 is a thin strip made of copper or iron.

Referring to fig. 5, in the present embodiment, the bracket body 1 is electroplated and injection molded into the reflection cup 5, the functional region 2 is disposed in the reflection cup 5, and the injection molded and filled plastic material is PPA.

The utility model discloses a pressure forming L shape structure's functional area 2 on support body 1 and forming the bonding region 3 of constituteing by a plurality of vertically and horizontally staggered's recess 4 in functional area 2, the silver colloid is all filled to recess 4 in functional area 2 surface of L shape structure and bonding region 3, the packing area and the degree of depth of silver colloid have been enlarged, when making the chip pass through silver colloid and fixing on functional area 2, not only functional area 2 through L shape structure has increased the area of contact with silver colloid, still through the bonding region 3 reinforcing of the recess 4 constitution by a plurality of vertically and horizontally staggered and the bonding strength of silver colloid.

The utility model discloses a functional area of design L shape structure and the bonding area of flute profile, for enlarge the packing area when solid conductive silver glue in follow-up encapsulating, the cohesion between reinforcing silver glue and the bottom pad avoids the problem that the underset SMD device leads to the fact the silver glue to peel off through high temperature thermal energy process.

It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not limitations to the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. The utility model provides a prevent supporting structure that silver colloid peeled off, its characterized in that, includes the support body, the support body is equipped with the functional area, the functional area is L shape structure, be equipped with the bonding region that is used for placing the chip on the functional area, be equipped with a plurality of vertically and horizontally staggered's recess in the bonding region.

2. The stent structure of claim 1, wherein the groove of the bonding area is filled with silver paste, and the chip is fixed on the bonding area by the silver paste.

3. The stent structure for preventing silver colloid peeling according to claim 2, wherein the groove width of the bonding area is 0.03 mm.

4. The scaffold structure for preventing silver colloid from peeling off as claimed in claim 2, wherein the chip placed on the adhesive area is a red chip.

5. The scaffold structure for preventing silver colloid from peeling off as claimed in claim 1, wherein said functional region is formed by punching with a punch press.

6. The scaffold structure for preventing silver colloid from peeling off as claimed in claim 1, wherein the groove of the bonding area is formed by punching with a punch press.

7. The rack structure of claim 1, wherein the rack body is electroplated and injection molded to form a reflective cup, and the functional region is disposed in the reflective cup.

8. The stent structure of claim 7, wherein the injection-molded plastic material is PPA.

9. The stent structure for preventing silver colloid from peeling off as claimed in claim 1, wherein the stent body is a thin strip of copper material.

10. The stent structure for preventing silver colloid from peeling off as claimed in claim 1, wherein the stent body is a thin strip of iron material.