CN204720447U - A kind of electromagnetic shielding module package structure of groove substrate - Google Patents
A kind of electromagnetic shielding module package structure of groove substrate Download PDFInfo
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- CN204720447U CN204720447U CN201520427670.1U CN201520427670U CN204720447U CN 204720447 U CN204720447 U CN 204720447U CN 201520427670 U CN201520427670 U CN 201520427670U CN 204720447 U CN204720447 U CN 204720447U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Abstract
The utility model relates to a kind of electromagnetic shielding module package structure of groove substrate, belongs to technical field of semiconductor encapsulation.It comprises substrate (1), described substrate (1) front offers groove, described substrate (1) surface mount has the first components and parts/IC chip (4), passive device (5), radio frequency chip (6) and the second components and parts/IC chip (9), in described groove, conducting resinl (7) is provided with electro-magnetic shielding cover (8), described passive device (5) and radio frequency chip (6) are arranged in electro-magnetic shielding cover (8), and described substrate (1) upper area is encapsulated with plastic packaging material (10).The electromagnetic shielding module package structure of a kind of groove substrate of the utility model, which simplify technological process, saved production cost, improve production efficiency, reduce the height of whole module simultaneously, plastic-sealed body lower thickness, size is less, is conducive to saving space.
Description
Technical field
The utility model relates to a kind of electromagnetic shielding module package structure of groove substrate, belongs to technical field of semiconductor encapsulation.
Background technology
In recent years, along with the requirement of miniaturization of electronic products development, encapsulation technology is constantly reformed, and intelligent module technology develops rapidly.Because electronic component distribution density is high, the circuit between electronic component is short, and simultaneously electronic component need work under very high operating frequency, and the electromagnetic interference situation between making from the electronic component of electronics external or inside is day by day serious.In order to prevent electromagnetic mutual interference, the scheme of various anti electromagnetic wave interference is arisen at the historic moment.Traditional electromagnetic armouring structure mainly contains two kinds: a kind of is add crown cap above an independent wireless or radio-frequency module, and as shown in Figure 1, its shortcoming is that integrated level is low, and volume is large; Another kind of existing electromagnetic shielding encapsulation module structure as shown in Figure 2, slot after being encapsulating, fill metal and form an electro-magnetic screen layer with metal sputtering, spraying or other plated film modes on the surface of adhesive body on packaging body by its main technique.The shortcoming of adopting in this way is, the epoxy resin (epoxy) of blending 70-75% metal material is adopted to fill plastic-sealed body slotted section during encapsulation, but the metal of high-load is difficult to be distributed in epoxy resin equably, and be easy to be deposited on bottom encapsulated layer, form the hierarchy in accumulation of metal district and epoxy resin district.
Summary of the invention
The purpose of this utility model is to overcome above-mentioned deficiency, a kind of electromagnetic shielding module package structure of groove substrate is provided, which simplify technological process, save production cost, improve production efficiency, reduce the height of whole module simultaneously, plastic-sealed body lower thickness, size is less, is conducive to saving space.
The purpose of this utility model is achieved in that a kind of electromagnetic shielding module package structure of groove substrate, it comprises substrate, described substrate front side offers groove, described substrate surface is pasted with the first components and parts/IC chip, passive device, radio frequency chip and the second components and parts/IC chip, in described groove, conducting resinl is provided with electro-magnetic shielding cover, described passive device and radio frequency chip are arranged in electro-magnetic shielding cover, and described surface region is encapsulated with plastic packaging material.
Described plastic packaging material front flushes higher than electro-magnetic shielding cover or with electro-magnetic shielding cover.
Compared with prior art, the utility model has following beneficial effect:
1, employing arranges the height that reeded substrate can reduce electromagnetic armouring structure, and make whole module height reduction, therefore packaging body lower thickness, size is less, is conducive to saving space;
2, electro-magnetic shielding cover is adopted to be mounted on substrate by conducting resinl, can simplification of flowsheet, not needing to substantially increase production efficiency at plastic-sealed body surface laser fluting, cost-saving;
3, electro-magnetic shielding cover is adopted to be mounted on substrate by conducting resinl, can simplification of flowsheet, do not need to fill metal-to-metal adhesive and save material cost;
4, electro-magnetic shielding cover is adopted to be mounted on substrate by conducting resinl, can simplification of flowsheet, do not need sputtering technology, enhance productivity, cost-saving.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of traditional electromagnetic shielding encapsulating structure.
Fig. 2 is the schematic diagram of existing module packaging electromagnetic armouring structure.
Fig. 3 is the schematic diagram of the electromagnetic shielding module package structure embodiment 1 of a kind of groove substrate of the utility model.
Fig. 4 is the schematic diagram of the electromagnetic shielding module package structure embodiment 2 of a kind of groove substrate of the utility model.
Wherein:
Substrate 1
Conductive posts 2
Base island 3
First components and parts/IC chip 4
Passive device 5
Radio frequency chip 6
Conducting resinl 7
Electro-magnetic shielding cover 8
Second components and parts/IC chip 9
Plastic packaging material 10.
Embodiment
Embodiment 1: Full-plastics sealed
See Fig. 3, the electromagnetic shielding module package structure of a kind of groove substrate of the utility model, it comprises substrate 1, described substrate 1 front offers groove, described substrate 1 surface is provided with base island 3, be connected with substrate 1 back side by conductive posts 2 bottom described base island 3, surface, described base island 3 adopts conductive materials to be pasted with the first components and parts/IC chip 4 by SMT technique, passive device 5, radio frequency chip 6 and the second components and parts/IC chip 9, described groove Nei Ji island 3 is provided with electro-magnetic shielding cover 8 by conducting resinl 7, it is inner that described passive device 5 and radio frequency chip 6 are positioned at electro-magnetic shielding cover 8, described substrate 1 upper area is encapsulated with plastic packaging material 10, described plastic packaging material 10 front is higher than electromagnetism electro-magnetic shielding cover 8.
Embodiment 2: half plastic packaging
See Fig. 4, embodiment 2 is with the difference of embodiment 1: described plastic packaging material 10 front flushes with electro-magnetic shielding cover 8, and this structure is conducive to heat radiation.
Claims (2)
1. the electromagnetic shielding module package structure of a groove substrate, it is characterized in that: it comprises substrate (1), described substrate (1) front offers groove, described substrate (1) surface mount has the first components and parts/IC chip (4), passive device (5), radio frequency chip (6) and the second components and parts/IC chip (9), in described groove, conducting resinl (7) is provided with electro-magnetic shielding cover (8), described passive device (5) and radio frequency chip (6) are arranged in electro-magnetic shielding cover (8), and described substrate (1) upper area is encapsulated with plastic packaging material (10).
2. the electromagnetic shielding module package structure of a kind of groove substrate according to claim 1, is characterized in that: described plastic packaging material (10) front flushes higher than electro-magnetic shielding cover (8) or with electro-magnetic shielding cover (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520427670.1U CN204720447U (en) | 2015-06-19 | 2015-06-19 | A kind of electromagnetic shielding module package structure of groove substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520427670.1U CN204720447U (en) | 2015-06-19 | 2015-06-19 | A kind of electromagnetic shielding module package structure of groove substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204720447U true CN204720447U (en) | 2015-10-21 |
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| CN201520427670.1U Active CN204720447U (en) | 2015-06-19 | 2015-06-19 | A kind of electromagnetic shielding module package structure of groove substrate |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106206547A (en) * | 2016-07-17 | 2016-12-07 | 王培培 | A kind of integrated circuit package structure and manufacture method thereof |
| CN107978593A (en) * | 2017-12-26 | 2018-05-01 | 深圳铨力半导体有限公司 | A kind of encapsulating structure and method for packing of integrated tunable antenna array and radio-frequency module |
| CN108074825A (en) * | 2016-11-11 | 2018-05-25 | 上海磁宇信息科技有限公司 | Magnet assembly chip packaging method and magnet assembly chip package |
| CN110828407A (en) * | 2019-11-19 | 2020-02-21 | 华进半导体封装先导技术研发中心有限公司 | SiP packaging structure and preparation method thereof |
| CN111050534A (en) * | 2019-12-19 | 2020-04-21 | Oppo广东移动通信有限公司 | Substrate assembly and network device |
| CN111816641A (en) * | 2020-08-27 | 2020-10-23 | 华天科技（西安）有限公司 | Electromagnetic shielding packaging structure and method based on secondary plastic packaging |
| CN112259509A (en) * | 2020-09-30 | 2021-01-22 | 中国电子科技集团公司第十三研究所 | Three-dimensional stacked packaging device and assembling process method thereof |
| CN112259532A (en) * | 2020-09-30 | 2021-01-22 | 中国电子科技集团公司第十三研究所 | Microwave millimeter wave packaging device and manufacturing method thereof |
| CN112864132A (en) * | 2019-11-28 | 2021-05-28 | 江苏长电科技股份有限公司 | Packaging structure and packaging method of sensitive device |
| CN112945292A (en) * | 2019-12-11 | 2021-06-11 | 上海磁宇信息科技有限公司 | Gear position/speed sensor |
| CN113261096A (en) * | 2019-12-13 | 2021-08-13 | 深圳市汇顶科技股份有限公司 | Chip packaging structure |
| US11600687B2 (en) | 2020-03-13 | 2023-03-07 | Samsung Display Co., Ltd. | Electronic device package and display device including the same |
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2015
- 2015-06-19 CN CN201520427670.1U patent/CN204720447U/en active Active
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106206547B (en) * | 2016-07-17 | 2018-10-02 | 高燕妮 | A kind of integrated circuit package structure and its manufacturing method |
| CN109524387A (en) * | 2016-07-17 | 2019-03-26 | 高燕妮 | A kind of manufacturing method of integrated circuit package structure |
| CN106206547A (en) * | 2016-07-17 | 2016-12-07 | 王培培 | A kind of integrated circuit package structure and manufacture method thereof |
| CN108074825A (en) * | 2016-11-11 | 2018-05-25 | 上海磁宇信息科技有限公司 | Magnet assembly chip packaging method and magnet assembly chip package |
| CN107978593A (en) * | 2017-12-26 | 2018-05-01 | 深圳铨力半导体有限公司 | A kind of encapsulating structure and method for packing of integrated tunable antenna array and radio-frequency module |
| CN107978593B (en) * | 2017-12-26 | 2024-02-20 | 华进半导体封装先导技术研发中心有限公司 | Packaging structure and packaging method for integrated tunable antenna array and radio frequency module |
| CN110828407A (en) * | 2019-11-19 | 2020-02-21 | 华进半导体封装先导技术研发中心有限公司 | SiP packaging structure and preparation method thereof |
| CN112864132A (en) * | 2019-11-28 | 2021-05-28 | 江苏长电科技股份有限公司 | Packaging structure and packaging method of sensitive device |
| CN112945292A (en) * | 2019-12-11 | 2021-06-11 | 上海磁宇信息科技有限公司 | Gear position/speed sensor |
| CN113261096A (en) * | 2019-12-13 | 2021-08-13 | 深圳市汇顶科技股份有限公司 | Chip packaging structure |
| CN111050534A (en) * | 2019-12-19 | 2020-04-21 | Oppo广东移动通信有限公司 | Substrate assembly and network device |
| US11600687B2 (en) | 2020-03-13 | 2023-03-07 | Samsung Display Co., Ltd. | Electronic device package and display device including the same |
| CN111816641A (en) * | 2020-08-27 | 2020-10-23 | 华天科技（西安）有限公司 | Electromagnetic shielding packaging structure and method based on secondary plastic packaging |
| CN112259532A (en) * | 2020-09-30 | 2021-01-22 | 中国电子科技集团公司第十三研究所 | Microwave millimeter wave packaging device and manufacturing method thereof |
| CN112259509A (en) * | 2020-09-30 | 2021-01-22 | 中国电子科技集团公司第十三研究所 | Three-dimensional stacked packaging device and assembling process method thereof |
| CN112259532B (en) * | 2020-09-30 | 2022-12-13 | 中国电子科技集团公司第十三研究所 | Microwave millimeter wave packaging device and manufacturing method thereof |
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