CN117577620A - Resin sheet lamination packaging support and processing technology thereof - Google Patents
Resin sheet lamination packaging support and processing technology thereof Download PDFInfo
- Publication number
- CN117577620A CN117577620A CN202311845042.0A CN202311845042A CN117577620A CN 117577620 A CN117577620 A CN 117577620A CN 202311845042 A CN202311845042 A CN 202311845042A CN 117577620 A CN117577620 A CN 117577620A
- Authority
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- Prior art keywords
- cover plate
- bottom plate
- metal
- packaging
- resin sheet
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 56
- 229920005989 resin Polymers 0.000 title claims abstract description 56
- 239000011347 resin Substances 0.000 title claims abstract description 56
- 238000003475 lamination Methods 0.000 title claims abstract description 16
- 238000012545 processing Methods 0.000 title claims description 15
- 238000005516 engineering process Methods 0.000 title claims description 12
- 239000002184 metal Substances 0.000 claims abstract description 78
- 229910052751 metal Inorganic materials 0.000 claims abstract description 78
- 239000012790 adhesive layer Substances 0.000 claims abstract description 8
- 238000005538 encapsulation Methods 0.000 claims abstract description 7
- 238000004891 communication Methods 0.000 claims abstract description 4
- 238000003825 pressing Methods 0.000 claims description 31
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 22
- 238000007747 plating Methods 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
- 229910052802 copper Inorganic materials 0.000 claims description 17
- 239000010949 copper Substances 0.000 claims description 17
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 15
- 229910052737 gold Inorganic materials 0.000 claims description 15
- 239000010931 gold Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 15
- 239000004020 conductor Substances 0.000 claims description 12
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 11
- 239000010410 layer Substances 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 229910052759 nickel Inorganic materials 0.000 claims description 11
- 229910052709 silver Inorganic materials 0.000 claims description 11
- 239000004332 silver Substances 0.000 claims description 11
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 238000009713 electroplating Methods 0.000 claims description 10
- 238000005520 cutting process Methods 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 5
- 239000003292 glue Substances 0.000 claims description 5
- 239000004033 plastic Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000005553 drilling Methods 0.000 claims description 4
- 238000009824 pressure lamination Methods 0.000 claims description 3
- 238000005192 partition Methods 0.000 abstract description 3
- 238000013461 design Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000004819 Drying adhesive Substances 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000010147 laser engraving Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Ceramic Engineering (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The invention discloses a resin sheet lamination packaging support, which belongs to the technical field of packaging supports and comprises a bottom plate and a cover plate arranged on the bottom plate, wherein the bottom plate and the cover plate are laminated into a whole through an adhesive layer, a metal circuit conducting area is etched on the surface of the bottom plate, a metal PIN foot is etched on the back surface of the bottom plate, the metal circuit conducting area is in conductive intercommunication with the metal PIN foot, the cover plate is of a frame structure, grid supports are arranged in the cover plate in a crossing manner, and the grid supports divide the inner part of the cover plate into a plurality of block packaging supports. According to the packaging support, the metal circuit conducting area is etched on the surface of the bottom plate, the metal PIN is etched on the back, and the metal circuit conducting area is in conducting communication with the metal PIN, so that the packaging support can be applicable to electronic components with multiple PIN, and the PIN can be arranged at will and has large size; through setting up the apron into the frame to set up the net support in its inside, become a plurality of cubic encapsulation supports with apron internal partition, guarantee that encapsulation support can carry out arbitrary size and cut, be applicable to the electronic components of little interval.
Description
Technical Field
The invention relates to the technical field of packaging supports, in particular to a resin sheet pressing packaging support.
Background
The electronic component packaging bracket is assembled by adopting C2046 and C194 copper plates and PPA plastic materials at present, and the processing procedures of the bracket comprise copper electroplating, stamping, injection molding, bending, cutting and cleaning, so that the cost of a production die is high, the special design is adopted, the number of PIN PINs is more, the size of the bracket finished product is larger, and the use of small-space products is inconvenient; in particular to the application of a small-space display, in addition, the conventional CHIP product has the problems of light leakage around and poor waterproof and airtight properties; therefore, a new resin sheet pressing packaging bracket is needed to solve the above problems.
Disclosure of Invention
The invention mainly aims to provide a resin sheet pressing packaging bracket and a processing technology thereof, and aims to solve the technical problems that the existing packaging bracket is high in processing cost, not applicable to brackets with a large number of PIN PINs and small-space products.
In order to achieve the above purpose, the invention provides a resin sheet lamination packaging support, which comprises a bottom plate and a cover plate arranged on the bottom plate, wherein the bottom plate and the cover plate are laminated into a whole through an adhesive layer, a metal circuit conductive area is etched on the surface of the bottom plate, a metal PIN foot is etched on the back surface of the bottom plate, the metal circuit conductive area is in conductive intercommunication with the metal PIN foot, the cover plate is of a frame structure, grid supports are arranged in the cover plate in a crossing manner, and the grid supports divide the inner part of the cover plate into a plurality of block packaging supports.
Preferably, the bottom plate and the cover plate are made of plastic materials or BT material, the thickness of the bottom plate is 0.1-2mm, and the thickness of the cover plate is more than or equal to 0.18-20 mm.
Preferably, the cover plate is in an irregular ring shape or a quadrilateral shape or an elliptic shape or a polygonal shape, and the inner diameter or the length and width of the cover plate are more than or equal to 1mm.
Preferably, the adhesive layer is a resin adhesive.
Preferably, the base material of the metal circuit conductive area is a metal conductive material, the metal conductive material is arranged on the surface or the bottom surface of the bottom plate, the thickness of the metal conductive material is 0.02-2mm, and the metal conductive material is pressed on the bottom plate through a resin adhesive.
Preferably, the surface of the metal conductive material needs to be electroplated to form an electroplated layer, and the electroplated metal of the electroplated layer is copper, nickel, silver and gold, wherein the thickness of the electroplated layer of nickel, silver and gold is 1u "-500u".
Preferably, the bottom plate and the cover plate are laminated into a whole by a high-pressure lamination machine, and the TG point of the bottom plate and the cover plate is 300 ℃.
The invention also provides a processing technology of the resin sheet pressing packaging bracket, which comprises the following steps:
s1: cutting the bottom plate, and drilling the bottom plate;
s2: bonding copper sheets on the surface and the bottom surface of the bottom plate;
s3: manufacturing a metal circuit conductive area or a metal PIN foot through laser and exposure etching processes;
s4: electroplating the metal circuit conductive area and the metal PIN foot;
s5: electroplating and filling holes or resin holes in the metal circuit conductive areas to enable the metal circuit conductive areas to be in conductive communication with the metal PIN PINs;
s6: processing the cover plate by laser forming or CNC forming to enable the interior of the cover plate to be in a grid shape;
s7: coating glue on the bottom surface of the cover plate, and pressing the cover plate on the bottom plate through a pressing machine;
s8: finally, packaging the electronic components, and then cutting and forming according to the size.
Preferably, the plating process in step S4 is performed in the order of copper plating, nickel plating, silver plating, and gold plating, or may be performed without gold plating.
Preferably, in step S7, for small-sized products, the products may be packaged and then pressed, the pressing temperature is 100-160 °, and the pressing time is 1-5min.
The technical scheme of the invention has the beneficial effects that:
the resin sheet lamination packaging support mainly comprises a bottom plate and a cover plate, wherein a metal circuit conducting area is etched on the surface of the bottom plate, a metal PIN is etched on the back surface of the bottom plate, and the metal circuit conducting area is in conductive intercommunication with the metal PIN, so that the resin sheet lamination packaging support can be applicable to electronic components with multiple PIN, and the PIN can be arranged at will and has large size; through setting up the apron into frame construction to set up the net support in its inside, become a plurality of cubic encapsulation supports with apron internal partition, guarantee that encapsulation support can carry out arbitrary size and cut, be applicable to the electronic components of little interval. The processing technology of the resin sheet pressing packaging bracket provided by the invention saves the processing procedure and the cost of the packaging bracket; and ensure the shape and size of the packaging bracket to be cut at will, thus being applicable to the packaging of electronic components with small spacing.
Drawings
FIG. 1 is a schematic diagram of a resin sheet lamination package frame according to an embodiment of the present invention;
FIG. 2 is a schematic diagram showing a split structure of an embodiment of a resin sheet lamination package support according to the present invention;
FIG. 3 is a schematic cross-sectional view of a resin sheet lamination package support according to the present invention;
FIG. 4 is a schematic diagram of a resin sheet lamination package carrier according to an embodiment of the present invention after dicing;
fig. 5 is a schematic view showing a bottom structure of a resin sheet pressing package support after cutting according to an embodiment of the invention.
In the figure: the device comprises a 1-bottom plate, a 2-cover plate, a 3-bonding layer, a 4-metal circuit conducting area, a 5-metal PIN foot and a 6-grid bracket.
Detailed Description
The following description of the embodiments of the present invention will be made more clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The invention provides a resin sheet lamination packaging support, referring to figures 1-5, which comprises a bottom plate 1 and a cover plate 2 arranged on the bottom plate, wherein the bottom plate 1 and the cover plate 2 are laminated into a whole through an adhesive layer 3, a metal circuit conducting area 4 is etched on the surface of the bottom plate 1, a metal PIN foot 5 is etched on the back surface of the bottom plate, the metal circuit conducting area 4 and the metal PIN foot 5 are in conductive intercommunication, the cover plate 2 is of a frame structure, grid supports 6 are arranged in the cover plate 2 in a crossing manner, and the grid supports 6 divide the inner part of the cover plate 2 into a plurality of block packaging supports.
The resin sheet lamination packaging bracket comprises a bottom plate 1 and a cover plate 2, wherein the cover plate 2 and the bottom plate 1 are laminated into an integrated structure through an adhesive layer, a metal circuit conducting area 4 is etched on the surface of the bottom plate 1, a metal PIN foot 5 is etched on the back surface, and the metal circuit conducting area 4 and the metal PIN foot 5 are in conductive intercommunication, so that the electronic components which can be applicable to multiple PIN feet and can be arranged at will and have large sizes are ensured; through setting up apron 2 to frame construction to set up grid support 6 in its inside, become a plurality of cubic encapsulation supports with apron 2 internal partition, guarantee that encapsulation support can carry out arbitrary size and cut, be applicable to the electronic components of closely spaced.
In a preferred embodiment, referring to fig. 1-5, the bottom plate 1 and the cover plate 2 of the resin sheet pressing packaging bracket are made of plastic materials or BT materials, the thickness of the bottom plate 1 is 0.1-2mm, and the thickness of the cover plate 2 is more than or equal to 0.18mm-20mm. The bottom plate 1 and the cover plate 2 are made of plastic materials or BT materials, including but not limited to any resin materials, wherein the bottom plate 1 is a base plate, the thickness range of the base plate is 0.1-2mm, the length is designed according to the stroke of actual cutting equipment, the base plate is not limited to specific dimensions, and the minimum size of the base plate is the size of a single component; the cover plate 2 is a protective shell of the grid support 6, and plays a role in wrapping and molding packaging glue during packaging, and the raw material of the cover plate is a flat resin sheet, but is not limited to silicone or epoxy resin.
In a preferred embodiment, referring to fig. 1 to 5, the cover plate 2 of the resin sheet press-fit packaging bracket is irregularly annular or quadrangular or elliptic or polygonal in shape, and the inner diameter or length and width thereof is equal to or greater than 1mm. The adhesive layer 3 is a resin adhesive. The cover plate can be in the shape of a ring, a quadrangle, an ellipse or a polygon, and is formed by laser or CNC (computer numerical control) and is pressed right above the metal circuit conductive area 4 through a resin adhesive during installation.
In a preferred embodiment, referring to fig. 1 to 5, the substrate of the metal circuit conductive area 4 of the resin sheet lamination package support is a metal conductive material, which is disposed on the surface or bottom of the base plate 1, and has a thickness of 0.02-2mm, and the metal conductive material is laminated on the base plate through a resin adhesive. The surface of the metal conductive material is required to be electroplated to form an electroplated layer, and the electroplated metal of the electroplated layer is copper, nickel, silver and gold, wherein the thickness of the electroplated layer of nickel, silver and gold is 1-500 u.
The base material of the metal circuit conductive area 4 is a metal conductive material, specifically a copper sheet, which can be arranged on the surface and/or the bottom surface of the bottom plate 1, specifically set according to actual circuit requirements, the metal circuit conductive area 4 is mainly used for conductive welding of components, after etching the metal circuit, the metal is plated on the surface of the metal circuit, so that the metal circuit has a conductive function, the electroplating process comprises copper plating, nickel plating, silver plating, gold plating, or gold plating, wherein the thickness of the electroplated layers of nickel, silver and gold is 1u '-500 u'.
In a preferred embodiment, referring to fig. 1 to 5, the base plate 1 and the cover plate 2 of the resin sheet lamination package support are integrally laminated by a high pressure lamination machine, and the TG point thereof is 300 ℃. The base plate 1 and the cover plate 2 are pressed into a whole through a pressing machine, the base plate 1 and the cover plate 2 are resin base material sheets, the resin base material sheet has the characteristic of high temperature resistance and high humidity resistance, the TG point is 300 ℃, the resin base material sheet is particularly suitable for packaging electronic components, particularly suitable for packaging LED and IC integrated circuit supports, and the resin base material sheet can reach the standard above IP68 after being sealed and packaged.
As a preferable scheme, the base material of the metal circuit conductive area is a copper sheet, and a resin adhesive and a high-temperature high-pressure pressing machine are adopted during installation, so that the copper sheet is uniformly tiled and adhered on a bottom plate, wherein the thickness of the copper sheet is generally 0.02-2mm, a circuit can be arbitrarily designed through exposure etching or laser engraving by an integrated circuit manufacturing process, the circuit is not limited by a die, the minimum line diameter is 0.08mm, the minimum bottom PIN is 0.08mm, the directions can be arbitrarily arranged, and the circuit is suitable for bottom sorting test; the front and back surfaces of the bottom plate after the lamination are subjected to numerical control drilling technology, and then the circuits on the front and back surfaces of the bottom plate are conducted through electroplating hole filling technology.
In addition, the cover plate is formed by laser and CNC, is not limited by a traditional bracket stamping injection mold, can be designed according to requirements, has the minimum inner diameter of 1mm and the minimum thickness of 0.18, and can be applied to the field of small-space electronic components, in particular to the mini LED display screen and backlight industry. The manufacturing method comprises the steps of firstly forming a resin sheet substrate, namely a cover plate, by laser and CNC forming technology according to the designed size to manufacture a required inner frame shape, and then pressing the inner frame shape on the upper side of a metal circuit conductive area through a resin adhesive to form a surrounding, so that the surrounding is used for packaging and forming electronic components.
The resin sheet pressing packaging bracket provided by the invention also has the following characteristics:
1. compared with the traditional packaging support, the packaging support provided by the invention omits the working procedures of stamping, injection molding, bending and the like, and saves the production cost;
2. the packaging cover plate is manufactured by adopting a laser and CNC (computerized numerical control) process, the appearance size can be designed at will, and the problem of using a special die is solved;
3. the packaging support is different from a copper stamping process, has the minimum requirement on the size of a PIN PIN of more than 0.5mm, can achieve the minimum of the PIN PIN of 0.08mm, is suitable for packaging small-space electronic components, solves the packaging problem of mini LEDs and ICs, and can realize the design of a display screen with ultra-small P1.0, such as a multicolor display series;
4. the invention adopts a resin sheet forming cover plate process, the total thickness of the bracket can be 0.36mm at the minimum and 20mm at the maximum, and the resin sheet forming cover plate can be well applied to the small-space display industry, and is particularly suitable for the packaging size bracket within 2.0mm, especially for the multicolor LED bracket with frames of 1.5mm, 1.5mm and 1.0 mm.
The invention also provides a processing technology of the resin sheet pressing packaging bracket, which comprises the following steps:
s1: cutting the bottom plate, and drilling the bottom plate;
s2: bonding copper sheets on the surface and the bottom surface of the bottom plate;
s3: manufacturing a metal circuit conductive area or a metal PIN foot through laser and exposure etching processes;
s4: electroplating the metal circuit conductive area and the metal PIN foot;
s5: electroplating and filling holes or resin holes in the metal circuit conductive areas to enable the metal circuit conductive areas to be in conductive communication with the metal PIN PINs; the aperture is 0.02-0.8mm.
S6: processing the cover plate by laser forming or CNC forming to enable the interior of the cover plate to be in a grid shape;
s7: coating glue on the bottom surface of the cover plate, and pressing the cover plate on the bottom plate through a pressing machine; the glue coating adopts two processes, wherein the first is silk-screen adhesive and the second is a double-sided quick-drying adhesive film;
s8: finally, packaging the electronic components, and then cutting and forming according to the size.
The electroplating processing sequence in the step S4 is copper plating, nickel plating, silver plating and gold plating, or gold plating is not required.
In step S7, for small-sized products, the products can be packaged and pressed, the pressing temperature is 100-160 degrees, and the pressing time is 1-5min. The pressing force is linearly increased by 4-50 KG.
The processing technology of the resin sheet pressing packaging support can realize the packaging support with a small-spacing frame, reduce the manufacturing cost of a support die, improve the reliability of CHIP products, realize the display application design of the small-spacing P1.0 when applied to the LED industry, and realize complete light-tightness around unlike the conventional CHIP products.
The above description of the preferred embodiments of the present invention should not be taken as limiting the scope of the invention, but rather should be understood to cover all modifications, variations and adaptations of the present invention using its general principles and the following detailed description and the accompanying drawings, or the direct/indirect application of the present invention to other relevant arts and technologies.
Claims (10)
1. A resin sheet pressfitting encapsulation support which characterized in that: the integrated circuit board comprises a bottom plate and a cover plate arranged on the bottom plate, wherein the bottom plate and the cover plate are integrated through an adhesive layer in a pressing mode, a metal circuit conducting area is etched on the surface of the bottom plate, a metal PIN foot is etched on the back of the bottom plate, the metal circuit conducting area is in conductive intercommunication with the metal PIN foot, the cover plate is of a frame structure, grid supports are arranged in the cover plate in a crossing mode, and the grid supports divide the inner portion of the cover plate into a plurality of block-shaped packaging supports.
2. The resin sheet pressing packaging bracket according to claim 1, wherein the bottom plate and the cover plate are made of plastic materials or BT material, the thickness of the bottom plate is 0.1-2mm, and the thickness of the cover plate is more than or equal to 0.18-20 mm.
3. The resin sheet pressing packaging bracket according to claim 1, wherein the cover plate is irregularly annular or quadrangular or elliptic or polygonal, and the inner diameter or length and width of the cover plate are larger than or equal to 1mm.
4. The resin sheet press-fit packaging bracket according to claim 1, wherein the adhesive layer is a resin adhesive.
5. The resin sheet press-fit packaging bracket according to claim 1, wherein the base material of the metal circuit conductive area is a metal conductive material which is arranged on the surface or the bottom surface of the bottom plate and has a thickness of 0.02-2mm, and the metal conductive material is press-fit on the bottom plate through a resin adhesive.
6. The resin sheet pressing package support according to claim 5, wherein the surface of the metal conductive material is required to be electroplated to form an electroplated layer, and the electroplated metal of the electroplated layer is copper, nickel, silver or gold, wherein the thickness of the electroplated layer of nickel, silver or gold is 1-500 u ".
7. The resin sheet lamination packaging bracket according to claim 1, wherein the base plate and the cover plate are laminated into a whole by a high-pressure lamination machine, and the TG point thereof is 300 ℃.
8. The processing technology of the resin sheet pressing packaging bracket is characterized by comprising the following steps of:
s1: cutting the bottom plate, and drilling the bottom plate;
s2: bonding copper sheets on the surface and the bottom surface of the bottom plate;
s3: manufacturing a metal circuit conductive area or a metal PIN foot through laser and exposure etching processes;
s4: electroplating the metal circuit conductive area and the metal PIN foot;
s5: electroplating and filling holes or resin holes in the metal circuit conductive areas to enable the metal circuit conductive areas to be in conductive communication with the metal PIN PINs;
s6: processing the cover plate by laser forming or CNC forming to enable the interior of the cover plate to be in a grid shape;
s7: coating glue on the bottom surface of the cover plate, and pressing the cover plate on the bottom plate through a pressing machine;
s8: finally, packaging the electronic components, and then cutting and forming according to the size.
9. The process for manufacturing a resin sheet press-fit package carrier according to claim 8, wherein the plating process in step S4 is performed in the order of copper plating, nickel plating, silver plating, and gold plating, or without gold plating.
10. The process for manufacturing a resin sheet press-fit packaging bracket according to claim 8, wherein in step S7, for small-sized products, the packaging is performed first and then the packaging is performed, the pressing temperature is 100-160 °, and the pressing time is 1-5min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311845042.0A CN117577620A (en) | 2023-12-29 | 2023-12-29 | Resin sheet lamination packaging support and processing technology thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311845042.0A CN117577620A (en) | 2023-12-29 | 2023-12-29 | Resin sheet lamination packaging support and processing technology thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117577620A true CN117577620A (en) | 2024-02-20 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311845042.0A Pending CN117577620A (en) | 2023-12-29 | 2023-12-29 | Resin sheet lamination packaging support and processing technology thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117577620A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118053962A (en) * | 2024-04-16 | 2024-05-17 | 深圳市色彩光电有限公司 | Magic color lamp bead structure and manufacturing method thereof |
-
2023
- 2023-12-29 CN CN202311845042.0A patent/CN117577620A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118053962A (en) * | 2024-04-16 | 2024-05-17 | 深圳市色彩光电有限公司 | Magic color lamp bead structure and manufacturing method thereof |
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