CN112584618A - Wavy LED lamp strip circuit board and manufacturing method - Google Patents
Wavy LED lamp strip circuit board and manufacturing method Download PDFInfo
- Publication number
- CN112584618A CN112584618A CN201910961524.XA CN201910961524A CN112584618A CN 112584618 A CN112584618 A CN 112584618A CN 201910961524 A CN201910961524 A CN 201910961524A CN 112584618 A CN112584618 A CN 112584618A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- wavy
- lamp strip
- led lamp
- strip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0283—Stretchable printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
Abstract
The invention relates to a wavy LED lamp strip circuit board and a manufacturing method thereof, in particular to a lamp strip circuit board which is extruded and molded into a wavy structure with a convex front surface or/and a convex back surface by a mold to form a telescopic circuit board without welding a pad of a component, and the lamp strip manufactured by the circuit board is the telescopic lamp strip which is not easy to break when being bent.
Description
Technical Field
The invention relates to the field of LED lamp belts, in particular to a wavy LED lamp belt circuit board and a manufacturing method thereof.
Background
LED circuit board lamp area has always, many positions all need crooked use as required during the use, lamp area all causes the circuit board bending fracture very easily when crooked use usually, or the circuit board is broken string, or long lamp area is because of self weight is heavy when the installation, because of tensile fracture, or there is thick copper line or copper winding displacement at the lamp area circuit board back, during the bending, thick copper pushes up circuit board absolutely, or pushes up circuit board absolutely when the waterproof resin of lamp area package is crooked, how to solve this crooked and tensile easy-to-break problem, improve the anti-flex ability, a difficult problem in the industry has always been.
In order to overcome the defects and solve the technical problems, the lamp strip circuit board is manufactured into a wavy three-dimensional circuit board, the lamp strip circuit board is extruded into a wavy shape by a mould without welding a bonding pad of a component, and the lamp strip manufactured by the circuit board is a wavy telescopic lamp strip which is not easy to break when bent and stretched.
Disclosure of Invention
The invention relates to a wavy LED lamp strip circuit board and a manufacturing method thereof, in particular to a lamp strip circuit board which is extruded and molded into a wavy structure with a convex front surface or/and a convex back surface by a mold to form a telescopic circuit board without welding a pad of a component, and the lamp strip manufactured by the circuit board is the telescopic lamp strip which is not easy to break when being bent.
The invention provides a method for manufacturing a wavy LED lamp strip circuit board, and particularly relates to a method for extruding a connected circuit board containing a plurality of lamp strip circuit boards into a wavy shape by using an extrusion die, wherein the extrusion die consists of an upper template and a lower template, the upper template and the lower template are respectively provided with a plurality of grooves and convex ribs, or one of the upper template and the lower template is provided with convex ribs, the other template is provided with grooves, when the upper template and the lower template are aligned and overlapped, each convex rib corresponds to one groove and forms a state that the convex ribs are embedded into the grooves, the lower template is provided with positioning pins, the upper template is provided with positioning holes, the circuit board is placed on the lower template, then the upper template is placed on the circuit board, the template positioning holes are hung on the positioning pins, the whole positioning lamination is placed in a press, after the cold pressing lamination is completed, the combination is taken out of the press, the circuit board is, the circuit board is pressed into a wavy shape, the wavy circuit board is a telescopic circuit board, and the LED lamp strip manufactured by using the circuit board is resistant to stretching and bending, and is not easy to break when bent or stretched
According to the present invention, there is also provided a wavy LED strip circuit board, comprising: a single-layer or double-layer circuit board; the wave-shaped structure is arranged on the circuit board and protrudes; the LED lamp strip is characterized in that a plurality of raised waves are formed on two surfaces of the circuit board, or a plurality of raised waves are formed on one surface of the circuit board, the formed wavy circuit board is a three-dimensional circuit board extruded by a planar circuit board, the whole wavy circuit board is a shaped three-dimensional flexible circuit board when no external force stretches or extrudes, when the wavy circuit board is stretched or extruded by an external force, the raised parts can be stretched or extruded to deform, so that the whole circuit board can be stretched and lengthened longitudinally (in the long direction), or can be extruded to lengthen or shorten, the circuit board is a connected circuit board containing a plurality of lamp strip circuit boards, the LED lamp strip made of the circuit board is a telescopic lamp strip, and when the lamp strip is used, the LED lamp strip is not easy to break when being bent or stretched.
According to a preferred embodiment of the invention, the wavy structure arranged on the circuit board is a protruding wavy structure, and the circuit board is shaped by extrusion, so that the circuit board is a stable structure when the lamp strip is manufactured, the printed solder paste can be printed accurately, and the circuit board can be attached accurately when an SMT machine is used for attaching components.
According to a preferred embodiment of the invention, the wavy LED strip circuit board is characterized in that the circuit board is a connected circuit board comprising a plurality of strip circuit boards, and the positions of the protrusions of each strip circuit board can be the same or different.
According to a preferred embodiment of the present invention, the wavy LED strip circuit board is characterized in that the wavy structure protruding on the circuit board is formed at a position avoiding the position of the soldering component, and the protruding is formed at a non-component blank of the circuit board.
According to a preferred embodiment of the present invention, the wavy LED strip circuit board is characterized in that when the circuit board is a single-layer circuit board, the single-layer circuit board is a circuit board made of conducting wires, or a circuit board made of copper foils.
According to a preferred embodiment of the present invention, the wavy LED strip circuit board is characterized in that when the circuit board is a double-layer circuit board, the two layers of circuits of the double-layer circuit board are conducted in a through hole copper plating manner, or the two layers of circuits are conducted in a tin soldering manner, or the two layers of circuits are conducted in a conductive ink manner.
The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.
Drawings
The features, objects, and advantages of the present invention will become more apparent from the description set forth below when taken in conjunction with the drawings, a brief description of which follows.
Fig. 1 is a schematic plan view of a wiring board.
FIG. 2 is a schematic cross-sectional view of an extrusion die having a plurality of grooves and ribs on both the upper and lower die plates.
FIG. 3 is a schematic cross-sectional view of the extrusion die of FIG. 2 for extruding a circuit board.
Fig. 4 is a schematic cross-sectional view of a circuit board having a plurality of raised waves on both sides.
FIG. 5 is a schematic cross-sectional view of an extrusion die having an upper die plate with a plurality of grooves and a lower die plate with a plurality of ribs.
FIG. 6 is a schematic cross-sectional view of the extrusion die of FIG. 5 for extruding a circuit board.
Fig. 7 is a schematic cross-sectional view of a circuit board having a plurality of raised waves on only one side.
Fig. 8 is a schematic plan view of a wavy LED strip circuit board.
Detailed Description
The present invention will be described in detail below by taking preferred embodiments as examples.
It will be understood by those skilled in the art that the following descriptions are provided for purposes of illustration and description of certain preferred embodiments only and are not intended to limit the scope of the present invention.
Manufacturing a circuit board:
the single-layer circuit board 1 shown in the figure 1 is manufactured by adopting a traditional circuit board manufacturing process and carrying out processes of silk-screen printing of circuit anti-corrosion ink, baking curing, etching, film stripping, silk-screen printing of front ink solder mask on a single-layer flexible copper-clad plate to expose a resistance pad 1.1a and an LED lamp pad 1.1b, baking, character printing, baking curing, OSP anti-oxidation and the like, wherein in the processing flow, the mark 1 in the figure 1 represents the single-layer circuit board.
Or drilling a double-layer flexible copper-clad plate, depositing copper, plating copper, pasting a dry film, exposing and displaying a scene, etching, removing a film, silk-screening front ink solder mask to expose a resistance pad 1.1a and an LED lamp pad 1.1b, baking, silk-screening back ink solder mask, baking, character baking, OSP anti-oxidation and other processes to manufacture the double-layer circuit board 1 shown in the figure 1, wherein in the processing flow, the mark 1 in the figure 1 indicates the double-layer circuit board.
Manufacturing an extrusion die:
cutting waves from the middle of the thickness of a steel plate with the thickness of 15mm by adopting a linear cutting processing mode according to designed cutting data to divide the steel plate into two parts, cutting to manufacture an upper template 2.1a and a lower template 2.1b, meanwhile, a groove 2.2a and a convex rib 2.2b are cut on the upper template 2.1a, a convex rib 2.2b and a groove 2.2a are correspondingly cut on the lower template 2.1b, the groove 2.2a on the upper template 2.1a is correspondingly matched with the convex rib 2.2b on the lower template 2.1b, the convex rib 2.2b on the upper template 2.1a is correspondingly matched with the groove 2.2a on the lower template 2.1b, and then 4 positioning holes are processed and manufactured on the processing center, then, a positioning pin is mounted on the lower template 2.1b, and after grinding and polishing, an extrusion die (as shown in fig. 2) is manufactured, wherein the upper template 2.1a and the lower template 2.1b are respectively provided with a plurality of grooves 2.2a and ribs 2.2b which are matched with each other correspondingly.
Or, according to another cutting data of the design, an extrusion die is manufactured, in which the upper die plate 2.1a has a plurality of grooves 2.2a, the lower die plate 2.1b has a plurality of ribs 2.2b, and the grooves 2.2a on the upper die plate 2.1a and the ribs 2.2b on the lower die plate 2.1b are matched with each other correspondingly (as shown in fig. 5).
Manufacturing a wavy circuit board:
the LED circuit board with the wavy light strip is manufactured by using an extrusion die shown in figure 2, placing a circuit board 1 on a lower template 2.1b, sleeving a hole in the circuit board 1 on a positioning pin of the lower template 2.1b for alignment and fixing, or aligning and fixing through a CCD (charge coupled device), aligning and sleeving a positioning hole in an upper template 2.1a on a positioning pin of the lower template 2.1b, aligning and overlapping the positioning pins, placing the circuit board 1 in a faster press, cold pressing for 1 minute, extruding a wavy structure (shown in figure 3) from the circuit board 1, taking out the extrusion die from the press after the cold pressing is completed, taking down the circuit board 1, extruding a wavy structure 1.3a from the front side of the circuit board 1, and extruding a wavy structure (shown in figures 4 and 8) from the back side of the circuit board 1.
Or, an extrusion die shown in fig. 5 is used for placing the circuit board 1 on the lower template 2.1b, the hole on the circuit board 1 is sleeved on the positioning pin of the lower template 2.1b for alignment and fixation, or the positioning pin is aligned and fixed through a CCD, the positioning hole on the upper template 2.1a is aligned and sleeved on the positioning pin of the lower template 2.1b, the circuit board 1 is aligned and overlapped together, then the circuit board 1 is placed in a comparatively fast press for cold pressing for 1 minute, a wave-shaped structure (shown in fig. 6) is extruded from the circuit board 1, after the cold pressing is completed, the extrusion die is taken out from the press, the circuit board 1 is taken down, the front surface of the circuit board 1 is pressed into a shape structure (shown in fig. 7 and 8) with a plurality of raised waves 1.3a, and the wave-shaped LED circuit board is manufactured.
The lamp strip circuit board is made into the wavy three-dimensional circuit board, the lamp strip circuit board is extruded into a wavy shape by a mould without welding the position of a bonding pad of a component, and the lamp strip made of the circuit board is a wavy telescopic lamp strip and is not easy to break when bent and stretched.
The invention is described in detail with reference to the accompanying drawings by using a specific embodiment of a wavy LED strip circuit board and a manufacturing method thereof. It will be understood by those skilled in the art, however, that the foregoing is merely illustrative and descriptive of some specific embodiments and is not to be construed as limiting the scope of the invention, especially the scope of the claims.
Claims (7)
1. A method for manufacturing a wavy LED lamp strip circuit board comprises the steps of extruding a connected circuit board containing a plurality of lamp strip circuit boards into a wavy shape by an extrusion die, wherein the extrusion die comprises an upper template and a lower template, the upper template and the lower template are respectively provided with a plurality of grooves and convex ribs, or one of the upper template and the lower template is provided with a convex rib, the other template is provided with a groove, when the upper template and the lower template are aligned and overlapped, each convex rib corresponds to one groove and forms a state that the convex ribs are embedded into the grooves, the lower template is provided with positioning pins, the upper template is provided with positioning holes, the circuit board is placed on the lower template, then the upper template is placed on the circuit board, the template positioning holes are hung on the positioning pins, the whole positioning and laminating combination is placed in a press for cold pressing, after the cold pressing is completed, the combination is taken out of the press, and then, the circuit board has been pressed into the wave form, and this wave form circuit board is the telescopic circuit board, and the LED lamp area of using this circuit board preparation, tensile and bending resistance, bending or tensile difficult fracture when the lamp area uses.
2. A wavy LED lamp area circuit board includes:
a single-layer or double-layer circuit board;
the wave-shaped structure is arranged on the circuit board and protrudes;
the LED lamp strip is characterized in that a plurality of raised waves are formed on two surfaces of the circuit board, or a plurality of raised waves are formed on one surface of the circuit board, the formed wavy circuit board is a three-dimensional circuit board extruded by a planar circuit board, the whole wavy circuit board is a shaped three-dimensional flexible circuit board when no external force stretches or extrudes, when the wavy circuit board is stretched or extruded by an external force, the raised parts can be stretched or extruded to deform, so that the whole circuit board can be stretched and lengthened longitudinally (in the long direction), or can be extruded to lengthen or shorten, the circuit board is a connected circuit board containing a plurality of lamp strip circuit boards, the LED lamp strip made of the circuit board is a telescopic lamp strip, and when the lamp strip is used, the LED lamp strip is not easy to break when being bent or stretched.
3. The wavy LED lamp strip circuit board according to claim 1 or 2, wherein the wavy structure protruding from the circuit board is formed by extruding the circuit board, so that the circuit board is stable when the lamp strip is manufactured, the printed solder paste can be printed accurately, and the circuit board can be attached accurately when an SMT machine attaches components.
4. The wavy LED strip circuit board according to claim 1 or 2, wherein the circuit board is a connected circuit board comprising a plurality of strip circuit boards, and the positions of the protrusions of each strip circuit board can be the same or different.
5. The wavy LED strip circuit board of claim 1 or 2, wherein the wavy structure protruding from the circuit board is formed at a position avoiding the positions of the soldering components and at a position avoiding the component-free space of the circuit board.
6. The wavy LED strip circuit board of claim 1 or 2, wherein when the circuit board is a single-layer circuit board, the single-layer circuit board is a circuit board made of conducting wires or a circuit board made of copper foil.
7. The wavy LED lamp strip circuit board according to claim 1 or 2, wherein when the circuit board is a double-layer circuit board, the two layers of circuits of the double-layer circuit board are conducted in a through hole copper plating manner, or the two layers of circuits are conducted in a tin soldering manner, or the two layers of circuits are conducted in a conductive ink manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910961524.XA CN112584618A (en) | 2019-09-27 | 2019-09-27 | Wavy LED lamp strip circuit board and manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910961524.XA CN112584618A (en) | 2019-09-27 | 2019-09-27 | Wavy LED lamp strip circuit board and manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112584618A true CN112584618A (en) | 2021-03-30 |
Family
ID=75116981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910961524.XA Pending CN112584618A (en) | 2019-09-27 | 2019-09-27 | Wavy LED lamp strip circuit board and manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112584618A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112974580A (en) * | 2021-05-11 | 2021-06-18 | 四川英创力电子科技股份有限公司 | Bent circuit board and processing equipment and method thereof |
-
2019
- 2019-09-27 CN CN201910961524.XA patent/CN112584618A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112974580A (en) * | 2021-05-11 | 2021-06-18 | 四川英创力电子科技股份有限公司 | Bent circuit board and processing equipment and method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1671274B (en) | Flexible substrate having interlaminar junctions, and process for producing the same | |
| CN101621894B (en) | Printed circuit board (PCB) assembly method and printed circuit board preformed product | |
| TWI606769B (en) | Method for manufacturing rigid-flexible printed circuit board | |
| TW201410097A (en) | Multilayer flexible printed circuit board and method for manufacturing same | |
| CN104254213A (en) | Multi-layer circuit board and manufacturing method thereof | |
| CN112584618A (en) | Wavy LED lamp strip circuit board and manufacturing method | |
| CN207354726U (en) | A kind of one-sided metallic base circuit board for being used to weld pin member | |
| CN211821838U (en) | Discontinuous layered flexible laminated circuit board lamp strip | |
| CN110972413B (en) | Composite circuit board and manufacturing method thereof | |
| CN212381475U (en) | Wavy LED lamp area circuit board | |
| CN217825568U (en) | Double-layer flexible circuit board | |
| CN212381453U (en) | LED lamp area of wave stromatolite circuit board preparation | |
| CN212381476U (en) | Wavy LED circuit board lamp area | |
| CN212381451U (en) | Laminated circuit board made of wavy LED lamp strip circuit board | |
| CN112584617A (en) | Laminated circuit board manufactured by superposing wavy LED lamp strip circuit board and metal circuit board and manufacturing method | |
| KR100615074B1 (en) | Punching method of FPC with unconnected compound hard toolings | |
| CN212204122U (en) | Wavy LED lamp area with LED circuit board module preparation | |
| CN112584616A (en) | Wavy LED circuit board lamp strip and manufacturing method | |
| CN112576964A (en) | Wavy LED lamp strip manufactured by LED circuit board module and manufacturing method | |
| CN107645855B (en) | Leadless electroplating circuit board and manufacturing method thereof | |
| WO2021057311A1 (en) | Light strip having discontinuously layered flexible laminated circuit board, and manufacturing method | |
| JP2007317981A (en) | Flexible printed wiring board, and backlighting device of liquid crystal module | |
| CN211821837U (en) | Long lamp strip assembled by wavy LED short lamp strips | |
| KR20210156005A (en) | Method for manufacturing flexible printed circuit board | |
| KR100646452B1 (en) | Blade mold of FPC |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |