CN209896044U

CN209896044U - Stamping type copper foil substrate

Info

Publication number: CN209896044U
Application number: CN201920622500.7U
Authority: CN
Inventors: 徐家鸿; 徐静志
Original assignee: Individual
Current assignee: Individual
Priority date: 2019-04-30
Filing date: 2019-04-30
Publication date: 2020-01-03
Anticipated expiration: 2029-04-30

Abstract

The utility model provides a punching press formula copper foil substrate, include: the LED chip packaging structure comprises a body, a plurality of unit bodies and a plurality of second positioning holes, wherein the unit bodies are formed on the body with the length of 516mm, the width of 415mm and the thickness of 0.1 mm-0.23 mm in a 3 x 8 matrix arrangement mode through a stamping process, the interior of each unit body is divided into two areas, each area is provided with 64 windows, a connecting section is formed between the two areas, a bearing part for placing an LED chip is formed between every two adjacent windows, the length of each window is 24.6 mm-25.6 mm, the width of each window is 0.3 mm-0.35 mm, the width of each bearing part is 1.55 mm-1.6 mm, any three corners around each unit body are respectively provided with a first positioning hole, and the second positioning holes are formed in the areas of the body except the unit bodies, so that the production efficiency and the quality are greatly improved.

Description

Stamping type copper foil substrate

Technical Field

The utility model relates to a LED lighting device's material field especially relates to a punching press formula copper foil base plate, and it utilizes the punching press processing procedure to process to the copper foil base plate of specific dimensions fast, so promotes production efficiency and quality by a wide margin.

Background

The Light-Emitting Diode (LED) chip is packaged and fixed on a carrier, and the package is completed by gold wire bonding and glue sealing, the package has the advantages of lightness, high thermal conductivity, simple circuit and the like, the carrier is used as an intermediate product for communicating the LED chip and a circuit board, and usually, a circuit is arranged inside the carrier to connect the chip and the circuit board, so as to ensure the normal operation of the circuit.

Generally, a carrier 10 for carrying LED chips is usually made of Printed Circuit Boards (PCBs) which are made of copper foil substrates, wherein a conductive copper foil is disposed on a top surface and a bottom surface of a plastic glass plate as a substrate, and after proper electroplating, a plurality of electrode portions and a carrying portion are formed thereon, and the LED chips are placed on the carrying portion and electrically connected to the LED chips and the electrode portions by soldering or surface adhesion. However, most of the substrates using the plastic-glass plate can only be machined (including laser cutting or wire cutting) due to the characteristics of the materials, and the substrates do not have thermal conductivity during use, so that the heat generated by the LED chip cannot be effectively dissipated, which causes a phenomenon of thermal failure during long-term use, and affects the illumination brightness and the service life thereof during use.

In recent years, a Chip On Board (COB) integrated packaging technology is gradually the mainstream of an LED lighting source, and in order to improve the stability and reliability of the lighting source, compared with a lighting product of a traditional Surface Mount Device (SMD) chip type packaging technology or a high-power packaging technology, a lighting product produced by the COB integrated packaging technology can achieve a better energy efficiency index and lower power consumption by obtaining the maximum lighting effect requirement in a certain unit area; the carrier used in such COB integrated package technology is mostly made of heat conductive metal material, and although it has the characteristic of convenient processing, it can be manufactured by stamping, cutting or drilling, but because of the electrical insulation problem, the surface of the carrier must be applied with solder mask ink, and the light reflection effect will be indirectly affected, so it is necessary to improve the carrier.

In view of this, the utility model discloses the designer designs a copper foil base plate who uses special size very much, and collocation punching press processing procedure is made and is reduced the problem person that traditional carrier plate used by a wide margin, and it is quick not only to make, the precision is high, can also effectively reduce manufacturing cost, produces advantages such as quick and that the quality is good, has further promoted the application of traditional copper foil base plate on LED encapsulation processing procedure.

SUMMERY OF THE UTILITY MODEL

The utility model discloses an aim at providing a punching press formula copper foil base plate, in order to utilize the punching press process to carry out the punching press process to the copper foil base plate of special specification, in order to form a plurality of cell cube fast, and this each cell cube inside divide into two regions, this each region all is formed with 64 windows, and be formed with a linkage segment between these two regions, then form a bearing part of placing the LED wafer between this two adjacent windows, and be equipped with a first locating hole respectively in this each cell cube arbitrary three corner department all around, these a few second locating holes shaping is in this body region except these a few cell cubes, in order to promote efficiency such as production efficiency and quality by a wide margin.

To achieve the above object, the present invention provides a stamped copper clad laminate manufactured by integrally forming a stamped copper clad laminate, comprising:

a body, its size is 516mm long, 415mm wide and 0.1 mm-0.23 mm thick, and the body is formed by an insulating substrate and two conductive copper foils set up on two sides of the insulating substrate separately;

24 unit bodies which are arranged on the body in a 3 multiplied by 8 matrix through successive punching, wherein adjacent unit bodies are arranged in a side-by-side abutting mode, the interior of each unit body is divided into two areas, each area is provided with 64 windows, a connecting section is formed between the two areas, a bearing part for placing an LED wafer is formed between the two adjacent windows, the length of each window is 24.6 mm-25.6 mm, the width of each window is 0.3 mm-0.35 mm, the width of each bearing part is 1.55 mm-1.6 mm, and any three corners around each unit body are respectively provided with a first positioning hole for subsequent processing of the 24 unit bodies; and

and a plurality of second positioning holes which are respectively formed in the areas of the body except the 24 unit bodies for the positioning and punching of the punching machine.

The punched copper foil substrate is characterized in that the window is one of a rectangle, an oblong and a semicircular shape at two ends.

The punched copper foil substrate is characterized in that the two conductive copper foils on the two sides of the insulating base material are electrically conducted through the window by electroplating.

The stamping type copper foil substrate is characterized in that a rectangular frame surrounding line for cutting is formed around each unit body.

The stamping type copper foil substrate is characterized in that the insulating base material is one of a bakelite plate, a glass fiber plate, a plastic plate and an insulating preimpregnation material.

Therefore, the utility model discloses an this punching press formula copper foil base plate utilizes 64 thickness 0.3mm ~ 0.35mm, width 25.16 mm's special punching pin, the mode with continuous punching press is length 516mm, this body that width 415mm and thickness are 0.1mm ~ 0.23mm, accomplish these a plurality of windowing fast in certain area scope, and usable equal proportional scaling's mode is made with the same mode on this body of bigger area or less area, its total area precision can reach within 0.005mm in order to accord with customer's demand, and such manufacturing approach is again fast economic, can make full use of monoblock material, compare in other if: the speed of computer-assisted cutting or laser cutting is tens of times faster.

Drawings

Fig. 1 is a schematic structural diagram of a preferred embodiment of the present invention.

Fig. 2 is a front expanded view of the preferred embodiment of the present invention.

Fig. 3 is a schematic structural diagram of the unit body according to the preferred embodiment of the present invention.

Description of reference numerals: 1-stamping a copper foil substrate; 11-a body; 111-an insulating substrate; 112-conductive copper foil; 12-unit body; 121-region; 122-windowing; 123-connecting segment; 124-a carrier; 125-first positioning hole; 13-second positioning hole.

Detailed Description

For clear understanding of the contents of the present invention, reference is made to the accompanying drawings and the following description.

Please refer to fig. 1, fig. 2 and fig. 3, which are schematic structural diagrams, front expanded views and schematic structural diagrams of the unit body according to the preferred embodiment of the present invention. As shown in the following figures, the stamped-out copper foil substrate 1 of the present invention is integrally formed by stamping, and includes a main body 11, 24 unit bodies 12 and a plurality of second positioning holes 13.

Wherein the body 11 has a length of 516mm, a width of 415mm and a thickness of 0.1 mm-0.23 mm, and the body 11 is composed of an insulating substrate 111 and two conductive copper foils 112 respectively disposed on two sides thereof, it should be noted that the present invention is directed to the insulating substrate 111 selected from the following: the conductive copper foil 112 is disposed on both sides of the insulating substrate 111, and is made of one of bakelite board, glass fiber board, plastic board, and prepreg material prepared by mixing glass fiber non-woven fabric with epoxy resin.

The 24 unit bodies 12 are sequentially punched and arranged on the main body 11 in a 3 × 8 matrix arrangement, so that the two adjacent unit bodies 12 are arranged side by side in an adjacent manner, a rectangular frame surrounding line for cutting is formed around each unit body 12 to distinguish the range of the rectangular frame surrounding line, the inside of each unit body 12 is divided into two areas 121, each area 121 is formed with 64 windows 122, a connecting section 123 is formed between the two areas 121, and a bearing part 124 for placing an LED chip is formed between the two adjacent windows 122, it should be noted that the length of each window 122 of the present invention is the same as the length of each window 122 of the present invention

24.6mm to 25.6mm, a width of 0.3mm to 0.35mm, and a width of each bearing part 124 of 1.55mm to 1.6 mm. In addition, a first positioning hole 125 is disposed at any three corners of the periphery of each unit 12 for positioning the unit 12 during subsequent processing. Furthermore, the windows 122 of the present invention are selected from the following: one of the rectangular, oblong and semicircular shapes at both ends is, as shown in the figure, the rectangular windows 122 are adopted without being limited by the shape of cutting tool or laser, and the windows 122 are used for electrically connecting the two conductive copper foils 112 on both sides of the insulating base 111 after electroplating.

The second positioning holes 13 are formed in the main body 11 except the unit bodies 12 according to a punching process, so as to allow the punching machine to perform positioning punching.

Therefore, the utility model discloses a this punching press formula copper foil substrate 1 utilizes 64 thickness 0.3mm ~ 0.35mm, width 25.16 mm's special punching pin, with continuous punching press's mode with the size for length 516mm, this body 11 that width 415mm and thickness are 0.1mm ~ 0.23mm accomplishes these a plurality of windowing 122 fast in certain area range, and usable equal proportional scaling's mode is made with the same mode on this body 11 of bigger area or less area, its total area precision can reach within 0.005mm in order to accord with customer's demand, and such manufacturing approach is again economic fast again, can make full use of monoblock material, compare in other if: the speed of computer-assisted cutting or laser cutting is tens of times faster.

The foregoing description is intended to be illustrative rather than limiting, and it will be appreciated by those skilled in the art that many modifications, variations or equivalents may be made without departing from the spirit and scope of the invention as defined in the appended claims.

Claims

1. A stamped copper foil substrate is integrally formed in a stamping mode, and is characterized by comprising:

2. The stamped-form copper foil substrate of claim 1, wherein the window is one of rectangular, oblong and semicircular at both ends.

3. The stamped-out copper foil substrate of claim 1, wherein the opening is plated to electrically connect the two conductive copper foils on the two sides of the insulating substrate.

4. The stamped-form copper foil substrate of claim 1, wherein a rectangular frame contour for trimming is formed around each unit body.

5. The stamped copper foil substrate of claim 1, wherein the insulating substrate is one of a bakelite board, a fiberglass board, a plastic board, and an insulating prepreg.