CN102290497A - Production method for surface mounted device (SMD) lead frame of light-emitting diode - Google Patents
Production method for surface mounted device (SMD) lead frame of light-emitting diode Download PDFInfo
- Publication number
- CN102290497A CN102290497A CN2010105111958A CN201010511195A CN102290497A CN 102290497 A CN102290497 A CN 102290497A CN 2010105111958 A CN2010105111958 A CN 2010105111958A CN 201010511195 A CN201010511195 A CN 201010511195A CN 102290497 A CN102290497 A CN 102290497A
- Authority
- CN
- China
- Prior art keywords
- light
- pin
- smd
- emitting diode
- conductor area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Led Device Packages (AREA)
Abstract
The invention discloses a production method for the surface mounted device (SMD) lead frame of a light-emitting diode. The production method is characterized in that two times of plastic molding injection are conducted in a lead area; firstly, a first time of plastic molding injection is conducted in the lead area to form a base which is used for fixedly connecting the pins of the lead frame; secondly, the pins in the lead area are bent on the base through punch dies for two times; and finally a second time of plastic molding injection is conducted on the base to form an insulating shell, and the insulating shell fully covers the pins bent on the base to complete a die pad. The invention is further characterized in that the material of the insulating shell formed at the second time of plastic molding injection is nontransparent colored plastic and the colored plastic is preferably black.
Description
Technical field
The present invention discloses a kind of SMD manufacture of wire holder of light-emitting diode, and is particularly to carry out on conductor area twice the mold ejection formation.
Background technology
Because light-emitting diode (Light-Emitting Diode, LED) characteristic long, pollution-free, low-power consumption enjoys favor the life-span, it is the main flow that becomes current green illumination tide, no matter in markets such as functional illumination, landscape ornamental illumination, LCD backlight illumination and automotive lighting, the shared ratio of LED is all highly grown up.
Even so, but still there are some technical problems in the encapsulation of LED, and the crystal grain life-span that causes the LED lighting is unfavorable for the long-run development of LED lighting industry than the weak point of expection.
Surface mount device (the Surface Mounted Devices of existing light-emitting diode, SMD) the lead frame process technique has been exposed in TaiWan, China patent of invention publication number No. 200849535, its main processing procedure penetrates a die pad for carry out mold on conductor area, then with the pin bending.The pin that buries end in its die pad can electrically connect with light-emitting diode chip for backlight unit, and the pin that exposes to external glue wall after its bending then electrically connects with circuit board (Printed Circuit Board is called for short PCB).Because the SMD lead frame of this existing light-emitting diode that processing procedure is produced, the outer pin of its external glue wall can't be coated within the plastics fully, must carry out extra manufacture procedure of adhesive, but this manufacture procedure of adhesive can't coat by this fully that external glue wall is outer pin usually fully, cause steam to infiltrate along this pin that exposes, maybe this pin that exposes is easy to oxidation, sulfuration, so that the problem of light-emitting diode chip for backlight unit breaking-up.
In order to solve every problem of prior art, the inventor proposes a kind of SMD manufacture of wire holder of light-emitting diode based on research and development and many practical experience for many years, with shortcoming and fully inclusive and equitable its advantage of energy of improving above-mentioned prior art.
Summary of the invention
Because above-mentioned prior art problems, one of the present invention purpose promptly is to provide a kind of SMD manufacture of wire holder of light-emitting diode, pin with the SMD lead frame die pad of improving light-emitting diode exposes, and is easy to oxidation, sulfuration, the shortcoming that causes light-emitting diode to reduce useful life.
Edge is, for reaching above-mentioned purpose, the invention provides a kind of SMD manufacture of wire holder of light-emitting diode, comprises step S61～S68.
At first, provide a metal substrate in step S61; Then on this metal substrate, carry out step S62, most conductor area of punching press, and each conductor area comprises at least one pin; In step S63, electroplate this metal substrate; Afterwards, in step S64, carry out the mold first time and penetrate with moulding one pedestal on each conductor area, this pedestal has the function of affixed this pin; Secondly, in step S65, carry out punch die and cut blanking removal material pin; Then,, carry out two sections punch dies in step S66, with the pin bending on this pedestal; ,, on this pedestal, carry out second time mold and penetrate with moulding one insulation shell in step S67 thereafter, this insulation shell with the pin of bending on this pedestal be coated on fully in this insulation shell a die pad; At last,, carry out punch die and cut blanking removal material pin, obtain having the SMD lead frame of most light-emitting diodes in step S68.
The SMD manufacture of wire holder of a kind of light-emitting diode of the present invention in another specific embodiment, also can move to first section punch die bending processing procedure in two sections punch die bending processing procedures among the step S66 and electroplate preceding the carrying out of this metal substrate (step S63).
Edge is that the SMD manufacture of wire holder of a kind of light-emitting diode of the present invention is characterized in that carrying out twice mold and penetrates on the SMD of light-emitting diode lead frame.There is no the pin that exposes on the die pad external glue wall of its finished product; can avoid lead frame with the light-emitting diode of existing process technique manufacturing; steam can infiltrate along the pin that exposes, and maybe this pin that exposes is easy to the lead frame of oxidation, sulfuration or light-emitting diode along connecing the difficult problem that exposes pin of sealing fully of face envelope protection all around glue with PCB.
In addition, the downstream encapsulation manufacturer of light-emitting diode, the glutinous crystalline substance of light-emitting diode is encapsulated in after the lead frame, in order to solve the uneven diffusing look problem of light source, the white surface of die pad must be become black with various technology with surface treatment, to absorb the reflection ray of extraneous light and this light-emitting diode itself.
Of the present invention being further characterized in that, the pedestal of the ejection formation of mold for the first time, its material is the white plastic with high reflectance, with the light extraction efficiency after the lifting LED package; The insulation shell of the ejection formation of mold for the second time, its material is a coloured plastics material, preferably this coloured plastics material is complete lighttight black plastic, then can simplify downstream manufacturers must become with various technology the die pad after the encapsulation black with surface treatment processing procedure.
From the above, conducting wire frame structure of the present invention, it can have following advantage:
The SMD manufacture of wire holder of a kind of light-emitting diode of the present invention, the one purpose penetrates for carry out twice mold on lead frame, the problem that the pin that the solution prior art produces exposes, also solved simultaneously the sealing problem of the pin that the SMD lead frame of light-emitting diode exposes, overcome the insurmountable for a long time pin of industrial circle more at one stroke and exposed, be easy to the problem of oxidation, sulfuration.
The SMD manufacture of wire holder of a kind of light-emitting diode of the present invention, its another purpose are the pedestal of the ejection formation of mold for the first time, and its material is the white plastic with high reflectance, with the light extraction efficiency after the lifting LED package.
The SMD manufacture of wire holder of a kind of light-emitting diode of the present invention, its another purpose is the insulation shell of the ejection formation of mold for the second time, its material is a coloured plastics material, and preferably this coloured plastics material is complete lighttight black plastic, to simplify the processing procedure of downstream manufacturers.
Now for being had technical characterictic of the present invention and the effect that reached, your juror further understands and understanding, careful assistant with preferred embodiment and cooperate detailed explanation as after, the right specific embodiment that is exemplified and diagram only provide with reference to and explanation usefulness, be not to be used for to the present invention's limitr in addition.
Description of drawings
Fig. 1 is the flow chart of manufacture method of the LED conducting wire frame of prior art.
Fig. 2 is existing LED conducting wire frame schematic diagram.
Fig. 3 is the preferred embodiment flow chart of the SMD manufacture of wire holder of a kind of light-emitting diode of the present invention.
Fig. 4 is the preferred embodiment schematic diagram of the SMD lead frame processing procedure of a kind of light-emitting diode of the present invention.
The die pad schematic diagram that Fig. 5 makes with the SMD manufacture of wire holder of a kind of light-emitting diode of the present invention.
[main element symbol description]
2 conductor area
20 die pad
210 pins
230 external glue walls
610 pedestals
630 insulation shells
S11～S15 manufacture method step
S61～S68 manufacture method step
Embodiment
Hereinafter with reference to correlative type, the embodiment according to the SMD manufacture of wire holder of a kind of light-emitting diode of the present invention is described, to be convenient to understand for making, the similar elements among the following embodiment illustrates with identical symbology.
Please consult Fig. 1 and Fig. 2 simultaneously.Fig. 1 is the flow chart of manufacture method of the LED conducting wire frame of prior art.The manufacture method that shows existing LED conducting wire frame among the figure comprises step S11～S15, and wherein described related elements of step S11～S15 such as conductor area 2, pin 210 and die pad 20 are shown in Fig. 2.
At first, provide a metal substrate in step S11; Then on this metal substrate, carry out step S12, most conductor area 2 of punching press, and each conductor area 2 comprises at least one pin 210; In step S13, electroplate this metal substrate; Afterwards, in step S14, on each conductor area 2, form die pad 20 with injection molding method, again with pin 210 bendings; At last,, cut blanking, to obtain most LED conducting wire frames at the metal substrate upper trimming die in step S15.
See also Fig. 2, it is existing LED conducting wire frame schematic diagram.The LED conducting wire frame that demonstration is finished with the manufacture method of the LED conducting wire frame of prior art among the figure, though burying the pin 210 of end within itself and LED crystal particle electrically connect can be coated in the resin envelope material, but its pin 210 that exposes to external glue wall 230 can allow the steam in the environment infiltrate along this pin that exposes 210, and must carry out extra manufacture procedure of adhesive, but this manufacture procedure of adhesive can't coat external glue wall 230 these outer pins 210 usually fully fully, and this pin that exposes 210 also is easy to oxidation and sulfuration because of being exposed to external environment in addition.
See also Fig. 3, Fig. 4 and Fig. 5.Fig. 3 is the preferred embodiment flow chart of the SMD manufacture of wire holder of a kind of light-emitting diode of the present invention; Fig. 4 is the preferred embodiment schematic diagram of the SMD lead frame processing procedure of a kind of light-emitting diode of the present invention.The SMD manufacture of wire holder that shows a kind of light-emitting diode of the present invention among the figure comprises step S61～S68, and wherein described related elements of step S61～S68 such as conductor area 2, pin 210, pedestal 610, insulation shell 630 and die pad 20 are shown in Fig. 4 and Fig. 5.
At first, provide a metal substrate in step S61; Then on this metal substrate, carry out step S62, most conductor area 2 of punching press, and each conductor area 2 comprises at least one pin 210; In step S63, electroplate this metal substrate; Afterwards, in step S64, carry out the mold first time and penetrate with moulding one pedestal 610 on each conductor area 2, this pedestal 610 has the function of affixed this pin 210; Secondly, in step S65, carry out punch die and cut blanking removal material pin; Then,, carry out two sections punch dies in step S66, with pin 210 bendings on each conductor area 2 on this pedestal 610; ,, on this pedestal 610, carry out second time mold and penetrate with moulding one insulation shell 630 in step S67 thereafter, this insulation shell 630 with the pin 210 of bending on this pedestal be coated on fully in this insulation shell 630 a die pad 20; At last,, carry out punch die and cut blanking removal material pin, obtain having the SMD lead frame of most light-emitting diodes in step S68.
See also Fig. 5, the die pad schematic diagram that it is made with the SMD manufacture of wire holder of a kind of light-emitting diode of the present invention.Among the figure, this pin 210 is coated in this insulation shell 630 fully.
Because the SMD manufacture of wire holder of a kind of light-emitting diode of the present invention, when this conductor area 2 is carried out first time mold and is penetrated, one end of pin 210 is fixed on this pedestal 610, again with the other end of two sections these pins 210 of punch die bending, and with mold second time ejection formation insulation shell 630 pin 210 of this bending is coated in the resin envelope material fully, so the problem that prior art pin 210 exposes is readily solved.
The SMD manufacture of wire holder of a kind of light-emitting diode of the present invention in this preferred embodiment, after mold first time ejection formation and punch die cut blanking (step S64 and step S65), carries out two sections punch die bending processing procedures of step S66.But in another specific embodiment, also first section punch die bending processing procedure in two sections punch die bending processing procedures among the step S66 can be moved to and electroplate preceding the carrying out of this metal substrate (step S63).
The SMD manufacture of wire holder of a kind of light-emitting diode of the present invention, in another preferred embodiment, in the pedestal 610 of mold first time ejection formation, its material is the white plastic with high reflectance, with the light extraction efficiency after the lifting LED package.
The SMD manufacture of wire holder of a kind of light-emitting diode of the present invention, in another preferred embodiment, the insulation shell 630 of this ejection formation of mold for the second time, its material is a coloured plastics material, this coloured plastics material is preferably complete lighttight black plastic.
The SMD manufacture of wire holder of a kind of light-emitting diode of the present invention, also can be applicable to the lead frame manufacturing of other solid-state light emitting elements, as Organic Light Emitting Diode (Organic Light Emitting Diode, OLED) lead frame manufacturing, electroluminescence (Electro Luminescence, lead frame manufacturing EL).
Above specific embodiment is described only to be of the present invention exemplifying, but not is restricted person.Anyly do not break away from spirit of the present invention and category, and, all should be contained in the accompanying Claim book its equivalent modifications of carrying out or change.
Claims (5)
1. the SMD manufacture of wire holder of a light-emitting diode is characterized in that, comprises the following step: a metal substrate is provided; Most conductor area of punching press on this metal substrate, and each conductor area comprises at least one pin; Then, electroplate this metal substrate; Afterwards, carrying out the mold first time in each conductor area penetrates with moulding one pedestal; Secondly, carry out punch die and cut blanking removal material pin; Then, carry out two sections punch dies with the pin bending on each conductor area on these pedestals; Thereafter, carrying out the mold second time on these pedestals penetrates with moulding one insulation shell, so that the pin of bending on these pedestals is coated in these insulation shells fully; At last, carry out punch die and cut blanking removal material pin, to obtain having the SMD lead frame of most light-emitting diodes.
2. the SMD manufacture of wire holder of a light-emitting diode is characterized in that, comprises the following step: a metal substrate is provided; Most conductor area of punching press on this metal substrate, and each conductor area comprises at least one pin; Then, carry out first section punch die with the pin bending on each conductor area; Electroplate this metal substrate thereafter; Afterwards, carrying out the mold first time in each conductor area penetrates with moulding one pedestal; Secondly, carry out punch die and cut blanking removal material pin; Then, carry out second section punch die with the pin bending on each conductor area on these pedestals; Thereafter, carrying out the mold second time on these pedestals penetrates with moulding one insulation shell, so that the pin of bending on these pedestals is coated in these insulation shells fully; At last, carry out punch die and cut blanking removal material pin, to obtain having the SMD lead frame of most light-emitting diodes.
3. the SMD manufacture of wire holder of a kind of light-emitting diode as claimed in claim 1 or 2, these pedestals wherein, its material is the white plastic with high reflectance, to promote the light extraction efficiency after the LED package.
4. the SMD manufacture of wire holder of a kind of light-emitting diode as claimed in claim 1 or 2, these insulation shells wherein, its material is a coloured plastics material, and this coloured plastics material is complete lighttight black plastic.
5. the SMD manufacture of wire holder of a kind of light-emitting diode as claimed in claim 1 or 2, wherein this lead frame includes the lead frame of OLED (OLED) and the lead frame of electroluminescence (EL).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105111958A CN102290497A (en) | 2010-10-13 | 2010-10-13 | Production method for surface mounted device (SMD) lead frame of light-emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105111958A CN102290497A (en) | 2010-10-13 | 2010-10-13 | Production method for surface mounted device (SMD) lead frame of light-emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102290497A true CN102290497A (en) | 2011-12-21 |
Family
ID=45336735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105111958A Pending CN102290497A (en) | 2010-10-13 | 2010-10-13 | Production method for surface mounted device (SMD) lead frame of light-emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102290497A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102280532A (en) * | 2010-12-08 | 2011-12-14 | 连得科技股份有限公司 | Manufacturing method of SMD double-color lead frame of light emitting diode |
| CN108878619A (en) * | 2017-05-15 | 2018-11-23 | 巨贸精密工业股份有限公司 | Light source perceptron lead frame matrix structure |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1672269A (en) * | 2002-06-19 | 2005-09-21 | 三垦电气株式会社 | Semiconductor light emitting device, method for producing the same and reflector for semiconductor light emitting device |
| CN101043062A (en) * | 2006-03-22 | 2007-09-26 | 松圣光电科技股份有限公司 | Seat structure of diode illuminating device and method for manufacturing diode illuminating device |
| CN201017897Y (en) * | 2007-03-22 | 2008-02-06 | 一诠精密工业股份有限公司 | Surface-mounted device diode crystal-fixing support structure |
| CN101136447A (en) * | 2006-08-31 | 2008-03-05 | 株式会社东芝 | Semiconductor light emitting device |
| TW200849535A (en) * | 2007-06-06 | 2008-12-16 | I Chiun Precision Ind Co Ltd | Method of manufacturing LED lead frame |
-
2010
- 2010-10-13 CN CN2010105111958A patent/CN102290497A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1672269A (en) * | 2002-06-19 | 2005-09-21 | 三垦电气株式会社 | Semiconductor light emitting device, method for producing the same and reflector for semiconductor light emitting device |
| CN101043062A (en) * | 2006-03-22 | 2007-09-26 | 松圣光电科技股份有限公司 | Seat structure of diode illuminating device and method for manufacturing diode illuminating device |
| CN101136447A (en) * | 2006-08-31 | 2008-03-05 | 株式会社东芝 | Semiconductor light emitting device |
| CN201017897Y (en) * | 2007-03-22 | 2008-02-06 | 一诠精密工业股份有限公司 | Surface-mounted device diode crystal-fixing support structure |
| TW200849535A (en) * | 2007-06-06 | 2008-12-16 | I Chiun Precision Ind Co Ltd | Method of manufacturing LED lead frame |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102280532A (en) * | 2010-12-08 | 2011-12-14 | 连得科技股份有限公司 | Manufacturing method of SMD double-color lead frame of light emitting diode |
| CN108878619A (en) * | 2017-05-15 | 2018-11-23 | 巨贸精密工业股份有限公司 | Light source perceptron lead frame matrix structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101364585B (en) | Chip packaging construction and manufacturing method therefor | |
| CN101276866B (en) | High power LED bracket as well as high power LED made by the same | |
| JP2015515716A (en) | Method and system for forming an integrated light guide | |
| CN106531730A (en) | LED packaging assembly and manufacturing method thereof | |
| CN202308051U (en) | LED packaging support and LED device | |
| CN102290497A (en) | Production method for surface mounted device (SMD) lead frame of light-emitting diode | |
| CN101900259A (en) | Light-emitting diode module and production method thereof | |
| CN209991250U (en) | LED lamp string | |
| CN209180714U (en) | The flexible filament and filament lamp that can be independently formed | |
| CN100428457C (en) | Light-emitting diodes surface-adhered foundation support and its production | |
| CN103633224A (en) | LED (light-emitting diode) light source module and production process thereof | |
| CN2692845Y (en) | High-heat radiating LED | |
| CN102280532A (en) | Manufacturing method of SMD double-color lead frame of light emitting diode | |
| CN104779246A (en) | Light-emitting assembly, backlight device and methods for manufacturing same | |
| CN201060870Y (en) | Side light-emitting diode device | |
| CN103700757A (en) | Surface-mounted LED (light-emitting diode) lead frame and manufacturing method thereof | |
| US8012777B2 (en) | Packaging process of light emitting diode | |
| TW200849535A (en) | Method of manufacturing LED lead frame | |
| CN220710340U (en) | LED device with multiple light emitting areas and LED light source | |
| TW201203628A (en) | LED SMD leadframe manufacturing method | |
| CN201196385Y (en) | Surface labeling LED | |
| CN203733836U (en) | LED filament and illuminating device | |
| CN2720644Y (en) | Bent LED support and bent LED made therefrom | |
| CN101308894B (en) | Manufacture method of LED support | |
| CN215183958U (en) | Side-emitting device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20111221 |