CN2720644Y

CN2720644Y - Bent LED support and bent LED made therefrom

Info

Publication number: CN2720644Y
Application number: CN2004200847946U
Authority: CN
Inventors: 王小平
Original assignee: Shanghai Jiatang Electronic Co Ltd
Current assignee: Shanghai Jiatang Electronic Co Ltd
Priority date: 2004-08-24
Filing date: 2004-08-24
Publication date: 2005-08-24
Anticipated expiration: 2014-08-24

Abstract

The utility model provides a bent LED bracket which is designed by special bending to avoid stress generation and a bent LED which is made of the bent LED bracket. The bent LED bracket presents in structure of array which comprises N lines and M rows of bracket units; each bracket unit comprises a base and pins with bending design; ribs are connected between the pins of the same unit and between the neighboring units. At least a bending design is provided on the bracket pins of the bent LED; the preference is that the two bending designs are provided on the bracket pins: the first bending part is designed for solving the stress generation, and the second bending part is designed for meeting the industrial standard between the bracket clearance. The utility model has following advantages: 1) the problem of stress generation is solved fundamentally, and the luminous quality and the degree of stability of the light emitting diode are improved largely; 2) the extra cost caused by unstable quality can be reduced. The popularization and the application of the bent LED bracket has important meanings.

Description

A kind of bending-type led support reaches by its bending-type LED that makes

Technical field

The utility model belongs to field of photoelectric technology, relates to a kind of bending-type led support and reaches by its bending-type LED that makes.

Background technology

Its support pin of traditional light-emitting diode (LED) generally is a linear pattern, during electronic product on being applied to market now, usually needs according to the design of electronic product the support pin of light-emitting diode to be given bending.On technology, when implementing the action of bending,, can cause stress to a certain degree to produce unavoidably because of the support pin is a metal material, also therefore can the quality of light-emitting diode be exerted an influence, even the phenomenon that can cause dead lamp not work.This kind situation has challenge on the degree absolute for the quality of light-emitting diode in the industry.

The utility model content

The technical problems to be solved in the utility model is to overcome the deficiencies in the prior art, provides a kind of bending-type led support that can avoid stress to produce through special bending design to reach by its bending-type LED that makes.

The technical solution of the utility model is such:

A kind of bending-type led support, it is the array structure, is made up of the capable M row of a N carrier unit, and each carrier unit comprises the pin of pedestal and bending design, is connected with rib between the pin of same unit and between the adjacent cells.

Above-mentioned bending-type led support also is provided with location hole on its bottom rib.

A kind of bending-type LED that is made by above-mentioned bending-type led support is characterized in that, has place bending design on its support pin at least.

Above-mentioned bending-type LED has the bending design of two places on one of them root support pin.Wherein first place bending design on support pin is 0.3 centimeters bending under colloid.

Above-mentioned bending-type LED and support thereof, wherein, described support pin can be two, three or four, generally uses morely and is with two and three support pins.

Above-mentioned bending-type led support structure is stamped to form by a block of metal plate, and used material is generally copper material.Its manufacturing process generally is in process computer graphics on the mold frame of making support and after confirming on the size, to make new-type mold frame earlier; Again copper strips is amplified in punch press and carry out drawing, produce the blank support; Carry out three roads at last again and electroplate (nickel plating, copper facing, silver-plated) technology, make the semi-finished product support.

The technology manufacture process that the led support structure of utilizing above-mentioned special bending to design is made bending-type LED is as follows:

1. bonding led chip in pedestal;

2. use the gold thread bonding, formation is electrically connected;

3. in the mould bar, inject encapsulating epoxy resin, support inserted the mould bar, determine the insertion position and the degree of depth after, allow epoxy resin cure form optical lens and seal protection.

4. drawing, with unnecessary support pin and rib excision, each unit forms an independently LED lamp.

Above-mentioned technical process is with to make general LED technical process basic identical, but utilizes the utility model to make bending-type LED through the led support of special bending design, can fully avoid the stress that causes because of bending, makes the LED lamp quality of making more reliable and more stable.

Compare with traditional LED and support thereof, the bending-type LED and the support thereof of a kind of particular design of the utility model have following advantage:

1) solves the problem that the support bending produces stress at all, promoted luminescent quality and the stability of light-emitting diode greatly;

2) reduced the extra cost of being paid because of the quality instability.

Therefore, apply and the utlity model has significance.

Description of drawings:

Fig. 1 is the structural representation of a kind of bending-type led support with two pins of the utility model;

Fig. 2 is the structural representation of a kind of bending-type led support with three pins of the utility model;

Fig. 3 is the structural representation of a kind of bending-type LED with two pins of the utility model;

Fig. 4 is the structural representation of a kind of bending-type LED with three pins of the utility model.

Embodiment:

The utility model is described in further detail below in conjunction with drawings and Examples.

As can be seen from Figure 1, a kind of bending-type led support of the utility model with two pins, it is the array structure, form by the capable M row of a N carrier unit, each carrier unit comprises the

11,12 of pedestal 1,2 and bending design, is connected with rib 10 between the pin of same unit and between the adjacent cells.This bending-type led support structure is stamped to form on a monoblock copper coin after making mould in advance.After the punch forming, on support, also leave supplemental support rib 15 and bottom rib 14, location hole 18 is arranged on the end rib.The effect of this location hole is: 1) for the location of vertical hanging when the encapsulated epoxy resin; 2) locate for the accuracy when sanction connects redundance.

As can be seen from Figure 2, a kind of bending-type led support of the utility model with three pins, it is the array structure, form by the capable M row of a N carrier unit, each carrier unit comprises the

11,12,13 of pedestal 1,2,3 and bending design, is connected with rib 10 between the pin of same unit and between the adjacent cells.This bending-type led support structure is stamped to form on a monoblock copper coin after also making mould in advance.After the punch forming, on support, also leave supplemental support rib 15 and bottom rib 14, location hole 18 is arranged on the end rib.

Bonding led chip and gold thread are sealed glue in the pedestal of above-mentioned bending-type led support, cut along dotted line 16 then to be divided into carrier unit one by one, with unnecessary support pin and rib excision, promptly obtain bending-type LED finished product one by one again.

As can be seen from Figure 3, a kind of bending-type LED that makes by bending-type led support shown in Figure 1 of the utility model (two pin), it comprises colloid 4, pedestal 1,2 and the pin 11 of bending design, 12, the bending design of two places is arranged on its support pin 11 (negative pole), first place bending 5 designs for the basic generation that solves stress, because in the assembling process of processing procedure, will be under colloid 0.3 centimeters bending and forming, yet colloid itself can not bear any external force, under any circumstance, from colloid so near will certainly produce an outside stress apart from the people to colloid for bending, chip and support combination are the conductive silver glues by oven dry, so after the people produces stress for bending, support in the colloid and chip, elargol, the gold thread solder joint just stowing might occur, and cause loose contact and lost efficacy, so, the utility model has directly been made bending with regard to one time punching molded when doing support, thereby the people can not occur for producing the problem of stress after the bending; Second place is positioned at the bending 6 of support pin front end, for the industrial standard that cooperates the support gap designs, because when being applied to LED on the electronic product that matches, requires to keep certain interval between the

support pin

11,12 of LED.The bending design of two places is arranged on support pin 12 (positive pole), and first place bending 8 designs for the basic generation that solves stress, and second place is positioned at the bending 7 of support pin front end, for the industrial standard that cooperates the support gap designs.

As can be seen from Figure 4, a kind of bending-type LED (tripod) that makes by bending-type led support shown in Figure 2 of the utility model, it comprises the

11,12,13 of colloid 4, pedestal 1,2,3 and bending design, two

places bending design

5 and 6 is arranged on its support pin 11 (negative pole), and effect is with aforesaid identical; One place bending design 8 is arranged, for the basic generation that solves stress designs on support pin 12 (positive pole); The bending design of two places is arranged on support pin 13 (negative pole), first place bending 9 designs for the basic generation that solves stress, second place is positioned at the bending 7 of support pin front end, for the industrial standard that cooperates the support gap designs, because when being applied to LED on the electronic product that matches, requiring between the

support pin

11 and 12 of LED, keep certain interval between 12 and 13.

Claims

1. bending-type led support, it is the array structure, is made up of the capable M row of a N carrier unit, each carrier unit comprises pedestal and pin, be connected with rib between the pin of same unit and between the adjacent cells, it is characterized in that, have place bending design on the described pin at least.

2. bending-type led support as claimed in claim 1 is characterized in that, also is provided with location hole on its bottom rib.

3. bending-type led support as claimed in claim 1 is characterized in that, described pin has two or three.

4. a bending-type LED who is made by claim 1 or 2 described bending-type led supports is characterized in that, has place bending design on its support pin at least.

5. bending-type LED as claimed in claim 4 is characterized in that, described support pin is two or three.

6. bending-type LED as claimed in claim 4 is characterized in that, the bending design of two places is arranged on one of them root support pin.

7. bending-type LED as claimed in claim 5 is characterized in that, the bending design of two places is arranged on one of them root support pin.

8. bending-type LED as claimed in claim 6, wherein first place bending design on support pin is 0.3 centimeters bending under colloid.

9. bending-type LED as claimed in claim 7, wherein first place bending design on support pin is 0.3 centimeters bending under colloid.