CN2613048Y - Composite structure of dot matrix LED - Google Patents
Composite structure of dot matrix LED Download PDFInfo
- Publication number
- CN2613048Y CN2613048Y CNU032415680U CN03241568U CN2613048Y CN 2613048 Y CN2613048 Y CN 2613048Y CN U032415680 U CNU032415680 U CN U032415680U CN 03241568 U CN03241568 U CN 03241568U CN 2613048 Y CN2613048 Y CN 2613048Y
- Authority
- CN
- China
- Prior art keywords
- emitting diode
- circuit board
- circuit
- light
- dot matrix
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Planar Illumination Modules (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The utility model provides a composed structure of a point matrix light emitting diode, comprising a circuit board, a conductive board and a plurality of light emitting diode chip, wherein one face of the circuit board is a circuit face, the other face is a fixed connection face, the circuit board is equipped with a plurality of slot holes to communicated the circuit face and the fixed connection face, the circuit board edge is brought out a positive line and a negative line with the circuit board, the conductive board is equipped on the fixed connection face of the circuit board, the plurality of light emitting diode chip are equipped on the slot holes of the circuit board, the light emitting diode chip is fixed on the conductive board, the light emitting diode chip is also equipped with a positive wire and a negative wire, which are respectively electrically connected with the positive line and the negative line of the circuit board. The light emitting diode chip on the composed structure of the utility model can be radiated by a heat conductive board, has the feature of high brightness, and simplifies the manufacturing process, and the line of the circuit board is easy to be connected, thereby the flat surface of the heat conductive board is easy to be equipped.
Description
Technical field
The utility model provides a kind of combining structure of dot matrix light-emitting diode, and particularly a kind of high-brightness LED chip is packaged in the combining structure of circuit board slotted hole.
Background technology
The visual indicia product can enrich variation in conjunction with the application of photoelectric subassembly, improves conspicuousness.And the characteristic of photoelectric subassembly mainly the providing and change of its brightness, makes it more noticeable.As advertisement plate, be the combining structure of operating point matrix light-emitting diode, by the collocation design of light, can make the advertising results multiplication.Wherein, photoelectric subassembly must possess enough brightness, could show eye-catching clearly content, and the high heat that high brightness produced needs the energy efficiently radiates heat, just can keep normal function.And advertisement plate is mounted to significantly area usually, therefore, easy assembling mode need be arranged, and could satisfy engineering efficient and quality.
The combining structure of known dot matrix light-emitting diode, see also shown in Figure 1, include circuit board (figure slightly), light-emitting diode 1 and housing 2, wherein this light-emitting diode 1 is fixedly arranged on a side surface of this circuit board, insert a plastics mould of being ready for again and carry out encapsulating, behind overbaking, form housing 2, the wiring 10 on extracting circuit plate opposite side surface again.
The combining structure of above-mentioned known dot matrix light-emitting diode, because radiating condition is not good, the brightness of light-emitting diode is limited, avoid overheated burning, then the illumination effect of advertisement plate is influenced.
Secondly, light-emitting diode is arranged on the circuit board, and forms housing in the encapsulating mode, makes volume increase, and forms the waste in space.
In addition, manufacturing process is cumbersome, makes product percent of pass reduce, and quality descends, thereby breaks down easily, and must possess various related die equipment, and cost significantly increases.
Again, this housing cooperates installation required, and the wiring of circuit board arrangement, and a side surface that makes housing have wiring is not the plane, the inconvenience that causes group to establish, efficient and quality that influence is constructed.
Therefore, the combining structure of above-mentioned known dot matrix light-emitting diode on reality is used, obviously has inconvenience and shortcoming, need be improved.
Summary of the invention
Main purpose of the present utility model is to overcome the shortcoming of above-mentioned prior art and combining structure that a kind of dot matrix light-emitting diode is provided, and its brightness is increased, and volume reduces, and manufacturing process is simplified, and failure rate is low, and cost reduces, and structure is simple, and combination easily.
The purpose of this utility model can realize by following measure:
A kind of combining structure of dot matrix light-emitting diode, comprise a circuit board, a heat-conducting plate and a plurality of light-emitting diode chip for backlight unit, wherein, this circuit board simultaneously is a circuit face, another side is affixed, circuit board be provided with a plurality of slotted eyes connect this circuit face with this affixed, board edge leads to the anodal circuit and the negative pole circuit of circuit board; This heat-conducting plate is located at affixed of this circuit board; And these a plurality of light-emitting diode chip for backlight unit, be located at respectively in the slotted eye of this circuit board, this light-emitting diode chip for backlight unit is bonded to this heat-conducting plate, and light-emitting diode chip for backlight unit also is provided with positive wire and cathode conductor, and electrically connects the anodal circuit and the negative pole circuit of this circuit board respectively.
Described circuit board is two laminar circuit boards.
Described circuit board is the multiple field circuit board.
Described heat-conducting plate is a metallic plate, and there is oxidation resistant reflective material layer on its surface.
Has the heat conduction glue-line between described light-emitting diode chip for backlight unit and the heat-conducting plate.
Be packaged with light transmission colloid shell on described light-emitting diode chip for backlight unit, positive wire and the cathode conductor.
The circuit face of described circuit board also is provided with square condenser lens, corresponding to this light-emitting diode chip for backlight unit.
The anodal circuit that described board edge is drawn and negative pole circuit are connected with the negative pole circuit is corresponding with the anodal circuit of adjacent another circuit board respectively.
Also be provided with magnet on the described heat-conducting plate and with the relative side of this circuit board, this magnet is connected with the magnet of adjacent another circuit board.
The utility model has following advantage compared to existing technology:
The combining structure of dot matrix light-emitting diode of the present utility model, this light-emitting diode chip for backlight unit directly is arranged in the slotted eye of this circuit board, and by this heat-conducting plate heat radiation, make light-emitting diode chip for backlight unit can bring into play high brightness characteristic, and manufacturing process is simple; And the anodal circuit of this circuit board is drawn and is easy to be connected from board edge with the negative pole circuit, and heat-conducting plate has an even surface and is easy to and installs.
Description of drawings
Fig. 1 is the schematic perspective view of the combining structure of known dot matrix light-emitting diode;
Fig. 2 is a three-dimensional exploded view of the present utility model;
Fig. 3 is a three-dimensional combination figure of the present utility model;
Fig. 4 is the partial sectional view at slotted eye of the present utility model place;
Fig. 5 is the schematic perspective view that the utility model is provided with magnet; And
Fig. 6 is the schematic perspective view that the utility model makes up extension mutually.
Embodiment
See also Fig. 2 to shown in Figure 4, the utility model is a kind of combining structure of dot matrix light-emitting diode, comprises a circuit board 3, a heat-conducting plate 4 and a plurality of light-emitting diode chip for backlight unit 5, wherein:
Heat-conducting plate 4 is located on affixed 31 of this circuit board 3, and this heat-conducting plate 4 is a metallic plate, the oxidation resistant reflective material of its external coating.
Light-emitting diode chip for backlight unit 5, be located in the slotted eye 32 of this circuit board 3, above-mentioned light-emitting diode chip for backlight unit 5 is bonded to this heat-conducting plate 4, adopt heat-conducting glue 50 to make it to glue together mutually between light-emitting diode chip for backlight unit 5 and the heat-conducting plate 4, light-emitting diode chip for backlight unit 5 is provided with positive wire 51 and cathode conductor 52 in addition, and electrically connect the anodal circuit 34 and the negative pole circuit 35 of the circuit face 30 of this circuit board 3 respectively, be packaged with light transmission colloid 53 on this light-emitting diode chip for backlight unit 5, positive wire 51 and the cathode conductor 52 in addition, in case oxidation.The circuit face 30 of this circuit board 3 further is provided with square condenser lens (figure slightly) corresponding to this light-emitting diode chip for backlight unit 5.
The combining structure of the utility model dot matrix light-emitting diode, directly offer slotted eye 32 for ccontaining light-emitting diode chip for backlight unit 5 at circuit board 3, and directly being bonded to heat-conducting plate 4, light-emitting diode chip for backlight unit 5 dispels the heat, make it can bring into play the characteristic of high brightness, and under the normal heat radiation situation of heat-conducting plate 4, effective reduced volume.And complex process that need not mould in the preparation process not only promotes quality, lowers failure rate, and can reduce cost, and wherein circuit board 3 can adopt known circuit design and need not otherwise designed.Install by smooth heat-conducting plate 4 surfaces simultaneously, make engineering easy, completion is quick, quality-improving.
See also shown in Figure 5, this heat-conducting plate 4 also is provided with magnet 6 tossing about of this circuit board 3, see also shown in Figure 6, this magnet 6 is adsorbable in external metallization installation surface 7, is easy to temporary fixing, so that move freely, combine required luminous product such as advertisement plate through arbitrarily, and this magnet 6 is attracted each other with the magnet 6 of adjacent another circuit board 3, and is welded, and can promote efficiency of construction and guarantee the engineering quality.And this board edge 33 anodal circuit 34 of drawing and negative pole circuit 35 respectively with the anodal circuit 34 and negative pole circuit 35 corresponding the interconnecting of adjacent another circuit board 3, make its circuit easy to connect, be easy to arrangement, and save the space.
Therefore, the combining structure of dot matrix light-emitting diode of the present utility model has following advantage:
(1) this light-emitting diode chip for backlight unit directly is bonded to heat-conducting plate, the high temperature that the high brightness of light-emitting diode chip for backlight unit produces can dispel the heat via heat-conducting plate, be stranded this and can guarantee its high brightness characteristic, the brightness multiplication of unit are, and chip directly is arranged in the slotted eye of circuit board and contacts with heat-conducting plate, under normal heat radiation situation, volume is reduced.
(2) this circuit board is offered implantation and the encapsulation of slotted eye for light-emitting diode chip for backlight unit, and contact heat radiation with heat-conducting plate, preparation process is more simplified, promote production efficiency and yield, and need not known die apparatus, and circuit board can be directly does compatible utilization with known circuit design, and manufacturing cost significantly reduces.
(3) positive wire of this light-emitting diode chip for backlight unit and cathode conductor connect from the circuit face of circuit board, and the anodal circuit of circuit board and negative pole circuit are drawn from board edge, structure is simple, easy to connect, cooperate setting up of magnet again, adsorbablely assemble arbitrarily in the metal installation surface, being stranded this, that engineering is carried out is more easy.
Claims (9)
1, a kind of combining structure of dot matrix light-emitting diode is characterized in that, comprising:
One circuit board, it simultaneously is a circuit face, another side is affixed, this circuit board be provided with a plurality of slotted eyes connect this circuit face with this affixed, board edge leads to the anodal circuit and the negative pole circuit of circuit board;
One heat-conducting plate, affixed of being located at this circuit board; And
A plurality of light-emitting diode chip for backlight unit are located at respectively in the slotted eye of this circuit board, and affixed with this heat-conducting plate, and light-emitting diode chip for backlight unit also is provided with positive wire and cathode conductor, and electrically connect the anodal circuit and the negative pole circuit of this circuit board respectively.
2, the combining structure of dot matrix light-emitting diode as claimed in claim 1 is characterized in that, described circuit board is two laminar circuit boards.
3, the combining structure of dot matrix light-emitting diode as claimed in claim 1 is characterized in that, described circuit board is the multiple field circuit board.
4, the combining structure of dot matrix light-emitting diode as claimed in claim 1 is characterized in that, described heat-conducting plate is a metallic plate, and there is oxidation resistant reflective material layer on its surface.
5, the combining structure of dot matrix light-emitting diode as claimed in claim 1 is characterized in that, has the heat conduction glue-line between described light-emitting diode chip for backlight unit and the heat-conducting plate.
6, the combining structure of dot matrix light-emitting diode as claimed in claim 1 is characterized in that, is packaged with light transmission colloid shell on described light-emitting diode chip for backlight unit, positive wire and the cathode conductor.
7, the combining structure of dot matrix light-emitting diode as claimed in claim 1 is characterized in that, the circuit face of described circuit board also is provided with square condenser lens, corresponding to this light-emitting diode chip for backlight unit.
8, the combining structure of dot matrix light-emitting diode as claimed in claim 1 is characterized in that, the anodal circuit that described board edge is drawn and negative pole circuit are connected with the negative pole circuit is corresponding with the anodal circuit of adjacent another circuit board respectively.
9, the combining structure of dot matrix light-emitting diode as claimed in claim 8 is characterized in that, also is provided with magnet on the described heat-conducting plate and with the relative side of this circuit board, and this magnet is connected with the magnet of adjacent another circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU032415680U CN2613048Y (en) | 2003-04-07 | 2003-04-07 | Composite structure of dot matrix LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU032415680U CN2613048Y (en) | 2003-04-07 | 2003-04-07 | Composite structure of dot matrix LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2613048Y true CN2613048Y (en) | 2004-04-21 |
Family
ID=34168442
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU032415680U Expired - Fee Related CN2613048Y (en) | 2003-04-07 | 2003-04-07 | Composite structure of dot matrix LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2613048Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100423257C (en) * | 2006-12-20 | 2008-10-01 | 黄虎钧 | Lighting stick with LBD wafer |
| CN102155634A (en) * | 2010-02-11 | 2011-08-17 | 佰鸿工业股份有限公司 | LED (light emitting diode) lighting module and method for manufacturing LED lighting module |
| CN101226976B (en) * | 2007-10-09 | 2012-01-04 | 番禺得意精密电子工业有限公司 | LED device and locating structure thereof |
| WO2012040959A1 (en) * | 2010-09-30 | 2012-04-05 | 福建中科万邦光电股份有限公司 | Package structure of high-power led light source module |
| US8240882B2 (en) | 2009-12-25 | 2012-08-14 | Bright Led Electronics Corp. | Light emitting diode module and method for making the same |
-
2003
- 2003-04-07 CN CNU032415680U patent/CN2613048Y/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100423257C (en) * | 2006-12-20 | 2008-10-01 | 黄虎钧 | Lighting stick with LBD wafer |
| CN101226976B (en) * | 2007-10-09 | 2012-01-04 | 番禺得意精密电子工业有限公司 | LED device and locating structure thereof |
| US8240882B2 (en) | 2009-12-25 | 2012-08-14 | Bright Led Electronics Corp. | Light emitting diode module and method for making the same |
| CN102155634A (en) * | 2010-02-11 | 2011-08-17 | 佰鸿工业股份有限公司 | LED (light emitting diode) lighting module and method for manufacturing LED lighting module |
| WO2012040959A1 (en) * | 2010-09-30 | 2012-04-05 | 福建中科万邦光电股份有限公司 | Package structure of high-power led light source module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20040421 Termination date: 20100407 |