CN2655429Y

CN2655429Y - LED structure

Info

Publication number: CN2655429Y
Application number: CNU032787537U
Authority: CN
Inventors: 黄德森
Original assignee: CANGYUE ELECTRONIC ENTERPRISE Co Ltd FUINAN PROV
Current assignee: CANGYUE ELECTRONIC ENTERPRISE Co Ltd FUINAN PROV
Priority date: 2003-09-22
Filing date: 2003-09-22
Publication date: 2004-11-10
Anticipated expiration: 2013-09-22

Abstract

The utility model aims to provide a light emitting diode structure, which can effectively increase the heat radiation effect of the light emitting diode, decreases the junction of the light emitting chip, increases the light emitting effect and life of the light emitting diode, meanwhile increases the quantity of the light emitting chip in per area. The utility model is realized as the following, a light emitting diode structure comprises a heat conductive base plate, wherein the heat conductive base plate is equipped with a circuit, an insulation layer is equipped between the heat conductive base plate and the circuit, above one light emitting chip are distributed on space between the circuits and the heat conductive base plate, the light emitting chip is connected with the circuit through metal wires, and the light emitting chip is coated with light transparent protection layer. Since the heat conductive base plate is equipped, the light emitting chip can quickly conduct heat through the heat conductive base, which decreases the junction on the light emitting chip, increases the effect and life of the light emitting chip, and realizes the distribution of more light emitting chips in per area.

Description

A kind of light emitting diode construction

Technical field

The utility model relates to light emitting diode construction.

Background technology

The encapsulation technology of traditional light-emitting diode (LED) is with crystal-bonding adhesive luminescence chip to be fixed on the support, between luminescence chip and support, connect plain conductor then, use the epoxy encapsulation moulding again, at last the mode of this light-emitting diode with plug-in unit is weldingly fixed on the printed circuit board (PCB), this structure light-emitting diode is dispelled the heat by support, radiating effect is relatively poor, and the junction temperature of luminescence chip is higher, can influence the luminous efficacy and the life-span of light-emitting diode.And the luminescence chip that this light emitting diode construction unit are distributes is less, can't be applicable to the general lighting that needs higher brightness.So, the junction temperature that reduces luminescence chip is to improve the luminous efficacy and the life-span of light-emitting diode, and the quantity that increases the unit are luminescence chip, it is the urgent problem that solves of industry always, like this, just can make full use of the life-span length of light-emitting diode, the advantage of little power consumption, be applied to purposes more widely, become the environmentally friendly machine that substitutes conventional light source.

Summary of the invention

The purpose of this utility model is to provide a kind of light emitting diode construction, he can significantly improve the radiating effect of light-emitting diode, reduce the junction temperature of luminescence chip, improve the luminous efficacy and the life-span of light-emitting diode, can increase simultaneously unit are luminescence chip quantity and improve the luminous efficiency of unit are.

The utility model is to realize like this; a kind of light emitting diode construction; comprise heat-conducting substrate; heat-conducting substrate is provided with circuit; one layer insulating is arranged between heat-conducting substrate and circuit; more than one luminescence chip is distributed between the circuit, in the space on the heat-conducting substrate, luminescence chip links to each other with circuit by plain conductor, is coated with the protective layer of printing opacity on luminescence chip.

Above-mentioned a kind of light emitting diode construction; Between circuit, form depression or groove on the heat-conducting substrate, luminescence chip is distributed in depression or bottom portion of groove, is coated with the protective layer of printing opacity on luminescence chip and depression or groove.

Above-mentioned light emitting diode construction; Luminescence chip is distributed between the circuit, on the insulating barrier in the space.

Above-mentioned a kind of light emitting diode construction; Luminescence chip can stick between the circuit by viscose glue, in the space on heat-conducting substrate or the insulating barrier.

Above-mentioned a kind of light emitting diode construction; On luminescence chip, be provided with the optical lens of printing opacity, optical lens is fixed on the top of luminescence chip.

Above-mentioned a kind of light emitting diode construction; Link to each other to form circuit by plain conductor between the more than one luminescence chip, the two ends of circuit link to each other with circuit on the substrate between the chip;

Above-mentioned a kind of light emitting diode construction; Light emitting diode construction is made module, and is distributed on the supporting bracket, and available circuit links to each other between the module, or links to each other by lead, fixes between module and the supporting bracket.

Above-mentioned a kind of light emitting diode construction; Heat-conducting substrate becomes curved surface shaped, and luminescence chip and circuit are distributed on the heat-conducting substrate of curved surface shaped.

Above-mentioned a kind of light emitting diode construction; On heat-conducting substrate, be provided with a small fan.

Owing to be provided with heat-conducting substrate, luminescence chip promptly conducts heat by heat-conducting substrate, has reduced the junction temperature on the luminescence chip, has improved the usefulness and the life-span of luminescence chip, also can be implemented in the more luminescence chip of distribution on the unit are; And on heat-conducting substrate, be provided with depression or groove, can realize the effect of optically focused; In addition, can will can be scattered in various circuit between the luminescence chip and between luminescence chip and the circuit, to adapt to different needs; Also have, luminescence chip can be made into various modules, produces in batches, and according to different needs, is installed on the supporting bracket, forms lighting source or illuminating source.

Description of drawings

Fig. 1 is first kind of embodiment vertical view of the utility model.

Fig. 2 is the broken section enlarged drawing of first kind of embodiment shown in the utility model figure one.

Fig. 3 is the broken section enlarged drawing of second kind of embodiment of the utility model.

Fig. 4 is the stereogram of the 3rd embodiment of the present utility model.

Fig. 5 is the 4th an embodiment vertical view of the present utility model.

Fig. 6 is the vertical view of the 5th embodiment of the present utility model

Fig. 7 is the vertical view of the 6th embodiment of the present utility model

Fig. 8 is the A-A cutaway view of the 6th embodiment of the present utility model

Fig. 9 is the vertical view of the 7th embodiment of the present utility model

Figure 10 is that partial enlarged drawing is analysed and observe in the side of the 7th embodiment of the present utility model

Figure 11 is the end view of the 8th embodiment of the present utility model

Embodiment

With reference to Fig. 1, shown in Figure 2; light emitting diode construction; comprise heat-conducting substrate 1; heat-conducting substrate 1 is provided with circuit 3; one layer insulating 2 is arranged between heat-conducting substrate 1 and circuit 3; more than one luminescence chip 4 is distributed between the circuit 3, in the space on the heat-conducting substrate 1, luminescence chip 4 links to each other with circuit 3 by plain conductor 5, is coated with the protective layer 6 of printing opacity on luminescence chip 4.

Heat-conducting substrate 1 is a material with aluminium, copper, pottery that heat conductivility is good, certainly, also can be the good material of other heat conductivilitys; Insulating barrier 2 should have strong insulation property, and the circuit 3 that is covered with on insulating barrier 2 can be Copper Foil, can make required various circuit by etching method then by being covered with one deck Copper Foil earlier on insulating barrier 2;

Luminescence chip 4 is distributed between the copper foil circuit, in the space on the heat-conducting substrate 1, luminescence chip 4 also can be distributed between the Copper Foil, overlay on the insulating barrier 2 on the heat-conducting substrate 1, and luminescence chip 4 also can stick between the circuit 3 by viscose glue, in the space on heat-conducting substrate 1 or the insulating barrier 2; Luminescence chip 4 links to each other with circuit 3 by plain conductor 5; on luminescence chip 4, cover the protective layer 6 of one deck printing opacity; protective layer 6 can be circular arc; the material of protective layer 6 can be epoxy resin or silicon rubber etc.; effect with optically focused; also can carry out the conversion of the color of light, as add fluorescent material in protective layer 6, the blue light that luminescence chip 4 sends can be exchanged into white light.

Owing to adopt the strong and harder Heat Conduction Material of heat conductivility, luminescence chip 4 sees through viscose glue and is close to heat-conducting substrate 1, heat on the luminescence chip 4 promptly can be conducted, greatly reduced the junction temperature of luminescence chip 4, luminous efficiency and life-span have been improved, also can be implemented in the more luminescence chip 4 that distributes in the less area, heat-conducting substrate 1 can also be as support structure in addition.

As shown in Figure 3, another embodiment of the present utility model is between circuit; form depression 7 on the heat-conducting substrate 1; luminescence chip 4 is distributed in depression 7 bottoms, and luminescence chip 4 links to each other with circuit 3 by plain conductor 5, is coated with the protective layer 6 of printing opacity on luminescence chip 4 and depression 7.The light that 7 pairs of luminescence chips 4 of the depression of circular arc send has reflex, can make anaclasis and to penetrating away from the direction of substrate, strengthen luminous efficiency, and the structure of circular arc has increased the contact area with heat-conducting substrate 1, makes between luminescence chip 4 and the heat-conducting substrate 1 to have better heat-conducting effect.

Fig. 4 is the 3rd embodiment of the present utility model, on luminescence chip 4, be provided with the optical lens 11 of printing opacity, optical lens 11 is provided with four pin, on heat-conducting substrate 1, correspondence is provided with four holes 13 around the luminescence chip 4, and optical lens 11 cooperates by four pin 12 and four holes 13, be fixed on the top of luminescence chip 4, the outside ejaculation of the light transmission optical lens 11 of luminescence chip 4; Optical lens 11 also can directly stick on the heat-conducting substrate 1.

Fig. 5 is the 4th embodiment of the present utility model, and 4, three luminescence chips of three luminescence chips 4 that distributed simultaneously in depression 7 bottoms link to each other with circuit 3 respectively by plain conductor 5; The 5th embodiment shown in Figure 6, by behind the continuous formation of the plain conductor series circuit, the two ends of series circuit link to each other with circuit between three luminescence chips 4; Fig. 7, Fig. 8 are the 6th embodiment of the present utility model, between circuit, form groove 8 on the heat-conducting substrate 1, luminescence chip 4 is distributed in groove 8 bottoms, each luminescence chip 4 links to each other with circuit 3 by plain conductor 5, also can be after link to each other forming series circuit by plain conductor between the luminescence chip 4, the two ends of series circuit link to each other with circuit; Can be according to different needs, between luminescence chip 4 and circuit 3, form different circuit structures, luminescence chip 4 promptly can directly link to each other with circuit 3, also can be after forming the serial or parallel connection circuit between the luminescence chip 4, link to each other with circuit 3 on the heat-conducting substrate again.

Because as previously mentioned, luminescence chip 4 can promptly conduct heat go out, and has under the prerequisite in same luminous efficiency and life-span at each luminescence chip 4, can increase the quantity of the luminescence chip 4 of unit are, and increases the luminous intensity of unit are.

Fig. 9, Figure 10 are the 7th embodiment of the present utility model, make module at above-mentioned light emitting diode construction 9, and be distributed on the supporting bracket 10, available circuit links to each other between the module, or links to each other by lead, available rivet fixes between module 9 and the supporting bracket 10, also can use viscose glue to fix, like this, mass-produce the identical light-emitting diode (LED) module with higher luminous intensity 9, according to different needs, be scattered in difformity and area lighting device in supporting bracket; Supporting bracket 10 can be used the material of good heat conductivity, also the heat on the heat-conducting substrate 1 can be conducted rapidly,

Figure 11 is the 8th embodiment of the present utility model, 1 one-tenth curved surface shaped of above-mentioned heat-conducting substrate, and luminescence chip 4 and circuit 3 are distributed on the heat-conducting substrate 1 of curved surface shaped, certainly, can heat-conducting substrate 1 be made different shapes according to different needs.

In addition, can on heat-conducting substrate 1, be provided with a small fan, reduce the temperature of heat-conducting substrate 1, and reduce the area of heat-conducting substrate 1, simultaneously, improve the luminous efficiency and the life-span of luminescence chip 4.

Claims

1, a kind of light emitting diode construction; it is characterized in that: comprise heat-conducting substrate; heat-conducting substrate is provided with circuit; one layer insulating is arranged between heat-conducting substrate and circuit; more than one luminescence chip is distributed between the circuit, in the space on the heat-conducting substrate; luminescence chip links to each other with circuit by plain conductor, is coated with the protective layer of printing opacity on luminescence chip.

2, a kind of light emitting diode construction as claimed in claim 1; it is characterized in that: between circuit; form depression or groove on the heat-conducting substrate, luminescence chip is distributed in the bottom of depression or groove, is coated with the protective layer of printing opacity on luminescence chip and depression or groove.

3, a kind of light emitting diode construction as claimed in claim 1 or 2 is characterized in that: luminescence chip is distributed between the circuit, on the insulating barrier in the space.

4, a kind of light emitting diode construction as claimed in claim 1 or 2 is characterized in that: luminescence chip can stick between the circuit by viscose glue, in the space on heat-conducting substrate or the insulating barrier.

5, a kind of light emitting diode construction as claimed in claim 1 or 2 is characterized in that: on luminescence chip, be provided with the optical lens of printing opacity, optical lens is fixed on the top of luminescence chip.

6, a kind of light emitting diode construction as claimed in claim 1 or 2 is characterized in that: after link to each other forming circuit by plain conductor between the more than one luminescence chip, the two ends of circuit link to each other with circuit on the substrate between the chip;

7, a kind of light emitting diode construction as claimed in claim 1 or 2, it is characterized in that: light emitting diode construction is made module, and is distributed on the supporting bracket, and available circuit links to each other or links to each other by lead between the module, fixes between module and the supporting bracket.

8, a kind of light emitting diode construction as claimed in claim 1 or 2, it is characterized in that: heat-conducting substrate becomes curved surface shaped, and luminescence chip and circuit are distributed on the heat-conducting substrate of curved surface shaped.

9, a kind of light emitting diode construction as claimed in claim 1 or 2 is characterized in that: be provided with a small fan on heat-conducting substrate.

10, a kind of light emitting diode construction as claimed in claim 1 or 2 is characterized in that: between the circuit, be distributed with one on the heat-conducting substrate with last depression or groove, connect by circuit between the chip of depression or groove.