CN2641451Y - Illuinating device composed of thin light-emitting diode - Google Patents
Illuinating device composed of thin light-emitting diode Download PDFInfo
- Publication number
- CN2641451Y CN2641451Y CNU032642792U CN03264279U CN2641451Y CN 2641451 Y CN2641451 Y CN 2641451Y CN U032642792 U CNU032642792 U CN U032642792U CN 03264279 U CN03264279 U CN 03264279U CN 2641451 Y CN2641451 Y CN 2641451Y
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- Prior art keywords
- emitting diode
- light emitting
- thin
- module
- type light
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- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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Abstract
The utility model provides a lighting device consisting of thin light emitting diodes, comprising a thin light emitting diode module and a carrier less light emitting diode module; a plurality of light emitting diodes are arranged on the conductive layer of the base plate surface and form a junction with the conductive layer for the connection with the power lead, and the other surface of the light emitting diode module is a lighting surface; a heat conduction rubber piece is also provided, whose one surface is attached to the lightless surface of the light emitting diode module; besides, the utility model is further provided with a radiator attaching to the another surface of the above heat conduction rubber piece; when in work, the heat energy generated by the light emitting diode is transferred to the radiator from the heat conduction rubber piece to decrease the working temperature. The utility model not only has advantages of high light brightness and low energy consumption, but promises high radiation efficiency.
Description
Technical field
The utility model relates to a kind of lighting device, relates in particular to a kind of lighting device with the thin-type light emitting diode formation that has height radiating efficiency, low power consuming and high luminosity can be provided.
Background technology
The evolution of lighting device, be from originally merely as light source, little by little stress design aesthetic feeling, practicality.Consider existing available limited energy in recent years, various consumption product-derived strides forward towards low power consumption, high efficiency target more.
Adopt light-emitting diode (LED) as illuminating source, to replace traditional osram lamp, this kind practice has seen among the life on every side at present, and for example the traffic signal light on the road promptly is a modal example.Utilize light-emitting diode to constitute the light source great advantage and be that its power consumption can significantly reduce, the electricity expense saved of getting off for a long time is very considerable.Moreover another advantage of light-emitting diode is that its useful life is longer, and thus, the cost of equipment consume maintenance also can reduce.So from long term object, replace traditional tungsten lamp or Halogen lamp LED will become the feasible program of saving the energy, reducing cost with light-emitting diode.
Though the lighting device that light-emitting diode constitutes, its power consumption is few than conventional lamp, and therefore the class lighting device generally is made up of a plurality of light-emitting diode collective, so the heat energy of integral body generation is still very important.About this point, please refer to shown in Figure 6ly, for United States Patent (USP) announces the 6th, 133, the light emitting diode illuminating apparatus of tool radiating effect shown in No. 589 is the arrangement by several light-emitting diode forming array formulas, but only shows among the figure that with single light-emitting diode be example.Be coated with an insulating barrier 101 on a metal substrate 100, these insulating barrier 101 tops promptly are for the line layer 102 that connects LED crystal particle 110 positive and negative polarities, and present embodiment is to adopt the routing mode, and plain conductor is connected in two line layers 102.Below LED crystal particle 110, contact with 100 formation of aforementioned metal substrate by a solid brilliant insulating barrier 103, an insulating heat-conductive layer 104.
In said structure, this LED crystal particle 110 is to be passed to metal substrate 100 via aforementioned solid brilliant insulating barrier 103 with insulating heat-conductive layer 104 because of the heat energy that energising is produced, and constitutes large-area radiating effect by metal substrate 100.
Yet; the practice of this kind lighting device; its shortcoming is that the bottom surface of LED crystal particle 110 must have solid brilliant insulating barrier 103 and insulating heat-conductive layer 104; can make the metal substrate 100 of the thermal energy transfer of generation to the below; if add the protecting colloid that is packaged in LED crystal particle 110 tops; then the volume of light-emitting diode will have certain thickness, and so the reduction in bulk meeting for product causes very big difficulty.
The utility model content
The above-mentioned shortcoming that exists for the lighting device of the light-emitting diode that overcomes existing tool radiating effect, the utility model provides a kind of lighting device that constitutes with thin-type light emitting diode, it not only has the advantage of high luminosity, low power consuming, also has high cooling efficiency.
The technical scheme that its technical problem that solves the utility model adopts is:
A kind of lighting device that constitutes with thin-type light emitting diode, it is characterized in that, include: a thin-type light emitting diode module, it is the board-like light-emitting diode (LED) module of a no-load, several light-emitting diodes are located on the conductive layer of a substrate surface, and this substrate of etching to be to expose and to form contact for being connected with power lead with this conductive layer, and other face of this light-emitting diode (LED) module is a light-emitting area; One heat conduction film, it simultaneously is the non-light-emitting area that is attached at described thin-type light emitting diode module; One radiator is the face in addition that is attached at described heat conduction film; When described light-emitting diode (LED) module was worked, the heat energy of its generation was to be passed on the described radiator from this heat conduction film, to reduce working temperature.
The aforesaid lighting device that constitutes with thin-type light emitting diode, wherein the thin-type light emitting diode module is to be high density by several LED crystal particle to arrange the light emitting module that is constituted.
The aforesaid lighting device that constitutes with thin-type light emitting diode, wherein radiator comprises a flat pedestal, and this base-plates surface has several pieces radiating fins, and this flat pedestal is a hollow sealing body, and inside is filled with heat-conducting fluid.
The aforesaid lighting device that constitutes with thin-type light emitting diode, wherein the heat conduction film is a film or is the insulating material that is mixed with ceramic powders, employing is colded pressing or the thermosetting formula is incorporated into this thin-type light emitting diode module and radiator.
Heat-conducting fluid will transfer gaseous state to by liquid state after absorbing heat energy whereby, and be dispersed evenly on the internal face of seal to improve radiating rate, will be behind gaseous molecular contact internal face because of condensation transfer liquid state once again to, and so constantly heat radiation circulation.
Description of drawings
Below in conjunction with drawings and Examples the utility model is further specified.
Fig. 1 is the decomposing schematic representation of the utility model one preferred embodiment.
Fig. 2 A～Fig. 2 C is the structural representation of the utility model thin-type light emitting diode module.
Fig. 3 A～Fig. 3 B is the structural representation of another embodiment of the utility model thin-type light emitting diode module
Fig. 4 is the circuit connection diagram of the utility model thin-type light emitting diode module.
Fig. 5 is the schematic diagram of the utility model radiator.
Fig. 6 is an existing lighting device that constitutes with light-emitting diode.
The number in the figure explanation:
1 power lead, 10 thin-type light emitting diode modules
11 substrates, 12 concave points
13 conductive layers, 14 LED crystal particle
15 sealings, 16 insulating barriers
17 light-emitting diodes, 20 heat conduction films
30 radiators, 31 pedestals
32 radiating fins, 33 heat-conducting fluids
100 metal substrates, 101 insulating barriers
102 line layers, 103 solid brilliant insulating barriers
104 insulating heat-conductive layers, 110 LED crystal particle
Embodiment
See also shown in Figure 1ly, the decomposing schematic representation for the utility model one preferred embodiment comprises:
One thin-type light emitting diode module 10, simultaneously for being connected with power lead 1, face is then as a light-emitting area in addition for it;
One heat conduction film 20 simultaneously is attached at the non-light-emitting area of aforementioned light-emitting diode (LED) module 10 with it, and the material of this heat conduction film 20 is the insulating material that is mixed with ceramic powders, can adopt to cold pressing or the thermosetting formula is attached on this thin-type light emitting diode module 10.
One radiator 30 is the faces in addition that are attached at heat conduction film 20.
Again, the visual actual user demand of the utility model is widely used in various lighting device such as indoor illumination, even on the traffic sign, does not limit it and use object.
See also shown in Fig. 2 A～Fig. 2 C, be the manufacturing flow chart of aforementioned thin-type light emitting diode module 10 1 embodiment.In Fig. 2 A, utilize a substrate 11 as bearing assembly, this substrate 11 can be Huang (red) copper coin.These substrate 11 surfaces can process etching in advance and form the slick and sly Lower pit 12 (Dimples) in several surfaces, also can not need to form concave point 12 and directly make smooth contact (as Fig. 3 A～Fig. 3 B).A conductive layer 13 is electroplated on each concave point 12 surface and part substrate 11 surfaces again, the metal surface that this conductive layer 13 has anticorrosion properties and can supply gold thread or aluminum steel to connect, also can be used as the thin metal layer that connects for the tin lead welding, as copper/nickel/copper/soft nickel/soft gold, soft nickel/soft gold, soft nickel/gold/palladium etc.No matter be to adopt which kind of material to constitute.The preferred thickness of this conductive layer 13 is to be as thin as 3um according to the I of the specified current design of product.
After treating that LED crystal particle 14 is glutinous and placing on the substrate 11, carrying out the encapsulating encapsulation process again, is to be the example explanation with the light-emitting diode because of present embodiment, so employed sealing 15 is a light transmissive material.
See also shown in Fig. 2 B, Fig. 2 C, after the sealing step is finished, carry out etching at aforesaid base plate 11 bottom surfaces, conductive layer 13 bottom surfaces and part sealing 15 on former concave point 12 or the smooth contact are revealed, part substrate 11 then reservation uses as lead frame 11 ' (Lead-frame).
See also Fig. 3 A～Fig. 3 B and be depicted as another embodiment of the present invention, be that with the first embodiment main difference point conductive layer 13 is to be designed to plane formula, it almost only is the thickness of adhesive body that the optimum benefits of this embodiment is to encapsulate the finished product thickness of finishing, and reduces small product size really greatly.
In sum, the structure of aforementioned thin-type light emitting diode module 10 is to be made of several light-emitting diodes 17, and each LED crystal particle 110 is not to stick at behind the printing board PCB again that encapsulating covers.But earlier after the surface of a thin substrate such as copper coin forms circuit, each LED crystal particle 110 is adhered on the circuit, in the encapsulation of grain surface encapsulating, reserved line from this substrate bottom surface etching and only.The module of this kind no-load plate technique, existence because of no printed circuit board (PCB), as a complete unit, the thickness of this light-emitting diode (LED) module 10 as thin as a wafer, naturally significantly reduce volume, in addition, utilize this kind process technique, can arrange out highdensity LED crystal particle, so can reach high luminosity requirement easily.
Shown in Figure 4, the vertical view of this thin-type light emitting diode module 10, the positive contact of aforementioned each light-emitting diode 17 can connect jointly and form single contact, and as the contact that is connected with power lead 1, the negative contacts of each light-emitting diode 17 also adopts this connected mode.
See also shown in Fig. 5, the structure of aforementioned radiator 30 includes a flat hollow sealing pedestal 31, and these pedestal 31 bottom surfaces are to combine with aforementioned heat conduction film 20, and pedestal 31 end faces then are provided with several radiating fin 32.These hollow base 31 inside are filled with heat-conducting fluid 33 again, when pedestal 31 by heat conduction film 20 with after light-emitting diode (LED) module 10 combines, heat-conducting fluid 33 can absorb the heat energy that light-emitting diode (LED) module 10 is produced, and transfer gaseous state to by liquid state, be dispersed evenly to this hollow base 31 inside with gaseous molecular, and has the effect of Homogeneouslly-radiating, to promote radiating rate, behind gaseous molecular contact internal face, transfer liquid state once again to because of condensation, and be back to pedestal 31 bottoms once again from internal face, so form the heat radiation circulation.Moreover, by the setting of several pieces radiating fins 32, area of dissipation is greatly increased, also can improve whole radiating efficiency.
By aforementioned detailed description, the utility model compared with prior art, has following plurality of advantages with the lighting device that thin-type light emitting diode constitutes:
1. high cooling efficiency: utilize radiator to be incorporated on the light-emitting diode (LED) module, whereby, module is able to quick dissipation because of the heat energy that work produces, and the stable operating state of light-emitting diode (LED) module is very helpful for keeping, and the useful life of extension fixture.
2. high luminosity: on aforementioned light-emitting diode (LED) module, because of processing procedure just, the brilliant material of light-emitting diode is to high-density easily arranges, so the lighting device of high luminosity can be provided.
3. reduction in bulk: because of aforementioned light-emitting diode (LED) module, be to adopt the manufacturing of no-load plate technique, do not use printed circuit board (PCB) fully, so thickness almost only is the encapsulating colloid.
In sum, the utility model has novelty, creativeness, practicality with the lighting device that thin-type light emitting diode constitutes, and meets novel patent requirement, so file an application in accordance with the law.
Claims (4)
1. a lighting device that constitutes with thin-type light emitting diode is characterized in that, includes:
One thin-type light emitting diode module, it is the board-like light-emitting diode (LED) module of a no-load, several light-emitting diodes are located on the conductive layer of a substrate surface, and form contact for being connected with power lead with this conductive layer, and the face in addition of this light-emitting diode (LED) module is a light-emitting area;
One heat conduction film, it simultaneously is the non-light-emitting area that is attached at described thin-type light emitting diode module;
One radiator is the face in addition that is attached at described heat conduction film.
2. the lighting device that constitutes with thin-type light emitting diode according to claim 1 is characterized in that described thin-type light emitting diode module is to be high density by several LED crystal particle to arrange the light emitting module that is constituted.
3. the lighting device that constitutes with thin-type light emitting diode according to claim 1 and 2, it is characterized in that described radiator comprises a flat pedestal, this base-plates surface has several pieces radiating fins, and this flat pedestal is a hollow sealing body, and inside is filled with heat-conducting fluid.
4. the lighting device that constitutes with thin-type light emitting diode according to claim 3 is characterized in that described heat conduction film is a film or for to be mixed with the insulating material of ceramic powders, and is incorporated into this thin-type light emitting diode module and radiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU032642792U CN2641451Y (en) | 2003-06-23 | 2003-06-23 | Illuinating device composed of thin light-emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU032642792U CN2641451Y (en) | 2003-06-23 | 2003-06-23 | Illuinating device composed of thin light-emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2641451Y true CN2641451Y (en) | 2004-09-15 |
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ID=34297207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU032642792U Expired - Lifetime CN2641451Y (en) | 2003-06-23 | 2003-06-23 | Illuinating device composed of thin light-emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2641451Y (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006050656A1 (en) * | 2004-11-09 | 2006-05-18 | Xuelin Li | A HEAT-DISPERSING STRUCTURE FOR THE LEDs LAMP |
| WO2006086927A1 (en) * | 2005-02-21 | 2006-08-24 | Sze Keun Chan | Led lighting lamp tube |
| WO2006128318A1 (en) * | 2005-03-31 | 2006-12-07 | Neobulb Technologies, Inc. | A high power led illuminating equipment having high thermal diffusivity |
| WO2007012240A1 (en) * | 2005-07-29 | 2007-02-01 | Zhiqing Xia | A led lamp with metal cooling panels |
| WO2008011756A1 (en) * | 2006-07-19 | 2008-01-31 | Jen-Shyan Chen | High power light emitting diode illuminating equipment with efficiently heat-dissipating module |
| CN100385313C (en) * | 2004-10-29 | 2008-04-30 | Lg.菲利浦Lcd株式会社 | Backlight unit and liquid crystal display device |
| WO2008055387A1 (en) * | 2006-11-10 | 2008-05-15 | Lo, Mei-Liang | A heat dissipating apparatus for lamp and method thereof |
| CN101208556B (en) * | 2005-06-29 | 2010-10-06 | 宗拓贝尔照明器材有限公司 | Lamp with a plurality of light-emitting diodes arranged in a decentralized manner |
| CN101408299B (en) * | 2007-10-10 | 2011-02-09 | 富准精密工业(深圳)有限公司 | LED light fitting with heat radiating device |
-
2003
- 2003-06-23 CN CNU032642792U patent/CN2641451Y/en not_active Expired - Lifetime
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100385313C (en) * | 2004-10-29 | 2008-04-30 | Lg.菲利浦Lcd株式会社 | Backlight unit and liquid crystal display device |
| WO2006050656A1 (en) * | 2004-11-09 | 2006-05-18 | Xuelin Li | A HEAT-DISPERSING STRUCTURE FOR THE LEDs LAMP |
| WO2006086927A1 (en) * | 2005-02-21 | 2006-08-24 | Sze Keun Chan | Led lighting lamp tube |
| WO2006128318A1 (en) * | 2005-03-31 | 2006-12-07 | Neobulb Technologies, Inc. | A high power led illuminating equipment having high thermal diffusivity |
| US7726844B2 (en) | 2005-03-31 | 2010-06-01 | Neobulb Technologies, Inc. | Illuminating equipment using high power LED with high efficiency of heat dissipation |
| AU2005332526B2 (en) * | 2005-03-31 | 2011-09-08 | Neobulb Technologies, Inc. | A high power LED illuminating equipment having high thermal diffusivity |
| US8226272B2 (en) | 2005-03-31 | 2012-07-24 | Neobulb Technologies, Inc. | Illuminating equipment using high power LED with high efficiency of heat dissipation |
| CN101208556B (en) * | 2005-06-29 | 2010-10-06 | 宗拓贝尔照明器材有限公司 | Lamp with a plurality of light-emitting diodes arranged in a decentralized manner |
| WO2007012240A1 (en) * | 2005-07-29 | 2007-02-01 | Zhiqing Xia | A led lamp with metal cooling panels |
| WO2008011756A1 (en) * | 2006-07-19 | 2008-01-31 | Jen-Shyan Chen | High power light emitting diode illuminating equipment with efficiently heat-dissipating module |
| WO2008055387A1 (en) * | 2006-11-10 | 2008-05-15 | Lo, Mei-Liang | A heat dissipating apparatus for lamp and method thereof |
| CN101408299B (en) * | 2007-10-10 | 2011-02-09 | 富准精密工业(深圳)有限公司 | LED light fitting with heat radiating device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20130623 Granted publication date: 20040915 |