CN2413390Y - Light-emitting diode device - Google Patents
Light-emitting diode device Download PDFInfo
- Publication number
- CN2413390Y CN2413390Y CN00205585U CN00205585U CN2413390Y CN 2413390 Y CN2413390 Y CN 2413390Y CN 00205585 U CN00205585 U CN 00205585U CN 00205585 U CN00205585 U CN 00205585U CN 2413390 Y CN2413390 Y CN 2413390Y
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- China
- Prior art keywords
- light
- heat
- radiating substrate
- emitting diodes
- lighting division
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- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- Led Devices (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Abstract
The utility model relates to a light-emitting diode device which aims to provide a light-emitting device with the advantages of reducing thermal resistance, increasing bearing electric current, improving brightness, reducing volume and fitting for high-power operating conditions. The utility model comprises at least one heat dissipation basal plate made of metal material and at least one lighting part, wherein the lighting part comprises a groove arranged on the heat dissipation basal plate, a printed circuit board arranged above the heat dissipation basal plate, at least one wafer of a light emitting diode body and at least one conducting wire connected between the corresponding wafer of the light emitting diode body and the corresponding printed circuit board; the wafer of the light emitting diode body is fixedly arranged in the groove of the heat dissipation basal plate. The heat dissipation basal plate is positioned on the bottom of the utility model, and the lighting part is arranged on the heat dissipation basal plate.
Description
The utility model belongs to light-emitting device, particularly a kind of light-emitting diodes body device.
As shown in Figure 1, the indicator light of the general indicating lamp device that uses because of thermal resistance is too high, makes its internal heat be difficult for shedding, so cause temperature to rise with the increase of using electric current, luminous benefit descends, and does not work thereby indicator light is become; And may internal temperature be increased because of electric current is excessive accidentally if there is an indicator light to use, even may lose efficacy, so the transmission indicator light be suitable for high-power service condition because of thermal expansion causes indicator light too greatly.
The purpose of this utility model provides a kind of thermal resistance, raising loaded current, raising brightness, reduced volume of reducing to be applicable to the light-emitting diodes body device of high-power service conditions.
The utility model comprises at least one heat-radiating substrate and at least one Lighting Division of being made by metal material; Lighting Division comprises the groove of being located on the heat-radiating substrate, printed circuit board (PCB), at least one LED Chips for Communication and at least one lead that is connected between corresponding LED Chips for Communication and the printed circuit board (PCB) of being located at the heat-radiating substrate top; LED Chips for Communication is located in the heat-radiating substrate groove, and is fixedly arranged on the heat-radiating substrate; Heat-radiating substrate is positioned at the bottom, and Lighting Division is located on the heat-radiating substrate.
Wherein:
Be provided with secondary carrier between LED Chips for Communication and the heat-radiating substrate; LED Chips for Communication is fixedly arranged on the heat-radiating substrate through secondary carrier.
Lighting Division also comprises is located at the wafer protection glue-line of heat-radiating substrate groove with the protection LED Chips for Communication.
Lighting Division also comprises being packaged in outside the LED Chips for Communication launches the encapsulating mirror lamella at visual angle in order to adjust light.
The heat-radiating substrate bottom surface is provided with fin.
Encapsulating mirror sheet series of strata are positioned to be positioned on the printed circuit board (PCB) of heat-radiating substrate top down to a few spacer layer.
Lighting Division comprises that plural number can send the LED Chips for Communication of two kinds of colors at least.
At least one Lighting Division comprises that plural number can send the Lighting Division of two kinds of colors at least.
The surface that Lighting Division is set of heat-radiating substrate is the plane.
The surface that Lighting Division is set of heat-radiating substrate is a curved surface.
Heat-radiating substrate is the strip plate.
Heat-radiating substrate is the bending plate.
The plural number Lighting Division is arranged at respectively on the plural heat-radiating substrate.
The plural number heat-radiating substrate is arranged at same printed circuit board (PCB) below.
At least one LED Chips for Communication is for sending the plural LED Chips for Communication of blue light; Contain the fluorescent agent that can send white light in Lighting Division.
At least one LED Chips for Communication is for sending the plural LED Chips for Communication of purple light; Contain the fluorescent agent that can send white light in Lighting Division.
The Lighting Division top is provided with at least one light shield.
Lighting Division comprises that plural number can send the LED Chips for Communication of two kinds of colors at least.
At least one Lighting Division comprises that plural number can send the Lighting Division of two kinds of colors at least.
Because the utility model comprises at least one heat-radiating substrate and at least one Lighting Division of being made by metal material; Lighting Division comprises the groove of being located on the heat-radiating substrate, printed circuit board (PCB), at least one LED Chips for Communication and at least one lead that is connected between corresponding LED Chips for Communication and the printed circuit board (PCB) of being located at the heat-radiating substrate top; LED Chips for Communication is fixedly arranged in the heat-radiating substrate groove; Heat-radiating substrate is positioned at the bottom, Lighting Division is located on the heat-radiating substrate, just constitutes the utility model of utilization low thermal resistance, by directly being fixedly arranged on LED Chips for Communication on the heat-radiating substrate, can significantly reduce thermal resistance, improve loaded current, be specially adapted under the high-power condition; And, just can on equal area, significantly improve brightness by improving single wafer luminosity; Or under the same brightness condition reduced volume significantly, so can reduce thermal resistance, improve loaded current, improving brightness, reduced volume, to be applicable to high-power service conditions, thereby reach the purpose of this utility model.
Fig. 1, indicating lamp structure diagrammatic elevation view for commonly using.
Fig. 2, be the utility model embodiment one structural representation cutaway view.
Fig. 3, be the utility model embodiment two structural representation cutaway views.
Fig. 4, be the utility model embodiment three structural representation cutaway views.
Fig. 5, be the utility model embodiment four structural representation cutaway views.
Fig. 6, for the utility model embodiment one structural representation cutaway view (luminous disome wafer is installed on the heat-radiating substrate by secondary carrier).
Fig. 7, be the utility model embodiment five structural representation front views.
Fig. 8, be the utility model embodiment six structural representation front views.
Fig. 9, be the utility model embodiment seven structural representation plane graphs.
Figure 10, be the utility model embodiment eight structural representation plane graphs.
Figure 11, be the utility model embodiment nine structural representation end views.
Figure 12, be the utility model embodiment ten structural representation end views.
Figure 13, be the utility model embodiment 11 structural representation stereograms.
Figure 14, be the utility model embodiment 12 combinational circuit connection layouts.
Figure 15, be the utility model embodiment 12 structural representation cutaway views.
Figure 16, be the utility model embodiment 13 combinational circuit connection layouts.
Figure 17, be A portion enlarged drawing (Lighting Division comprises single LED Chips for Communication) among Figure 16.
Figure 18, be A portion enlarged drawing (Lighting Division comprises a plurality of LED Chips for Communication) among Figure 16.
Figure 19, be the utility model embodiment 14 structural representation cutaway views.
Figure 20, be the utility model embodiment 14 combinational circuit connection layouts.
Figure 21, be the utility model embodiment 15 combinational circuit connection layouts.
Below in conjunction with accompanying drawing the utility model is further elaborated.
Embodiment one
As shown in Figure 2, the utility model 1A comprises heat-radiating substrate 11, at least one LED Chips for Communication 12, at least one printed circuit board (PCB) 13, one deck protection glue-line 14, one deck encapsulating mirror lamella 15 and the above location of one deck lamella 16 at least at least.
Heat-radiating substrate 11 can be the good material of thermal diffusivities such as aluminium, copper or metal and constitutes, and which is provided with the groove 112 that light-emitting diodes crystal 12 is installed, and groove 112 inner surfaces are provided with installation portion 111; The bottom of heat-radiating substrate 11 is provided with the fin 114 that forms plural number heat radiation ditch 113; Or offer plural number heat radiation ditch 113.
Printed circuit board (PCB) 13 is provided with more than one electrode part 131 and one or more electric respectively lead (aluminum steel or gold thread) 132 that is connected on the LED Chips for Communication 12; The very thin thickness of printed circuit board (PCB) 13 as 0.2mm, to reduce the absorption to reflection or refracted ray, increases whole lighting efficiency.
Encapsulating mirror lamella 15 forms circle hull shape or other shapes.
Heat-radiating substrate 11 is located at the bottom; Each LED Chips for Communication 12 is incorporated into respectively on the installation portion 111 of heat-radiating substrate 11, it can directly combine with heat-radiating substrate 11, also can be as shown in Figure 6, it is installed on the secondary carrier (Submount) 115 that is arranged on the heat-radiating substrate 11, adjusts LED Chips for Communication 12 and heat-radiating substrate 11 different thermal coefficient of expansion and heat radiation function by secondary carrier 115; Each printed circuit board (PCB) 13 is to be fixedly arranged on the heat-radiating substrate 11; Wafer protection glue-line 14 is covered in heat-radiating substrate 11 grooves 112 places, and is positioned at printed circuit board (PCB) 13 tops, by wafer protection glue-line 14 protection LED Chips for Communication 12; Encapsulating mirror lamella 15 is to be packaged on the wafer protection glue-line 14, to launch visual angle (Viewang1e) in order to adjust light; Location lamella 16 is that encapsulating mirror lamella 15 is positioned on the printed circuit board (PCB) 13 of heat-radiating substrate 11 tops; The groove 112 of heat-radiating substrate 12, installation portion 111, printed circuit board (PCB) 13, LED Chips for Communication 12 and lead 132 constitute Lighting Division 17.
Embodiment two
As shown in Figure 3, the printed circuit board (PCB) 13B of the utility model 1B is provided with the left and right electrode part 135,135 ' that lays respectively at and arranged on left and right sides, and is connected on the LED Chips for Communication 12 with left and right lead 132,132 ' electricity respectively.
Embodiment three
As shown in Figure 4, the last formation of the heat-radiating substrate 11C of the utility model 1C constitutes Lighting Division 17 by groove 112, installation portion 111, printed circuit board (PCB) 13C, LED Chips for Communication 12 and the lead 132 of heat-radiating substrate 11C more than two.
Embodiment four
As shown in Figure 5, be provided with three in the Lighting Division 17D of the utility model 1D and have different glow colors, as blue, red, green LED Chips for Communication 12,12 ', 12 "; Printed circuit board (PCB) 13D is provided with three electrode part 131,131 ', 131 ", and respectively with three leads 132,132 ', 132 " electricity is connected to three LED Chips for Communication 12,12 ', 12 with different glow colors " on, with individual drive separately.
Embodiment five
As shown in Figure 7, the heat-radiating substrate 11E lower plane of the utility model 1E is provided with a plurality of, and as four Lighting Divisions 17, heat-radiating substrate 11E goes up the plane and is provided with lamp socket portion 18.Four Lighting Divisions 17 are to send monochrome, polychrome and white light, can also have single Lighting Division 17, to constitute the flashlight lamp holder.
Embodiment six
As shown in Figure 8, the heat-radiating substrate 11F lower plane of the utility model 1F is the arcwall face that is fan-like pattern, sphere shape or other shape curved surfaces; And be provided with a plurality ofly in the lower plane of curved of heat-radiating substrate 11F, as five Lighting Divisions 17, heat-radiating substrate 11F goes up the plane and is provided with lamp socket portion 18.
Embodiment seven
As shown in Figure 9, the heat-radiating substrate 11G of the utility model 1G is strip; Be provided with in heat-radiating substrate 11G a plurality of, as 11 Lighting Divisions 17.During use, cooperate each Lighting Division 17 horizontal view angle to extend to form band light source, to be suitable for use as backlight of LCD or the 3rd stop lamp.
Embodiment eight
As shown in figure 10, the heat-radiating substrate 11H of the utility model 1H is provided with three Lighting Divisions 17, to constitute luminescence unit 19; And constitute the utility model 1H of signal lamp light emitting source by six luminescence units 19.
Embodiment nine
As shown in figure 11, the heat-radiating substrate 11I of the utility model 1I is provided with single Lighting Division 17, and is provided with light shield 20 before Lighting Division 17, to reduce the interference of extraneous light.
Embodiment ten
As shown in figure 12, the heat-radiating substrate 11J of the utility model 1J is provided with a plurality of m of being row, n is capable, the Lighting Division of arranging as four row, four lines array 17, and constituting the utility model 1J of the lamp of gathering together (CLUSTER), m, n can be positive integers such as 1 or 2 or 3.
As shown in figure 13, the heat-radiating substrate 11K of the utility model 1K is ring-type or other sigmoid bands, is provided with a plurality of Lighting Divisions 17 in heat-radiating substrate 11K, to constitute luminescence zonal texture.During use, can be suitable for use as backlight of LCD.
As Figure 14, shown in Figure 15, the heat-radiating substrate 11L of the utility model 1L is provided with three Lighting Divisions 17, to constitute luminescence unit 19L; And constitute the utility model 1L of signal lamp light emitting source by six luminescence unit 19L.Its combinational circuit system goes up and arranged on left and right sides with full wafer heat-radiating substrate 11L and sets firmly three identical (or different) and printed circuit board (PCB) 13L that circuit is communicated with respectively, and each three electrode part 131,131 ', 131 in each sheet printed circuit board (PCB) 13L " between be provided with series circuit 3; each two termination section 133,133 ' can be utilized and be spirally connected or scolding tin electrically conducts piece 4 modes with line conduction on heat-radiating substrate 11L and the printed circuit board (PCB) 13L with formation it on, constitutes combinational circuit by parallel line 2 and series circuit 3.
As Figure 16, Figure 17, shown in Figure 180, the heat-radiating substrate 11M of the utility model 1M is provided with three Lighting Divisions 17, to constitute luminescence unit 19; And constitute the utility model 1M of signal lamp light emitting source by four luminescence units 19.Its combinational circuit lies in and sets firmly the printed circuit board (PCB) 13M that the full wafer circuit is communicated with on the full wafer heat-radiating substrate 11M, each LED Chips for Communication 12 forms several left and right parallel lines that are connected with mutually 2 by left electrode (negative electrode) portion 135 and right electrode (positive electrode) portion 135 ' and series circuit 3 constitutes combinational circuit on it, and because the both positive and negative polarity of each LED Chips for Communication 12 is all located in the above, so the parallel line 2 of circuit and series circuit 3 can be determined by printed circuit board (PCB) 13M entirely, and heat-radiating substrate 11M is electrical because of itself not having, thereby can be made into whole piece.As shown in figure 17, Lighting Division 17 comprises single LED Chips for Communication 12.As shown in figure 18, Lighting Division 17 ' comprises a plurality of LED Chips for Communication 12.
As Figure 19, shown in Figure 20, the heat-radiating substrate 11N of the utility model 1N is divided into some cutting plates.On the suitable room of printed circuit board (PCB) 13N of the last left and right series connection of heat-radiating substrate 11N that is cutting plate, be spirally connected or weld and be provided with the piece 4 that electrically conducts, to be spirally connected or be welded in this sheet below more piecewise for the heat-radiating substrate 11N of cutting plate, heat radiation not only is provided, and is conducted with each series circuit 2 and each parallel line 3 of top.
As shown in figure 21, the heat-radiating substrate 11P of the utility model 1P is provided with several upper and lower parallel lines 2 of direct formation and left and right series circuit 3 constitutes the printed circuit board (PCB) 13P of combinational circuit, and need not mode string (also) connection by being spirally connected or welding.
The utlity model has following advantages:
1, is shaped by at least one heat-radiating substrate and at least one printed circuit board (PCB) appropriate combination, makes it to have Various industrial utilization.
2, by being communicated at least one parallel connection and series circuit between at least one luminous two plate body wafer, consist of Use the purpose of low thermal resistance light-emitting diode device.
3, LED Chips for Communication directly is fixedly arranged on the heat-radiating substrate, can significantly reduces thermal resistance, improve carrying Electric current is specially adapted under the high-power condition.
4, greatly increase owing to single wafer luminosity, so on equal area, significantly improve brightness; Or Reduced volume significantly under the same brightness condition.
Claims (19)
1, a kind of light-emitting diodes body device is characterized in that it comprises at least one heat-radiating substrate and at least one Lighting Division of being made by metal material; Lighting Division comprises the groove of being located on the heat-radiating substrate, printed circuit board (PCB), at least one LED Chips for Communication and at least one lead that is connected between corresponding LED Chips for Communication and the printed circuit board (PCB) of being located at the heat-radiating substrate top; LED Chips for Communication is located in the heat-radiating substrate groove, and is fixedly arranged on the heat-radiating substrate; Heat-radiating substrate is positioned at the bottom, and Lighting Division is located on the heat-radiating substrate.
2, light-emitting diodes body device according to claim 1 is characterized in that being provided with between described LED Chips for Communication and the heat-radiating substrate secondary carrier; LED Chips for Communication is fixedly arranged on the heat-radiating substrate through secondary carrier.
3, light-emitting diodes body device according to claim 1 and 2, it is characterized in that described Lighting Division also comprise be located at the heat-radiating substrate groove with the protection LED Chips for Communication the wafer protection glue-line.
4, light-emitting diodes body device according to claim 1 and 2 is characterized in that described Lighting Division comprises that also being packaged in LED Chips for Communication launches the encapsulating mirror lamella at visual angle in order to adjust light outward.
5, light-emitting diodes body device according to claim 1 and 2 is characterized in that described heat-radiating substrate bottom surface is provided with fin.
6, light-emitting diodes body device according to claim 4 is characterized in that described encapsulating mirror sheet series of strata so that a few spacer layer is positioned to be positioned on the printed circuit board (PCB) of heat-radiating substrate top.
7, light-emitting diodes body device according to claim 1 and 2 is characterized in that described Lighting Division comprises that plural number can send the LED Chips for Communication of two kinds of colors at least.
8, light-emitting diodes body device according to claim 1 and 2 is characterized in that described at least one Lighting Division comprises that plural number can send the Lighting Division of two kinds of colors at least.
9, light-emitting diodes body device according to claim 1 and 2, the surface that Lighting Division is set that it is characterized in that described heat-radiating substrate is the plane.
10, light-emitting diodes body device according to claim 1 and 2, the surface that Lighting Division is set that it is characterized in that described heat-radiating substrate is a curved surface.
11, light-emitting diodes body device according to claim 1 and 2 is characterized in that described heat-radiating substrate is the strip plate.
12, light-emitting diodes body device according to claim 1 and 2 is characterized in that described heat-radiating substrate is the bending plate.
13, light-emitting diodes body device according to claim 8 is characterized in that described plural Lighting Division is arranged at respectively on the plural heat-radiating substrate.
14, light-emitting diodes body device according to claim 13 is characterized in that described plural heat-radiating substrate is arranged at same printed circuit board (PCB) below.
15, light-emitting diodes body device according to claim 1 and 2 is characterized in that described at least one LED Chips for Communication is for sending the plural LED Chips for Communication of blue light; Contain the fluorescent agent that can send white light in Lighting Division.
16, light-emitting diodes body device according to claim 1 and 2 is characterized in that described at least one LED Chips for Communication is for sending the plural LED Chips for Communication of purple light; Contain the fluorescent agent that can send white light in Lighting Division.
17, light-emitting diodes body device according to claim 1 and 2 is characterized in that described Lighting Division top is provided with at least one light shield.
18, light-emitting diodes body device according to claim 15 is characterized in that described Lighting Division comprises that plural number can send the LED Chips for Communication of two kinds of colors at least.
19, light-emitting diodes body device according to claim 15 is characterized in that described at least one Lighting Division comprises that plural number can send the Lighting Division of two kinds of colors at least.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN00205585U CN2413390Y (en) | 2000-02-24 | 2000-02-24 | Light-emitting diode device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN00205585U CN2413390Y (en) | 2000-02-24 | 2000-02-24 | Light-emitting diode device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2413390Y true CN2413390Y (en) | 2001-01-03 |
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ID=33573728
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN00205585U Expired - Lifetime CN2413390Y (en) | 2000-02-24 | 2000-02-24 | Light-emitting diode device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2413390Y (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100421269C (en) * | 2005-06-03 | 2008-09-24 | 邢陈震仑 | Packaging device for LED in low thermal resistance |
| CN100435362C (en) * | 2004-06-21 | 2008-11-19 | 西铁城电子股份有限公司 | Light-emitting diode |
| CN100449801C (en) * | 2004-09-30 | 2009-01-07 | 晶元光电股份有限公司 | Semiconductor luminescent element composition |
| CN100452448C (en) * | 2003-02-28 | 2009-01-14 | 株式会社西铁城电子 | Light emitting element and light emitting device with the light emitting element and method for manufacturing the light emitting element |
| CN101847679A (en) * | 2009-04-02 | 2010-09-29 | 刘春� | Isothermal body heat radiation substrate of LED luminous body and isothermal body heat radiation method of LED luminous body |
| CN101369615B (en) * | 2007-08-17 | 2010-11-10 | 广东昭信光电科技有限公司 | Packaging method for low-thermal resistance high-power light-emitting diode |
| CN102322577A (en) * | 2011-09-09 | 2012-01-18 | 安徽金雨灯业有限公司 | A kind of metal substrate chip directly-mounting type LED encapsulation fluorescent lamp |
| CN101800271B (en) * | 2009-02-10 | 2012-01-18 | 亿光电子工业股份有限公司 | Light emitting diode packaging body and manufacturing method thereof |
| CN101290962B (en) * | 2007-04-19 | 2012-07-18 | 斯坦雷电气株式会社 | Optical device |
| US8389307B2 (en) | 2009-02-04 | 2013-03-05 | Everlight Electronics Co., Ltd. | Light emitting diode package and fabrication method thereof |
| CN104009028A (en) * | 2014-05-26 | 2014-08-27 | 上海信耀电子有限公司 | Integrated package method and structure of high-power LED with ceramic substrate and heat dissipation substratum |
| TWI563206B (en) * | 2016-02-26 | 2016-12-21 | ||
| CN107013857A (en) * | 2015-11-06 | 2017-08-04 | 利萨·德雷克塞迈尔有限责任公司 | Lighting device and the manufacture method of lighting device for vehicle |
| US10598314B2 (en) | 2017-03-31 | 2020-03-24 | Liquidleds Lighting Corp. | LED lamp |
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2000
- 2000-02-24 CN CN00205585U patent/CN2413390Y/en not_active Expired - Lifetime
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100452448C (en) * | 2003-02-28 | 2009-01-14 | 株式会社西铁城电子 | Light emitting element and light emitting device with the light emitting element and method for manufacturing the light emitting element |
| US7737462B2 (en) | 2003-02-28 | 2010-06-15 | Citizen Electronics Co., Ltd | Light emitting diode and light emitting diode device including the light emitting diode element and method for manufacturing the light emitting diode |
| US7745835B2 (en) | 2003-02-28 | 2010-06-29 | Citizen Electronics Co., Ltd. | Light emitting diode and light emitting diode device including the light emitting diode element and method for manufacturing the light emitting diode |
| CN100435362C (en) * | 2004-06-21 | 2008-11-19 | 西铁城电子股份有限公司 | Light-emitting diode |
| US7642704B2 (en) | 2004-06-21 | 2010-01-05 | Citizen Electronics Co., Ltd. | Light-emitting diode with a base |
| CN100449801C (en) * | 2004-09-30 | 2009-01-07 | 晶元光电股份有限公司 | Semiconductor luminescent element composition |
| CN100421269C (en) * | 2005-06-03 | 2008-09-24 | 邢陈震仑 | Packaging device for LED in low thermal resistance |
| CN101290962B (en) * | 2007-04-19 | 2012-07-18 | 斯坦雷电气株式会社 | Optical device |
| CN101369615B (en) * | 2007-08-17 | 2010-11-10 | 广东昭信光电科技有限公司 | Packaging method for low-thermal resistance high-power light-emitting diode |
| US8431948B2 (en) | 2009-02-04 | 2013-04-30 | Everlight Electronics Co., Ltd. | Light emitting diode package and fabrication method thereof |
| US8389307B2 (en) | 2009-02-04 | 2013-03-05 | Everlight Electronics Co., Ltd. | Light emitting diode package and fabrication method thereof |
| CN101800271B (en) * | 2009-02-10 | 2012-01-18 | 亿光电子工业股份有限公司 | Light emitting diode packaging body and manufacturing method thereof |
| CN101847679A (en) * | 2009-04-02 | 2010-09-29 | 刘春� | Isothermal body heat radiation substrate of LED luminous body and isothermal body heat radiation method of LED luminous body |
| CN102322577A (en) * | 2011-09-09 | 2012-01-18 | 安徽金雨灯业有限公司 | A kind of metal substrate chip directly-mounting type LED encapsulation fluorescent lamp |
| CN104009028A (en) * | 2014-05-26 | 2014-08-27 | 上海信耀电子有限公司 | Integrated package method and structure of high-power LED with ceramic substrate and heat dissipation substratum |
| CN104009028B (en) * | 2014-05-26 | 2017-06-06 | 上海信耀电子有限公司 | The high power LED integration packaging method and structure of ceramic substrate and heat radiation substrate |
| CN107013857A (en) * | 2015-11-06 | 2017-08-04 | 利萨·德雷克塞迈尔有限责任公司 | Lighting device and the manufacture method of lighting device for vehicle |
| CN107013857B (en) * | 2015-11-06 | 2023-12-12 | 利萨·德雷克塞迈尔有限责任公司 | Lighting device for vehicle and manufacturing method of lighting device |
| TWI563206B (en) * | 2016-02-26 | 2016-12-21 | ||
| US9945532B2 (en) | 2016-02-26 | 2018-04-17 | Liquidleds Lighting Corp. | Light-emitting diode light source and lamp |
| US10598314B2 (en) | 2017-03-31 | 2020-03-24 | Liquidleds Lighting Corp. | LED lamp |
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