CN101576241B - Radiating method of LED radiator and radiator for implementing same - Google Patents

Radiating method of LED radiator and radiator for implementing same Download PDF

Info

Publication number
CN101576241B
CN101576241B CN2009101355626A CN200910135562A CN101576241B CN 101576241 B CN101576241 B CN 101576241B CN 2009101355626 A CN2009101355626 A CN 2009101355626A CN 200910135562 A CN200910135562 A CN 200910135562A CN 101576241 B CN101576241 B CN 101576241B
Authority
CN
China
Prior art keywords
cooling stand
metal substrate
led
radiator
make
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2009101355626A
Other languages
Chinese (zh)
Other versions
CN101576241A (en
Inventor
安波
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongguan Perfect Science & Technology Co Ltd
Original Assignee
Dongguan Perfect Science & Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongguan Perfect Science & Technology Co Ltd filed Critical Dongguan Perfect Science & Technology Co Ltd
Priority to CN2009101355626A priority Critical patent/CN101576241B/en
Publication of CN101576241A publication Critical patent/CN101576241A/en
Application granted granted Critical
Publication of CN101576241B publication Critical patent/CN101576241B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)

Abstract

The invention discloses a radiating method of an LED radiator and also discloses the radiator for implementing same, and the radiator comprises a radiating support and a plurality of LED lights. A metal basal plate the width of which is slightly smaller than that of the radiating support is arranged on the front side of the radiating support, and a printed circuit which can be connected with the LED lights is longitudinally arranged in the middle position of the metal basal plate; the LED lights are welded on the printed circuit at intervals, and are fixed on the metal basal plate to form an integral structure. The invention has simple structure, and the metal basal plate and the radiating support are separately arranged to be convenient for manufacture; the printed circuit is arranged on the metal basal plate, and the LED lights can be directly welded, and can be fixed on the radiating support by radiating silicon grease so as to form an integral radiating structure; the heat of the LED lights can be rapidly radiated, thereby reducing the speed of LED brightness decline and greatly prolonging the service life of the LED lights; the LED lights can be used for more than 50000 hours at least by practical tests.

Description

The heat dissipating method of LED radiator and implement the radiator of this method
Technical field
The present invention relates to the LED radiator, particularly a kind of heat dissipating method of LED radiator and implement the radiator of this method.
Background technology
Traditional roads light, its light source adopts powerful mercury vapor lamp, Metal halogen lamp or high-pressure mercury lamp etc. mostly, contain hazardous substance mostly in its light source, cause environmental pollution easily, and the thick heaviness of the lamp holder of making, power consumption is big, maintenance cost is high, illuminating effect is all unsatisfactory at aspects such as colour rendering and anti-dazzle performances.Meanwhile, the development of semiconductor light sources light emitting diode (LED) is but very rapid, and in recent years, the luminous efficiency of partial L ED has substantially exceeded incandescent lamp, even surpasses the luminous efficiency of fluorescent lamp.Compare with traditional Projecting Lamp electric light source, the basic nonhazardous of led light source, no electromagnetic pollution and have that volume is little, energy consumption is low, light efficiency is high, caloric value is relatively low and many-sided advantage such as long service life can substitute conventional light source and make roads light.
Consider single chip LED luminosity deficiency, the LED light fixture generally adopts led array formula structure, has produced thus that LED light fixture heat is concentrated, local temperature is too high, causes the light decay aggravation, thereby influence the normal use of LED, causes the reduction in service life.At present, power type white light LED can only be converted into luminous energy with about 15% electric energy, and remaining 85% energy changes into heat energy.Along with the increase of LED power, quantity of heat production increases, and bad if heat dissipation problem solves, heat concentrates in the small-sized chip, makes that the chip internal temperature is more and more higher.The too high meeting of chip temperature brings many problems, as quickening device aging, accelerates the speed of LED light decay, reduction of service life, even also can cause chip to burn; How effectively solve heat radiation, become and high-powerly face the problem that presses for solution most at the LED light fixture.
Summary of the invention
At the existing high-power LED lamp existing above-mentioned deficiency of dispelling the heat, one of the object of the invention is, provides a kind of and can be in time the heat of LED be dissipated, and reduces the speed of LED light decay, thereby prolongs the heat dissipating method of the LED radiator in its service life.
The present invention also aims to, provide a kind of simple in structure, in light weight and rapid heat dissipation is used for realizing the radiator of the heat dissipating method of aforesaid LED radiator.
The present invention for achieving the above object, the technical scheme that is provided is:
A kind of heat dissipating method of LED radiator, it comprises some LED lamps, it comprises the steps:
(1) preparation one strip metal;
(2) preparation cooling stand: hole in the described strip metal back side, section, shaping processing, make its front form panel, the back side forms and is interval with some heatsink transverse fins along its long limit trend;
(3) preparation ventilation slot: on described cooling stand front, vertically be symmetrical arranged two and be used for the semicircle ventilation slot that this cooling stand ventilates;
(4) preparation one plate-shape metal;
(5) preparation metal substrate: described plate-shape metal is carried out shaping processing, make its width be slightly less than the width of described cooling stand;
(6) make the substrate module: can connect the printed wire of described LED lamp in the positive vertical setting in centre position of described metal substrate, at interval described LED lamp is welded on the described printed wire, and be fixed on the described metal substrate and form integral structure;
(7) make LED lamp module: adopt heat dissipating silicone grease that described substrate module is bonded on the panel of cooling stand;
The heat that described LED lamp produces distributes via the heat radiation and the convection action of described metal substrate and cooling stand.
Described step (3), it also comprises the steps:
(31), be used to make this surface to possess waterproof and dustproof, the processing of oxidation resistant nano-solution in the surface of described cooling stand.
Described step (5), it also comprises the steps:
(51), be used to make this surface to possess waterproof and dustproof, the processing of oxidation resistant nano-solution in the surface of described metal substrate.
A kind of radiator of implementing the heat dissipating method of above-mentioned LED radiator, it comprises a cooling stand and some LED lamps, described cooling stand front is provided with a metal substrate that is slightly less than its width, this vertical setting in metal substrate centre position can connect the printed wire of described LED lamp, described LED lamp is welded on the described printed wire at interval, and is fixed on the described metal substrate and forms integral structure.
On the cooling stand front of described metal substrate both sides, be arranged with and be convenient to the semicircle ventilation slot that this cooling stand ventilates.
Move towards the heatsink transverse fin that the interval vertically is provided with the big or small corresponding area of dissipation of light source of some and described LED lamp in the described cooling stand back side along its long limit.
Described radiating fin thickness is 1~5 millimeter.
Described cooling stand adopts 99% pure aluminum material to make.
The surface of described cooling stand possesses waterproof and dustproof, oxidation resistant nanotechnology treatments.
Described metal substrate is bonded on the described cooling stand by heat dissipating silicone grease;
Described metal substrate adopts 99% pure aluminum material to make.
The surface of described metal substrate possesses waterproof and dustproof, oxidation resistant nanotechnology treatments.
Beneficial effect of the present invention is: method provided by the invention can be in time dissipates the heat of LED, thereby reduces the speed of its light decay, increases the service life; Radiator provided by the invention, simple in structure, metal substrate and cooling stand separate type are provided with, and are convenient to preparation; The metal substrate and the cooling stand that adopt 99% pure aluminum material to make, it is in light weight; For making its radiating effect better, be provided with radiating fin in cooling stand, its thickness is 1~5 millimeter, is provided with two ventilation slots so that ventilate in cooling stand simultaneously; Metal substrate is provided with printed wire, can directly weld the LED lamp, and is fixed on the described cooling stand by heat dissipating silicone grease, forms the radiator structure of integral type, can be rapidly the heat of LED lamp be distributed, thereby has thoroughly solved the heat radiation difficult problem of great power LED; Simultaneously cooling stand and metal substrate all adopt nanotechnology treatments, its without water stained on its surface, are not stained with dirt, have self-cleaning function; Prove through practical test, the present invention in the course of the work, temperature maintains 45 ℃ ± 5 ℃ scope all the time; Prolonged the service life of LED lamp greatly, can use more than 50000 hours at least.
Description of drawings
Fig. 1 is a perspective view of the present invention
Fig. 2 is the decomposing schematic representation of Fig. 1;
Fig. 3 is the front view of Fig. 1;
Fig. 4 is the left view of Fig. 1.
The specific embodiment
Embodiment: referring to Fig. 1, Fig. 2 and Fig. 3, the embodiment of the invention provides a kind of heat dissipating method of LED radiator, and it comprises some LED lamps 3, and it comprises the steps::
(1) preparation one strip metal;
(2) preparation cooling stand 1: hole in the described strip metal back side, section, shaping processing, make its front form panel, the back side forms and is interval with some heatsink transverse fins 11 along its long limit trend;
(3) preparation ventilation slot 12: on described cooling stand 1 front, vertically be symmetrical arranged two and be used for the semicircle ventilation slot 12 that this cooling stand 1 ventilates;
(4), be used to make this surface to possess waterproof and dustproof, the processing of oxidation resistant nano-solution in the surface of described cooling stand 1.
(4) preparation one plate-shape metal;
(5) preparation metal substrate 2: described plate-shape metal is carried out shaping processing, make its width be slightly less than the width of described cooling stand 1;
(6), be used to make this surface to possess waterproof and dustproof, the processing of oxidation resistant nano-solution in the surface of described metal substrate 2.
(7) make the substrate module: can connect the printed wire of described LED lamp 3 in the described metal substrate vertical setting in 2 positive centre positions, at interval described LED lamp 3 is welded on the described printed wire, and be fixed on the described metal substrate 2 and form integral structure;
(8) make LED lamp 3 modules: adopt heat dissipating silicone grease that described substrate module is bonded on the panel of cooling stand 1;
(9) after 3 work of connection power LED lamp, the heat that this LED lamp 3 produces distributes via the heat radiation and the convection action of described metal substrate 2 and cooling stand 1; And heat is big more, and radiation and convection action are strong more.
The radiator that a kind of heat dissipating method of implementing above-mentioned LED radiator is made, it comprises a cooling stand 1, a metal substrate 2 and some LED lamps 3, cooling stand 1 and metal substrate 2 adopt 99% pure aluminum material to make; Metal substrate 2 is carried out shaping processing, make its width be slightly less than the width of cooling stand 1; Cut into slices at cooling stand 1 back side, shaping, make the heatsink transverse fin 11 of the big or small corresponding area of dissipation of light source that move towards vertically to be provided with at interval some and LED lamp 3 along its long limit; These radiating fin 11 thickness are 2 millimeters, and in other embodiments, these radiating fin 11 thickness can be between 1~5 millimeter; The area of dissipation of radiating fin 11 can be set according to the light source actual size of LED lamp 3, promptly change its height and width, the quantity of radiating fin 11 and the length of cooling stand 1 can be adjusted according to actual conditions simultaneously, to reach the best radiating effect of LED lamp 3.The leading indicator of estimating a LED radiator is the efficiently radiates heat area of LED radiator, and the big more expression radiating effect of efficiently radiates heat area is good more.That is: the big more radiating effect of Pin and Fin ratio is good more, and Pin is meant the area of radiating fin 11, and Fin is meant the distance between the two adjacent fins.For making its radiating effect better, on cooling stand 1 front of metal substrate 2 both sides, be arranged with and be convenient to the semicircle ventilation slot 12 that this cooling stand 1 ventilates; After cooling stand 1 and metal substrate 2 machine-shapings, all adopt nano-solution to handle, make its surface have self-cleaning function, energy waterproof and dustproof and anti-oxidant; Other embodiment can carry out other technical finesse or do not handle its surface; The printed wire that can connect described LED lamp 3 in the metal substrate vertical setting in 2 positive centre positions, at interval described LED lamp 3 is welded on this printed wire, and be fixed on the cooling stand 1 radiator structure that forms integral type, thereby make LED lamp 3 modules by heat dissipating silicone grease; Heat in the time of can fast LED lamp 3 being worked like this distributes, thereby has thoroughly solved the heat radiation difficult problem of great power LED.
As described in the above embodiment of the present invention, adopt structure same or similar and other radiator and the heat dissipating method that obtain, all in protection domain of the present invention with it.

Claims (6)

1. the heat dissipating method of a LED radiator, it comprises some LED lamps, it is characterized in that it comprises the steps:
(1) preparation one strip metal;
(2) preparation cooling stand: hole in the described strip metal back side, section, shaping processing, make its front form panel, the back side forms and is interval with some heatsink transverse fins along its long limit trend;
(3) preparation ventilation slot: on described cooling stand front, vertically be symmetrical arranged two and be used for the semicircle ventilation slot that this cooling stand ventilates;
(4) preparation one plate-shape metal;
(5) preparation metal substrate: described plate-shape metal is carried out shaping processing, make its width be slightly less than the width of described cooling stand;
(6) make the substrate module: can connect the printed wire of described LED lamp in the positive vertical setting in centre position of described metal substrate, at interval described LED lamp is welded on the described printed wire, and be fixed on the described metal substrate and form integral structure;
(7) make LED lamp module: adopt heat dissipating silicone grease that described substrate module is bonded on the panel of cooling stand;
The heat that described LED lamp produces distributes via the heat radiation and the convection action of described metal substrate and cooling stand.
2. the heat dissipating method of LED radiator according to claim 1 is characterized in that, described step (3), and it also comprises the steps:
(31), be used to make this surface to possess waterproof and dustproof, the processing of oxidation resistant nano-solution in the surface of described cooling stand.
3. the heat dissipating method of LED radiator according to claim 1 is characterized in that, described step (5), and it also comprises the steps:
(51), be used to make this surface to possess waterproof and dustproof, the processing of oxidation resistant nano-solution in the surface of described metal substrate.
4. radiator of implementing the heat dissipating method of the described LED radiator of claim 1, it comprises a cooling stand and some LED lamps, it is characterized in that, one strip metal, hole at this strip metal back side, section, shaping processing, its front formation panel, the back side are formed be interval with some heatsink transverse fins, constitute cooling stand thus along its long limit trend; Described cooling stand front is provided with a metal substrate that is slightly less than its width, this vertical setting in metal substrate centre position can connect the printed wire of described LED lamp, described LED lamp is welded on the described printed wire at interval, and is fixed on the described metal substrate and forms integral structure; On the cooling stand front of described metal substrate both sides, vertically be symmetrical arranged two and be used for the semicircle ventilation slot that this cooling stand ventilates; Described metal substrate is bonded on the described cooling stand by heat dissipating silicone grease.
5. radiator according to claim 4 is characterized in that, described radiating fin thickness is 1~5 millimeter.
6. radiator according to claim 4 is characterized in that, described cooling stand and metal substrate adopt 99% pure aluminum material to make.
CN2009101355626A 2009-04-27 2009-04-27 Radiating method of LED radiator and radiator for implementing same Expired - Fee Related CN101576241B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009101355626A CN101576241B (en) 2009-04-27 2009-04-27 Radiating method of LED radiator and radiator for implementing same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009101355626A CN101576241B (en) 2009-04-27 2009-04-27 Radiating method of LED radiator and radiator for implementing same

Publications (2)

Publication Number Publication Date
CN101576241A CN101576241A (en) 2009-11-11
CN101576241B true CN101576241B (en) 2011-01-05

Family

ID=41271242

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009101355626A Expired - Fee Related CN101576241B (en) 2009-04-27 2009-04-27 Radiating method of LED radiator and radiator for implementing same

Country Status (1)

Country Link
CN (1) CN101576241B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101793368A (en) * 2010-03-16 2010-08-04 海洋王照明科技股份有限公司 Embedded taxiway illumination device
CN102606994A (en) * 2011-01-21 2012-07-25 贺志萍 Radiating device for LED lamp and manufacturing method thereof
CN103256576A (en) * 2012-02-21 2013-08-21 黄子晋 Low-cost high-efficient radiating device of long-service-life LED energy-saving lamp
CN102818189A (en) * 2012-08-07 2012-12-12 苏州金科信汇光电科技有限公司 LED (light emitting diode) street lamp structure with heat conducting hole and hot runner
CN103277772A (en) * 2013-06-26 2013-09-04 苏州金科信汇光电科技有限公司 Bidirectional ventilated heat dissipation structure of lamp
CN104019389A (en) * 2014-05-30 2014-09-03 广东金源照明科技有限公司 Efficient-heat-dissipation integrated LED modulator tube structure and production process thereof

Also Published As

Publication number Publication date
CN101576241A (en) 2009-11-11

Similar Documents

Publication Publication Date Title
CN101576241B (en) Radiating method of LED radiator and radiator for implementing same
CN101839413A (en) LED fluorescent lamp
CN201141526Y (en) Novel LED daylight lamp
CN101576242B (en) Radiating method of high-power LED radiator and radiator for implementing same
CN2872073Y (en) High-brightness and large-power LED light
CN202629635U (en) Quickly-radiated light-emitting diode (LED) bulb
CN201302064Y (en) Large-power LED film lamp
CN201232870Y (en) Plate type LED lamp with multi-angle curved surface
CN204629144U (en) Cross-ventilation radiating type LED lamp
CN101493219A (en) High heat radiation LED illuminating apparatus and method for manufacturing same
CN208204944U (en) LED lamp heat sink
CN201652268U (en) High-power LED radiating module
CN103227266B (en) LED encapsulation structure
CN201964194U (en) Novel strip-shaped light-emitting diode (LED) lamp
CN201221716Y (en) LED embedding lamp
CN201166348Y (en) High heat radiation performance LED illuminating apparatus
CN201547725U (en) Heat dissipation device of LED lamp
CN102434864B (en) Heat-dissipating method of LED (Light-Emitting Diode) heat-dissipating module and LED heat-dissipating module
CN201242127Y (en) Heat radiation daylight lamp
CN111106099A (en) High-power COB heat dissipation packaging structure
CN203571681U (en) Radiator for LED lamp
CN202303080U (en) LED (light-emitting diode) down lamp
CN200968580Y (en) High power LED lighting lamp
CN203364069U (en) External heat dissipation mechanism of LED front steering lamp
CN102544344A (en) Composite phase-change three-dimensional light emitting diode (LED) heat radiator

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110105