CN101576241A - Radiating method of LED radiator and radiator for implementing same - Google Patents
Radiating method of LED radiator and radiator for implementing same Download PDFInfo
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- CN101576241A CN101576241A CNA2009101355626A CN200910135562A CN101576241A CN 101576241 A CN101576241 A CN 101576241A CN A2009101355626 A CNA2009101355626 A CN A2009101355626A CN 200910135562 A CN200910135562 A CN 200910135562A CN 101576241 A CN101576241 A CN 101576241A
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- radiator
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- 238000000034 method Methods 0.000 title claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims abstract description 56
- 239000002184 metal Substances 0.000 claims abstract description 56
- 239000004519 grease Substances 0.000 claims abstract description 8
- 238000001816 cooling Methods 0.000 claims description 51
- 239000000758 substrate Substances 0.000 claims description 44
- 238000002360 preparation method Methods 0.000 claims description 16
- 238000012545 processing Methods 0.000 claims description 13
- 238000009423 ventilation Methods 0.000 claims description 10
- 238000007493 shaping process Methods 0.000 claims description 9
- 230000003647 oxidation Effects 0.000 claims description 8
- 238000007254 oxidation reaction Methods 0.000 claims description 8
- 229920001296 polysiloxane Polymers 0.000 claims description 7
- 230000005855 radiation Effects 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000012360 testing method Methods 0.000 abstract description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 230000007423 decrease Effects 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 6
- 238000011282 treatment Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 235000006708 antioxidants Nutrition 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000000383 hazardous chemical Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention discloses a radiating method of an LED radiator and also discloses the radiator for implementing same, and the radiator comprises a radiating support and a plurality of LED lights. A metal basal plate the width of which is slightly smaller than that of the radiating support is arranged on the front side of the radiating support, and a printed circuit which can be connected with the LED lights is longitudinally arranged in the middle position of the metal basal plate; the LED lights are welded on the printed circuit at intervals, and are fixed on the metal basal plate to form an integral structure. The invention has simple structure, and the metal basal plate and the radiating support are separately arranged to be convenient for manufacture; the printed circuit is arranged on the metal basal plate, and the LED lights can be directly welded, and can be fixed on the radiating support by radiating silicon grease so as to form an integral radiating structure; the heat of the LED lights can be rapidly radiated, thereby reducing the speed of LED brightness decline and greatly prolonging the service life of the LED lights; the LED lights can be used for more than 50000 hours at least by practical tests.
Description
Technical field
The present invention relates to the LED radiator, particularly a kind of heat dissipating method of LED radiator and implement the radiator of this method.
Background technology
Traditional roads light, its light source adopts powerful mercury vapor lamp, Metal halogen lamp or high-pressure mercury lamp etc. mostly, contain hazardous substance mostly in its light source, cause environmental pollution easily, and the thick heaviness of the lamp holder of making, power consumption is big, maintenance cost is high, illuminating effect is all unsatisfactory at aspects such as colour rendering and anti-dazzle performances.Meanwhile, the development of semiconductor light sources light emitting diode (LED) is but very rapid, and in recent years, the luminous efficiency of partial L ED has substantially exceeded incandescent lamp, even surpasses the luminous efficiency of fluorescent lamp.Compare with traditional Projecting Lamp electric light source, the basic nonhazardous of led light source, no electromagnetic pollution and have that volume is little, energy consumption is low, light efficiency is high, caloric value is relatively low and many-sided advantage such as long service life can substitute conventional light source and make roads light.
Consider single chip LED luminosity deficiency, the LED light fixture generally adopts led array formula structure, has produced thus that LED light fixture heat is concentrated, local temperature is too high, causes the light decay aggravation, thereby influence the normal use of LED, causes the reduction in service life.At present, power type white light LED can only be converted into luminous energy with about 15% electric energy, and remaining 85% energy changes into heat energy.Along with the increase of LED power, quantity of heat production increases, and bad if heat dissipation problem solves, heat concentrates in the small-sized chip, makes that the chip internal temperature is more and more higher.The too high meeting of chip temperature brings many problems, as quickening device aging, accelerates the speed of LED light decay, reduction of service life, even also can cause chip to burn; How effectively solve heat radiation, become and high-powerly face the problem that presses for solution most at the LED light fixture.
Summary of the invention
At the existing high-power LED lamp existing above-mentioned deficiency of dispelling the heat, one of the object of the invention is, provides a kind of and can be in time the heat of LED be dissipated, and reduces the speed of LED light decay, thereby prolongs the heat dissipating method of the LED radiator in its service life.
The present invention also aims to, provide a kind of simple in structure, in light weight and rapid heat dissipation is used for realizing the radiator of the heat dissipating method of aforesaid LED radiator.
The present invention for achieving the above object, the technical scheme that is provided is:
A kind of heat dissipating method of LED radiator, it comprises some LED lamps, it comprises the steps:
(1) preparation one strip metal;
(2) preparation cooling stand: hole in the described strip metal back side, section, shaping processing, make its front form panel, the back side forms and is interval with some heatsink transverse fins along its long limit trend;
(3) preparation ventilation slot: on described cooling stand front, vertically be symmetrical arranged two and be used for the semicircle ventilation slot that this cooling stand ventilates;
(4) preparation one plate-shape metal;
(5) preparation metal substrate: described plate-shape metal is carried out shaping processing, make its width be slightly less than the width of described cooling stand;
(6) make the substrate module: can connect the printed wire of described LED lamp in the positive vertical setting in centre position of described metal substrate, at interval described LED lamp is welded on the described printed wire, and be fixed on the described metal substrate and form integral structure;
(7) make LED lamp module: adopt heat dissipating silicone grease that described substrate module is bonded on the panel of cooling stand;
The heat that described LED lamp produces distributes via the heat radiation and the convection action of described metal substrate and cooling stand.
Described step (3), it also comprises the steps:
(31), be used to make this surface to possess waterproof and dustproof, the processing of oxidation resistant nano-solution in the surface of described cooling stand.
Described step (5), it also comprises the steps:
(51), be used to make this surface to possess waterproof and dustproof, the processing of oxidation resistant nano-solution in the surface of described metal substrate.
A kind of radiator of implementing the heat dissipating method of above-mentioned LED radiator, it comprises a cooling stand and some LED lamps, described cooling stand front is provided with a metal substrate that is slightly less than its width, this vertical setting in metal substrate centre position can connect the printed wire of described LED lamp, described LED lamp is welded on the described printed wire at interval, and is fixed on the described metal substrate and forms integral structure.
On the cooling stand front of described metal substrate both sides, be arranged with and be convenient to the semicircle ventilation slot that this cooling stand ventilates.
Move towards the heatsink transverse fin that the interval vertically is provided with the big or small corresponding area of dissipation of light source of some and described LED lamp in the described cooling stand back side along its long limit.
Described radiating fin thickness is 1～5 millimeter.
Described cooling stand adopts 99% pure aluminum material to make.
The surface of described cooling stand possesses waterproof and dustproof, oxidation resistant nanotechnology treatments.
Described metal substrate is bonded on the described cooling stand by heat dissipating silicone grease;
Described metal substrate adopts 99% pure aluminum material to make.
The surface of described metal substrate possesses waterproof and dustproof, oxidation resistant nanotechnology treatments.
Beneficial effect of the present invention is: method provided by the invention can be in time dissipates the heat of LED, thereby reduces the speed of its light decay, increases the service life; Radiator provided by the invention, simple in structure, metal substrate and cooling stand separate type are provided with, and are convenient to preparation; The metal substrate and the cooling stand that adopt 99% pure aluminum material to make, it is in light weight; For making its radiating effect better, be provided with radiating fin in cooling stand, its thickness is 1～5 millimeter, is provided with two ventilation slots so that ventilate in cooling stand simultaneously; Metal substrate is provided with printed wire, can directly weld the LED lamp, and is fixed on the described cooling stand by heat dissipating silicone grease, forms the radiator structure of integral type, can be rapidly the heat of LED lamp be distributed, thereby has thoroughly solved the heat radiation difficult problem of great power LED; Simultaneously cooling stand and metal substrate all adopt nanotechnology treatments, its without water stained on its surface, are not stained with dirt, have self-cleaning function; Prove through practical test, the present invention in the course of the work, temperature maintains 45 ℃ ± 5 ℃ scope all the time; Prolonged the service life of LED lamp greatly, can use more than 50000 hours at least.
Description of drawings
Fig. 1 is a perspective view of the present invention
Fig. 2 is the decomposing schematic representation of Fig. 1;
Fig. 3 is the front view of Fig. 1;
Fig. 4 is the left view of Fig. 1.
The specific embodiment
Embodiment: referring to Fig. 1, Fig. 2 and Fig. 3, the embodiment of the invention provides a kind of heat dissipating method of LED radiator, and it comprises some LED lamps 3, and it comprises the steps::
(1) preparation one strip metal;
(2) preparation cooling stand 1: hole in the described strip metal back side, section, shaping processing, make its front form panel, the back side forms and is interval with some heatsink transverse fins 11 along its long limit trend;
(3) preparation ventilation slot 12: on described cooling stand 1 front, vertically be symmetrical arranged two and be used for the semicircle ventilation slot 12 that this cooling stand 1 ventilates;
(4), be used to make this surface to possess waterproof and dustproof, the processing of oxidation resistant nano-solution in the surface of described cooling stand 1.
(4) preparation one plate-shape metal;
(5) preparation metal substrate 2: described plate-shape metal is carried out shaping processing, make its width be slightly less than the width of described cooling stand 1;
(6), be used to make this surface to possess waterproof and dustproof, the processing of oxidation resistant nano-solution in the surface of described metal substrate 2.
(7) make the substrate module: can connect the printed wire of described LED lamp 3 in the described metal substrate vertical setting in 2 positive centre positions, at interval described LED lamp 3 is welded on the described printed wire, and be fixed on the described metal substrate 2 and form integral structure;
(8) make LED lamp 3 modules: adopt heat dissipating silicone grease that described substrate module is bonded on the panel of cooling stand 1;
(9) after 3 work of connection power LED lamp, the heat that this LED lamp 3 produces distributes via the heat radiation and the convection action of described metal substrate 2 and cooling stand 1; And heat is big more, and radiation and convection action are strong more.
The radiator that a kind of heat dissipating method of implementing above-mentioned LED radiator is made, it comprises a cooling stand 1, a metal substrate 2 and some LED lamps 3, cooling stand 1 and metal substrate 2 adopt 99% pure aluminum material to make; Metal substrate 2 is carried out shaping processing, make its width be slightly less than the width of cooling stand 1; Cut into slices at cooling stand 1 back side, shaping, make the heatsink transverse fin 11 of the big or small corresponding area of dissipation of light source that move towards vertically to be provided with at interval some and LED lamp 3 along its long limit; These radiating fin 11 thickness are 2 millimeters, and in other embodiments, these radiating fin 11 thickness can be between 1～5 millimeter; The area of dissipation of radiating fin 11 can be set according to the light source actual size of LED lamp 3, promptly change its height and width, the quantity of radiating fin 11 and the length of cooling stand 1 can be adjusted according to actual conditions simultaneously, to reach the best radiating effect of LED lamp 3.The leading indicator of estimating a LED radiator is the efficiently radiates heat area of LED radiator, and the big more expression radiating effect of efficiently radiates heat area is good more.That is: the big more radiating effect of Pin and Fin ratio is good more, and Pin is meant the area of radiating fin 11, and Fin is meant the distance between the two adjacent fins.For making its radiating effect better, on cooling stand 1 front of metal substrate 2 both sides, be arranged with and be convenient to the semicircle ventilation slot 12 that this cooling stand 1 ventilates; After cooling stand 1 and metal substrate 2 machine-shapings, all adopt nano-solution to handle, make its surface have self-cleaning function, energy waterproof and dustproof and anti-oxidant; Other embodiment can carry out other technical finesse or do not handle its surface; The printed wire that can connect described LED lamp 3 in the metal substrate vertical setting in 2 positive centre positions, at interval described LED lamp 3 is welded on this printed wire, and be fixed on the cooling stand 1 radiator structure that forms integral type, thereby make LED lamp 3 modules by heat dissipating silicone grease; Heat in the time of can fast LED lamp 3 being worked like this distributes, thereby has thoroughly solved the heat radiation difficult problem of great power LED.
As described in the above embodiment of the present invention, adopt structure same or similar and other radiator and the heat dissipating method that obtain, all in protection domain of the present invention with it.
Claims (9)
1, a kind of heat dissipating method of LED radiator, it comprises some LED lamps, it is characterized in that it comprises the steps:
(1) preparation one strip metal;
(2) preparation cooling stand: hole in the described strip metal back side, section, shaping processing, make its front form panel, the back side forms and is interval with some heatsink transverse fins along its long limit trend;
(3) preparation ventilation slot: on described cooling stand front, vertically be symmetrical arranged two and be used for the semicircle ventilation slot that this cooling stand ventilates;
(4) preparation one plate-shape metal;
(5) preparation metal substrate: described plate-shape metal is carried out shaping processing, make its width be slightly less than the width of described cooling stand;
(6) make the substrate module: can connect the printed wire of described LED lamp in the positive vertical setting in centre position of described metal substrate, at interval described LED lamp is welded on the described printed wire, and be fixed on the described metal substrate and form integral structure;
(7) make LED lamp module: adopt heat dissipating silicone grease that described substrate module is bonded on the panel of cooling stand;
The heat that described LED lamp produces distributes via the heat radiation and the convection action of described metal substrate and cooling stand.
2, the heat dissipating method of LED radiator according to claim 1 is characterized in that, described step (3), and it also comprises the steps:
(31), be used to make this surface to possess waterproof and dustproof, the processing of oxidation resistant nano-solution in the surface of described cooling stand.
3, the heat dissipating method of LED radiator according to claim 1 is characterized in that, described step (5), and it also comprises the steps:
(51), be used to make this surface to possess waterproof and dustproof, the processing of oxidation resistant nano-solution in the surface of described metal substrate.
4, a kind of radiator of implementing the heat dissipating method of the described LED radiator of claim 1, it comprises a cooling stand and some LED lamps, it is characterized in that, described cooling stand front is provided with a metal substrate that is slightly less than its width, this vertical setting in metal substrate centre position can connect the printed wire of described LED lamp, described LED lamp is welded on the described printed wire at interval, and is fixed on the described metal substrate and forms integral structure.
5, radiator according to claim 4 is characterized in that, is arranged with to be convenient to the semicircle ventilation slot that this cooling stand ventilates on the cooling stand front of described metal substrate both sides.
6, radiator according to claim 4 is characterized in that, moves towards the heatsink transverse fin that the interval vertically is provided with the big or small corresponding area of dissipation of light source of some and described LED lamp in the described cooling stand back side along its long limit.
7, radiator according to claim 6 is characterized in that, described radiating fin thickness is 1～5 millimeter.
8, radiator according to claim 4 is characterized in that, described cooling stand and metal substrate adopt 99% pure aluminum material to make.
9, radiator according to claim 8 is characterized in that, described metal substrate is bonded on the described cooling stand by heat dissipating silicone grease.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101355626A CN101576241B (en) | 2009-04-27 | 2009-04-27 | Radiating method of LED radiator and radiator for implementing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101355626A CN101576241B (en) | 2009-04-27 | 2009-04-27 | Radiating method of LED radiator and radiator for implementing same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101576241A true CN101576241A (en) | 2009-11-11 |
| CN101576241B CN101576241B (en) | 2011-01-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2009101355626A Expired - Fee Related CN101576241B (en) | 2009-04-27 | 2009-04-27 | Radiating method of LED radiator and radiator for implementing same |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101793368A (en) * | 2010-03-16 | 2010-08-04 | 海洋王照明科技股份有限公司 | Embedded taxiway illumination device |
| CN102606994A (en) * | 2011-01-21 | 2012-07-25 | 贺志萍 | LED lamp cooling device and its manufacturing method |
| CN102818189A (en) * | 2012-08-07 | 2012-12-12 | 苏州金科信汇光电科技有限公司 | LED (light emitting diode) street lamp structure with heat conducting hole and hot runner |
| CN103256576A (en) * | 2012-02-21 | 2013-08-21 | 黄子晋 | Low-cost high-efficient radiating device of long-service-life LED energy-saving lamp |
| CN103277772A (en) * | 2013-06-26 | 2013-09-04 | 苏州金科信汇光电科技有限公司 | Bidirectional ventilated heat dissipation structure of lamp |
| CN104019389A (en) * | 2014-05-30 | 2014-09-03 | 广东金源照明科技有限公司 | Efficient-heat-dissipation integrated LED modulator tube structure and production process thereof |
-
2009
- 2009-04-27 CN CN2009101355626A patent/CN101576241B/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101793368A (en) * | 2010-03-16 | 2010-08-04 | 海洋王照明科技股份有限公司 | Embedded taxiway illumination device |
| CN102606994A (en) * | 2011-01-21 | 2012-07-25 | 贺志萍 | LED lamp cooling device and its manufacturing method |
| CN103256576A (en) * | 2012-02-21 | 2013-08-21 | 黄子晋 | Low-cost high-efficient radiating device of long-service-life LED energy-saving lamp |
| CN102818189A (en) * | 2012-08-07 | 2012-12-12 | 苏州金科信汇光电科技有限公司 | LED (light emitting diode) street lamp structure with heat conducting hole and hot runner |
| CN103277772A (en) * | 2013-06-26 | 2013-09-04 | 苏州金科信汇光电科技有限公司 | Bidirectional ventilated heat dissipation structure of lamp |
| CN104019389A (en) * | 2014-05-30 | 2014-09-03 | 广东金源照明科技有限公司 | Efficient-heat-dissipation integrated LED modulator tube structure and production process thereof |
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| Publication number | Publication date |
|---|---|
| CN101576241B (en) | 2011-01-05 |
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Granted publication date: 20110105 |