CN2357414Y

CN2357414Y - Improved semiconductor element lead wire frame

Info

Publication number: CN2357414Y
Application number: CN 98248753
Authority: CN
Inventors: 周万顺
Original assignee: Individual
Current assignee: Individual
Priority date: 1998-11-27
Filing date: 1998-11-27
Publication date: 2000-01-05
Anticipated expiration: 2008-11-27

Abstract

The utility model relates to an improved lead wire frame for a semiconductor element, which comprises a plurality of sheets of support frame units. In the utility model, a support frame connecting foot for a P pole end which presents a strip-shaped sheet body is respectively arranged in each support frame unit; the middle part of the support frame connecting foot for a P pole end is connected with an adapting part which presents a circular sheet body, and the middle part of the adapting part forms a bowl-shaped concave part which contains a semiconductor light-emitting wafer. A support frame connecting foot for an N pole end which also presents a strip-shaped sheet body is arranged at the position opposite to the support frame connecting foot for a P pole end with a proper clearance kept away from the support frame connecting foot for a P pole; both sides of the support frame connecting foot for an N pole end are respectively provided with a through hole on the support frame connecting foot for an N pole end at the positions adjacent to the adapting part, so the support frame unit has steady supporting force after the support frame unit is bent, when the light-emitting wafer is applied, a projecting light source which emits light rays more well, farther and more uniformly is obtained.

Description

Improved semiconductor element lead frame

The utility model relates to a kind of structural improvement of semiconductor element lead frame.

Press, known applications is in the semiconductor element (as light-emittingdiode) of the 3rd stop lamp and other super brightness demand, its lead frame on processing procedure generally is that the processing of mat punch press is to stamp out the carrier unit that most sheets are arranged, be respectively equipped with the extreme pin of a P in each frame unit, be provided with an extreme pin of N that undertakes the PN wafer on it with the extreme pin of this P corresponding section, this PN wafer is that mat one overlap joint line and the extreme pin of P link together, afterwards, coated encapsulation by encapsulating material (as resin) again, and the pin of clinched lead end etc., so, can on lead frame, be packaged with most semiconductor elements.

Only, its two leg does not have than stable support strength, moreover this PN wafer is placed in the lead frame, without special design, causes it on using, as is used for the display panel of the 3rd stop lamp, can not obtain preferable projection source (its uniform luminance differs).

So, the part improved of the above-mentioned disappearance of this creator thoughts, be that the spy concentrates on studies and cooperates the utilization of scientific principle, finally propose a kind of reasonable in design and effectively improve the utility model of above-mentioned disappearance, so that a kind of firmly support force of lead frame to be provided, and the structure that the light source of semiconductor light emitting wafer thereon can be throwed equably.

A purpose of the present utility model provides a kind of improved semiconductor element framework, and it has the firmly support force of lead frame, and the light source of luminescent wafer can be projeced on the 3rd stop lamp and other demand super brightness purposes equably.

Another purpose of the present utility model provides a kind of improved semiconductor element framework, and its structural design can be beneficial to the pin bending of each carrier unit.

For reaching above-mentioned purpose, technological means and effect thereof that the utility model adopted are: a kind of improved semiconductor element lead frame, it is that a tablet is processed to stamp out a lead frame through punch press, this lead frame upper punch is provided with most plate racks unit, be respectively equipped with an extreme support pin of P (the first support pin) that is the strip lamellar body in each carrier unit, the pars intermedia of this support pin is connected to a carrier that is round shape lamellar body, the central authorities of carrier form one and are bowl-shape recess, its degree of depth is about 0.35mm, start point is at 45～90 degree, can be contained in wherein in order to the semiconductor light emitting wafer, and the light source that makes luminescent wafer can be projeced on the lighting use of the 3rd stop lamp and demand super brightness equably, on the position relative with the extreme support pin of this P, being provided with one keeps appropriate gap also to be the extreme support pin of N (the second support pin) of strip lamellar body, adjacent to the both sides of carrier, be respectively equipped with a through hole on this support pin, in order to the pin bending of each carrier unit.

The mat said structure makes the carrier unit after bending have firm support force, and makes luminescent wafer go up (on the structure as the 3rd stop lamp and other demand super brightness) in using, and can obtain the evenly projection source that reaches preferable, far away.

Now illustrate in detail that for embodiment structure of the present utility model and function are as follows in conjunction with the accompanying drawings, so that understand fully.

Fig. 1 is a vertical view of the present utility model;

Fig. 2 is the vertical view of the single carrier unit of the utility model;

Fig. 3 is the end view of the single carrier unit of the utility model;

Fig. 4 is the vertical view of the single carrier unit of the utility model after bending;

Fig. 5 is the end view of the single carrier unit of the utility model after bending;

Fig. 6 is the front view of the single carrier unit of the utility model after bending.

Label in the accompanying drawing and the explanation of circuit unit title:

1 ... lead frame 2 ... carrier unit

21 ... the extreme support pin 22 of P ... carrier

221 ... recess 23 ... the extreme support pin of N

231 ... through hole

See also Fig. 1 to shown in Figure 6, the utility model is a kind of " improved semiconductor element lead frame ", be make one with alloy material as the tablet of conductive material through punch press processing to stamp out a lead frame 1, this lead frame 1 upper punch is provided with most plate racks unit 2; Wherein:

Be respectively equipped with an extreme support pin 21 of P that is the strip lamellar body in each carrier unit 2, the pars intermedia of the extreme support pin 21 of this P is connected to a carrier 22 that is round shape lamellar body, the central authorities of carrier 22 form one and are bowl-shape recess 221, its degree of depth is about 0.35mm, start point is at 45～90 degree, can be contained in wherein in order to semiconductor light emitting wafer (not shown), and the light source that makes luminescent wafer is gone up (as: the 3rd stop lamp) and can be obtained preferable, far away and even projection source in using.

On the position relative with the extreme support pin of this P 21, being provided with one keeps appropriate gap (about 0.37mm) also to be the extreme support pin 23 of N of strip lamellar body, on this support pin 23 adjacent to the both sides of carrier 22, be respectively equipped with a through hole 231, in order to the pin bending of each carrier unit 2, the spacing of two through hole 231 is to remain on about 3.5mm.

Its special construction design of mat the utlity model has following advantage:

1). make pin (4 pin ends are arranged on it) bracing force average, the support force that tool is firm through each carrier unit 2 after the bending.

2). make luminescent wafer on using, can obtain preferable projection source (distributing equably).

In sum, the utility model " improved semiconductor element lead frame " is to be a rare novel creation, so propose utility application according to Patent Law.

Only, the above only is a preferable possible embodiments of the present utility model, non-so promptly arrest limit practical range of the present utility model, so the equivalent structure that uses the utility model specification and accompanying drawing content to do such as changes (can be according to the electric energy needs as this electric conducting material, the design unlike material), all in like manner all be contained in the scope of the present utility model.

Claims

1, a kind of improved semiconductor element lead frame, be make one with alloy material as the tablet of conductive material through punch press processing to stamp out a lead frame, this lead frame upper punch is provided with most plate racks unit, it is characterized in that each carrier unit comprises:

One first support pin is the strip lamellar body, and the intermediate portion is connected to a carrier that is round shape lamellar body, and the central authorities of carrier form a recess that is bowl-shape holding semiconductor luminescent wafer;

One second support pin is the strip lamellar body, is provided in a side of on the position relative with the first support pin, adjacent to the both sides of carrier, is respectively equipped with a through hole that is beneficial to each carrier unit bending on this support pin.

2, improved semiconductor element lead frame as claimed in claim 1, it is characterized in that: the gap of two stands pin is maintained at about 0.37mm.

3, improved semiconductor element lead frame as claimed in claim 1, it is characterized in that: the spacing of two through hole is maintained at about 3.5mm.

4, improved semiconductor element lead frame as claimed in claim 1, it is characterized in that: recess depths is about 0.35mm, and start point is at 45～90 degree.