CN205211327U - Light -emitting diode (LED) display board - Google Patents
Light -emitting diode (LED) display board Download PDFInfo
- Publication number
- CN205211327U CN205211327U CN201520917221.5U CN201520917221U CN205211327U CN 205211327 U CN205211327 U CN 205211327U CN 201520917221 U CN201520917221 U CN 201520917221U CN 205211327 U CN205211327 U CN 205211327U
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- Prior art keywords
- display board
- led display
- led
- groove
- driving circuit
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Abstract
The application discloses light -emitting diode (LED) display board includes the base plate and is located the light screen on base plate upper portion, the upper surface of base plate is provided with the recess, install the LED wafer in the recess, the lower surface of base plate is provided with the mounting groove, it is equipped with the IC drive circuit part to paste in the mounting groove, the LED wafer with the IC drive circuit part is connected. The utility model provides an above -mentioned light -emitting diode (LED) display board can improve the packaging efficiency, reduction in production cost.
Description
Technical field
The utility model relates to light fixture manufacturing technology field, particularly relates to a kind of LED display board.
Background technology
Current LED display board, in manufacturing process, is by chip placement on substrate, and recycling routing technology, be connected with the connecting points on substrate by chip, this packaging efficiency is low, and cost is high.
Utility model content
For solving the problem, the utility model provides a kind of LED display board, can improve packaging efficiency, reduces production cost.
A kind of LED display board that the utility model provides, comprise: substrate and the shadow shield being positioned at described substrate top, the upper surface of described substrate is provided with groove, in described groove, LED wafer is installed, the lower surface of described substrate is provided with mounting groove, be pasted with IC driving circuit parts in described mounting groove, described LED wafer is connected with described IC driving circuit parts.
Preferably, in above-mentioned LED display board, the dorsal edge of described IC driving circuit parts is provided with the paster solder joint for being mounted by described IC driving circuit parts in described mounting groove.
Preferably, in above-mentioned LED display board, in described mounting groove, be provided with fluid sealant or base material.
Preferably, in above-mentioned LED display board, one end of the close described groove of described LED wafer is provided with the projection with described groove fit, and described projection is connected with described IC driving circuit parts through after described groove.
Preferably, in above-mentioned LED display board, in described groove, be provided with shading glue.
Preferably, in above-mentioned LED display board, be connected by pin between described shadow shield with described substrate.
Preferably, in above-mentioned LED display board, described LED wafer equidistantly distributes on the substrate.
Known by foregoing description, the above-mentioned LED display board that the utility model provides, because the upper surface of described substrate is provided with groove, be provided with LED wafer in described groove, the lower surface of described substrate is provided with mounting groove, is pasted with IC driving circuit parts in described mounting groove, described LED wafer is connected with described IC driving circuit parts, this just without the need to routing technology, thus can improve packaging efficiency, reduces production cost.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only embodiment of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to the accompanying drawing provided.
The front view of the first LED display board that Fig. 1 provides for the embodiment of the present application;
The schematic rear view of the IC driving circuit parts of the second LED display board that Fig. 2 provides for the embodiment of the present application;
The vertical view of the first LED display board that Fig. 3 provides for the embodiment of the present application.
Embodiment
Core concept of the present utility model is to provide a kind of LED display board, can improve packaging efficiency, reduces production cost.
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
The first LED display board that the embodiment of the present application provides as shown in Figure 1, the front view of the first LED display board that Fig. 1 provides for the embodiment of the present application.This LED display board comprises: substrate 1 and the shadow shield 2 being positioned at described substrate 1 top, the upper surface interval of described substrate 1 be provided with groove 3, the quantity of groove 3 can be multiple, in described groove 3, LED wafer 4 is installed, the lower surface of described substrate 1 is provided with mounting groove 5, be pasted with IC driving circuit parts 6 in described mounting groove 5, described LED wafer 4 is connected with described IC driving circuit parts 6.
Known by foregoing description, the above-mentioned LED display board that the embodiment of the present application provides, because the upper surface of described substrate is provided with groove, be provided with LED wafer in described groove, the lower surface of described substrate is provided with mounting groove, is pasted with IC driving circuit parts in described mounting groove, described LED wafer is connected with described IC driving circuit parts, this just without the need to routing technology, thus can improve packaging efficiency, reduces production cost.
The embodiment of the present application additionally provides the second LED display board, in the second LED display board, except there is the technical characteristic identical with the first LED display board above-mentioned, also comprise following technical characteristic: the dorsal edge of described IC driving circuit parts is provided with the paster solder joint for being mounted by described IC driving circuit parts in described mounting groove, specifically as shown in Figure 2, the schematic rear view of the IC driving circuit parts of the second LED display board that Fig. 2 provides for the embodiment of the present application, the back side of these IC driving circuit parts 6 visible is provided with multiple paster solder joint 9, in process of production, utilize this paster solder joint 9 just can easily be mounted in mounting groove by IC driving circuit parts 6, so just significantly improve work efficiency relative to routing technique of the prior art, also reduce further production cost.
The embodiment of the present application additionally provides the third LED display board, in the third LED display board, except there is the technical characteristic identical with the first LED display board above-mentioned, also comprise following technical characteristic: continue with reference to figure 1, be provided with fluid sealant 7 or base material in described mounting groove, this makes it possible to the heat dispersion of intensifier circuit.
Further, above-mentioned the first, on the basis of the second and the third LED display board, can also comprise following technical characteristic: one end of the close described groove of described LED wafer is provided with the projection with described groove fit, described projection is connected with described IC driving circuit parts through after described groove.The length of this projection can be arranged to a higher value, to guarantee to be connected to IC driver part, realizes the connection of LED wafer and IC driver part, thus IC driver part can effectively driving LED wafer be luminous.
Further, in above-mentioned LED display board, with reference to figure 1, shading glue 8 is provided with in described groove, the light so just avoiding LED wafer to launch spills from top, optionally, be connected between described shadow shield with described substrate by pin, this just makes to be connected between shadow shield with substrate more firm.
And, in above-mentioned LED display board, described LED wafer 4 optionally equidistantly distributes on described substrate 1, as shown in Figure 3, the vertical view of the first LED display board that Fig. 3 provides for the embodiment of the present application, multiple described LED wafer 4 in rods arranged in horizontal line on described substrate 1, also can have the rectangular array arrangement of two row or multi-row, and can comprise captions monochrome or full-color display module.
In above-mentioned LED display board, substrate thickness can be reduced to 1.0 millimeters to 1.1 millimeters, and LED wafer height is 0.65 millimeter to 1.6 millimeters, so the height of overall LED display board is 1.65 millimeters to 2.8 millimeters.
Known by foregoing description, the above-mentioned LED display board that the embodiment of the present application provides has less thickness, mechanically easy to use, and be widely used in the encapsulation of microprocessor, and can be applicable to drawing, extraordinary application and electronic chip assembling etc., there is the advantage that structure is simple, easy to assembly.
To the above-mentioned explanation of the disclosed embodiments, professional and technical personnel in the field are realized or uses the utility model.To be apparent for those skilled in the art to the multiple amendment of these embodiments, General Principle as defined herein when not departing from spirit or scope of the present utility model, can realize in other embodiments.Therefore, the utility model can not be restricted to these embodiments shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (7)
1. a LED display board, it is characterized in that, comprise substrate and the shadow shield being positioned at described substrate top, the upper surface of described substrate is provided with groove, in described groove, LED wafer is installed, the lower surface of described substrate is provided with mounting groove, is pasted with IC driving circuit parts in described mounting groove, and described LED wafer is connected with described IC driving circuit parts.
2. LED display board according to claim 1, is characterized in that, the dorsal edge of described IC driving circuit parts is provided with the paster solder joint for being mounted by described IC driving circuit parts in described mounting groove.
3. LED display board according to claim 2, is characterized in that, is provided with fluid sealant or base material in described mounting groove.
4. the LED display board according to any one of claim 1-3, is characterized in that, one end of the close described groove of described LED wafer is provided with the projection with described groove fit, and described projection is connected with described IC driving circuit parts through after described groove.
5. LED display board according to claim 4, is characterized in that, is provided with shading glue in described groove.
6. LED display board according to claim 5, is characterized in that, is connected between described shadow shield with described substrate by pin.
7. LED display board according to claim 4, is characterized in that, described LED wafer equidistantly distributes on the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520917221.5U CN205211327U (en) | 2015-11-17 | 2015-11-17 | Light -emitting diode (LED) display board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520917221.5U CN205211327U (en) | 2015-11-17 | 2015-11-17 | Light -emitting diode (LED) display board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205211327U true CN205211327U (en) | 2016-05-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520917221.5U Expired - Fee Related CN205211327U (en) | 2015-11-17 | 2015-11-17 | Light -emitting diode (LED) display board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205211327U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105280106A (en) * | 2015-11-17 | 2016-01-27 | 东莞嘉鑫创光电有限公司 | LED display panel |
-
2015
- 2015-11-17 CN CN201520917221.5U patent/CN205211327U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105280106A (en) * | 2015-11-17 | 2016-01-27 | 东莞嘉鑫创光电有限公司 | LED display panel |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160504 Termination date: 20161117 |