CN210771549U

CN210771549U - Flip-chip LED lamp strip structure

Info

Publication number: CN210771549U
Application number: CN201921651926.1U
Authority: CN
Inventors: 刘海潮; 刘海方
Original assignee: Shenzhen Jinhong Photoelectric Co ltd
Current assignee: Shenzhen Jinhong Photoelectric Co ltd
Priority date: 2019-09-29
Filing date: 2019-09-29
Publication date: 2020-06-16
Anticipated expiration: 2029-09-29

Abstract

The utility model discloses a flip-chip LED lamp strip structure, be in including lamp strip and flip-chip a plurality of wafer along the extending direction equidistance distribution of lamp strip on the lamp strip, it predetermines the wafer position to be equipped with a plurality of on the lamp strip, the solder joint at wafer both ends sets firmly through the tin cream predetermine on the wafer position, the one end of lamp strip is equipped with the wiring pad, be equipped with preset circuit in the lamp strip, preset circuit's input with the wiring pad is connected, preset circuit's output with a plurality of wafer is connected. The utility model provides a pair of flip-chip LED lamp strip structure has following characteristics: (1) the heat dissipation performance is strong; (2) the process is simple; (3) the light emitting angle of the wafer can reach 180 degrees, which is more beneficial to landscape decoration; (4) the volume is smaller, and the transportation and installation are facilitated; (5) the practicality is stronger, can make the size the same with the rope.

Description

Flip-chip LED lamp strip structure

Technical Field

The utility model relates to a LED lamp strip field, concretely relates to flip-chip LED lamp strip structure.

Background

The current process of manufacturing the LED lamp strip is as follows: firstly, lamp bead light splitting braiding is well done by a packaging factory, a disc of lamp beads is made, then the lamp beads are pasted on an FPC board which is brushed with solder paste by a chip mounter, and then reflow soldering is carried out. The procedure is pasted to the FPC board by the lamp pearl again, and the procedure is many complicated. The light-emitting angle of the lamp bead is only 120 degrees.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome prior art not enough, provide a luminous angle can reach 180, and simple process's flip-chip LED lamp strip structure.

The technical scheme of the utility model as follows:

the utility model provides a flip-chip LED lamp strip structure, is in including lamp strip and flip-chip a plurality of wafer along the extending direction equidistance distribution of lamp strip on the lamp strip, it predetermines the wafer position to be equipped with a plurality of on the lamp strip, the solder joint at wafer both ends sets firmly through the tin cream predetermine on the wafer position, the one end of lamp strip is equipped with the wiring pad, be equipped with in the lamp strip and predetermine the circuit, predetermine the circuit the input with the wiring pad is connected, predetermine the circuit the output with a plurality of wafer connection.

Further, the wafers comprise a blue wafer, a green wafer, a red wafer and a white wafer.

Furthermore, the lamp strip adopts a flexible FPC lamp strip.

Furthermore, the number of the wafers on the lamp strip is 30-1000 wafers/m.

Furthermore, the wafers are arranged in 1-50 rows on the lamp strip.

Further, the terminal pads include a positive electrode pad and a negative electrode pad.

Compared with the prior art, the beneficial effects of the utility model reside in that:

(1) the wafer is strongly adhered to the FPC through the solder paste, the wafer is not provided with a packaging support, and the wafer is directly connected with the FPC board, so that heat dissipation is better;

(2) the chip is not packaged into a lamp bead but directly pasted on the FPC, and the manufacturing procedure is simple;

(3) the light-emitting angle of the lamp bead is 120 degrees, the light-emitting angle of the wafer is 180 degrees, the landscape decoration is facilitated, and the light can be clearly seen no matter which angle is arranged on the front side;

(4) the volume is smaller, and the transportation and installation are facilitated;

(5) the practicality is stronger, and current lamp strip width can't accomplish very narrowly, the utility model provides a flip-chip LED lamp strip structure can be made the same size with the rope.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic structural view of an inverted LED light bar structure provided by the present invention;

fig. 2 is a schematic view of the mounting of the wafer according to the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

In order to explain the technical solution of the present invention, the following description is made by using specific examples.

Examples

Please refer to fig. 1 and fig. 2, the utility model provides a pair of flip-chip LED lamp strip structure, be in including lamp strip 1 and flip-chip a plurality of wafer 2 along the extending direction equidistance distribution of lamp strip 1 on the lamp strip 1, what lamp strip 1 adopted is the soft lamp strip of FPC, be equipped with a plurality of on the lamp strip 1 and predetermine the wafer position, the solder joint at 2 both ends of wafer sets firmly through tin cream 3 on predetermineeing the wafer position, the subsides dress direction of wafer 2 is unrestricted, the one end of lamp strip 1 is equipped with wiring pad 4, wiring pad 4 includes anodal pad and negative pole pad, be equipped with preset circuit in the lamp strip 1, should predetermine the circuit and include 12V, 24V, 36V FPC board circuit, predetermine the input of circuit with wiring pad 4 is connected, predetermine the output of circuit with a plurality of wafer 2 are connected.

In the soldering process of the wafer 2, firstly, the FPC is produced, then the FPC is placed on a clamp, a die bonder is used for dispensing solder paste on welding points of a pre-bonded wafer of the FPC, then the die bonder is used for sucking a flip chip onto an FPC board, and then reflow soldering is carried out, so that the wafer is fixed on the FPC board, and the flip chip is suitable for (including colored wafers such as a blue light wafer, a green light wafer, a red light wafer, a white light wafer and the like).

The number of wafers 2 on the lamp strip 1 is 30 ~ 1000/meter, wafer 2 can be 1 ~ 50 rows on the lamp strip 1.

To sum up, the utility model provides a pair of flip-chip LED lamp strip structure has following characteristics: (1) the wafer is strongly adhered to the FPC through the solder paste, the wafer is not provided with a packaging support, and the wafer is directly connected with the FPC board, so that heat dissipation is better; (2) the chip is not packaged into a lamp bead but directly pasted on the FPC, and the manufacturing procedure is simple; (3) the light-emitting angle of the lamp bead is 120 degrees, the light-emitting angle of the wafer is 180 degrees, the landscape decoration is facilitated, and the light can be clearly seen no matter which angle is arranged on the front side; (4) the volume is smaller, and the transportation and installation are facilitated; (5) the practicality is stronger, and current lamp strip width can't accomplish very narrowly, the utility model provides a flip-chip LED lamp strip structure can be made the same size with the rope.

The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims

1. The utility model provides a flip-chip LED lamp strip structure which characterized in that: including lamp strip and flip-chip a plurality of wafer along the extending direction equidistance distribution of lamp strip on the lamp strip, it predetermines the wafer position to be equipped with a plurality of on the lamp strip, the solder joint at wafer both ends sets firmly through the tin cream predetermine on the wafer position, the one end of lamp strip is equipped with the wiring pad, be equipped with preset circuit in the lamp strip, predetermine the input of circuit with the wiring pad is connected, predetermine the output of circuit with a plurality of wafer connection.

2. The flip-chip LED light bar structure of claim 1, wherein: the wafer comprises a blue light wafer, a green light wafer, a red light wafer and a white light wafer.

3. The flip-chip LED light bar structure of claim 1, wherein: the lamp strip adopts the flexible lamp strip of FPC.

4. The flip-chip LED light bar structure of claim 1, wherein: the number of the wafers on the lamp strip is 30-1000 wafers/meter.

5. The flip-chip LED light bar structure of claim 1, wherein: the wafers are arranged in 1-50 rows on the lamp strip.

6. The flip-chip LED light bar structure of claim 1, wherein: the terminal pad includes a positive electrode pad and a negative electrode pad.