CN210778653U - Structure is glued to soft lamp strip point - Google Patents
Structure is glued to soft lamp strip point Download PDFInfo
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- CN210778653U CN210778653U CN201921648733.0U CN201921648733U CN210778653U CN 210778653 U CN210778653 U CN 210778653U CN 201921648733 U CN201921648733 U CN 201921648733U CN 210778653 U CN210778653 U CN 210778653U
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- lamp strip
- wafer
- strip board
- board
- light
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Abstract
The utility model discloses a structure is glued to soft lamp strip point, a plurality of wafer that distributes along the extending direction equidistance of lamp strip board on the lamp strip board including lamp strip board and flip-chip, a plurality of wafer concave groove has been preset on the lamp strip board, the wafer sets firmly on wafer concave groove through the tin cream, and the surface covering of wafer has the fluorescent glue, the one end of lamp strip board is equipped with the wiring pad, be equipped with preset circuit in the lamp strip board, preset circuit's input is connected with the wiring pad, preset circuit's output with a plurality of wafer connection. The utility model provides a pair of structure is glued to soft lamp strip point has following characteristics: (1) the heat dissipation performance is strong; (2) the process is simple; (3) the light emitting angle of the wafer can reach 180 degrees, which is more beneficial to landscape decoration; (4) fluorescent powder is dotted on the wafer to realize the desired light color; (5) the volume is smaller, and the transportation and installation are facilitated; (6) the practicality is stronger, can make the size the same with the rope.
Description
Technical Field
The utility model relates to a LED lamp strip field, concretely relates to structure is glued to soft lamp strip point.
Background
The current process of manufacturing the LED lamp strip is as follows: firstly, lamp bead light splitting braiding is well done by a packaging factory, a disc of lamp beads is made, then the lamp beads are pasted on an FPC board which is brushed with solder paste by a chip mounter, and then reflow soldering is carried out. The procedure is pasted to the FPC board by the lamp pearl again, and the procedure is many complicated. The light-emitting angle of the lamp bead is only 120 degrees.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to overcome prior art not enough, provide a luminous angle can reach 180, and simple process's soft lamp strip point is glued and is constructed.
The technical scheme of the utility model as follows:
the utility model provides a structure is glued to soft lamp strip point, is in including lamp strip board and flip-chip a plurality of wafer along the extending direction equidistance distribution of lamp strip board on the lamp strip board, a plurality of wafer concave groove has been preset on the lamp strip board, the wafer sets firmly through the tin cream on the wafer concave groove, the surface covering of wafer has fluorescent glue, the one end of lamp strip board is equipped with the wiring pad, be equipped with preset circuit in the lamp strip board, preset circuit's input with the wiring pad is connected, preset circuit's output with a plurality of wafer connection.
Furthermore, the fluorescent glue is in a hemispherical shape.
Furthermore, the lamp strip board adopts a flexible FPC (flexible printed circuit) light strip board.
Further, the light colors of the fluorescent glue comprise positive white, warm white, natural white, red light, green light and purple light.
Further, the terminal pads include a positive electrode pad and a negative electrode pad.
Compared with the prior art, the beneficial effects of the utility model reside in that:
(1) the wafer is strongly adhered to the FPC through the solder paste, the wafer is not provided with a packaging support, and the wafer is directly connected with the FPC board, so that heat dissipation is better;
(2) the chip is not packaged into a lamp bead but directly pasted on the FPC, and the manufacturing procedure is simple;
(3) the light-emitting angle of the lamp bead is 120 degrees, the light-emitting angle of the wafer is 180 degrees, the landscape decoration is facilitated, and the light can be clearly seen no matter which angle is arranged on the front side;
(4) the fluorescent powder is dotted on the wafer, so that the desired light color can be realized, a wider color gamut can be obtained, and more colors can be obtained;
(5) the volume is smaller, and the transportation and installation are facilitated;
(6) the practicality is stronger, and current lamp strip width can't accomplish very narrowly, the utility model provides a structure is glued to soft lamp strip point can be made the same size with the rope.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic structural view of a soft light bar dispensing structure provided by the present invention;
fig. 2 is a schematic view of the mounting of the wafer according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In order to explain the technical solution of the present invention, the following description is made by using specific examples.
Examples
Referring to fig. 1 and 2, the present invention provides a flexible light bar dispensing structure, which includes a light bar plate 1 and a plurality of chips 2 mounted on the light bar plate 1 and equidistantly distributed along the extending direction of the light bar plate 1, the light bar plate 1 adopts an FPC soft light bar plate, a plurality of wafer concave grooves 3 are preset on the light bar plate 1, the wafer 2 is fixedly arranged on the wafer concave groove 3 through solder paste 4, the surface of the wafer 2 is covered with fluorescent glue 5, the fluorescent glue 5 is in a hemispherical shape, one end of the light bar board 1 is provided with a wiring pad 6, the wiring pad 6 comprises an anode pad and a cathode pad, a preset circuit is arranged in the light bar board 1, the preset circuit comprises 12V, 24V and 36V FPC board sub-circuits, wherein the input end of the preset circuit is connected with the wiring bonding pad 6, and the output end of the preset circuit is connected with the plurality of wafers 2.
During the soldering process of the wafer 2, firstly, the FPC is produced, the position of the wafer concave groove 3 is designed, the die bonder is used for dispensing solder paste to the flip chip position, the positive electrode and the negative electrode of the wafer have solder paste, the amount of the solder paste cannot be more or less, the wafer 2 absorbs the position of the wafer concave groove 3 of the flexible light bar plate by the die bonder, a flexible light bar plate can be completed by repeating the above actions, after the wafer 2 is fixed, the flexible light bar plate is transferred to a reflow soldering machine, reflow soldering is carried out, after the material comes out, the wafer 2 is firmly fixed on the flexible light bar plate, the next procedure is carried out, the prepared glue is poured into the needle cylinder, a small glue is dispensed onto the wafer 2 through the glue dispenser, the glue flows, the glue covers the wafer 2 and flows into the wafer concave groove 3 to form glue with a shape close to the shape, the glue is poured into the oven for preheating at a low temperature, and the shape is fixed, and then the mixture is transferred to a high-temperature oven to be baked for several hours, and the baking is finished.
Wherein, the wafers 2 can be randomly placed in position and order.
The number of the wafers 2 placed on the soft light bar is not limited, and the angle of the wafers 2 is not limited.
The size of the wafer 2 is not limited, and the size and color of the light bar plate 1 are not limited.
The light colors of the fluorescent glue 5 include white, warm white, natural white, red light, green light, purple light and the like, and can also be light colors of other colors, so that the desired light colors can be realized.
To sum up, the utility model provides a pair of structure is glued to soft lamp strip point has following characteristics: (1) the wafer is strongly adhered to the FPC through the solder paste, the wafer is not provided with a packaging support, and the wafer is directly connected with the FPC board, so that heat dissipation is better; (2) the chip is not packaged into a lamp bead but directly pasted on the FPC, and the manufacturing procedure is simple; (3) the light-emitting angle of the lamp bead is 120 degrees, the light-emitting angle of the wafer is 180 degrees, the landscape decoration is facilitated, and the light can be clearly seen no matter which angle is arranged on the front side; (4) the fluorescent powder is dotted on the wafer, so that the desired light color can be realized, a wider color gamut can be obtained, and more colors can be obtained; (5) the volume is smaller, and the transportation and installation are facilitated; (6) the practicality is stronger, and current lamp strip width can't accomplish very narrowly, the utility model provides a structure is glued to soft lamp strip point can be made the same size with the rope.
The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (5)
1. The utility model provides a structure is glued to soft lamp strip point, its characterized in that: including lamp strip board and flip-chip a plurality of wafer along the extending direction equidistance distribution of lamp strip board on the lamp strip board, a plurality of wafer concave groove has been preset on the lamp strip board, the wafer sets firmly through the tin cream on the wafer concave groove, the surface covering of wafer has fluorescent glue, the one end of lamp strip board is equipped with the wiring pad, be equipped with preset circuit in the lamp strip board, preset circuit's input with the wiring pad is connected, preset circuit's output with a plurality of wafer is connected.
2. The flexible light bar dispensing structure of claim 1, wherein: the fluorescent glue is in a hemispherical shape.
3. The flexible light bar dispensing structure of claim 1, wherein: the lamp strip board adopts a Flexible Printed Circuit (FPC) flexible lamp strip board.
4. The flexible light bar dispensing structure of claim 1, wherein: the light colors of the fluorescent glue comprise positive white, warm white, natural white, red light, green light and purple light.
5. The flexible light bar dispensing structure of claim 1, wherein: the terminal pad includes a positive electrode pad and a negative electrode pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921648733.0U CN210778653U (en) | 2019-09-29 | 2019-09-29 | Structure is glued to soft lamp strip point |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921648733.0U CN210778653U (en) | 2019-09-29 | 2019-09-29 | Structure is glued to soft lamp strip point |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210778653U true CN210778653U (en) | 2020-06-16 |
Family
ID=71037906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921648733.0U Active CN210778653U (en) | 2019-09-29 | 2019-09-29 | Structure is glued to soft lamp strip point |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210778653U (en) |
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2019
- 2019-09-29 CN CN201921648733.0U patent/CN210778653U/en active Active
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