WO2014008773A1 - Method of fabricating surface-mounted led module - Google Patents
Method of fabricating surface-mounted led module Download PDFInfo
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- WO2014008773A1 WO2014008773A1 PCT/CN2013/074164 CN2013074164W WO2014008773A1 WO 2014008773 A1 WO2014008773 A1 WO 2014008773A1 CN 2013074164 W CN2013074164 W CN 2013074164W WO 2014008773 A1 WO2014008773 A1 WO 2014008773A1
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- chip
- led chip
- pad
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- manufacturing
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 28
- 239000002184 metal Substances 0.000 claims abstract description 33
- 238000000034 method Methods 0.000 claims abstract description 33
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- 229910000679 solder Inorganic materials 0.000 claims abstract description 30
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/048—Self-alignment during soldering; Terminals, pads or shape of solder adapted therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/082—Suction, e.g. for holding solder balls or components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
- H05K2203/1366—Spraying coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the invention relates to a production method for manufacturing a chip type LED module.
- LED With the development of lighting LED technology, compared with the traditional incandescent lamp, halogen lamp type of illumination source, LED has obvious advantages of energy saving, reliability, longevity, and can gradually achieve the lighting performance of fluorescent lamps, such as light effect and display Color index, life aspect. Therefore, the global development of lighting LEDs is on the rise, and the annual output of LED light sources is gradually increasing.
- LED light sources Compared with traditional light sources, LED light sources have some obvious features. Usually, in terms of volume, LED light sources are in units of a single chip, with electrodes, phosphors, package structures, etc., with a small volume and With less luminous flux, if it is necessary to form a suitable lighting fixture, it is inevitable to use multiple LED light sources to form an array of modules. On the one hand, it can integrate volume, structure shape and uniform power supply, on the other hand, sufficient luminous flux must be achieved. These features are already prominent in general lighting and indoor lighting: a more common practice is to arrange a complete package of LED light sources on the substrate to be fixed and connected to form an LED module that can be illuminated as a whole, and then assembled into a complete module. Lighting.
- the luminaire is large in shape and the luminous flux required for a single luminaire is high (such as 1000 lm or more), the number of single LED light sources must be very large, especially when using LED light sources packaged in medium and small power (such as 10 mil). Therefore, the manufacturing process of the entire module is very long, and it is necessary to complete the packaging of a single LED light source before soldering on the substrate to form a module.
- COB chip-on-board
- the chip is fixed on the substrate, and then the wire is connected, and finally the phosphor is coated and the protective glue is covered.
- This type of method eliminates the package of a single LED light source, but brings a new problem: after the LED chip is fixed on the substrate, it is always necessary to perform single wire bonding, powder coating, etc., taking into account the strength of the wire, its failure rate. Higher, the processing causes more hidden dangers. Moreover, the process time is too long and the quantity of materials is large, so the material cost and time cost of manufacturing are difficult to reduce.
- the main object of the present invention is to provide a method for manufacturing a chip-type LED module, which solves the problem of excessive material cost of the packaged material when the LED module is mass-produced, and another object is to solve the problem of large-scale pressing of the LED module.
- the time cost of the process time is too long during production; the other purpose is to solve the hidden danger of the single LED light source on the finished LED module without the high reliability of the processing technology:
- a method for manufacturing a chip type LED module comprising the following steps:
- Preparation providing a flip-chip structure of the LED chip, one side of the LED chip has a metal electrode, and the surface spacing of the metal electrode is not less than 80 ⁇ m;
- the metal electrodes of the LED chip are located at the bottom of the tape receiving space, and the light emitting surface of the LED chip is located at the opening of the receiving space;
- the LED chip is sucked out from the braid by a vacuum nozzle, and placed on a pad of a substrate; the metal electrode is opposite to the pad, and the light emitting surface of the LED chip faces upward;
- the pad and the metal electrode are fixed and connected correspondingly.
- the mounting step is occupied, the tape is placed on an automatically fed placement machine, and controlled to feed one by one.
- a solder paste is preliminarily disposed on the pad, and a metal electrode of the LED chip is temporarily fixed to the substrate by a surface tension of the solder paste.
- a solder reflow machine is used to cure the solder paste between the metal electrode and the pad.
- the reflow soldering machine includes the following processes:
- Sending a plate placing the already mounted substrate on a conveyor belt, the conveyor belt being controlled and traveling;
- Preheating volatilizing the auxiliary solvent in the solder paste
- Average temperature activate the flux in the solder paste and evaporate excess water
- Reflow soldering melting the solder paste to fill the area between the metal electrode and the pad and connecting the two;
- Cooling The temperature of the solder paste, metal electrode, and pad is lowered to a cooling temperature.
- the pad has a plurality of pads on the substrate, and the solder paste is attached to the pad by screen printing.
- the light emitting surface of the LED chip is covered with a fluorescent film, and the fluorescent film is in one-to-one correspondence with the LED chip, and is separately mounted.
- the light emitting surface of the LED chip is covered with a fluorescent film, and the fluorescent film is in the form of a monolithic film covering the surface portion of the LED chip together with the substrate on which it is placed.
- the light emitting surface of the LED chip is covered with a fluorescent film, and the fluorescent film is directly sprayed on the light emitting surface of the LED chip by liquid spraying, together with the same side thereof.
- the surface of the substrate is covered with a fluorescent film, and the fluorescent film is directly sprayed on the light emitting surface of the LED chip by liquid spraying, together with the same side thereof.
- the LED chip emits visible light and is in the range of 440-470 nm. It can also be used to emit ultraviolet light with a wavelength range of 240-355 nm.
- an auxiliary colloid having a bottom portion of the LED chip temporarily fixed to the surface of the substrate is disposed adjacent to the pad.
- the flip chip LED chip is directly loaded by braiding, which avoids the packaging of a single LED light source, saves the packaging material and packaging process time of a single LED light source, and the production line;
- the vacuum nozzle absorbs the light-emitting surface of the LED chip, and its geometric characteristics are consistent, and there is no leakage failure caused by irregular shape, and the patch has low failure rate and accurate positioning;
- FIG. 1 is a side view of a flip chip structure LED chip 10 used in Embodiment 1 of the present invention.
- FIG. 2 is a view showing the form of the LED chip 10 in the braid 20 after receiving the LED chip tapping step of the embodiment
- Figure 3 is a plan view of the braid 20 of the embodiment
- Figure 4 is a state of the mounting step of the first embodiment
- Figure 5 is another state of the mounting step of the first embodiment
- Figure 6 is a plan view of the first embodiment after the fixing step is completed
- Figure 7 is a side view of the state shown in Figure 6;
- Figure 8 is a state diagram of a powder coating step after the mounting step of the first embodiment
- Figure 9 is a state diagram of the second mounting step of the embodiment of the present invention.
- Fig. 10 is a view showing the state of the powder coating step after the completion of the mounting step of the second embodiment.
- Embodiment 1 is a diagrammatic representation of Embodiment 1:
- the LED chip 10 of the Flip-chip structure used in the present invention has a main body 10 as a semiconductor material portion and a lower and a negative metal electrode which is in ohmic contact with the main body 10, and is below the main body 10.
- the distance G1 between the electrodes 13 is 80 ⁇ m; the LED chip of the flip-chip structure, the light-emitting surface 12 and the metal electrode 13 of the conductive portion are located on both sides of the body 10, and do not interfere with each other, and the luminous efficiency thereof is high. .
- the LED chips 10 are placed one by one in the braid 20, each LED chip occupies an accommodating space 23, and is independent of each other; and the metal electrode 13 of the LED chip 10 is located at the bottom of the accommodating space 23; The light exit surface 12 is located at the opening of the accommodating space.
- the protective film 21 is closed at the opening of the braid 20 to protect the accommodating space 23.
- the braid 20 has a positioning hole along its length direction, which facilitates the ratcheting mechanism of the braiding machine to grasp and drive its travel, and realize automatic feeding one by one.
- the tape of this embodiment is suitable for the placement machine of all the patch products, and has good versatility.
- the two states of the mounting steps are respectively performed; after the tape 20 is mounted on the automatic placement machine, the placement machine is loaded on the substrate 40 to be mounted; the vacuum nozzle 30 is extended.
- the accommodating space after touching the light-emitting surface 12 of the LED chip 10, the same position is sucked out, which is the suction state shown in FIG. 4; and then translated to the upper surface of the substrate 41, wherein the pad 41 is the final One-to-one correspondence with the metal electrodes 13 has a screen-printed solder paste 42 on the pad 41; the pad 41 gap G2 is also 80 ⁇ m.
- the metal electrode 13 and the pad 41 are temporarily fixed by the tension of the solder paste 42 itself, and are not randomly displaced due to air flow or shaking.
- solder paste 42 passes through the following steps in the reflow soldering machine:
- Sending board placing the already mounted substrate 40 on the conveyor belt, and the conveyor belt is controlled and travels;
- Average temperature activate the flux in the solder paste 42 and evaporate excess water
- molten solder paste 42 fills the area between the metal electrode 13 and the pad 41 and connects the two;
- Cooling The temperature of the solder paste 42, the metal electrode 13, and the pad 41 is lowered to the cooling temperature.
- the LED chip 10 which has been mounted and fixed, the metal electrode 13 and the pad 41 have been fixed and kept in communication by the solid solder paste 42.
- the solder paste 42 has pulled the metal electrode 13 in alignment by its own tension before solidification.
- the LED chip 10 has been fixed on the substrate 40, and all the LED chips 10 on the substrate 40 are connected according to the line of the pad 41, and a complete module has been formed, which can be illuminated by being connected to the power source.
- the 455 nm blue LED chip 10 is used, and the entire module needs to realize white light output of 4000K color temperature. Therefore, the module must be coated with phosphor.
- the liquid powder is sprayed directly to spray the phosphor.
- the flip chip LED chip 10 adopts the method of tape loading directly, and has obvious features, so that the manufacturing process of the whole LED module avoids the packaging of a single LED light source, and finally all the LED chips 10 can be removed without a single package. Fixed and connected to the substrate 40, saving the packaging material and packaging process time of the single LED light source, and the production line; Moreover, the placement machine of the vacuum nozzle 30 absorbs the light emitting surface of the LED chip 10, and the geometric characteristics thereof are consistent.
- Embodiment 2 is a diagrammatic representation of Embodiment 1:
- FIG. 9 two state diagrams of Embodiment 2 of the present invention:
- the substrate 40 has an auxiliary colloid 45 between the pads 41.
- the auxiliary colloid 45 functions when the LED chip 10 is large in volume. It is difficult to temporarily fix the LED chip 10 to the substrate by the tension of the solder paste 42, and the auxiliary colloid 45 serves as a temporary component to make the LED chip 10 and the pad 41 relatively accurate and stable, and the posture deviation does not occur even after the reflow oven. .
- the fluorescent film is in the form of a monolithic film, which is separately formed, so that the appropriate pressure and bonding can be directly used.
- the fluorescent film 50 is entirely covered on the LED chip 10 together with the surface portion of the substrate 40. This method further shortens the molding time of the entire module, does not require spraying, and does not need to be baked for curing, so it is very fast. Process flow.
- the direct bonding of the LED chip 10 to the substrate 40 by the placement machine has obvious convenience for coating the phosphor on a large area, so that the fluorescent film can be efficiently formed by various methods.
- the flip chip LED chip is directly loaded by the tape, which avoids the packaging of a single LED light source, saves the packaging material and packaging process time of a single LED light source, and the production line.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Disclosed is a method of fabricating a surface-mounted LED module, comprising the following steps: preparing, providing an LED chip (10) of a flip-chip structure, one side of the LED chip (10) having metal electrodes (13), and the surface pitch of the metal electrodes (13) being not smaller than 80 μm; arranging, placing a plurality of LΕD chips (10) in a strip, the metal electrodes (13) of the LED chip (10) being located at the bottom of a strip receiving space (23), and the light emitting surface (12) of the LED chip (10) being located at the opening of the receiving space (23); adhering, sucking the LED chip (10) from the strip using a vacuum suction cup (30), and placing the LED chip (10) on a solder pad of a substrate, so that the metal electrode (13) is opposite the solder pad, and the light emitting surface (12) of the LED chip (10) faces upwards; and fixing, correspondingly fixing and joining the solder pad and the metal electrode (13). By directly adopting a strip carrying manner for a flip-chip LED chip, the encapsulation of a single LED light source is avoided; the encapsulation material, encapsulation process time, and production line for a single LED light source are saved.
Description
本发明涉及一种制造贴片式LED模组的生产方法。 The invention relates to a production method for manufacturing a chip type LED module.
随着照明LED技术的发展,相对于传统白炽灯、卤素灯类型的照明光源而言,LED已经具有明显节能、可靠、长寿的优势,并且已经可以逐渐达到荧光灯的照明性能,例如光效和显色指数、寿命方面。因此,全球范围内,照明LED的发展方兴未艾,LED光源年产量也逐步增加,With the development of lighting LED technology, compared with the traditional incandescent lamp, halogen lamp type of illumination source, LED has obvious advantages of energy saving, reliability, longevity, and can gradually achieve the lighting performance of fluorescent lamps, such as light effect and display Color index, life aspect. Therefore, the global development of lighting LEDs is on the rise, and the annual output of LED light sources is gradually increasing.
相比传统的光源,LED光源具有一些明显的特点,通常在体积上,LED光源都是以单个芯片(chip)为单位,带有电极、荧光粉、封装结构等等,具有较小的体积和较少的光通量,若需要组成合适的照明灯具,则难免使用多个LED光源组成阵列形态的模组,一方面可以整合体积、构造形状并统一供电,另一方面必须达到足够的光通量。这些特点在通用照明、室内照明就已经十分突出:比较常见的做法,就是将完整封装的LED光源排列在基板上固定、连通,构成可整体发光的LED模组,再用此模组装配成完整灯具。若灯具形态较大,单个灯具所需的光通量较高(如1000lm以上),则单颗LED光源的数量必然十分多,特别是采用中小功率(如10mil)封装的LED光源时甚为明显。所以,整个模组的制造工艺制程很长,必须先完成单颗LED光源的封装,才予以焊接在基板上制成模组。Compared with traditional light sources, LED light sources have some obvious features. Usually, in terms of volume, LED light sources are in units of a single chip, with electrodes, phosphors, package structures, etc., with a small volume and With less luminous flux, if it is necessary to form a suitable lighting fixture, it is inevitable to use multiple LED light sources to form an array of modules. On the one hand, it can integrate volume, structure shape and uniform power supply, on the other hand, sufficient luminous flux must be achieved. These features are already prominent in general lighting and indoor lighting: a more common practice is to arrange a complete package of LED light sources on the substrate to be fixed and connected to form an LED module that can be illuminated as a whole, and then assembled into a complete module. Lighting. If the luminaire is large in shape and the luminous flux required for a single luminaire is high (such as 1000 lm or more), the number of single LED light sources must be very large, especially when using LED light sources packaged in medium and small power (such as 10 mil). Therefore, the manufacturing process of the entire module is very long, and it is necessary to complete the packaging of a single LED light source before soldering on the substrate to form a module.
针对此问题,有一类办法是COB(chip-on-board)技术,即将芯片固定在基板上以后,再进行打线连接,最后加以涂覆荧光粉、覆盖保护胶等。这类方式免除了单个LED光源的封装体,但带来了新的问题:LED芯片固定于基板以后,总需要针对单个进行打线、涂粉等处理,考虑到金属线的强度,其失效率较高,处理造成工艺隐患较多。而且工艺制程时间太长,备料数量多,所以制造的物料成本和时间成本都难以缩减。In response to this problem, there is a type of COB (chip-on-board) technology, in which the chip is fixed on the substrate, and then the wire is connected, and finally the phosphor is coated and the protective glue is covered. This type of method eliminates the package of a single LED light source, but brings a new problem: after the LED chip is fixed on the substrate, it is always necessary to perform single wire bonding, powder coating, etc., taking into account the strength of the wire, its failure rate. Higher, the processing causes more hidden dangers. Moreover, the process time is too long and the quantity of materials is large, so the material cost and time cost of manufacturing are difficult to reduce.
所以,在LED模组大规模生产时,总是难以避免封装结构带来过高的成本和繁杂物料带来的工艺流程太长,而且可靠性不高的问题。Therefore, in the large-scale production of LED modules, it is always difficult to avoid the problem that the package structure brings too high cost and the process flow caused by complicated materials is too long and the reliability is not high.
本发明的主要目的在于提供一种贴片式LED模组的制造方法,解决LED模组大规模生产时耗用封装的物料过多的物料成本问题;另一目的在于解决按LED模组大规模生产时工艺制程时间太长的时间成本问题;再一目的在于解决生产完毕的LED模组其上单颗LED光源可靠性不高、具有加工工艺的隐患:The main object of the present invention is to provide a method for manufacturing a chip-type LED module, which solves the problem of excessive material cost of the packaged material when the LED module is mass-produced, and another object is to solve the problem of large-scale pressing of the LED module. The time cost of the process time is too long during production; the other purpose is to solve the hidden danger of the single LED light source on the finished LED module without the high reliability of the processing technology:
一种贴片式LED模组的制造方法,包括以下步骤:A method for manufacturing a chip type LED module, comprising the following steps:
备料:提供覆晶结构的LED芯片,该LED芯片的一面具有金属电极,并且,所述金属电极的表面间距不小于80μm;Preparation: providing a flip-chip structure of the LED chip, one side of the LED chip has a metal electrode, and the surface spacing of the metal electrode is not less than 80 μm;
编排:将多个所述LED芯片置于一编带当中,所述LED芯片其金属电极位于所述编带容置空间的底部,所述LED芯片的出光面位于所述容置空间开口处;Arranging a plurality of the LED chips in a braided strip, the metal electrodes of the LED chip are located at the bottom of the tape receiving space, and the light emitting surface of the LED chip is located at the opening of the receiving space;
贴装:采用真空吸嘴将所述LED芯片从所述编带中吸出,置于一基板的焊盘上;所述金属电极与所述焊盘相对,所述LED芯片的出光面朝上;及Mounting: the LED chip is sucked out from the braid by a vacuum nozzle, and placed on a pad of a substrate; the metal electrode is opposite to the pad, and the light emitting surface of the LED chip faces upward; and
固定:将所述焊盘和金属电极对应固定并连通。Fixed: The pad and the metal electrode are fixed and connected correspondingly.
作为本技术方案的改进,可以在如下方面体现:As an improvement of the technical solution, it can be embodied in the following aspects:
较佳实施例中,所述贴装步骤占用,所述编带置于一自动进给的贴片机上,并受控逐个进给。In a preferred embodiment, the mounting step is occupied, the tape is placed on an automatically fed placement machine, and controlled to feed one by one.
较佳实施例中,所述贴装步骤中,所述焊盘上预先设好锡膏,所述LED芯片的金属电极利用所述锡膏的表面张力暂时固定于所述基板。In a preferred embodiment, in the mounting step, a solder paste is preliminarily disposed on the pad, and a metal electrode of the LED chip is temporarily fixed to the substrate by a surface tension of the solder paste.
较佳实施例中,所述固定步骤中采用回流焊机使所述金属电极和焊盘之间的锡膏固化。In a preferred embodiment, a solder reflow machine is used to cure the solder paste between the metal electrode and the pad.
较佳实施例中,所述回流焊机包括以下流程:In a preferred embodiment, the reflow soldering machine includes the following processes:
送板:将已经贴装好的所述基板放置于传输带上,所述传输带受控并行进;Sending a plate: placing the already mounted substrate on a conveyor belt, the conveyor belt being controlled and traveling;
预热:将所述锡膏中的辅助溶剂挥发;Preheating: volatilizing the auxiliary solvent in the solder paste;
均温:活化所述锡膏中的助焊剂,并蒸发多余水分;Average temperature: activate the flux in the solder paste and evaporate excess water;
回焊:熔融所述锡膏使之填充所述金属电极和焊盘之间区域并将二者连接;Reflow soldering: melting the solder paste to fill the area between the metal electrode and the pad and connecting the two;
冷却:使所述锡膏、金属电极、焊盘的温度降低至冷却温度。Cooling: The temperature of the solder paste, metal electrode, and pad is lowered to a cooling temperature.
较佳实施例中,所述焊盘于所述基板上具有多个,所述锡膏采用丝网印刷的方式附着于所述焊盘。In a preferred embodiment, the pad has a plurality of pads on the substrate, and the solder paste is attached to the pad by screen printing.
较佳实施例中,所述固定步骤完成后,将所述LED芯片的出光面覆盖荧光膜,所述荧光膜与所述LED芯片一一对应,单独贴装。In a preferred embodiment, after the fixing step is completed, the light emitting surface of the LED chip is covered with a fluorescent film, and the fluorescent film is in one-to-one correspondence with the LED chip, and is separately mounted.
较佳实施例中,所述固定步骤完成后,将所述LED芯片的出光面覆盖荧光膜,所述荧光膜为一整体薄膜的形态,覆盖于所述LED芯片连同其所在基板的表面部分。In a preferred embodiment, after the fixing step is completed, the light emitting surface of the LED chip is covered with a fluorescent film, and the fluorescent film is in the form of a monolithic film covering the surface portion of the LED chip together with the substrate on which it is placed.
较佳实施例中,所述固定步骤完成后,将所述LED芯片的出光面覆盖荧光膜,所述荧光膜采用液态喷涂的方式直接喷涂于所述LED芯片的出光面,连同其同侧的所述基板表面。In a preferred embodiment, after the fixing step is completed, the light emitting surface of the LED chip is covered with a fluorescent film, and the fluorescent film is directly sprayed on the light emitting surface of the LED chip by liquid spraying, together with the same side thereof. The surface of the substrate.
较佳实施例中,所述LED芯片为发出可见光为蓝光者,其波长范围为440-470nm。也可为发出紫外光者,其波长范围为240-355nm。In a preferred embodiment, the LED chip emits visible light and is in the range of 440-470 nm. It can also be used to emit ultraviolet light with a wavelength range of 240-355 nm.
较佳实施例中,所述贴装步骤中,所述焊盘旁设有具有将所述LED芯片底部暂时固定于所述基板表面的辅助胶体。In a preferred embodiment, in the mounting step, an auxiliary colloid having a bottom portion of the LED chip temporarily fixed to the surface of the substrate is disposed adjacent to the pad.
本发明带来的有益效果是:The beneficial effects brought by the invention are:
1.
将覆晶LED芯片直接采用编带装载的方式,避免了单个LED光源的封装,节省了单个LED光源的封装物料和封装工艺时间、以及生产线;1.
The flip chip LED chip is directly loaded by braiding, which avoids the packaging of a single LED light source, saves the packaging material and packaging process time of a single LED light source, and the production line;
2.
用真空吸嘴吸取的是LED芯片的出光面,其几何特征一致性好,没有不规则形态带来的吸合失效的情况,其贴片失效率低,定位精确;2.
The vacuum nozzle absorbs the light-emitting surface of the LED chip, and its geometric characteristics are consistent, and there is no leakage failure caused by irregular shape, and the patch has low failure rate and accurate positioning;
3.
编带式的LED芯片,所有的贴片工艺可以沿用现有的SMT设备,不需要作额外硬件的投入,避免了封装线的成本和工艺时间,其量产的实现较容易;3.
Tape-type LED chip, all the chip process can use the existing SMT equipment, no additional hardware investment, avoiding the cost and process time of the packaging line, and the mass production is easier to implement;
4.
覆晶结构的LED芯片贴装于基板后,易于实现荧光膜的行程,可以使用整体喷涂的方式,大面积地实现荧光粉涂覆,喷涂设备可以不接触到LED芯片,其工艺时间短,没有接触工艺带来的隐患。4.
After the flip-chip structure of the LED chip is mounted on the substrate, it is easy to realize the stroke of the fluorescent film, and the whole coating method can be used to realize the phosphor coating in a large area, and the spraying device can not contact the LED chip, and the process time is short, and there is no The hidden dangers caused by the contact process.
以下结合附图实施例对本发明作进一步说明:The present invention is further described below in conjunction with the embodiments of the drawings:
图1是本发明实施例一所用的覆晶结构的LED芯片10侧视图;1 is a side view of a flip chip structure LED chip 10 used in Embodiment 1 of the present invention;
图2是实施例一LED芯片编带步骤接收后LED芯片10在编带20中的形态;2 is a view showing the form of the LED chip 10 in the braid 20 after receiving the LED chip tapping step of the embodiment;
图3是实施例一编带20的俯视图;Figure 3 is a plan view of the braid 20 of the embodiment;
图4是实施例一贴装步骤的一个状态;Figure 4 is a state of the mounting step of the first embodiment;
图5是实施例一贴装步骤的另一个状态;Figure 5 is another state of the mounting step of the first embodiment;
图6是实施例一固定步骤完毕后的俯视图;Figure 6 is a plan view of the first embodiment after the fixing step is completed;
图7图6所示状态的侧视图;Figure 7 is a side view of the state shown in Figure 6;
图8是实施例一贴装步骤之后的一涂粉步骤状态图;Figure 8 is a state diagram of a powder coating step after the mounting step of the first embodiment;
图9是本发明实施例二贴装步骤的一个状态图;Figure 9 is a state diagram of the second mounting step of the embodiment of the present invention;
图10是实施例二贴装步骤完毕后涂粉步骤状态图。Fig. 10 is a view showing the state of the powder coating step after the completion of the mounting step of the second embodiment.
实施例一:Embodiment 1:
图1所示,本发明所利用的覆晶(Flip-chip)结构的LED芯片10,其主体10为半导体材料部分,下方是与主体10构成欧姆接触的正、负金属电极,在主体10下方的平面内,金属电极13彼此之间的间距G1为80μm;此类覆晶结构的LED芯片,发光面12与导电部分的金属电极13位于主体10的两面,互不干涉,其发光效率较高。As shown in FIG. 1, the LED chip 10 of the Flip-chip structure used in the present invention has a main body 10 as a semiconductor material portion and a lower and a negative metal electrode which is in ohmic contact with the main body 10, and is below the main body 10. In the plane of the metal electrodes 13, the distance G1 between the electrodes 13 is 80 μm; the LED chip of the flip-chip structure, the light-emitting surface 12 and the metal electrode 13 of the conductive portion are located on both sides of the body 10, and do not interfere with each other, and the luminous efficiency thereof is high. .
如图2和图3所示,将LED芯片10逐个放入编带20中,每一个LED芯片占据一个容置空间23,彼此独立;并且LED芯片10的金属电极13位于容置空间23底部;出光面12位于容置空间的开口处。当LED芯片13置入容置空间完毕,编带20的开口处会有保护膜21将容置空间23封闭,以为保护。编带20沿其长度方向具有定位孔,方便编带机的棘轮等机构抓取并驱动其行进,实现逐个自动进给。本实施例的这种编带适用于所有贴片产品的贴片机,具有良好的通用性。As shown in FIG. 2 and FIG. 3, the LED chips 10 are placed one by one in the braid 20, each LED chip occupies an accommodating space 23, and is independent of each other; and the metal electrode 13 of the LED chip 10 is located at the bottom of the accommodating space 23; The light exit surface 12 is located at the opening of the accommodating space. When the LED chip 13 is placed in the accommodating space, the protective film 21 is closed at the opening of the braid 20 to protect the accommodating space 23. The braid 20 has a positioning hole along its length direction, which facilitates the ratcheting mechanism of the braiding machine to grasp and drive its travel, and realize automatic feeding one by one. The tape of this embodiment is suitable for the placement machine of all the patch products, and has good versatility.
如图4和图5所示,分别贴装步骤的两个状态;当编带20装置于自动贴片机上以后,再将贴片机装载上待贴装的基板40;真空吸嘴30伸入容置空间内,碰触LED芯片10的出光面12后,将其同姿态吸出,此为图4所示的吸出状态;再平移至基板40的焊盘41上方,其中焊盘41乃是最终与金属电极13一一对应者,同时焊盘41上已经具有丝网印刷的锡膏42;焊盘41间隙G2也为80μm。此为图5所示的贴片状态。在图5所示的状态之后,利用锡膏42本身的张力,金属电极13和焊盘41得以暂时固定,而不会因为气流、晃动而随意错位。As shown in FIG. 4 and FIG. 5, the two states of the mounting steps are respectively performed; after the tape 20 is mounted on the automatic placement machine, the placement machine is loaded on the substrate 40 to be mounted; the vacuum nozzle 30 is extended. In the accommodating space, after touching the light-emitting surface 12 of the LED chip 10, the same position is sucked out, which is the suction state shown in FIG. 4; and then translated to the upper surface of the substrate 41, wherein the pad 41 is the final One-to-one correspondence with the metal electrodes 13 has a screen-printed solder paste 42 on the pad 41; the pad 41 gap G2 is also 80 μm. This is the patch state shown in FIG. After the state shown in Fig. 5, the metal electrode 13 and the pad 41 are temporarily fixed by the tension of the solder paste 42 itself, and are not randomly displaced due to air flow or shaking.
在此之后,锡膏42在回流焊机经过了以下步骤:After that, the solder paste 42 passes through the following steps in the reflow soldering machine:
送板:将已经贴装好的基板40放置于传输带上,传输带受控并行进;Sending board: placing the already mounted substrate 40 on the conveyor belt, and the conveyor belt is controlled and travels;
预热:将锡膏42中的辅助溶剂挥发;Preheating: volatilizing the auxiliary solvent in the solder paste 42;
均温:活化锡膏42中的助焊剂,并蒸发多余水分;Average temperature: activate the flux in the solder paste 42 and evaporate excess water;
回焊:熔融锡膏42使之填充金属电极13和焊盘41之间区域并将二者连接;Reflow soldering: molten solder paste 42 fills the area between the metal electrode 13 and the pad 41 and connects the two;
冷却:使锡膏42、金属电极13、焊盘41的温度降低至冷却温度。Cooling: The temperature of the solder paste 42, the metal electrode 13, and the pad 41 is lowered to the cooling temperature.
完成上述过程后,如图6和图7所示,已经贴装并固定完毕的LED芯片10,金属电极13与焊盘41已经由固态的锡膏42所固定并保持连通。锡膏42在凝固前已依靠自身张力将金属电极13拉动对位。如此,基板40已经固定好LED芯片10,并且,基板40上所有的LED芯片10依据其焊盘41的线路连接,已经构成一个完整的模组,通过接入电源即可整体点亮。After the above process is completed, as shown in FIGS. 6 and 7, the LED chip 10 which has been mounted and fixed, the metal electrode 13 and the pad 41 have been fixed and kept in communication by the solid solder paste 42. The solder paste 42 has pulled the metal electrode 13 in alignment by its own tension before solidification. In this way, the LED chip 10 has been fixed on the substrate 40, and all the LED chips 10 on the substrate 40 are connected according to the line of the pad 41, and a complete module has been formed, which can be illuminated by being connected to the power source.
本实施例采用的是455nm蓝光LED芯片10,需要整个模组实现4000K色温的白光输出,所以,还必须对模组进行荧光粉涂覆,本实施例采用液态喷涂的方式,将荧光粉直接喷涂于LED芯片10的出光面,连同其同侧的所述基板表面。再经过适当的烘烤,使LED芯片10的出光面12表面、以及其侧面,均有一层荧光膜12,于是,整个基板40所固定的LED芯片10可以通体发出白光,达到高光通照明的要求。In this embodiment, the 455 nm blue LED chip 10 is used, and the entire module needs to realize white light output of 4000K color temperature. Therefore, the module must be coated with phosphor. In this embodiment, the liquid powder is sprayed directly to spray the phosphor. The light emitting surface of the LED chip 10, together with the substrate surface on the same side thereof. After proper baking, the surface of the light-emitting surface 12 of the LED chip 10 and the side surface thereof are provided with a fluorescent film 12, so that the LED chip 10 fixed on the entire substrate 40 can emit white light through the whole body to meet the requirements of high-light illumination. .
可见,将覆晶LED芯片10直接采用编带装载的方式,具有明显的特点,使整个LED模组的制造工艺避免了单个LED光源的封装,最终不需要单个封装就可以将所有的LED芯片10固定并连通于基板40上,节省了单个LED光源的封装物料和封装工艺时间、以及生产线;而且,用真空吸嘴30的贴片机,吸取的是LED芯片10的出光面,其几何特征一致性好,没有不规则形态带来的吸合失效的情况,
例如荧光粉的不平整面,所以其贴片失效率低,定位精确;再者,当使用了编带式的LED芯片10,所有的贴片工艺可以沿用现有的SMT设备,不需要作额外硬件的投入,避免了封装线的成本和工艺时间,其量产的实现较容易;最后,当覆晶结构的LED芯片10贴装于基板40后,易于实现荧光膜的行程,可以使用整体喷涂的方式,大面积地实现荧光粉涂覆,喷涂设备可以不接触到LED芯片10,其工艺时间短,没有接触工艺带来的隐患。It can be seen that the flip chip LED chip 10 adopts the method of tape loading directly, and has obvious features, so that the manufacturing process of the whole LED module avoids the packaging of a single LED light source, and finally all the LED chips 10 can be removed without a single package. Fixed and connected to the substrate 40, saving the packaging material and packaging process time of the single LED light source, and the production line; Moreover, the placement machine of the vacuum nozzle 30 absorbs the light emitting surface of the LED chip 10, and the geometric characteristics thereof are consistent. Good sex, no irregularity caused by irregularities,
For example, the uneven surface of the phosphor, so the patch failure rate is low, the positioning is accurate; in addition, when the tape type LED chip 10 is used, all the patch processes can use the existing SMT device without additional The input of hardware avoids the cost and process time of the package line, and the mass production is easy to realize. Finally, when the flip chip LED chip 10 is mounted on the substrate 40, the stroke of the fluorescent film is easily realized, and the whole spray can be used. The method of realizing phosphor coating on a large area, the spraying equipment can not touch the LED chip 10, the process time is short, and there is no hidden trouble caused by the contact process.
实施例二:Embodiment 2:
如图9、图10,本发明实施例二的两个状态图:9 and FIG. 10, two state diagrams of Embodiment 2 of the present invention:
本实施例与实施例一相比,不同的是,在贴装步骤中,基板40其焊盘41之间具有辅助胶体45,此辅助胶体45作用在于,当LED芯片10体积较大时,单靠锡膏42的张力难以将LED芯片10暂时固定于基板,辅助胶体45就作为一暂时性的部件使LED芯片10与焊盘41相对精确而稳定,即使经过回流焊炉也不会发生姿态偏差。The difference between the embodiment and the first embodiment is that, in the mounting step, the substrate 40 has an auxiliary colloid 45 between the pads 41. The auxiliary colloid 45 functions when the LED chip 10 is large in volume. It is difficult to temporarily fix the LED chip 10 to the substrate by the tension of the solder paste 42, and the auxiliary colloid 45 serves as a temporary component to make the LED chip 10 and the pad 41 relatively accurate and stable, and the posture deviation does not occur even after the reflow oven. .
另一不同的是,当LED芯片10固定步骤完毕后,将LED芯片10的出光面覆盖荧光膜50,此荧光膜为一整体薄膜的形态,单独成型,所以可以直接用适当的压力和粘结剂,使荧光膜50整体覆盖于LED芯片10连同其所在基板40的表面部分,此方式进一步缩短了整个模组的成型时间,不需要喷涂,也不需要烘烤等待其固化,故具有十分快速的工艺流程。Another difference is that after the fixing step of the LED chip 10 is completed, the light emitting surface of the LED chip 10 is covered with the fluorescent film 50. The fluorescent film is in the form of a monolithic film, which is separately formed, so that the appropriate pressure and bonding can be directly used. The fluorescent film 50 is entirely covered on the LED chip 10 together with the surface portion of the substrate 40. This method further shortens the molding time of the entire module, does not require spraying, and does not need to be baked for curing, so it is very fast. Process flow.
可见,这种直接将LED芯片10用贴片机贴合于基板40的方式,对大面积涂覆荧光粉具有明显的便利,使其可用多种方法有效地成型荧光膜。It can be seen that the direct bonding of the LED chip 10 to the substrate 40 by the placement machine has obvious convenience for coating the phosphor on a large area, so that the fluorescent film can be efficiently formed by various methods.
以上所述,仅为本发明较佳实施例而已,故不能依此限定本发明实施的范围,即依本发明专利范围及说明书内容所作的等效变化与修饰,皆应仍属本发明涵盖的范围内。The above is only the preferred embodiment of the present invention, and thus the scope of the present invention is not limited thereto, that is, equivalent changes and modifications made in accordance with the scope of the invention and the contents of the specification should still be covered by the present invention. Within the scope.
将覆晶LED芯片直接采用编带装载的方式,避免了单个LED光源的封装,节省了单个LED光源的封装物料和封装工艺时间、以及生产线。The flip chip LED chip is directly loaded by the tape, which avoids the packaging of a single LED light source, saves the packaging material and packaging process time of a single LED light source, and the production line.
Claims (12)
- 一种贴片式LED模组的制造方法,其特征在于:包括以下步骤: A manufacturing method of a chip type LED module, comprising: the following steps:备料:提供覆晶结构的LED芯片,该LED芯片的一面具有金属电极,并且,所述金属电极的表面间距不小于80μm;Preparation: providing a flip-chip structure of the LED chip, one side of the LED chip has a metal electrode, and the surface spacing of the metal electrode is not less than 80 μm;编排:将多个所述LED芯片置于一编带当中,所述LED芯片其金属电极位于所述编带容置空间的底部,所述LED芯片的出光面位于所述容置空间开口处;Arranging a plurality of the LED chips in a braided strip, the metal electrodes of the LED chip are located at the bottom of the tape receiving space, and the light emitting surface of the LED chip is located at the opening of the receiving space;贴装:采用真空吸嘴将所述LED芯片从所述编带中吸出,置于一基板的焊盘上;所述金属电极与所述焊盘相对,所述LED芯片的出光面朝上;及Mounting: the LED chip is sucked out from the braid by a vacuum nozzle, and placed on a pad of a substrate; the metal electrode is opposite to the pad, and the light emitting surface of the LED chip faces upward; and固定:将所述焊盘和金属电极对应固定并连通。Fixed: The pad and the metal electrode are fixed and connected correspondingly.
- 根据权利要求1所述一种贴片式LED模组的制造方法,其特征在于:所述贴装步骤占用,所述编带置于一自动进给的贴片机上,并受控逐个进给。The method for manufacturing a chip-type LED module according to claim 1, wherein the mounting step is occupied, the tape is placed on an automatic feeding device, and controlled by feeding one by one. .
- 根据权利要求1所述一种贴片式LED模组的制造方法,其特征在于:所述贴装步骤中,所述焊盘上预先设好锡膏,所述LED芯片的金属电极利用所述锡膏的表面张力暂时固定于所述基板。The method of manufacturing a chip-type LED module according to claim 1, wherein in the mounting step, solder paste is preliminarily provided on the pad, and the metal electrode of the LED chip utilizes the The surface tension of the solder paste is temporarily fixed to the substrate.
- 根据权利要求1所述一种贴片式LED模组的制造方法,其特征在于:所述固定步骤中采用回流焊机使所述金属电极和焊盘之间的锡膏固化。The method of manufacturing a chip-type LED module according to claim 1, wherein the solder paste between the metal electrode and the pad is cured by a reflow soldering machine in the fixing step.
- 根据权利要求4所述一种贴片式LED模组的制造方法,其特征在于:所述回流焊机包括以下流程:The method of manufacturing a chip-type LED module according to claim 4, wherein the reflow soldering machine comprises the following processes:送板:将已经贴装好的所述基板放置于传输带上,所述传输带受控并行进;Sending a plate: placing the already mounted substrate on a conveyor belt, the conveyor belt being controlled and traveling;预热:将所述锡膏中的辅助溶剂挥发;Preheating: volatilizing the auxiliary solvent in the solder paste;均温:活化所述锡膏中的助焊剂,并蒸发多余水分;Average temperature: activate the flux in the solder paste and evaporate excess water;回焊:熔融所述锡膏使之填充所述金属电极和焊盘之间区域并将二者连接;Reflow soldering: melting the solder paste to fill the area between the metal electrode and the pad and connecting the two;冷却:使所述锡膏、金属电极、焊盘的温度降低至冷却温度。Cooling: The temperature of the solder paste, metal electrode, and pad is lowered to a cooling temperature.
- 根据权利要求1至5中任一项所述一种贴片式LED模组的制造方法,其特征在于:所述焊盘于所述基板上具有多个,所述锡膏采用丝网印刷的方式附着于所述焊盘。The method for manufacturing a chip-type LED module according to any one of claims 1 to 5, wherein the pad has a plurality of the substrate, and the solder paste is screen printed. The method is attached to the pad.
- 根据权利要求6所述一种贴片式LED模组的制造方法,其特征在于:所述固定步骤完成后,将所述LED芯片的出光面覆盖荧光膜,所述荧光膜与所述LED芯片一一对应,单独贴装。The method for manufacturing a chip-type LED module according to claim 6, wherein after the fixing step is completed, the light-emitting surface of the LED chip is covered with a fluorescent film, the fluorescent film and the LED chip. One-to-one correspondence, mounted separately.
- 根据权利要求6所述一种贴片式LED模组的制造方法,其特征在于:所述固定步骤完成后,将所述LED芯片的出光面覆盖荧光膜,所述荧光膜为一整体薄膜的形态,覆盖于所述LED芯片连同其所在基板的表面部分。The method for manufacturing a chip-type LED module according to claim 6, wherein after the fixing step is completed, the light-emitting surface of the LED chip is covered with a fluorescent film, and the fluorescent film is an integral film. The form covers the surface portion of the LED chip together with the substrate on which it is placed.
- 根据权利要求6所述一种贴片式LED模组的制造方法,其特征在于:所述固定步骤完成后,将所述LED芯片的出光面覆盖荧光膜,所述荧光膜采用液态喷涂的方式直接喷涂于所述LED芯片的出光面,连同其同侧的所述基板表面。The method for manufacturing a chip-type LED module according to claim 6, wherein after the fixing step is completed, the light-emitting surface of the LED chip is covered with a fluorescent film, and the fluorescent film is sprayed by liquid. Sprayed directly onto the light exit surface of the LED chip, along with the substrate surface on the same side thereof.
- 根据权利要求6所述一种贴片式LED模组的制造方法,其特征在于:所述LED芯片为发出可见光为蓝光者,其波长范围为440-470nm。The method for manufacturing a chip-type LED module according to claim 6, wherein the LED chip emits visible light and is in the range of 440-470 nm.
- 根据权利要求6所述一种贴片式LED模组的制造方法,其特征在于:所述LED芯片为发出紫外光者,其波长范围为240-355nm。The method for manufacturing a chip-type LED module according to claim 6, wherein the LED chip emits ultraviolet light and has a wavelength range of 240-355 nm.
- 根据权利要求6所述一种贴片式LED模组的制造方法,其特征在于:所述贴装步骤中,所述焊盘旁设有具有将所述LED芯片底部暂时固定于所述基板表面的辅助胶体。The method for manufacturing a chip-type LED module according to claim 6, wherein in the mounting step, the pad is provided with a surface for temporarily fixing the bottom of the LED chip to the surface of the substrate. Auxiliary colloid.
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