CN113410219A - LED film pasting screen and manufacturing method thereof - Google Patents
LED film pasting screen and manufacturing method thereof Download PDFInfo
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- CN113410219A CN113410219A CN202110809395.XA CN202110809395A CN113410219A CN 113410219 A CN113410219 A CN 113410219A CN 202110809395 A CN202110809395 A CN 202110809395A CN 113410219 A CN113410219 A CN 113410219A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
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Abstract
The invention discloses an LED film pasting screen and a manufacturing method thereof, relating to the technical field of flexible display; the manufacturing method of the LED film screen comprises the following steps: forming an LED matrix conducting circuit on the surface of the transparent film substrate; the LED matrix conducting circuit comprises a plurality of groups of pad electrodes; mounting an LED chip at each group of pad electrodes of the LED matrix conducting circuit, and realizing the infiltration connection between the LED pins and the pad electrodes by using liquid metal; the wettability of the metal by the molten liquid metal provides a binding force and electrical conduction between the LED leads and the pad electrodes. In the embodiment of the invention, the liquid metal is selected as the connecting material between the LED chip and the bonding pad, the bonding force between the LED chip and the bonding pad is generated by utilizing the wettability of the liquid metal to the metal, the connection between the LED chip and the bonding pad is ensured, and meanwhile, the liquid metal can be in a molten state at room temperature, so that the use requirements of most of base materials can be met, and the problems of deformation and poor transparency of the base materials can be avoided.
Description
Technical Field
The invention belongs to the technical field of flexible display, and particularly relates to an LED film pasting screen and a manufacturing method thereof.
Background
With the continuous improvement of daily level of people and the continuous development of scientific technology, in recent years, the technology of transparent LED display screens with LED lamps distributed on a transparent substrate in an array mode begins to appear, the transparent LED display screens are gradually and widely applied in the market of two years, various product forms are developed, such as an LED film pasting screen and an LED glass screen, the LED film pasting screen is applied to target glass or a curtain wall in an integral pasting mode, so that the target glass or the curtain wall is endowed with an electronic display function, the LED glass screen directly replaces the target glass or the curtain wall to be used, and the LED film pasting screen and the curtain wall have certain differences in structure, application and manufacturing process. In addition, manufacturers have recently proposed the concept of the flexible LED film screen, which has good flexible deformability, so that the flexible LED film screen can meet the mounting requirements of different surfaces.
The LED surface mounting process is an indispensable link in the production of LED products, and the mounting efficiency of the LED surface mounting process has great influence on the production of the whole LED products; at present, a chip mounting process in the production process of an LED film-mounted screen mainly adopts the steps of firstly printing solder paste on a circuit pad in a steel mesh printing mode, then applying an adhesive in the center of the pad by using a dispenser, then mounting an LED chip by using a chip mounter based on the adhesive, and finally sending the LED chip into reflow soldering equipment to melt the solder paste and connect and fix a pin of the LED chip and the circuit pad.
Although the process can realize more stable connection between the LED chip and the bonding pad, the process also has a plurality of problems; firstly, the expansion and shrinkage of the base materials such as PET and the like are irregular in the steel mesh printing and processing process, the long-scale accumulated deviation is large, the printing precision of the solder paste is easily influenced, and the steel meshes adopted by the base materials in different batches and even the same batch cannot be used universally; in addition, the reflow soldering process has a high selectivity requirement on the temperature resistance of the base material, is not suitable for base materials with poor temperature resistance such as PET and the like, and is easy to cause the problems of deformation, poor transparency and the like of the base material.
Disclosure of Invention
In view of the above, an object of the present invention is to provide a method for manufacturing an LED film screen, so as to solve the problems that the manufacturing process of the LED film screen in the prior art has high requirement on the selectivity of the substrate, and easily causes the deformation of the substrate and the deterioration of the transparency.
In some illustrative embodiments, the method for manufacturing the LED film screen includes: forming an LED matrix conducting circuit on the surface of the transparent film substrate; the LED matrix conducting circuit comprises a plurality of groups of pad electrodes which are used for being matched with the LED chips to realize electric connection; mounting an LED chip at each group of pad electrodes of the LED matrix conducting circuit, and realizing the infiltration connection between pins of the LED chip and the pad electrodes by using liquid metal; the liquid metal is in a molten state at room temperature, and the wettability of the liquid metal on the metal provides binding force and electric conduction between the pins of the LED chip and the pad electrodes.
In some optional embodiments, mounting an LED chip at each group of pad electrodes of the LED matrix conductive circuit, and implementing the wetting connection between the pins of the LED chip and the pad electrodes by using a liquid metal specifically includes: and attaching the liquid metal to the pins of the LED chip, and then attaching the LED chip to the pad electrode to enable the pins of the LED chip to be in contact with the pad electrode, so that the pad electrode in contact with the pins of the LED chip is automatically infiltrated by the liquid metal, and the infiltration connection between the pins of the LED chip and the pad electrode is realized.
In some optional embodiments, before mounting the LED chip, the method further includes: and soaking the pins and/or the pad electrodes of the LED chip in soldering flux to remove the metal oxide on the surface.
In some optional embodiments, the liquid metal contains a metal component in the lead of the LED chip and/or the pad electrode.
In some optional embodiments, the liquid metal generates an alloying reaction with a metal component in the lead of the LED chip and/or the pad electrode.
In some optional embodiments, the LED matrix conductive traces are formed by one or more of sputtering, chemical etching, mechanical engraving, laser engraving, evaporation, chemical vapor deposition, physical vapor deposition, direct writing, printing, coating.
In some optional embodiments, before mounting an LED chip at each set of pad electrodes of the LED matrix conductive lines, further comprising: and forming an adhesive layer on the transparent film substrate at the position of the non-pad electrode in the pad area of the LED matrix conducting circuit so as to adhere the bottom surface of the LED chip.
In some optional embodiments, after mounting an LED chip at each group of pad electrodes of the LED matrix conductive circuit and implementing the wetting connection between the pins of the LED chip and the pad electrodes by using a liquid metal, the method further includes: and packaging and reinforcing the pins of the LED chip and the pad electrodes.
Another object of the present invention is to provide an LED film screen to solve the problems of the prior art.
In some illustrative embodiments, the LED film screen includes: the LED array comprises a transparent film substrate and an LED matrix conducting circuit formed on the surface of the transparent film substrate; the LED matrix conducting circuit comprises a plurality of groups of pad electrodes which are used for being matched with the LED chips to realize electric connection; the LED chip is attached to the pad electrode of the LED matrix conducting circuit; the pins of the LED chip are connected with the pad electrodes in an infiltrating manner by liquid metal, and the infiltrating property of the liquid metal to the metal provides binding force and electric conduction between the pins of the LED chip and the pad electrodes.
In some optional embodiments, the LED film screen further comprises: and the packaging structure is used for packaging and reinforcing the space between the pins of the LED chip and the pad electrodes.
Compared with the prior art, the invention has the following advantages:
in the embodiment of the invention, the liquid metal is selected as the connecting material between the LED chip and the bonding pad, and the bonding force on the LED chip and the bonding pad is generated by utilizing the wettability of the liquid metal to the metal, so that the connection between the LED chip and the bonding pad is ensured to a certain extent; furthermore, the invention does not need to open a steel mesh, saves the cost and is beneficial to improving the efficiency.
Drawings
FIG. 1 is a flow chart of a method for manufacturing an LED film screen according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a method for manufacturing an LED film-attached screen according to an embodiment of the invention;
FIG. 3 is a first structural example of an LED film pasting screen in the embodiment of the invention;
FIG. 4 is a second structural example of an LED film screen in an embodiment of the present invention;
fig. 5 is a third structural example of an LED film screen in the embodiment of the present invention.
Detailed Description
The following description and the drawings sufficiently illustrate specific embodiments of the invention to enable those skilled in the art to practice them. Other embodiments may incorporate structural, logical, electrical, process, and other changes. The examples merely typify possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in or substituted for those of others. The scope of embodiments of the invention encompasses the full ambit of the claims, as well as all available equivalents of the claims. Embodiments of the invention may be referred to herein, individually or collectively, by the term "invention" merely for convenience and without intending to voluntarily limit the scope of this application to any single invention or inventive concept if more than one is in fact disclosed.
It should be noted that the technical features in the embodiments of the present invention may be combined with each other without conflict.
The embodiment of the invention discloses a manufacturing method of an LED film pasting screen, and particularly, as shown in fig. 1-2, fig. 1 is a flow chart of the manufacturing method of the LED film pasting screen in the embodiment of the invention; fig. 2 is a schematic diagram of a manufacturing method of an LED film screen in an embodiment of the present invention. The manufacturing method of the LED film screen comprises the following steps:
step S11, forming an LED matrix conducting circuit 2 on the surface of the transparent film substrate 1; the LED matrix conducting circuit 2 comprises a plurality of groups of pad electrodes 6 which are used for being matched with the LED chips 3 to realize electric connection;
step S12, mounting LED chips 3 at each group of pad electrodes 6 of the LED matrix conducting circuit 2, and realizing the infiltration connection between pins 4 of the LED chips 3 and the pad electrodes 6 by using liquid metal 5; the wettability of the liquid metal 5 to the metal provides a binding force and electrical conduction between the pins 4 of the LED chip 3 and the pad electrodes 6.
In the embodiment of the invention, the liquid metal is selected as the connecting material between the LED chip and the bonding pad, and the bonding force and the electrical conduction between the LED chip and the bonding pad are generated by utilizing the wettability of the liquid metal to the metal, so that the connection between the LED chip and the bonding pad is ensured to a certain extent; furthermore, the invention does not need to open a steel mesh, saves the cost and is beneficial to improving the efficiency.
The transparent film substrate in the embodiment of the invention can be made of a transparent material with good temperature resistance or poor temperature resistance, and is particularly suitable for a transparent substrate with poor temperature resistance; the transparent film substrate is not limited to a flexible or rigid film/sheet. Specifically, the transparent film substrate in the embodiment of the present invention is not limited to PET, PVC, PU, PC, PP, PA, CPI (transparent PI), PMMA (acrylic), and the like.
The LED matrix conducting circuit in the embodiment of the invention can be formed by one or more modes of sputtering, chemical etching, mechanical engraving, laser engraving, evaporation, chemical vapor deposition, physical vapor deposition, direct writing, printing and coating; the material of the LED matrix conductive circuit is not limited to simple substances or alloys of copper, silver, gold, nickel, tin, aluminum, etc., conductive metal oxides (such as ITO indium tin oxide), and conductive ink using metal nanowires and metal particles as conductive fillers. The LED matrix conductive circuit meets the requirement of transparency through hollow design, and the specific line width and the specific space can refer to conventional design in the prior art.
The LED chip can be mounted by using CCD (charge coupled device) alignment mounting equipment in the prior art, so that accurate alignment mounting between the LED chip and the pad electrode is realized.
The liquid metal in the embodiment of the present invention may be room temperature liquid metal, where the room temperature liquid metal refers to a low melting point metal simple substance or alloy that is in a molten state at room temperature, that is, the melting point of the low melting point metal simple substance or alloy is not higher than room temperature, and is not limited to gallium-based alloys such as gallium simple substance, gallium-indium alloy, gallium-tin alloy, gallium-indium-tin-zinc alloy, and the like. In addition, the liquid metal may further include a trace amount of other metal components, such as copper, silver, gold, nickel, copper, tin, etc., to further enhance the affinity of the liquid metal to the relevant metal surface. In some embodiments, the liquid metal may also be a metal paste in which micro-nano conductive particles can be doped, and the micro-nano conductive particles are not limited to gold, silver, copper, nickel, tin, graphene, carbon nanotubes, conductive carbon black, and the like.
In some embodiments, the mounting of the LED chip at each group of pad electrodes of the LED matrix conductive circuit in step S12, and the implementing of the wetting connection between the pins of the LED chip and the pad electrodes by using the liquid metal may specifically include: and attaching the liquid metal to the pins of the LED chip, and then attaching the LED chip to the pad electrode to enable the pins of the LED chip to be in contact with the pad electrode, so that the pad electrode in contact with the pins of the LED chip is automatically infiltrated by the liquid metal, and the infiltration connection between the pins of the LED chip and the pad electrode is realized.
In the embodiment, the pins of the LED chip can be immersed in the liquid metal, so that the liquid metal is attached to the pins of the LED chip, the process can be completed by the chip mounting equipment, the chip mounting equipment directly mounts the liquid metal on the pad electrodes of the LED matrix conducting circuit after the attachment of the liquid metal on the pins of the LED chip is completed, the process does not need the assistance of other equipment/tools, the process flow is simplified, the equipment requirement is reduced, and the manufacturing efficiency is improved.
In other embodiments, the step S12 of mounting an LED chip at each group of pad electrodes of the LED matrix conductive traces, and implementing the wetting connection between the pins of the LED chip and the pad electrodes by using a liquid metal may specifically include: and attaching liquid metal to the pad electrode, mounting an LED chip on the pad electrode, enabling the pins of the LED chip to be in contact with the pad electrode, and automatically infiltrating the pins of the LED chip in contact with the pad electrode by the liquid metal to realize infiltration connection between the pins of the LED chip and the pad electrode.
In the embodiment, the liquid metal can be printed on the pad electrode in a screen printing mode, in other embodiments, the cover film can be formed on the non-pad electrode of the LED matrix conducting circuit, then the liquid metal is attached to the pad electrode in a spraying or dipping mode, the liquid metal is attached to the pad electrode in a large range in one step, dipping operation of each LED chip is not needed, manufacturing efficiency is improved, and the method is particularly suitable for simultaneous mounting of multiple LED chips in a large range.
In some embodiments, before mounting the LED chip in step S12, the method may further include: and soaking the pins and/or the pad electrodes of the LED chip in soldering flux to remove the metal oxide on the surface. In the embodiment, the metal oxide on the surface of the pin and/or the pad electrode of the LED chip is removed by the soldering flux, so that the adhesion of the surface of the LED chip to the liquid metal is improved, and the wetting adhesion of the liquid metal is ensured; in addition, the method is also beneficial to removing impurities in the non-pin area of the LED chip, and the liquid metal is prevented from being adhered to the surface of the LED chip shell. After the pins of the LED chip and the pad electrodes are connected through the liquid metal, the connection strength is certain, so that residual soldering flux on the surface can be cleaned by water flow, and the product is prevented from being influenced in the subsequent processing process.
The soldering flux in the embodiment of the invention can adopt soldering flux liquid or soldering paste, and the main function of the soldering flux is to eliminate metal oxide films formed on pins and pad electrodes of the LED chip due to long-term exposure to air. Preferably, since the leads of the current LED chip are mainly tin-clad copper, the formed metal oxide film is mainly tin oxide, and copper oxide may exist in other cases, organic acid can be used as a flux or a flux containing organic acid, organic salt and water obtained by reaction can be easily removed, and residual organic acid can be eliminated by natural evaporation or baking.
In some embodiments, the liquid metal contains a metal component in the leads of the LED chip and/or the pad electrodes. In the embodiment, because the liquid metal contains the same metal components as those in the pins and/or the pad electrodes of the LED chip, the affinity of the liquid metal in the pins and/or the pad electrodes of the LED chip can be further enhanced, so that the liquid metal is more easily infiltrated, and the connection strength of the pins and the pad electrodes of the LED chip is improved.
In some embodiments, the liquid metal produces an alloying reaction with a metal component in the leads of the LED chip and/or the pad electrode. Based on the alloying reaction of the liquid metal and the pins of the LED chip and/or the metal components in the pad electrode, on one hand, compared with simple metal infiltration, the adhesive force is stronger, so that the connection strength between the pins of the LED chip and the pad electrode can be further improved, on the other hand, due to the intermetallic alloying reaction, the pins of the LED chip and the pad electrode can be converted into solid connection of an alloying product from the connection by utilizing the infiltration force of the liquid metal, and the stable structure between the pins of the LED chip and the pad electrode is greatly improved.
In some embodiments, the flux used in the present invention may further include tin ions; first, tin ions can undergo a displacement reaction with the elemental metal/metal alloy of the low melting point metal that is more reactive than the tin ions, such as gallium, indium, sodium, potassium, and the like. So that tin ions are attached to the pins and/or the pad electrodes of the LED chip, and tin simple substances (molten state/free state) melted in the low-melting-point metal are extracted from the soldering flux in the process of contacting with the liquid metal. Preferably, the liquid metal can be gallium-indium alloy, so that the simple tin substance can spontaneously react with the gallium-indium alloy to produce alloy reaction, such as gallium-tin alloy, gallium-indium-tin alloy, indium-tin alloy and the like. The tin ions can be obtained, among others, from any soluble tin salt, such as tin chloride.
In some embodiments, before mounting the LED chip in step S12, the method may further include: removing redundant soldering flux (namely, the soldering flux which is not covered by the liquid metal and is exposed outside) by using alcohol, and avoiding influencing subsequent processing; in addition, the alcohol is also beneficial to removing metal oxides on the surface of the liquid metal, so that the wetting effect of the liquid metal is improved. In the embodiment, the excessive soldering flux and the oxide on the surface of the liquid metal are removed by adopting alcohol, and the residual alcohol can be quickly volatilized, so that the subsequent processing cannot be influenced.
As shown in fig. 3, in some embodiments, before mounting the LED chip 3 in step S12, the method may further include: an adhesive layer 7 is formed on the transparent film substrate 1 (e.g., the center of the pad region) at the position of the non-pad electrode 6 in the pad region of the LED matrix conductive circuit 2 for adhering the bottom surface of the LED chip 3, so that the structural stability of the LED chip 3 on the transparent film substrate 1 can be further improved. The adhesive layer 7 can be formed by dispensing with an adhesive through a dispenser (not limited to single-point dispensing or multi-head dispensing while dispensing), and in other embodiments, can be formed by screen printing.
As shown in fig. 4, preferably, in the embodiment of the present invention, the LED matrix conductive traces 2 formed on the transparent film substrate 1 are in a regular arrangement structure, and some of the pad electrodes 6 thereon are in a straight line in rows/columns, so that during the dispensing process, the dispensing can be directly performed on the pad electrodes in a dot-dash manner to form a linear adhesive layer 7, so as to meet the requirement of the mounting of a plurality of LED chips 3, and avoid the problem of low efficiency caused by dispensing one by one.
As shown in fig. 5, in some embodiments, after mounting an LED chip at each group of pad electrodes of the LED matrix conductive circuit and implementing the wetting connection between the leads of the LED chip and the pad electrodes by using a liquid metal, the method may further include: and packaging and reinforcing the pins 4 of the LED chip 3 and the pad electrodes 6, so that a packaging structure 8 of the LED chip 3 and the pad electrodes 6 is formed, and the connection strength between the LED chip 3 and the pad electrodes 6 is ensured.
In this embodiment, the pins of the LED chips and the pad electrodes are packaged and reinforced, and the individual dispensing packaging of each LED chip and the corresponding pad electrode is not limited, and the packaging adhesive may cover only the connection positions of the pins of the LED chips and the pad electrodes, or may cover the LED chips and the pad electrodes as a whole; in other embodiments, all the LED chips and the pad electrodes may be integrally packaged by pouring a fluidized adhesive on the transparent film substrate. Furthermore, all the LED chips and the pad electrodes may be integrally encapsulated by means of a cover film, and the cover film may be closely attached to the exposed transparent film substrate, the LED chips, and the pad electrodes by means of vacuum pumping. Preferably, the cover film is made of flexible stretchable material, so that the LED chip can be attached to multiple faces.
In the embodiment, the LED chip and the pad electrode establish good structural strength through the liquid metal, so that the LED chip and the pad electrode are not easy to loosen in the processes of dispensing, glue pouring and film pressing, and the normal connection between the LED chip and the pad electrode is ensured.
Example 1
a. Forming an LED matrix conducting circuit on the surface of the transparent film substrate; the LED matrix conducting circuit comprises a plurality of groups of pad electrodes which are used for being matched with the LED chips to realize electric connection;
b. grabbing the LED chip by using a CCD (charge coupled device) chip mounter, and soaking a pin of the LED chip in a liquid metal pool, so that the pin of the LED chip is attached with the liquid metal;
c. the LED chip is attached to the pad electrode, so that the liquid metal infiltrates the pad electrode which is in contact with the pins of the LED chip, and the pins of the LED chip are infiltrated and connected with the pad electrode by the liquid metal;
d. and c, repeating the steps b and c until all the LED chips are mounted.
Example 2
a. Forming an LED matrix conducting circuit on the surface of the transparent film substrate; the LED matrix conducting circuit comprises a plurality of groups of pad electrodes which are used for being matched with the LED chips to realize electric connection;
b. grabbing the LED chip by using a CCD (charge coupled device) chip mounter, and soaking a pin of the LED chip in the soldering flux;
c. dipping the pins of the LED chip in a liquid metal pool so as to attach the liquid metal to the pins of the LED chip;
d. the LED chip is attached to the pad electrode, so that the liquid metal infiltrates the pad electrode which is in contact with the pins of the LED chip, and the pins of the LED chip are infiltrated and connected with the pad electrode by the liquid metal;
d. and repeating the steps b, c and d until the LED chips are completely mounted.
Example 3
a. Forming an LED matrix conducting circuit on the surface of the transparent film substrate; the LED matrix conducting circuit comprises a plurality of groups of pad electrodes which are used for being matched with the LED chips to realize electric connection;
b. grabbing the LED chip by using a CCD (charge coupled device) chip mounter, and soaking a pin of the LED chip in the soldering flux;
c. dipping the pins of the LED chip in a liquid metal pool so as to attach the liquid metal to the pins of the LED chip;
d. dipping pins of the LED chip in alcohol;
e. the LED chip is attached to the pad electrode, so that the liquid metal infiltrates the pad electrode which is in contact with the pins of the LED chip, and the pins of the LED chip are infiltrated and connected with the pad electrode by the liquid metal;
f. and repeating the steps b, c, d and e until all the LED chips are mounted.
The embodiment of the invention also discloses an LED film pasting screen, and particularly, as shown in FIGS. 3-5, FIG. 3 is a first structural example of the LED film pasting screen in the embodiment of the invention; FIG. 4 is a second structural example of an LED film screen in an embodiment of the present invention; fig. 5 is a third structural example of an LED film screen in the embodiment of the present invention. The LED film pasting screen can be obtained by the manufacturing method of the LED film pasting screen. Specifically, this LED pad pasting screen includes: a transparent film substrate 1; an LED matrix conductive circuit 2 formed on the surface of the transparent film substrate 1; the LED matrix conductive circuit 2 comprises a plurality of groups of pad electrodes 6 which are used for being matched with the LED chips 3 to realize electric connection; an LED chip 3 attached to a pad electrode 6 of the LED matrix conductive circuit 2; liquid metal 5 is wrapped between the pins 4 of the LED chip 3 and the pad electrodes 6; the pins 4 of the LED chip 3 are in infiltration connection with the pad electrodes 6 by using the liquid metal 5, and the infiltration of the liquid metal 5 to the metal provides the binding force and the electric conduction between the pins 4 of the LED chip 3 and the pad electrodes 6.
In some embodiments, the liquid metal and the pin and/or pad electrodes of the LED chip have the same metal composition therebetween, thereby improving wettability of the liquid metal thereon;
in some embodiments, an alloying reaction may be performed between the liquid metal and the pin and/or pad electrodes of the LED chip, thereby improving wettability and structural strength of the liquid metal thereon;
in some embodiments, the LED film screen further comprises: the adhesive layer 7 formed on the transparent film substrate 1 (e.g., the center of the pad region) at the position of the non-pad electrode 6 in the pad region of the LED matrix conductive line 2 is used to provide adhesion between the LED chip 3 and the transparent film substrate 1, thereby ensuring a stable structure between the LED chip 3 and the pad electrode 6. Preferably, the adhesive layer 7 may have a linear structure, thereby satisfying the mounting of the plurality of LED chips 3.
In some embodiments, the LED film screen further comprises: and a package structure 8 formed between the LED chip 3 and the pad electrode 6, thereby achieving reinforcement of the connection between the LED chip 3 and the pad electrode 6. The packaging structure is not limited to a single-point type packaging structure and a full-coverage type packaging structure; the encapsulating material is not limited to a curing glue or a cover film.
Those of skill would further appreciate that the various illustrative logical blocks, modules, circuits, and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and steps have been described above generally in terms of their functionality. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the overall system. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present disclosure.
Claims (10)
1. A manufacturing method of an LED film screen is characterized by comprising the following steps:
forming an LED matrix conducting circuit on the surface of the transparent film substrate; the LED matrix conducting circuit comprises a plurality of groups of pad electrodes which are used for being matched with the LED chips to realize electric connection;
mounting an LED chip at each group of pad electrodes of the LED matrix conducting circuit, and realizing the infiltration connection between pins of the LED chip and the pad electrodes by using liquid metal;
the liquid metal is in a molten state at room temperature, and the wettability of the liquid metal on the metal provides binding force and electric conduction between the pins of the LED chip and the pad electrodes.
2. The method for manufacturing the LED film-pasting screen according to claim 1, wherein an LED chip is pasted at each group of pad electrodes of the LED matrix conductive circuit, and the pins of the LED chip and the pad electrodes are connected in a wetting manner by using liquid metal, and the method specifically comprises the following steps:
and attaching the liquid metal to the pins of the LED chip, and then attaching the LED chip to the pad electrode to enable the pins of the LED chip to be in contact with the pad electrode, so that the pad electrode in contact with the pins of the LED chip is automatically infiltrated by the liquid metal, and the infiltration connection between the pins of the LED chip and the pad electrode is realized.
3. The method for manufacturing an LED film screen according to claim 1, further comprising, before mounting the LED chip:
and soaking the pins and/or the pad electrodes of the LED chip in soldering flux to remove the metal oxide on the surface.
4. The method for manufacturing an LED film screen according to claim 1, wherein the liquid metal contains a metal component in a pin of the LED chip and/or the pad electrode.
5. The method for manufacturing an LED film screen according to claim 1, wherein the liquid metal is alloyed with a metal component in a lead of the LED chip and/or the pad electrode.
6. The method for manufacturing the LED film screen according to claim 1, wherein the LED matrix conductive circuit is formed by one or more of sputtering, chemical etching, mechanical engraving, laser engraving, evaporation, chemical vapor deposition, physical vapor deposition, direct writing, printing and coating.
7. The method for manufacturing an LED film screen according to claim 1, wherein before mounting an LED chip at each group of pad electrodes of the LED matrix conductive circuit, the method further comprises: and forming an adhesive layer on the transparent film substrate at the position of the non-pad electrode in the pad area of the LED matrix conducting circuit so as to adhere the bottom surface of the LED chip.
8. The method for manufacturing the LED film-pasting screen according to claim 1, wherein an LED chip is pasted at each group of pad electrodes of the LED matrix conductive circuit, and after the pins of the LED chip and the pad electrodes are connected in a wetting manner by using liquid metal, the method further comprises the following steps:
and packaging and reinforcing the pins of the LED chip and the pad electrodes.
9. An LED film screen, comprising:
the LED array comprises a transparent film substrate and an LED matrix conducting circuit formed on the surface of the transparent film substrate; the LED matrix conducting circuit comprises a plurality of groups of pad electrodes which are used for being matched with the LED chips to realize electric connection;
the LED chip is attached to the pad electrode of the LED matrix conducting circuit; the pins of the LED chip are connected with the pad electrodes in an infiltrating manner by liquid metal, and the infiltrating property of the liquid metal to the metal provides binding force and electric conduction between the pins of the LED chip and the pad electrodes.
10. The LED film screen of claim 9, further comprising: and the packaging structure is used for packaging and reinforcing the space between the pins of the LED chip and the pad electrodes.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110809395.XA CN113410219A (en) | 2021-07-17 | 2021-07-17 | LED film pasting screen and manufacturing method thereof |
| PCT/CN2021/131605 WO2023000562A1 (en) | 2021-07-17 | 2021-11-19 | Led film screen and manufacturing method therefor |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110809395.XA CN113410219A (en) | 2021-07-17 | 2021-07-17 | LED film pasting screen and manufacturing method thereof |
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| CN113410219A true CN113410219A (en) | 2021-09-17 |
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| CN202110809395.XA Pending CN113410219A (en) | 2021-07-17 | 2021-07-17 | LED film pasting screen and manufacturing method thereof |
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| CN (1) | CN113410219A (en) |
| WO (1) | WO2023000562A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023000562A1 (en) * | 2021-07-17 | 2023-01-26 | 北京梦之墨科技有限公司 | Led film screen and manufacturing method therefor |
| CN118156398A (en) * | 2024-05-10 | 2024-06-07 | 汕头超声显示器技术有限公司 | Manufacturing method of LED array device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN118377389A (en) * | 2023-03-10 | 2024-07-23 | 深圳市中佑光学科技有限公司 | LED screen laminating film and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP4803478B2 (en) * | 2004-10-20 | 2011-10-26 | 大日本印刷株式会社 | Ga-based alloy and organic functional element using the same |
| CN102779923B (en) * | 2012-07-09 | 2015-02-04 | 厦门吉瓦特照明科技有限公司 | Manufacturing method of patch type LED (Light-Emitting Diode) module |
| CN108112188A (en) * | 2017-12-20 | 2018-06-01 | 深圳大学 | A kind of welding method based on liquid metal |
| CN110972409A (en) * | 2018-09-29 | 2020-04-07 | 北京梦之墨科技有限公司 | Component assembling method and device |
| CN113410219A (en) * | 2021-07-17 | 2021-09-17 | 北京梦之墨科技有限公司 | LED film pasting screen and manufacturing method thereof |
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2021
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023000562A1 (en) * | 2021-07-17 | 2023-01-26 | 北京梦之墨科技有限公司 | Led film screen and manufacturing method therefor |
| CN118156398A (en) * | 2024-05-10 | 2024-06-07 | 汕头超声显示器技术有限公司 | Manufacturing method of LED array device |
| CN118156398B (en) * | 2024-05-10 | 2024-07-12 | 汕头超声显示器技术有限公司 | Manufacturing method of LED array device |
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