CN115003151B - Paster device is used in computer motherboard production and processing - Google Patents
Paster device is used in computer motherboard production and processing Download PDFInfo
- Publication number
- CN115003151B CN115003151B CN202210811393.9A CN202210811393A CN115003151B CN 115003151 B CN115003151 B CN 115003151B CN 202210811393 A CN202210811393 A CN 202210811393A CN 115003151 B CN115003151 B CN 115003151B
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- patch
- fixed
- assembly
- positioning
- sliding
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0406—Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0411—Pick-and-place heads or apparatus, e.g. with jaws having multiple mounting heads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/082—Integration of non-optical monitoring devices, i.e. using non-optical inspection means, e.g. electrical means, mechanical means or X-rays
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a chip mounting device for producing and processing a computer main board, which relates to the technical field of main board chip mounting, and comprises a base, a plurality of chip mounting modules and a plurality of chip mounting modules, wherein the base is preset on the ground; the conveying belt is arranged on the upper end face of the base; the transfer device is erected above the conveyor belt; the visual detection head and the connecting piece are fixed at the output end of the transfer device side by side; the positioning assembly is arranged on the lower end face of the connecting piece; and the feeding device is fixed on the upper end face of the base and is used for providing a patch original. According to the invention, a plurality of patch originals can be synchronously patched through the positioning assembly, so that the patch efficiency is improved, the firmness of the patches can be detected after the patches are finished, and the yield of the mainboard patches is improved.
Description
Technical Field
The invention relates to the technical field of mainboard surface mounting, in particular to a surface mounting device for producing and processing a computer mainboard.
Background
The computer main board patch is a circuit mounting technology for mounting a leadless or short-lead patch original on the surface of a printed circuit board or the surface of other substrates, and welding and assembling the printed circuit board or the surface of other substrates by reflow soldering or dip soldering and other methods.
At present, the patch to the computer motherboard is to carry out a plurality of times of location to the patch position to make and move the device and drive the paster suction head and carry out a plurality of times of individual paster, the paster efficiency is lower, and make the soldering tin of printing cool off through natural cooling's mode after the paster, lead to the paster to first position because of the shake that produces when carrying out the paster to the second position leads to the fact the influence, thereby make the paster take place the skew by a small margin, and can not carry out firm performance's detection to whole after whole paster is accomplished.
In view of the above, the present invention provides a chip mounting device for producing and processing a computer motherboard to solve the above problems.
Disclosure of Invention
In order to achieve the above purpose, the present invention provides the following technical solutions: a chip device for producing and processing a computer motherboard comprises:
the base is preset on the ground;
the conveying belt is arranged on the upper end face of the base;
the transfer device is erected above the conveyor belt;
the visual detection head and the connecting piece are fixed at the output end of the transfer device side by side;
the positioning assembly is arranged on the lower end face of the connecting piece; and
and the feeding device is fixed on the upper end surface of the base and is used for providing a patch original.
Further, preferably, the positioning assembly includes:
the fixed disc is fixed on the lower end face of the connecting piece;
the top plate is fixed on the lower end face of the fixed disc, and the lower end face of the top plate is fixed with two side plates;
the driving shell is fixed on one side of one side plate far away from the other side plate, and at least four positioning motors are distributed in the driving shell at equal intervals;
the threaded rod is rotatably arranged between the two side plates, and one end of the threaded rod is connected with the output end of the positioning motor;
the sliding block is in threaded connection with the threaded rod;
the bottom plate is fixed on the lower end face of the side plate; and
and the patch assembly is fixed on the lower end surface of the sliding block.
Further, preferably, a rectangular chute is formed at a position of the bottom plate corresponding to the sliding block, and the patch assembly can slide along the length direction of the rectangular chute.
Further, preferably, the patch assembly includes:
the auxiliary positioning assembly is arranged in the rectangular chute in a sliding manner and moves synchronously with the sliding block;
the cooling assembly is fixed on the lower end face of the auxiliary positioning assembly, and an adjusting motor is fixed at the center position inside the cooling assembly; and
the paster suction head is arranged at the bottom of the cooling assembly in a sliding manner, one end of the paster suction head is sleeved at the output end of the adjusting motor in a sliding manner, and a pressing spring is arranged between the paster suction head and the cooling assembly and used for enabling the paster suction head to be in elastic contact with a paster original.
Further, preferably, the auxiliary positioning assembly includes:
the positioning shell is arranged in the rectangular chute in a sliding manner;
the piston is arranged in the positioning shell in a sliding way, and both ends of the piston extend out of the positioning shell and are fixedly provided with connecting lugs; and
the two hydraulic ports are arranged on one side of the positioning shell and are used for conveying liquid into the positioning shell and controlling the movement of the piston.
Further, preferably, the cooling assembly includes:
the sliding disc is arranged on the lower end face of the positioning shell in a sliding manner, and two sides of the sliding disc are fixedly connected with the connecting lugs;
the conical table is fixed on the lower end face of the sliding disc, two air inlets are formed in the outer wall of the conical table, and the patch suction head can slide in the conical table; and
the cooling ports are circumferentially arranged on the conical table, one end of the conical table located at the prime number is communicated with the cooling ports through an annular pipeline, and the annular pipeline is connected with one of the air inlets.
Further, preferably, an adsorption port is formed in a side wall of one end of the patch suction head, which is located in the conical table, and the adsorption port is communicated with the other air inlet, and the other air inlet is in an air suction state.
Further, preferably, the cooling ports are each inclined toward the patch suction head.
Compared with the prior art, the invention provides a patch device for producing and processing a computer main board, which has the following beneficial effects:
in the invention, the position of the patch to be detected can be detected by the vision probe before the patch, so that the patch sequence is planned, a plurality of patch original pieces are adsorbed by a plurality of patch suction heads when the patch is carried out each time, the patch suction heads are moved to the position to be patched by the positioning motor and the auxiliary positioning assembly in the process of moving the transfer device to the upper part of the main board, so that the patch is carried out on the plurality of positions simultaneously, the moving times of the transfer device are reduced, the patch positions can be cooled by the cooling ports during the patch, the next group of patches can be conveniently carried out, and after all patches are carried out, the outflow amount of gas can be increased by the cooling ports, so that the stability of the patch original pieces is detected.
Drawings
Fig. 1 is an overall schematic diagram of a chip mounter for producing and processing a computer motherboard;
FIG. 2 is a schematic diagram of a positioning assembly of a chip mounter for producing and processing a motherboard of a computer;
fig. 3 is a schematic diagram of a chip assembly of a chip device for producing and processing a computer motherboard;
in the figure: 1. a base; 2. a conveyor belt; 3. a transfer device; 4. a vision probe; 5. a connecting piece; 6. a positioning assembly; 7. a feeding device; 61. a fixed plate; 62. a top plate; 63. a side plate; 64. a drive housing; 65. positioning a motor; 66. a bottom plate; 67. a threaded rod; 68. a sliding block; 69. a patch assembly; 691. positioning a shell; 692. a piston; 693. a hydraulic port; 694. a sliding plate; 695. a conical table; 696. a cooling port; 697. an air inlet; 698. a patch suction head.
Detailed Description
Referring to fig. 1 to 3, the present invention provides a technical solution: a chip device for producing and processing a computer motherboard comprises:
the base 1 is preset on the ground;
the conveying belt 2 is arranged on the upper end face of the base 1;
a transfer device 3 installed above the conveyor belt 2;
the visual detection head 4 and the connecting piece 5 are fixed at the output end of the transfer device 3 side by side;
the positioning assembly 6 is arranged on the lower end face of the connecting piece 5; and
and the feeding device 7 is fixed on the upper end surface of the base 1 and is used for providing a patch original.
It should be noted that, a receiving box is installed at a position of the feeding device 7 near the outlet, and is used for recovering the patch original falling from the main board.
In this embodiment, the positioning assembly 6 comprises:
a fixing plate 61 fixed to the lower end surface of the connector 5;
a top plate 62 fixed to a lower end surface of the fixed plate 61, and having two side plates 63 fixed to the lower end surface thereof;
a driving housing 64 fixed on one side of one side plate 63 far away from the other side plate 63, and having at least four positioning motors 65 arranged therein at equal intervals;
a threaded rod 67 rotatably disposed between the two side plates 63 and having one end connected to an output end of the positioning motor 65;
a sliding block 68 screwed on the threaded rod 67;
a bottom plate 66 fixed to a lower end surface of the side plate 63; and
and a patch assembly 69 fixed to a lower end surface of the slider 68.
In a preferred embodiment, a rectangular sliding groove is formed at a position of the bottom plate 66 corresponding to the sliding block 68, and the patch assembly 69 can slide along the length direction of the rectangular sliding groove.
Wherein, the sliding block 68 returns to the side far away from the positioning motor 65 after each patch is completed, thereby shortening the distance between the patch assembly 69 and the feeding device 7 by a small margin, reducing the moving distance of the transferring device 3 and prolonging the service life thereof.
As a preferred embodiment, the patch assembly 69 includes:
the auxiliary positioning assembly is arranged in the rectangular chute in a sliding manner and moves synchronously with the sliding block 68;
the cooling assembly is fixed on the lower end face of the auxiliary positioning assembly, and an adjusting motor is fixed at the center position inside the cooling assembly; and
the paster suction head 698 is arranged at the bottom of the cooling component in a sliding way, one end of the paster suction head 698 is sheathed at the output end of the adjusting motor in a sliding way, and a pressing spring is arranged between the paster suction head 698 and the cooling component and used for enabling the paster suction head 698 to be in elastic contact with a paster original.
It should be noted that the existing patch device is configured to be individually telescopic for the plurality of patch suction heads 698 during the patch, so as to perform the individual patch, and the device is configured to divide the position to be patched into a plurality of groups by the vision probe during the patch, and then to perform simultaneous patch for each group of patch positions by the plurality of patch suction heads 698, so as to improve the patch efficiency, that is, for example, when the number of the patch positions to be patched is twenty, the patch device can be divided into five groups, each group is four patch positions (note that the four patch positions in each group need to ensure that the plurality of patch suction heads 698 do not interfere with each other), and then five groups of different patch positions are input to the positioning motor and the auxiliary positioning assembly, so that the patch suction heads 698 perform the patch for five groups of different positions, thereby greatly improving the patch efficiency.
As a preferred embodiment, the auxiliary positioning assembly includes:
the positioning shell 691 is arranged in the rectangular chute in a sliding way;
the piston 692 is arranged inside the positioning shell 691 in a sliding way, and both ends of the piston extend out of the positioning shell 691 and are fixedly provided with connecting lugs; and
two hydraulic ports 693 are provided on one side of the positioning housing 691, and are used for delivering liquid into the positioning housing 691 to control the movement of the piston 692.
As a preferred embodiment, the cooling assembly includes:
the sliding disc 694 is arranged on the lower end surface of the positioning shell 691 in a sliding manner, and two sides of the sliding disc are fixedly connected with the connecting lugs;
a conical table 695 fixed on the lower end surface of the sliding tray 694, and having two air inlets 697 formed on the outer wall thereof, wherein the patch suction head 698 can slide inside; and
the cooling ports 696 are circumferentially arranged on the conical table 695, and one end of the conical table 695 is communicated with one of the air inlets 697 through an annular pipeline.
In a preferred embodiment, the side wall of the end of the patch suction head 698 located in the conical table 695 is provided with an adsorption port, the adsorption port is communicated with another air inlet 697, and the other air inlet 697 is in an air suction state.
That is, when the mounting is performed, the cooling gas can be discharged through the cooling port 696, and the discharge amount is small, and only the cooling gas is required to be ensured to be spread to a small extent around the center of the original mounting after being discharged, thereby performing the cooling process.
In a preferred embodiment, the cooling ports 696 are each inclined toward the patch head 698.
It should be noted that, when the last patch operation is completed, the plurality of patch suction heads 698 return to the initial position, and the ejection amount and the ejection force of the cooling port 696 are increased at this time, so that the transfer device 3 is controlled to further cool the whole main board, and meanwhile, the patch original can be detected through the increased ejection force, so as to determine whether the patch original is firmly attached, and the unqualified patch original is recovered by blowing the cooling gas into the receiving box.
Specifically, accessible visual probe 4 detects and needs the paster position before the paster to plan the paster order, adsorb a plurality of paster original paper through a plurality of paster suction heads 698 when the paster at every turn, move to the in-process of mainboard top at transfer device 3, paster suction head 698 is through locating motor 65 and auxiliary positioning subassembly removal to treating the paster position, thereby carry out the paster to a plurality of positions simultaneously, reduce the removal number of times that moves transfer device 3, and can also cool off the paster position through cooling port 696 during the paster, be convenient for go on by next group's paster, and after whole paster is accomplished, can also increase gaseous outflow through cooling port 696, thereby detect the steadiness of original paper.
The foregoing description is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical solution of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (4)
1. The utility model provides a paster device is used in computer motherboard production and processing which characterized in that: comprising the following steps:
a base (1) which is preset on the ground;
the conveying belt (2) is arranged on the upper end face of the base (1);
a transfer device (3) arranged above the conveyor belt (2);
the visual detection head (4) and the connecting piece (5) are fixed at the output end of the transfer device (3) side by side;
the positioning assembly (6) is arranged on the lower end face of the connecting piece (5); and
the feeding device (7) is fixed on the upper end face of the base (1) and is used for providing patch originals;
the positioning assembly (6) comprises:
a fixed disk (61) fixed on the lower end surface of the connecting piece (5);
a top plate (62) fixed to the lower end surface of the fixed plate (61), and having two side plates (63) fixed to the lower end surface thereof;
the driving shell (64) is fixed on one side, far away from the other side plate (63), of one side plate (63), and at least four positioning motors (65) are equidistantly arranged in the driving shell;
the threaded rod (67) is rotatably arranged between the two side plates (63), and one end of the threaded rod is connected with the output end of the positioning motor (65);
a sliding block (68) which is screwed on the threaded rod (67);
a bottom plate (66) fixed to the lower end surface of the side plate (63); and
the patch assembly (69) is fixed on the lower end face of the sliding block (68);
a rectangular sliding groove is formed in a position, corresponding to the sliding block (68), of the bottom plate (66), and the patch assembly (69) can slide along the length direction of the rectangular sliding groove;
the patch assembly (69) includes:
the auxiliary positioning assembly is arranged in the rectangular chute in a sliding manner and moves synchronously with the sliding block (68);
the cooling assembly is fixed on the lower end face of the auxiliary positioning assembly, and an adjusting motor is fixed at the center position inside the cooling assembly; and
the patch suction head (698) is arranged at the bottom of the cooling component in a sliding way, one end of the patch suction head is sleeved at the output end of the adjusting motor in a sliding way, and a pressing spring is arranged between the patch suction head (698) and the cooling component and used for enabling the patch suction head (698) to be in elastic contact with a patch original piece;
the auxiliary positioning assembly comprises:
the positioning shell (691) is arranged in the rectangular chute in a sliding manner;
the piston (692) is arranged inside the positioning shell (691) in a sliding manner, and both ends of the piston extend out of the positioning shell (691) and are fixedly provided with connecting lugs; and
and two hydraulic ports (693) are respectively arranged on one side of the positioning shell (691) and are used for conveying liquid into the positioning shell (691) to control the movement of the piston (692).
2. The chip mounter for computer motherboard production and processing according to claim 1, wherein: the cooling assembly includes:
the sliding disc (694) is arranged on the lower end face of the positioning shell (691) in a sliding manner, and two sides of the sliding disc are fixedly connected with the connecting lugs;
the conical table (695) is fixed on the lower end surface of the sliding disc (694), the outer wall of the conical table is provided with two air inlets (697), and the patch suction head (698) can slide in the conical table; and
the cooling ports (696) are circumferentially arranged on the conical table (695), one end of the conical table (695) is communicated with one of the cooling ports through an annular pipeline, and the annular pipeline is connected with one of the air inlets (697).
3. The chip mounter for computer motherboard production and processing according to claim 2, wherein: the patch suction head (698) is positioned on one end side wall in the conical table (695) and is provided with an adsorption port, the adsorption port is communicated with the other air inlet (697), and the other air inlet (697) is in an air suction state.
4. The chip mounter for computer motherboard production and processing according to claim 2, wherein: the cooling ports (696) are all inclined towards the patch suction head (698).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210811393.9A CN115003151B (en) | 2022-07-11 | 2022-07-11 | Paster device is used in computer motherboard production and processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210811393.9A CN115003151B (en) | 2022-07-11 | 2022-07-11 | Paster device is used in computer motherboard production and processing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115003151A CN115003151A (en) | 2022-09-02 |
| CN115003151B true CN115003151B (en) | 2023-07-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210811393.9A Active CN115003151B (en) | 2022-07-11 | 2022-07-11 | Paster device is used in computer motherboard production and processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115003151B (en) |
Citations (2)
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| WO2014008773A1 (en) * | 2012-07-09 | 2014-01-16 | 厦门吉瓦特照明科技有限公司 | Method of fabricating surface-mounted led module |
| CN211580338U (en) * | 2020-01-15 | 2020-09-25 | 宿州市鑫达润电子科技有限公司 | High-speed paster device for mainboard of accurate location |
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| US5862588A (en) * | 1995-08-14 | 1999-01-26 | International Business Machines Corporation | Method for restraining circuit board warp during area array rework |
| JP4445163B2 (en) * | 2001-07-13 | 2010-04-07 | パナソニック株式会社 | Electronic component mounting equipment |
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| CN204362427U (en) * | 2014-12-25 | 2015-05-27 | 深圳市艾迪特智能装备有限公司 | A kind of LED chip mounter placement head structure |
| DE112015006997B4 (en) * | 2015-10-01 | 2024-06-13 | Yamaha Hatsudoki Kabushiki Kaisha | Mounting head and surface mount fixture |
| US10757851B2 (en) * | 2016-06-14 | 2020-08-25 | Fuji Corporation | Electronic component mounter and electronic component release method |
| CN105960158A (en) * | 2016-06-17 | 2016-09-21 | 东莞市百事通电子设备有限公司 | Bilateral feeding LED placement machine |
| CN209435752U (en) * | 2018-12-04 | 2019-09-24 | 深圳市炫硕智造技术有限公司 | A kind of suction nozzle adsorption mechanism adjustable in pitch |
| CN211406750U (en) * | 2019-11-29 | 2020-09-01 | 深圳市普能达电子有限公司 | Paster device is used in production of mobile terminal product |
| CN112509771A (en) * | 2020-11-30 | 2021-03-16 | 江西昶龙科技有限公司 | Full-automatic chip mounter for producing thick film chip resistor |
| CN113163703B (en) * | 2021-04-23 | 2021-11-30 | 深圳市健仕达电子有限公司 | LED chip mounter |
| CN216873738U (en) * | 2021-12-09 | 2022-07-01 | 深圳市晟典电子设备有限公司 | SMT chip mounter with stable mounting |
| CN216752651U (en) * | 2021-12-14 | 2022-06-14 | 东莞市一实机械设备有限公司 | Full-automatic visual positioning chip mounter |
| CN216727979U (en) * | 2022-01-06 | 2022-06-14 | 佛山市顺森洋科技有限公司 | Electronic accessory assembling device |
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2022
- 2022-07-11 CN CN202210811393.9A patent/CN115003151B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014008773A1 (en) * | 2012-07-09 | 2014-01-16 | 厦门吉瓦特照明科技有限公司 | Method of fabricating surface-mounted led module |
| CN211580338U (en) * | 2020-01-15 | 2020-09-25 | 宿州市鑫达润电子科技有限公司 | High-speed paster device for mainboard of accurate location |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115003151A (en) | 2022-09-02 |
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