CN113782471A - LED screen packaging process based on LED flip chip packaging technology and LED screen - Google Patents
LED screen packaging process based on LED flip chip packaging technology and LED screen Download PDFInfo
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- CN113782471A CN113782471A CN202111074952.4A CN202111074952A CN113782471A CN 113782471 A CN113782471 A CN 113782471A CN 202111074952 A CN202111074952 A CN 202111074952A CN 113782471 A CN113782471 A CN 113782471A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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Abstract
The invention relates to an LED screen packaging process based on an LED flip chip packaging technology and an LED screen, wherein the packaging process comprises the steps of welding an IC, a resistor, a capacitor, a power supply seat and a connecting terminal on a PCB to obtain a first PCB; cleaning the first PCB, and uniformly expanding the LED flip chips by using a crystal expanding machine; printing solder paste on a first PCB, fixing an LED flip chip on the first PCB by using a die bonder, forming a pixel point by every 3 LED chips, detecting by using AOI detection equipment, and putting the qualified LED flip chip into a reflow furnace to be welded into a second PCB; the second PCB is detected by AOI detection equipment, the second PCB which is qualified in detection is subjected to vacuum mould pressing by a mould pressing machine to obtain a third PCB, after baking and forming, unnecessary technological edges are cut off according to the required specification and size, and the lamp surface of the module is coated or filmed, so that the surface is displayed to be black, the contrast of the product and the uniformity and consistency of the color are improved, and the display effect is better. Each pixel point only needs 6 metal bonding points, and a bonding wire link is omitted.
Description
Technical Field
The invention relates to the technical field of LED display screen packaging, in particular to an LED screen packaging process based on an LED flip chip packaging technology and an LED screen.
Background
With the gradual maturity of LED (Light-emitting Diode) display technology, people have higher and higher requirements for the definition of LED display screens, so that high-definition LED display screens are widely popularized on a large scale. At present, the distance between adjacent pixels on most LED display screens is 4mm, 3mm or 2.5mm, and mass production is started, but with the rapid development of LED display technology, people put forward higher requirements on the pixels of the LED display screens, and the LED display screens on the market cannot meet the requirements, but the conventional packaging method is difficult to produce the LED display screens with higher pixels. The existing LED packaging methods include the following: the first is a pin (Lamp) LED package; the LED chip is fixed on a lead frame, after electrode leads are welded, the LED chip is packaged into a certain transparent shape by epoxy resin to form a single LED device, the pins or the package can be divided into packages with the diameters of phi 3 and phi 5 according to different external dimensions, and the package is characterized in that the distance from the chip to a light-emitting surface is controlled. The advantage lies in that various different light-emitting angles can be obtained: the requirements of side luminescence can be obtained at 15 degrees, 30 degrees, 45 degrees, 60 degrees, 90 degrees, 120 degrees and the like, and the automatic production is relatively easy. The defect is that the device can only be suitable for large-space and outdoor products with low requirements on angles. The second is Surface Mount Technology (SMT) packaging; the LED chip is adhered on a microminiature lead frame, after electrode leads are welded, injection molding is carried out, and the light emitting surface is generally encapsulated by epoxy resin. The light mixing device has the advantages of convenient light mixing effect, better consistency on a display screen, complex and complicated process, more and scattered finished products, low delivery rate and incapability of making small intervals for the products. The third type is Chip On Board (COB) LED package; directly transferring and fixing the LED chip on a PCB (Printed Circuit Board) lamp position bonding pad, then conducting conductivity treatment on the LED chip, after performance test, carrying out mould pressing by using epoxy resin, then cutting edges, carrying out surface treatment, and assembling into a screen. The defects are that the straight through rate is not high, the problem of screen uniformity needs to be solved by point-by-point correction, and the maintenance is inconvenient.
Disclosure of Invention
Technical problem to be solved
In view of the above disadvantages and shortcomings of the prior art, the present invention provides an LED panel packaging process based on an LED flip chip packaging technology and an LED panel, which solves the technical problems of complicated packaging process, incapability of making a fine pitch, and poor heat dissipation of an LED display panel.
(II) technical scheme
In order to achieve the above object, the LED screen packaging process based on the LED flip chip packaging technology of the present invention comprises:
s1, welding an IC, a resistor, a capacitor, a power supply seat and a connecting terminal on the driving surface of the PCB to obtain a first PCB;
s2, cleaning the first PCB by using a plasma machine, wherein the cleaning conditions for cleaning the first PCB are that the radio frequency time is 8-12S, the base pressure is 40-60N, and the radio frequency pressure is 20-30N;
s3, uniformly expanding the film carrying the LED flip chips by using a crystal expander;
s4, printing solder paste on the first PCB by using a printing machine, fixing the LED flip chips on the first PCB by using a die bonder, forming a pixel point by every 3 LED flip chips, detecting the first PCB fixed with the LED flip chips by using AOI (automatic optical inspection) detection equipment, and welding the qualified first PCB in a reflow furnace to obtain a second PCB;
s5, detecting the second PCB by using AOI detection equipment, and repairing the second PCB with welding defects;
s6, carrying out vacuum mould pressing on the qualified second PCB by using a mould pressing machine to obtain a third PCB;
and S7, baking the third PCB by using a thermal cycle oven or a vertical oven.
Optionally, the capacitor comprises a first capacitor and a second capacitor, and the second capacitor is an electrolytic capacitor.
Optionally, one of the pixel points includes a first LED flip chip, a second LED flip chip, and a third LED flip chip, the first LED flip chip is configured to emit red light, the second LED flip chip is configured to emit green light, and the third LED flip chip is configured to emit blue light.
Optionally, before step S1, the method further includes: and printing solder paste on the driving surface of the PCB.
Optionally, the LED screen packaging process based on the LED flip chip packaging technology further includes: and S8, cutting off the process edge of the baked third PCB by using a cutter.
Optionally, the LED screen packaging process based on the LED flip chip packaging technology further includes: and S9, spraying or pasting a film on the surface of the third PCB after the process edge is cut.
Optionally, the LED screen packaging process based on the LED flip chip packaging technology further includes: and cutting the bonding pad of the third PCB by adopting a laser cutting process.
Further, the present invention also provides an LED screen, which includes:
the pixel point arrays are arranged on the first surface of the PCB, and each pixel point is provided with 6 bonding pads; the pixel point comprises a first LED flip chip, a second LED flip chip and a third LED flip chip, wherein the first LED flip chip is used for emitting red light, the second LED flip chip is used for emitting green light, and the third LED flip chip is used for emitting blue light; the anode and the cathode of the first LED flip chip, the anode and the cathode of the second LED flip chip and the anode and the cathode of the third LED flip chip are respectively connected with the 6 bonding pads in a one-to-one correspondence manner; and the second surface of the PCB is welded with an IC, a resistor and a capacitor correspondingly to the pixel points.
Optionally, the second surface of the PCB is further soldered with an electrolytic capacitor, a power socket, and a connection terminal.
Optionally, the first LED flip chip, the second LED flip chip, and the third LED flip chip each include a reflective layer and a light-emitting layer, and the reflective layer is located under the light-emitting layer.
(III) advantageous effects
The invention discloses that a COB packaging technology is adopted to directly package an LED flip chip on a PCB, so that the traditional steps of packaging the LED flip chip and then mounting the LED flip chip on the PCB are omitted, the distance between adjacent pixel points is further reduced, and the pixels of an LED display screen are improved;
the LED flip chip is well combined with the PCB, so that heat dissipation by means of the PCB is facilitated, heat dissipation of the LED display screen is effectively improved, and the overall performance and quality of the LED display screen are improved;
and each pixel point only needs 6 metal bonding points, so that a bonding wire link is omitted, the production flow is simplified, and the problems of insufficient bonding and wire breakage inside the LED chip are effectively solved.
Drawings
FIG. 1 is a method step diagram of an LED screen packaging process based on an LED flip chip packaging technology of the present invention;
FIG. 2 is a flow chart of the LED screen packaging process based on the LED flip chip packaging technology of the present invention;
FIG. 3 is a schematic structural diagram of an LED panel according to the present invention;
FIG. 4 is a schematic structural diagram of a pixel point of an LED panel according to the present invention;
FIG. 5 is a schematic view of a mounting structure of an LED flip chip of the LED panel of the present invention;
fig. 6 is a schematic view of a mounting structure of an LED front-mounted chip.
[ description of reference ]
1: an LED display screen;
2: pixel points; 21: a first LED flip chip; 22: a second LED flip chip; 23: a third LED flip chip;
3: a pad;
4: the LED is positively provided with a chip; 5: an LED flip chip;
6：IC；
7: and (4) welding a metal wire.
Detailed Description
For the purpose of better explaining the present invention and to facilitate understanding, the present invention will be described in detail by way of specific embodiments with reference to the accompanying drawings. In which the terms "upper", "lower", etc. are used herein with reference to the orientation of fig. 1.
For a better understanding of the above-described technical solutions, exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the invention are shown in the drawings, it should be understood that the invention can be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.
As shown in fig. 1 and fig. 2, the invention provides an LED screen packaging process based on an LED flip chip packaging technology, comprising the following steps:
welding an Integrated Circuit (IC), a resistor, a capacitor, a power supply seat and a connecting terminal on a driving surface of a Printed Circuit Board (PCB) to obtain a first PCB;
cleaning the first PCB by using a plasma machine, wherein the cleaning conditions for cleaning the first PCB are that the radio frequency time is 8-12s, the base pressure is 40-60N, and the radio frequency pressure is 20-30N;
uniformly expanding the plurality of LED flip chips by using a crystal expanding machine;
printing solder paste on the first PCB by using a printing machine, fixing LED flip chips on the first PCB by using a die bonder, wherein each 3 LED flip chips form a pixel point 2, detecting the first PCB fixed with the LED flip chips by using Automatic Optical Inspection (AOI) equipment, and welding the qualified first PCB in a reflow furnace to obtain a second PCB;
step five, detecting the welding condition of the second PCB by using AOI, determining whether the welding is normal, and carrying out AOI detection after the second PCB with welding defects is repaired until the second PCB is qualified;
step six, carrying out vacuum mould pressing on the qualified second PCB by using a mould pressing machine to obtain a third PCB;
and step seven, baking the third PCB by using a thermal cycle oven or a vertical furnace.
The COB packaging technology is adopted to directly package the LED flip chip on the PCB, the traditional step of packaging the LED flip chip and then mounting the LED flip chip on the PCB is omitted, the distance between adjacent pixel points 2 is further shortened, and pixels of the LED display screen 1 are effectively improved. The positive negative pole of LED flip chip is in the chip bottom surface, and positive negative pole lug weld is on PCB, and LED flip chip closely laminates with PCB, combines well, and LED flip chip dispels the heat with the help of PCB, improves LED display screen 1's heat effectively and gives off, has improved LED flip chip's durability, and then has made LED display screen 1's wholeness ability and quality all obtain the promotion. Compared with the traditional device packaging, the COB packaging eliminates the LED support, saves the link of reflow soldering of the lamp surface and improves the reliability and stability. COB lamp face mould pressing encapsulation, it is smooth level and smooth, prevent that external force collision ability is strong. COB packaging, wide visual angle, surface luminescence, no glare and higher contrast. LED flip chip encapsulation is for just installing the chip encapsulation, and every pixel 2 of just installing the chip needs 5 metal bonding wires altogether, 10 welding points, and every pixel 2 of LED flip chip only need 6 metal bonding points, need not the bonding wire welding, has simplified production flow effectively, has solved the inside rosin joint of LED chip and the bad problem of broken string. The LED flip chip packaging can avoid the problems of light absorption of a transparent conducting layer on a P-GaN of a normally mounted chip and light shading of the electrode bonding pad 3, the brightness of the chip is improved, and meanwhile the light emitting area and the light emitting efficiency of the LED display screen 1 are increased. The LED flip chip adopts COB encapsulation can further reduce product packaging thickness, has improved visual angle and has looked sideways at the homogeneity that shows.
In the first step, the capacitor welded on the driving surface of the PCB comprises a first capacitor and a second capacitor, wherein the second capacitor is preferably an electrolytic capacitor.
In step three, as shown in fig. 3 and 4, each pixel 2 includes a first LED flip chip 21, a second LED flip chip 22, and a third LED flip chip 23, which are uniformly arranged, where the first LED flip chip 21 is used for emitting red light, the second LED flip chip 22 is used for emitting green light, and the third LED flip chip 23 is used for emitting blue light. The color arrangement rules of the three LED flip chips in each pixel point 2 are the same, preferably red, green and blue, namely R/G/B arrangement.
And printing solder paste on the driving surface of the PCB before the step one, so that the IC, the resistor, the capacitor, the power supply seat and the connecting terminal can be quickly and stably welded conveniently, and the false soldering is avoided.
After the seventh step, the method further comprises the following steps: step eight, cutting off the unnecessary process edges of the baked third PCB by using a cutter; step nine, spraying or pasting a film on the surface of the third PCB after the process edge is cut; and step ten, assembling the LED screen and aging the LED screen. The implementation sequence of the step eight and the step nine can be changed, namely, the surface of the third PCB is sprayed or pasted with the film, and then the unnecessary process edge is cut.
The invention adopts the laser cutting process to cut the bonding pad 3 of the third PCB to replace the etching process, thereby solving the problem of irregularity of the bonding pad 3 caused by etching.
Further, as shown in fig. 3 and 4, the present invention also provides an LED screen, which includes a PCB and a plurality of pixel points 2. Wherein, a plurality of 2 arrays of pixel point set up in PCB's first face, all are provided with 6 pads 3 on every pixel point 2. As shown in fig. 4, the pixel 2 includes a first LED flip chip 21, a second LED flip chip 22 and a third LED flip chip 23, the first LED flip chip 21 is used for emitting red light, the second LED flip chip 22 is used for emitting green light, and the third LED flip chip 23 is used for emitting blue light. The first LED flip chip 21, the second LED flip chip 22 and the third LED flip chip 23 are respectively provided with a positive pole and a negative pole, and the positive poles and the negative poles of the first LED flip chip 21, the second LED flip chip 22 and the third LED flip chip 23 are respectively welded with the 6 bonding pads 3 in a one-to-one correspondence manner. The second surface of the PCB is a driving surface, an IC, a resistor and a capacitor are welded on the second surface of the PCB corresponding to each pixel point 2, and an electrolytic capacitor, a power supply seat and a connecting terminal are further welded on the second surface of the PCB. The first LED flip chip 21, the second LED flip chip 22 and the third LED flip chip 23 each include a reflective layer and a light-emitting layer, and the reflective layer is located directly below the light-emitting layer. As shown in fig. 5 and 6, fig. 5 is a schematic view of an installation structure of an LED flip chip of an LED screen of the present invention, and fig. 6 is a schematic view of an installation structure of an existing LED flip chip, where the package of the LED flip chip 5 is opposite to the package of the LED flip chip 4, and each pixel point 2 of the LED flip chip 4 needs 5 metal bonding wires 7 and 10 bonding points, and each pixel point 2 of the flip LED chip of the present invention only needs 6 metal bonding points, so that a bonding wire link is omitted, a production flow is simplified, and adverse problems such as insufficient bonding and wire breakage inside the chip are solved.
The invention discloses that a COB packaging technology is adopted to directly package an LED flip chip on a PCB, so that the traditional steps of packaging the LED flip chip and then mounting the LED flip chip on the PCB are omitted, the space between adjacent pixel points is further reduced, and the pixels of an LED display screen 1 are improved; the LED flip chip is well combined with the PCB, so that heat dissipation by means of the PCB is facilitated, heat dissipation of the LED display screen is effectively improved, and the overall performance and quality of the LED display screen are improved; and each pixel point only needs 6 metal bonding points, so that a bonding wire link is omitted, the production flow is simplified, and the problems of insufficient bonding and wire breakage inside the LED chip are effectively solved.
In the description of the present invention, it is to be understood that the terms "first", "second" and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium; either as communication within the two elements or as an interactive relationship of the two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, a first feature may be "on" or "under" a second feature, and the first and second features may be in direct contact, or the first and second features may be in indirect contact via an intermediate. Also, a first feature "on," "above," and "over" a second feature may be directly or obliquely above the second feature, or simply mean that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the second feature, or may simply mean that the first feature is at a lower level than the second feature.
In the description herein, the description of the terms "one embodiment," "some embodiments," "an embodiment," "an example," "a specific example" or "some examples" or the like, means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Although embodiments of the present invention have been shown and described above, it should be understood that the above embodiments are illustrative and not restrictive, and that those skilled in the art may make changes, modifications, substitutions and alterations to the above embodiments without departing from the scope of the present invention.
Claims (10)
1. An LED screen packaging process based on an LED flip chip packaging technology is characterized by comprising the following steps:
s1, welding an IC, a resistor, a capacitor, a power supply seat and a connecting terminal on the driving surface of the PCB to obtain a first PCB;
s2, cleaning the first PCB by using a plasma machine, wherein the cleaning conditions for cleaning the first PCB are that the radio frequency time is 8-12S, the base pressure is 40-60N, and the radio frequency pressure is 20-30N;
s3, uniformly expanding the film carrying the LED flip chips by using a crystal expander;
s4, printing solder paste on the first PCB by using a printing machine, fixing the LED flip chips on the first PCB by using a die bonder, forming a pixel point by every 3 LED flip chips, detecting the first PCB fixed with the LED flip chips by using AOI (automatic optical inspection) detection equipment, and welding the qualified first PCB in a reflow furnace to obtain a second PCB;
s5, detecting the second PCB by using AOI detection equipment, and repairing the second PCB with welding defects;
s6, carrying out vacuum mould pressing on the qualified second PCB by using a mould pressing machine to obtain a third PCB;
and S7, baking the third PCB by using a thermal cycle oven or a vertical oven.
2. The LED screen packaging process based on the LED flip chip packaging technology as claimed in claim 1, wherein the capacitor comprises a first capacitor and a second capacitor, and the second capacitor is an electrolytic capacitor.
3. The LED screen packaging process based on the LED flip chip packaging technology of claim 1, wherein one pixel point comprises a first LED flip chip, a second LED flip chip and a third LED flip chip, wherein the first LED flip chip is used for emitting red light, the second LED flip chip is used for emitting green light, and the third LED flip chip is used for emitting blue light.
4. The LED screen packaging process based on the LED flip-chip packaging technology according to claim 1, further comprising, before step S1: and printing solder paste on the driving surface of the PCB.
5. The LED screen packaging process based on the LED flip chip packaging technology according to claim 1, wherein the LED screen packaging process based on the LED flip chip packaging technology further comprises: and S8, cutting off the process edge of the baked third PCB by using a cutter.
6. The LED screen packaging process based on the LED flip chip packaging technology according to claim 1, wherein the LED screen packaging process based on the LED flip chip packaging technology further comprises: and S9, spraying or pasting a film on the surface of the third PCB after the process edge is cut.
7. The LED screen packaging process based on the LED flip chip packaging technology according to claim 1, wherein the LED screen packaging process based on the LED flip chip packaging technology further comprises: and cutting the bonding pad of the third PCB by adopting a laser cutting process.
8. An LED screen produced by the LED screen packaging process based on the LED flip chip packaging technology according to any one of claims 1 to 7, wherein the LED screen comprises:
a PCB; and the number of the first and second groups,
the pixel point arrays are arranged on the first surface of the PCB, and each pixel point is provided with 6 bonding pads; the pixel point comprises a first LED flip chip, a second LED flip chip and a third LED flip chip, wherein the first LED flip chip is used for emitting red light, the second LED flip chip is used for emitting green light, and the third LED flip chip is used for emitting blue light; the anode and the cathode of the first LED flip chip, the anode and the cathode of the second LED flip chip and the anode and the cathode of the third LED flip chip are respectively connected with the 6 bonding pads in a one-to-one correspondence manner; and the second surface of the PCB is welded with an IC, a resistor and a capacitor correspondingly to the pixel points.
9. The LED screen of claim 8, wherein the second side of the PCB is further soldered with electrolytic capacitors, power sockets and connection terminals.
10. The LED screen of claim 8, wherein the first LED flip chip, the second LED flip chip, and the third LED flip chip each comprise a light reflecting layer and a light emitting layer, the light reflecting layer being directly below the light emitting layer.
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