CN108231982A - A kind of LED packaging technologies - Google Patents
A kind of LED packaging technologies Download PDFInfo
- Publication number
- CN108231982A CN108231982A CN201711434910.0A CN201711434910A CN108231982A CN 108231982 A CN108231982 A CN 108231982A CN 201711434910 A CN201711434910 A CN 201711434910A CN 108231982 A CN108231982 A CN 108231982A
- Authority
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- China
- Prior art keywords
- led
- telescopic arm
- packaging technologies
- led packaging
- plate
- Prior art date
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- Granted
Links
- 238000012536 packaging technology Methods 0.000 title claims abstract description 18
- 238000000465 moulding Methods 0.000 claims abstract description 19
- 238000000576 coating method Methods 0.000 claims abstract description 13
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 6
- 238000012856 packing Methods 0.000 claims abstract description 5
- 238000003860 storage Methods 0.000 claims abstract description 5
- 230000005540 biological transmission Effects 0.000 claims description 15
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 10
- 238000004026 adhesive bonding Methods 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 8
- 238000003780 insertion Methods 0.000 claims description 6
- 230000037431 insertion Effects 0.000 claims description 6
- 230000001105 regulatory effect Effects 0.000 claims description 6
- 239000003381 stabilizer Substances 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 4
- 230000002459 sustained effect Effects 0.000 claims description 3
- 230000005619 thermoelectricity Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 7
- 241000218202 Coptis Species 0.000 abstract description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 11
- 239000011248 coating agent Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Coating Apparatus (AREA)
Abstract
The invention discloses a kind of LED packaging technologies, a kind of packaging technology of LED, include the following steps, chip with FPC with elargol is bonded between the two first, then die bond is carried out to LED with bonder, first time molding is carried out to LED with molding apparatus, secondly fluorescent film is coated to LED with phosphor coatings equipment, molding apparatus carries out second to LED and is molded, and finally LED is packed with packing machine, and packaged LED bubbles are put in storage.The present invention breaches traditional packaging technology, LED failure and better heat-radiation effect caused by using flip-chip bonding pattern electric action, without gold thread connection, reduction bonding wire problem.
Description
Technical field
The invention belongs to the technical field encapsulated in LED more particularly to a kind of LED packaging technologies.
Background technology
LED on the market is used mostly using conventional package form between wire bonding formula, i.e. chip and stent at present
Gold thread connects.This technique causes dead lamp there may be coming off between the improper gold goal of bonding wire parameter and electrode, makes LED failure,
And sub-fraction luminous energy can be absorbed with elargol die bond, package brightness is made to decrease.
Invention content
In view of the above-mentioned problems, the present invention provides a kind of LED packaging technologies of LED service lifes length obtained.
To achieve these goals, the present invention uses following technical scheme：A kind of LED packaging technologies, include the following steps：
S1：Elargol on point, later by die bonding to elargol, obtains LED on stent；
S2：Die bond operation is carried out to LED with bonder；
S3：First time molding is carried out to LED with molding apparatus；
S4：Fluorescent film is coated to LED with phosphor coatings equipment；
S5：Fluorescent film is dried using drying equipment；
S6：Second is carried out to LED with molding apparatus to be molded；
S7：Finally LED is packed with packing machine, and packaged LED is put in storage
Further, the spot gluing equipment includes coulisse, work top, switch, emergency stop switch, control panel, pedestal, display
Screen, adjustable working table, control handle, dispensing controller, Glue dripping head, feed pipe, connecting plate, glider, under the frid
Surface and the upper surface of work top are mutually parallel;The molding apparatus includes driving motor, control panel, display screen, heat dissipation
Mouth, transmission shaft, fixed station, fixing bracket, drive bearing, fixing bracket, the control panel insertion are installed on driving motor
Upper right side.Adjustable working table is provided on the spot gluing equipment, the top of work top is mounted on by sliding slot, according to its point
The situation of glue adjusts its adjustable working table；The molding apparatus structure is equipped with fixed station, the driving motor when being used
Energy is provided for feed device, control panel starts feed device, makes fixed station in the feeding back and forth of the both ends of transmission shaft.
Further, the adjustable working table is by workbench, the first telescopic arm, the second telescopic arm, third telescopic arm, cunning
Grooved ring, sliding slot composition.It is connected above the lower section of the workbench and the first telescopic arm, the rear side peace of first telescopic arm
Front side loaded on the second telescopic arm is installed on the second telescopic arm above the third telescopic arm, the inside of the runner ring
The runner ring that is connected on the outside of sliding slot is moved forward and backward its position on the chute, when being moved to required position, according to circumstances adjusts
Its height is saved, the second telescopic arm is pulled out from sliding slot, and third telescopic arm page is pulled out from sliding slot therewith, when also needing raising, is drawn
Going out the first telescopic arm makes workbench be in highest position, makes it have the effect of adjustable working table, makes its dispensing process
It is more convenient.
Further, the fixed station includes fixed station skeleton, cushion block, sliding recess, upper mounted plate, bottom plate, consolidates
Fixing limit frame, locating piece sliding slot, locating piece, the lower end of the cushion block and the bonding sliding recess in the upper end of fixed station skeleton
Inlay the upper end for being installed on cushion block, the lower end of fixed plate and the upper end of sliding recess fit, the bottom plate with
Upper mounted plate sustained height, the fixed position-limited rack and fixed station the skeleton cushion block that is integrated are too high by fixed plate, not with
Fixed station skeleton contacts, and upper mounted plate is reduced with bottom plate distance during feeding, and sent material is clamped, and locating piece control clamps
Material position afterwards allows the object of feeding terminal accurately to take away sent material, sliding recess limitation fixed block movement, positioning
The control locating piece movement of block sliding slot, effectively fixes die bond, make die bond safety and precise is transported to next ring in transmission process
Section improves the working efficiency of bonder.
Further, the lower surface of the adjustable working table is installed on the top of work top, the control handle with
Dispensing controller is electrically connected, and the Glue dripping head is connected with feed pipe, and the top insertion of the feed pipe is installed on glider
Inside, the rear side of the connecting plate are connected with glider, described that adjustable working table is provided on spot gluing equipment, make its tool
There is the effect of adjustable working table, the dispensing process for making it is more convenient.
Further, the fluorescence equipment includes display screen, screw, object table, fixed frame, body, power interface, branch
Foot, pressure gauge, operation panel, regulating switch, positioning device, applicator, scram button, object, cabinet door, handle, the positioning dress
It puts including FET pipes, shell, support ring, window, pin, pedestal, circuit original paper, thermoelectric plate, filter lens, the FET pipes are located at
The upper end of circuit original paper, the shell are integrated with window, and the support ring is located at the inside of shell, and the pin passes through
Pedestal is through at, the circuit original paper is located at the inside of shell, and the lower surface of the thermoelectric plate and the upper surface of filter lens are affixed
It closes, this phosphor coatings equipment, structure is equipped with positioning device, and positioning device is mounted on body, is powered on, object passes through
Window is mapped on filter lens, and analog signal is passed to thermoelectric plate by filter lens, is transmitted signal to by thermoelectric plate
Circuit original paper, digital signal is converted by circuit original paper by analog signal, and digital signal is passed to body by FET pipes,
Start to coat, article position is thus accurately positioned, ensure that the coating of object is uniform.
In conclusion the present invention has the following advantages：Adjustable working table is provided on spot gluing equipment, is installed by sliding slot
In the top of work top, its adjustable working table is adjusted according to its situation for dispensing glue；The molding apparatus structure is equipped with solid
Determine platform, driving motor provides energy for feed device when being used, and control panel starts feed device, passing fixed station
The feeding back and forth of the both ends of moving axis.
Description of the drawings
Fig. 1 is the structural diagram of the present invention.
Fig. 2 is the structure diagram of the spot gluing equipment of the present invention.
Fig. 3 is the structure diagram of fixed station in present invention point plastic structure.
Fig. 4 is the structure diagram of molding apparatus of the present invention.
Fig. 5 is the structure diagram of fixed station in molding apparatus of the present invention.
Fig. 6 is the structure diagram of fluorescent powder coating equipment of the present invention.
Fig. 7 is the structure diagram of the section of fluorescent powder coating equipment positioning device of the present invention.
Specific embodiment
In order to which those skilled in the art is made to be better understood from the present invention program, below in conjunction in the embodiment of the present invention
Attached drawing carries out the technical solution in the embodiment of the present invention clear, complete description.
A kind of LED packaging technologies, include the following steps：S1：Elargol is put on stent by spot gluing equipment, later by core
Piece is bonded on elargol, obtains LED；S2：Die bond operation is carried out to LED with die bond mechanism, concrete principle is the prior art, therefore not
It repeats again；Later using dryer at a temperature of 150 DEG C, 2h is toasted to LED；S3：LED is carried out with molding apparatus for the first time
Molding, coining operation and principle are the prior art, and so it will not be repeated；S4：Fluorescent film, tool are coated to LED with phosphor coatings equipment
The coating principle of body repeats no more；S5：Fluorescent film is dried using drying equipment；S6：Is carried out to LED with molding apparatus
Secondary mould pressing；S7：To LED testing, sortings, testing, sorting mainly be powered to LED, test whether can normal use,
It is normal then carry out packaging and storage；Finally LED is packed with packing machine, and packaged LED is put in storage, packing machine is
The prior art repeats no more；Drying equipment is the dryer being directly commercially available on the market, and structure repeats no more.
As shown in figs. 1-7, the spot gluing equipment 1 is opened including coulisse 111, work top 112, work top 113, emergency stop
Close 114, control panel 115, pedestal 116, display screen 30117, adjustable working table 118, control handle 119, dispensing controller
120th, Glue dripping head 121, feed pipe 122, connecting plate 123, glider 124, lower surface and the work top 112 of the frid 111
Upper surface be mutually parallel, the insertion of the back side of the work top 113 is installed on the inside of work top 112, and the emergency stop is opened
The back of pass 114 fits in the front side of work top 112, and the control panel 115 is electrically connected with work top 112, the bottom
The upper surface and the lower surface of work top 112 of seat 116 fit, and the lower surface insertion of the display screen 30117 is installed on work
Make the inside of table top 112, the lower surface of the adjustable working table 118 is installed on the top of work top 112, the control rotation
Button 119 is electrically connected with dispensing controller 120, and the Glue dripping head 121 is connected with feed pipe 122, the top of the feed pipe 122
The embedded inside for being installed on glider 124, the rear side of the connecting plate 123 are connected with glider 124, the adjustable work
Platform 118 is by workbench 801, the first telescopic arm 802, the second telescopic arm 803, third telescopic arm 804, runner ring 805, sliding slot 806
Composition, the lower section of the workbench 801 are connected with the top of the first telescopic arm 802, the rear side peace of first telescopic arm 802
Front side loaded on the second telescopic arm 803, the top of the third telescopic arm 804 are installed on the second telescopic arm 803, the sliding slot
The inside of ring 805 is connected with the outside of sliding slot 806, and the work top 113 is rectangular parallelepiped structure, the control handle 4
A diameter of 1cm, the right side of the dispensing controller 120 are welded in the left side of work top 112, the lower section of the coulisse 111
Parallel with the top of pedestal 116, second telescopic arm 803 is connected by sliding slot 806 with work top 112, the control
Knob 119 processed is made of pvc particles, has durable effect, and the display screen 30117 is made of TN, has effect at low cost
Fruit.
For the word explanation of work top 113 described in this patent to open and close, the control handle 4 is turned with manual
Manual element.
The top of work top is mounted on by sliding slot 806 when being used, adjusting it according to its situation for dispensing glue can
Workbench 118 is adjusted, runner ring 805 is moved forward and backward its position on sliding slot 806, when being moved to required position, according to circumstances
Its height is adjusted, the second telescopic arm 803 is pulled out from sliding slot 806, and third telescopic arm page 804 is pulled out from sliding slot 806 therewith, when
When also needing raising, pulling out the first telescopic arm 802 makes workbench 801 be in highest position.
It is poor to the height regulating effect of workbench to solve the prior art, leads to cumbersome during dispensing ask
Topic, being combined with each other by above-mentioned component of the invention, adjustable working table is provided in its structure, makes it have adjustable work
Make the effect of platform, the dispensing process for making it is more convenient.
Specifically, the molding apparatus 2 include driving motor 201, control panel 202, display screen 203, thermovent 204,
Transmission shaft 205, fixed station, fixing bracket 207, drive bearing 208, fixing bracket 209, the insertion of control panel 202 installation
In the upper right side of driving motor 201, the display screen 203 is set on the left side of panel 2 processed, and the thermovent 204, which is inlayed, to be installed on
The left side of driving motor 201, the drive bearing 208 are nested with transmission shaft 205, and the fixing bracket 207 is with fixed station
Integral structure, the upper end of the rear end fixing bracket 209 of the transmission shaft 205, the fixed station include fixed station skeleton 601,
Cushion block 602, sliding recess 603, upper mounted plate 604, bottom plate 605, fixed position-limited rack 606, locating piece sliding slot 607, positioning
Block 608, the lower end and the upper end of fixed station skeleton 601 of the cushion block 602 are bonding, and the sliding recess 603 is inlayed is installed on
The upper end of cushion block 602, the lower end and the upper end of sliding recess 603 of fixed plate 604 fit, the bottom plate 605
With 604 sustained height of upper mounted plate, the fixed position-limited rack 606 is integrated with fixed station skeleton 601, the locating piece
Sliding slot 607 is embedded in the middle-end for being installed on upper mounted plate 604, and the lower end and the upper end of position block sliding slot 607 of the locating piece 608 are mutually glued
It closes, the front end and the rear end of driving motor 201 of the transmission shaft 205 fit, and the drive bearing 208, which is inlayed, is installed on fixation
The middle-end of stent 207, the fixing bracket 207 are integrated with fixed station skeleton 601, and the display screen 203 is length
30CM, the rectangle of wide 15CM, the transmission shaft 205 are made of stainless steel, and have stronger non-deformability, the fixed branch
Frame 209 is made of steel material, has higher hardness.
Display 3 described in this patent is also generally referred to as monitor.Display is the I/O equipment for belonging to computer, i.e., defeated
Enter output equipment.It is that a kind of be shown to certain electronic document on screen by specific transmission device is re-reflected into human eye
Show tools, the fixing bracket 207 is restriction conduit or equipment displacement, is a kind of rack form.
When being used, driving motor 201 provides energy for feed device, and control panel 202 starts feed device, makes
For fixed station in the feeding back and forth of the both ends of transmission shaft 205, cushion block 602 is too high by fixed plate, does not contact, send with fixed station skeleton 601
Upper mounted plate 604 clamps sent material, the material after the control clamping of locating piece 608 with bottom plate 605 apart from diminution during material
Position allows the object of feeding terminal accurately to take away sent material, and sliding recess 603 limits fixed block movement, and locating piece is slided
Slot 607 controls locating piece 608 to move.
The prior art is solved when transmitting die bond, fixed effect is bad, and die bond easily slides in transmission process, reduces
The problem of transfer efficiency, being combined with each other by above-mentioned component of the invention, when being used, driving motor is carried for feed device
For energy, control panel starts feed device, and making fixed station, cushion block is too high by fixed plate in the feeding back and forth of the both ends of transmission shaft,
It is not contacted with fixed station skeleton, upper mounted plate is reduced with bottom plate distance during feeding, and sent material is clamped, locating piece control
Material position after clamping allows the object of feeding terminal accurately to take away sent material, sliding recess limitation fixed block movement,
The control locating piece movement of locating piece sliding slot, effectively fixes die bond, under being transported to for making die bond safety and precise in transmission process
A link improves the working efficiency of bonder.
Specifically, the phosphor coatings equipment 3 includes display screen 301, screw 302, object table 303, fixed frame 304, machine
Body 305, power interface 306, stabilizer blade 307, pressure gauge 308, operation panel 309, regulating switch 310, positioning device, applicator 312,
Scram button 313, object 314, cabinet door 315, handle 316, the display screen 301 are electrically connected with operation panel 309, the object table
303 are located at the lower end of object 314, and the power interface 306 is located at the left end of body 305, the pressure gauge 308 and operation panel
309 electrical connections, the regulating switch 310 are located at the right end of pressure gauge 308, and the regulating switch 310 is electrically connected with operation panel 309
It connects, the positioning device is located at the upper end of object 314, and the applicator 312 is located at the lower end of operation panel 309, and the emergency stop is pressed
Button 313 is electrically connected with body 305, and the cabinet door 315 is welded with 316 phase of handle, and the cabinet door 315 is located at the front end of body 305,
The positioning device includes FET pipes 1101, shell 1102, support ring 1103, window 1104, pin 1105, pedestal 1106, circuit
Original paper 1107, thermoelectric plate 1108, filter lens 1109, the FET pipes 1101 are located at the upper end of circuit original paper 1107, the shell
1102 are integrated with window 1104, and the support ring 1103 is located at the inside of shell 1102, and the pin 1105 runs through
In pedestal 1106, the circuit original paper 1107 is located at the inside of shell 1102, and the lower surface of the thermoelectric plate 1108 is saturating with filtering
The upper surface of mirror 1109 fits, and the screw 302 is threadedly coupled with fixed frame 304, the lower surface of the body 305 and stabilizer blade
307 upper surface is mutually welded, and the pin 1105 is electrically connected with body 305, a length of 5cm of the stabilizer blade 307, width 3cm, high
For 8cm, the stabilizer blade 307 is rectangular parallelepiped structure, and the object table 303 is made of stainless steel, and hardness is high and is not easy to get rusty.
Display screen 301 described in this patent is the I/O equipment for belonging to computer, i.e. input-output equipment, it is a kind of by one
Fixed electronic document is shown to the show tools that human eye is re-reflected on screen, the screw 302 by specific transmission device
It is the physics and mathematical principle of the inclined-plane circular rotating and frictional force that utilize object, fastens the work of implements parts by easy stages
Tool, screw are the general sayings of fastener, and daily pet phrase, screw is industrial necessity indispensable in daily life, such as
The general screw of the minimum screw that camera, glasses, clock and watch, electronics etc. use, TV, electric product, musical instrument, furniture etc.,
As for engineering, building, bridge then using large-scale screw, nut, traffic tool, aircraft, electric car, automobile etc. then for big primary screw simultaneously
With screw industrially bears vital task, as long as there is industry on the earth, then the function of screw is forever important, and screw is
Joint invention in people's production and living over the past thousands of years, from the point of view of application field, it is the first major invention of the mankind.
Positioning device is mounted on body 305 when being used, is powered on, object is mapped in by window 1104
On filter lens 1109, analog signal is passed to by thermoelectric plate 1108 by filter lens 1109, by thermoelectric plate 1108 by signal
Circuit original paper 1107 is conveyed to, analog signal is converted by digital signal by circuit original paper 1107, by FET pipes 1101 by number
Word signal passes to body 305, starts to coat, article position is thus accurately positioned, and ensures that the coating of object is uniform.
Solves prior art position calibration position inaccurate, it may appear that the phenomenon that offset, cause fluorescent powder coating uneven
Positioning device is mounted on body, powers on, object leads to by the problem of even, being combined with each other by above-mentioned component of the invention
It crosses window to be mapped on filter lens, analog signal is passed to by thermoelectric plate by filter lens, conveyed signal by thermoelectric plate
Circuit original paper is given, analog signal is converted by digital signal by circuit original paper, digital signal is passed to by machine by FET pipes
Body starts to coat, article position is thus accurately positioned, and ensures that the coating of object is uniform.
Obviously, described embodiment is only the part of the embodiment of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without making creative work
Embodiment should all belong to the scope of protection of the invention.
Claims (9)
1. a kind of LED packaging technologies, include the following steps：
S1：Elargol on point, later by die bonding to elargol, obtains LED on stent；
S2：Die bond operation is carried out to LED with bonder；
S3：First time molding is carried out to LED with molding apparatus；
S4：Fluorescent film is coated to LED with phosphor coatings equipment；
S5：Fluorescent film is dried using drying equipment；
S6：Second is carried out to LED with molding apparatus to be molded；
S7：Finally LED is packed with packing machine, and packaged LED is put in storage.
2. LED packaging technologies according to claim 1, it is characterised in that：The spot gluing equipment（1）Including coulisse
（111）, work top（112）, switch（113）, emergency stop switch（114）, control panel（115）, pedestal（116）, display screen
（117）, adjustable working table（118）, control handle（119）, dispensing controller（120）, Glue dripping head（121）, feed pipe
（122）, connecting plate（123）, glider（124）, the frid（111）Lower surface and work top（112）Upper surface phase
It is mutually parallel.
3. LED packaging technologies according to claim 1, it is characterised in that：The molding apparatus（2）Including driving motor
（201）, control panel（202）, display screen（203）, thermovent（204）, transmission shaft（205）, fixed station, fixing bracket（207）、
Drive bearing（208）, fixing bracket（209）, the control panel（202）Insertion is installed on driving motor（201）Upper right side.
4. LED packaging technologies according to claim 2, it is characterised in that：The adjustable working table（118）By workbench
（801）, the first telescopic arm（802）, the second telescopic arm（803）, third telescopic arm（804）, runner ring（805）, sliding slot（806）Group
Into.
5. LED packaging technologies according to claim 4, it is characterised in that：The workbench（801）Lower section stretched with first
Contracting arm（802）Top be connected, first telescopic arm（802）Rear side be installed on the second telescopic arm（803）Front side, institute
State third telescopic arm（804）Top be installed on the second telescopic arm（803）On, the runner ring（805）Inside and sliding slot
（806）Outside be connected.
6. LED packaging technologies according to claim 3, it is characterised in that：The fixed station includes fixed station skeleton
（601）, cushion block（602）, sliding recess（603）, upper mounted plate（604）, bottom plate（605）, fixed position-limited rack（606）, it is fixed
Position block sliding slot（607）, locating piece（608）, the cushion block（602）Lower end and fixed station skeleton（601）Upper end it is bonding.
7. LED packaging technologies according to claim 6, it is characterised in that：The sliding recess（603）It inlays and is installed on pad
Block（602）Upper end, fixed plate（604）Lower end and sliding recess（603）Upper end fit, the bottom plate
（605）With upper mounted plate（604）Sustained height, the fixed position-limited rack（606）With fixed station skeleton（601）Being integrated is tied
Structure.
8. LED packaging technologies according to claim 1, it is characterised in that：The fluorescence equipment（3）Including display screen
（301）, screw（302）, object table（303）, fixed frame（304）, body（305）, power interface（306）, stabilizer blade（307）, pressure
Power table（308）, operation panel（309）, regulating switch（310）, positioning device（311）, applicator（312）, scram button（313）、
Object（314）, cabinet door（315）, handle（316）.
9. LED packaging technologies according to claim 8, it is characterised in that：The positioning device is managed including FET（1101）、
Shell（1102）, support ring（1103）, window（1104）, pin（1105）, pedestal（1106）, circuit original paper（1107）, thermoelectricity
Plate（1108）, filter lens（1109）, the FET pipes（1101）Positioned at circuit original paper（1107）Upper end, the shell
（1102）With window（1104）It is integrated, the support ring（1103）Positioned at shell（1102）Inside, the pin
（1105）Through pedestal（1106）, the circuit original paper（1107）Positioned at shell（1102）Inside, the thermoelectric plate
（1108）Lower surface and filter lens（1109）Upper surface fit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711434910.0A CN108231982B (en) | 2017-12-26 | 2017-12-26 | LED packaging process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711434910.0A CN108231982B (en) | 2017-12-26 | 2017-12-26 | LED packaging process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108231982A true CN108231982A (en) | 2018-06-29 |
| CN108231982B CN108231982B (en) | 2020-10-30 |
Family
ID=62649006
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711434910.0A Active CN108231982B (en) | 2017-12-26 | 2017-12-26 | LED packaging process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108231982B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110767109A (en) * | 2019-10-31 | 2020-02-07 | 湖南合利来智慧显示科技有限公司 | LED screen manufacturing method for improving yield |
| CN113782471A (en) * | 2021-09-14 | 2021-12-10 | 深圳市兆驰晶显技术有限公司 | LED screen packaging process based on LED flip chip packaging technology and LED screen |
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| CN108231982B (en) | 2020-10-30 |
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