CN108231982B - LED packaging process - Google Patents
LED packaging process Download PDFInfo
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- CN108231982B CN108231982B CN201711434910.0A CN201711434910A CN108231982B CN 108231982 B CN108231982 B CN 108231982B CN 201711434910 A CN201711434910 A CN 201711434910A CN 108231982 B CN108231982 B CN 108231982B
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- telescopic arm
- sliding groove
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- 238000012858 packaging process Methods 0.000 title claims abstract description 9
- 239000011248 coating agent Substances 0.000 claims abstract description 21
- 238000000576 coating method Methods 0.000 claims abstract description 21
- 238000007723 die pressing method Methods 0.000 claims abstract description 14
- 238000004806 packaging method and process Methods 0.000 claims abstract description 13
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052709 silver Inorganic materials 0.000 claims abstract description 8
- 239000004332 silver Substances 0.000 claims abstract description 8
- 230000017525 heat dissipation Effects 0.000 claims abstract description 5
- 230000005540 biological transmission Effects 0.000 claims description 19
- 238000001035 drying Methods 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 230000005611 electricity Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 description 11
- 239000003292 glue Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 6
- 238000000465 moulding Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Coating Apparatus (AREA)
Abstract
The invention discloses an LED packaging process, which comprises the following steps of firstly bonding a chip and an FPC by silver adhesive, then carrying out die bonding on the LED by a die bonder, carrying out primary die pressing on the LED by die pressing equipment, secondly coating a fluorescent film on the LED by fluorescent coating equipment, carrying out secondary die pressing on the LED by the die pressing equipment, finally packaging the LED by a packaging machine, and warehousing the packaged LED bulb. The invention breaks through the traditional packaging process, adopts the flip chip bonding mode to play a role of conducting electricity, does not need gold wire connection, reduces the failure of the LED caused by the problem of wire bonding and has better heat dissipation effect.
Description
Technical Field
The invention belongs to the technical field of LED packaging, and particularly relates to an LED packaging process.
Background
Most of the LEDs on the market at present adopt a traditional packaging form, namely a lead bonding type, namely, a chip is connected with a support by a gold wire. The process may cause the lamp to be dead due to the falling between the gold ball and the electrode due to improper wire bonding parameters, so that the LED fails, and a small part of light energy can be absorbed by the silver adhesive die bonding, so that the packaging brightness is reduced.
Disclosure of Invention
Aiming at the problems, the invention provides the LED packaging process for manufacturing the LED with long service life.
In order to achieve the purpose, the invention adopts the following technical scheme: an LED packaging process, comprising the following steps:
s1: dispensing silver paste on the support, and then adhering the chip to the silver paste to obtain the LED;
s2: carrying out die bonding operation on the LED by using a die bonding machine;
s3: carrying out primary die pressing on the LED by using die pressing equipment;
s4: coating the LED with a fluorescent film by using fluorescent coating equipment;
s5: drying the fluorescent film by adopting drying equipment;
s6: carrying out secondary die pressing on the LED by using die pressing equipment;
s7: finally, packaging the LEDs by using a packaging machine, and warehousing the packaged LEDs
Furthermore, the glue dispensing equipment comprises a chute plate, a workbench surface, a switch, an emergency stop switch, a control panel, a base, a display screen, an adjustable workbench, a control knob, a glue dispensing controller, a glue dispensing head, a feeding pipe, a connecting plate and a slider, wherein the lower surface of the chute plate is parallel to the upper surface of the workbench surface, the mould pressing equipment comprises a driving motor, a control panel, a display screen, a heat dissipation port, a transmission shaft, a fixed platform, a fixed support, a transmission bearing and a fixed support, and the control panel is embedded and installed at the upper right end of the driving motor. The dispensing equipment is provided with an adjustable workbench, the adjustable workbench is arranged above the workbench surface through a chute, and the adjustable workbench is adjusted according to the dispensing condition; the mould pressing equipment is structurally provided with a fixed table, when the mould pressing equipment is used, the driving motor provides energy for the feeding device, and the control panel starts the feeding device to enable the fixed table to feed back and forth at two ends of the transmission shaft.
Furthermore, adjustable workstation comprises workstation, first flexible arm, the flexible arm of second, the flexible arm of third, spout ring, spout. The lower part of the workbench is connected with the upper part of the first telescopic arm, the rear side of the first telescopic arm is installed on the front side of the second telescopic arm, the upper part of the third telescopic arm is installed on the second telescopic arm, the inner side of the sliding groove ring is connected with the outer side of the sliding groove, the sliding groove ring moves back and forth on the sliding groove, when the sliding groove moves to a required position, the height of the sliding groove ring is adjusted according to the situation, the second telescopic arm is pulled out from the sliding groove, then the third telescopic arm page is pulled out from the sliding groove, and when the sliding groove ring still needs to be lifted, the first telescopic arm is pulled out to enable the workbench to be located at the highest position, so that the sliding groove ring has the effect of adjusting the workbench, and the dispensing process of the sliding groove ring is more.
Further, the fixed station comprises a fixed station framework, a cushion block, a sliding groove, an upper fixed plate, a lower fixed plate, a fixed limiting frame, a positioning block sliding groove and a positioning block, the lower end of the cushion block is bonded with the upper end of the fixed station framework, the sliding groove is embedded and installed at the upper end of the cushion block, the lower end of the upper fixed plate is attached to the upper end of the sliding groove, the lower fixed plate and the upper fixed plate are at the same height, the fixed limiting frame and the fixed station framework are of an integrated structure, the cushion block enables the fixed plate to be too high and not to be in contact with the fixed station framework, the distance between the upper fixed plate and the lower fixed plate is reduced during feeding, the fed materials are clamped tightly, the positioning block controls the position of the clamped materials, the fed materials can be accurately taken by the objects at the feeding end point, the sliding groove limits the movement of the fixed block, the die bonder is safely and accurately conveyed to the next link, and the working efficiency of the die bonder is improved.
Further, the lower surface of the adjustable workbench is arranged above the workbench surface, the control knob is electrically connected with the glue dispensing controller, the glue dispensing head is connected with the feeding pipe, the feeding pipe is embedded in the glider, the rear side of the connecting plate is connected with the glider, the adjustable workbench is arranged on the glue dispensing device, the glue dispensing device has the effect of the adjustable workbench, and the glue dispensing process is more convenient and rapid.
Furthermore, the fluorescence equipment comprises a display screen, a screw, an object table, a fixing frame, a machine body, a power interface, a support leg, a pressure gauge, an operating panel, an adjusting switch, a positioning device, an applicator, an emergency stop button, an object, a cabinet door and a handle, wherein the positioning device comprises an FET tube, a shell, a support ring, a window, pins, a base, a circuit element, a thermoelectric plate and a filter lens, the FET tube is positioned at the upper end of the circuit element, the shell and the window are of an integrated structure, the support ring is positioned in the shell, the pins penetrate through the base, the circuit element is positioned in the shell, the lower surface of the thermoelectric plate is attached to the upper surface of the filter lens, the fluorescence coating equipment is structurally provided with the positioning device, the positioning device is installed on the machine body, the power is switched on, the object is mapped on the filter lens through the window, and an analog signal is transmitted to, give the circuit original paper with signal transmission by the thermoelectric plate, turn into digital signal with analog signal through the circuit original paper, give the organism through the FET pipe with digital signal transmission, begin the coating, pinpoint the article position from this, guarantee that the coating of article is even.
In summary, the invention has the following advantages: the dispensing equipment is provided with an adjustable workbench which is arranged above the workbench surface through a chute and is adjusted according to the dispensing condition; the mould pressing equipment is structurally provided with a fixed table, when the mould pressing equipment is used, the driving motor provides energy for the feeding device, and the control panel starts the feeding device to enable the fixed table to feed back and forth at two ends of the transmission shaft.
Drawings
FIG. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic structural diagram of the dispensing apparatus of the present invention.
Fig. 3 is a schematic structural view of a fixing table in the dispensing structure of the invention.
FIG. 4 is a schematic view showing the structure of the molding apparatus of the present invention.
FIG. 5 is a schematic view showing the structure of a fixing table in the molding apparatus of the present invention.
FIG. 6 is a schematic structural view of a phosphor coating apparatus according to the present invention.
FIG. 7 is a schematic structural diagram of a cross section of a positioning device of the phosphor coating apparatus of the present invention.
Detailed Description
In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention.
An LED packaging process, comprising the following steps: s1: dispensing silver paste on the support through dispensing equipment, and then adhering the chip to the silver paste to obtain the LED; s2: the die bonding mechanism is used for carrying out die bonding operation on the LED, the specific principle is the prior art, and therefore the detailed description is omitted; then baking the LED for 2 hours at the temperature of 150 ℃ by adopting a dryer; s3: the LED is molded for the first time by using molding equipment, and the molding operation and the principle are the prior art, so the description is omitted; s4: coating the LED with a fluorescent film by using fluorescent coating equipment, wherein the specific coating principle is not described again; s5: drying the fluorescent film by adopting drying equipment; s6: carrying out secondary die pressing on the LED by using die pressing equipment; s7: testing and sorting the LEDs, wherein the testing and sorting mainly comprises electrifying the LEDs, testing whether the LEDs can be normally used or not, and packaging and warehousing the LEDs if the LEDs are normally used; finally, packaging the LEDs by using a packaging machine, and putting the packaged LEDs into a warehouse, wherein the packaging machine is the prior art and is not described any more; the drying equipment is a dryer directly purchased in the market, and the structure is not repeated.
As shown in fig. 1-7, the dispensing apparatus 1 includes a chute plate 111, a table top 112, a table top 113, an emergency stop switch 114, a control panel 115, a base 116, a display screen 30117, an adjustable table 118, a control knob 119, a dispensing controller 120, a dispensing head 121, a feeding pipe 122, a connecting plate 123, and a slider 124, wherein the lower surface of the chute plate 111 is parallel to the upper surface of the table top 112, the back of the table top 113 is embedded in the table top 112, the back of the emergency stop switch 114 is attached to the front side of the table top 112, the control panel 115 is electrically connected to the table top 112, the upper surface of the base 116 is attached to the lower surface of the table top 112, the lower surface of the display screen 30117 is embedded in the table top 112, the lower surface of the adjustable table 118 is mounted above the table top 112, the control knob 119 is electrically connected with the dispensing controller 120, the dispensing head 121 is connected with the feed tube 122, the feed tube 122 is embedded in the slider 124, the rear side of the connecting plate 123 is connected with the slider 124, the adjustable workbench 118 is composed of a workbench 801, a first telescopic arm 802, a second telescopic arm 803, a third telescopic arm 804, a chute ring 805 and a chute 806, the lower part of the workbench 801 is connected with the upper part of the first telescopic arm 802, the rear side of the first telescopic arm 802 is arranged at the front side of the second telescopic arm 803, the upper part of the third telescopic arm 804 is arranged on the second telescopic arm 803, the inner side of the chute ring 805 is connected with the outer side of the chute 806, the workbench surface 113 is of a cuboid structure, the diameter of the control knob 4 is 1cm, the dispensing controller 120 is welded at the left side of the right workbench surface 112, the lower portion of the chute board 111 is parallel to the upper portion of the base 116, the second telescopic arm 803 is connected to the working table 112 through a chute 806, the control knob 119 is made of pvc particles and has a durable effect, and the display 30117 is made of TN and has a low-cost effect.
The wording of the worktop 113 in this patent is to be interpreted as opening and closing, the control knob 4 being a manual element that is turned manually.
When the adjustable workbench is used, the adjustable workbench 118 is arranged above a workbench surface through the sliding groove 806 and adjusted according to the dispensing condition, the sliding groove ring 805 moves back and forth on the sliding groove 806, when the adjustable workbench moves to a required position, the height of the adjustable workbench is adjusted according to the condition, the second telescopic arm 803 is pulled out from the sliding groove 806, the third telescopic arm 804 is pulled out from the sliding groove 806, and when the adjustable workbench needs to be lifted, the first telescopic arm 802 is pulled out to enable the workbench 801 to be at the highest position.
The adjustable workbench is structurally arranged through the mutual combination of the components, so that the adjustable workbench has the effect of adjusting the workbench, and the glue dispensing process is more convenient and faster.
Specifically, the molding device 2 includes a driving motor 201, a control panel 202, a display screen 203, a heat dissipation port 204, a transmission shaft 205, a fixed platform, a fixed bracket 207, a transmission bearing 208, and a fixed bracket 209, wherein the control panel 202 is embedded in the upper right end of the driving motor 201, the display screen 203 is disposed on the left side of the panel 2, the heat dissipation port 204 is embedded in the left side of the driving motor 201, the transmission bearing 208 is embedded in the transmission shaft 205, the fixed bracket 207 and the fixed platform are integrated, the upper end of the fixed bracket 209 is fixed at the rear end of the transmission shaft 205, the fixed platform includes a fixed platform framework 601, a cushion block 602, a sliding groove 603, an upper fixed plate 604, a lower fixed plate 605, a fixed limit bracket 606, a positioning block chute 607, and a positioning block 608, the lower end of the cushion block 602 is bonded to the upper end of the fixed platform framework 601, the sliding groove 603 is embedded in the upper, the lower end of the upper fixing plate 604 is attached to the upper end of the sliding groove 603, the lower fixing plate 605 is at the same height as the upper fixing plate 604, the fixing limiting frame 606 and the fixing table framework 601 are of an integrated structure, the positioning block sliding groove 607 is embedded in the middle end of the upper fixing plate 604, the lower end of the positioning block 608 is bonded to the upper end of the positioning block sliding groove 607, the front end of the transmission shaft 205 is attached to the rear end of the driving motor 201, the transmission bearing 208 is embedded in the middle end of the fixing support 207, the fixing support 207 and the fixing table framework 601 are of an integrated structure, the display screen 203 is rectangular with the length of 30CM and the width of 15CM, the transmission shaft 205 is made of stainless steel and has strong deformation resistance, and the fixing support 209 is made of steel material and has high hardness.
The display 3 is also commonly referred to as a monitor in this patent. The display is an I/O device belonging to a computer, namely an input/output device. The fixed support 207 is a support form which limits displacement of a pipeline or equipment.
When the feeding device is used, the driving motor 201 provides energy for the feeding device, the control panel 202 starts the feeding device to enable the fixed platform to feed back and forth at two ends of the transmission shaft 205, the cushion block 602 enables the fixed plate to be too high to be in contact with the fixed platform framework 601, the distance between the upper fixed plate 604 and the lower fixed plate 605 is reduced during feeding to clamp the fed materials, the positioning block 608 controls the position of the clamped materials to enable the fed materials to be accurately taken away by an object at the feeding end point, the sliding groove 603 limits the movement of the fixed block, and the positioning block sliding groove 607 controls the movement of the positioning block 608.
The invention solves the problems that the fixing effect is poor when the die is transported and die bonding is easy to slide off in the transporting process and the transporting efficiency is reduced in the prior art, through the mutual combination of the components, when the die bonding machine is used, the driving motor provides energy for the feeding device, the control panel starts the feeding device to enable the fixed table to feed materials back and forth at two ends of the transmission shaft, the fixed plate is too high by the cushion block and is not contacted with the fixed table framework, the distance between the upper fixed plate and the lower fixed plate is reduced during feeding, the fed materials are clamped tightly, the position of the clamped materials is controlled by the positioning block, the fed materials can be accurately taken by the object at the feeding end point, the fixed block is limited by the sliding groove to move, the positioning block is controlled by the positioning block sliding groove to move, the die bonding is effectively fixed in the transporting process, the die bonding is safely and accurately transported to the next.
Specifically, the fluorescent coating apparatus 3 includes a display screen 301, a screw 302, an object table 303, a fixing frame 304, a body 305, a power source interface 306, a support leg 307, a pressure gauge 308, an operation panel 309, an adjusting switch 310, a positioning device, an applicator 312, an emergency stop button 313, an object 314, a cabinet door 315, and a handle 316, wherein the display screen 301 is electrically connected to the operation panel 309, the object table 303 is located at the lower end of the object 314, the power source interface 306 is located at the left end of the body 305, the pressure gauge 308 is electrically connected to the operation panel 309, the adjusting switch 310 is located at the right end of the pressure gauge 308, the adjusting switch 310 is electrically connected to the operation panel 309, the positioning device is located at the upper end of the object 314, the applicator 312 is located at the lower end of the operation panel 309, the emergency stop button 313 is electrically connected to the body 305, the handle 315 is welded to the body 316, the, the positioning device comprises an FET tube 1101, a housing 1102, a support ring 1103, a window 1104, pins 1105, a base 1106, a circuit element 1107, a thermoelectric plate 1108 and a filter lens 1109, wherein the FET tube 1101 is positioned at the upper end of the circuit element 1107, the housing 1102 and the window 1104 are of an integrated structure, the support ring 1103 is positioned inside the housing 1102, the pins 1105 penetrate through the base 1106, the circuit element 1107 is positioned inside the housing 1102, the lower surface of the thermoelectric plate 1108 is attached to the upper surface of the filter lens 1109, a screw 302 is in threaded connection with a fixing frame 304, the lower surface of the machine body 305 is welded to the upper surface of a supporting leg 307, the pins 1105 are electrically connected with the machine body 305, the supporting leg 307 is 5cm long, 3cm wide and 8cm high, the supporting leg 307 is of a cuboid structure, and the object table 303 is made of stainless steel, and has high hardness and is not prone to rusting.
The display screen 301 is an I/O device belonging to a computer, i.e. an input/output device, and is a display tool for displaying a certain electronic document on a screen through a specific transmission device and reflecting the electronic document to human eyes, the screw 302 is a tool for fastening a machine member of an object step by utilizing physics and mathematical principles of inclined circular rotation and friction of the object, the screw is a general term of a fastening member, and a daily oral language, the screw is an indispensable industrial necessity in daily life, such as a camera, glasses, a clock, an extremely small screw used by electronics, etc., a general screw for a television, an electric product, a musical instrument, furniture, etc., as for engineering, construction, a bridge, a large screw, a nut, a transportation device, an airplane, a trolley bus, an automobile, etc., is a large screw and a small screw, and a large screw is used together, and the screw has an important task in industry as long as there is an industry on the earth, the function of the screw is always important, the screw is a common invention in production and life of people for thousands of years, and the screw is the first invention of human according to the application field.
When the positioning device is used, the positioning device is installed on the machine body 305, a power supply is switched on, an object is mapped on the filter lens 1109 through the window 1104, an analog signal is transmitted to the thermal electric plate 1108 through the filter lens 1109, the thermal electric plate 1108 transmits the signal to the circuit element 1107, the analog signal is converted into a digital signal through the circuit element 1107, the digital signal is transmitted to the machine body 305 through the FET pipe 1101, coating is started, the position of the object is accurately positioned, and the coating uniformity of the object is guaranteed.
The invention solves the problems of inaccurate position calibration and positioning and uneven fluorescent powder coating caused by the phenomenon of offset in the prior art, and the invention installs the positioning device on the machine body through the mutual combination of the components, switches on the power supply, maps the object on the filter lens through the window, transmits the analog signal to the thermoelectric plate through the filter lens, transmits the signal to the circuit original through the thermoelectric plate, converts the analog signal into the digital signal through the circuit original, transmits the digital signal to the machine body through the FET tube, and starts coating, thereby accurately positioning the position of the object and ensuring the uniform coating of the object.
It is to be understood that the described embodiments are merely a few embodiments of the invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Claims (1)
1. An LED packaging process, comprising the following steps:
s1: dispensing silver paste on the support, and then adhering the chip to the silver paste to obtain the LED;
s2: carrying out die bonding operation on the LED by using a die bonding machine;
s3: carrying out primary die pressing on the LED by using die pressing equipment;
s4: coating the LED with a fluorescent film by using fluorescent coating equipment;
s5: drying the fluorescent film by adopting drying equipment;
s6: carrying out secondary die pressing on the LED by using die pressing equipment;
s7: finally, packaging the LEDs by using a packaging machine, and warehousing the packaged LEDs;
the dispensing equipment (1) comprises a chute plate (111), a workbench surface (112), a switch (113), an emergency stop switch (114), a control panel (115), a base (116), a display screen (117), an adjustable workbench (118), a control knob (119), a dispensing controller (120), a dispensing head (121), a feeding pipe (122), a connecting plate (123) and a slider (124), wherein the lower surface of the chute plate (111) is parallel to the upper surface of the workbench surface (112);
the adjustable workbench (118) consists of a workbench (801), a first telescopic arm (802), a second telescopic arm (803), a third telescopic arm (804), a chute ring (805) and a chute (806);
the lower part of the workbench (801) is connected with the upper part of a first telescopic arm (802), the rear side of the first telescopic arm (802) is arranged at the front side of a second telescopic arm (803), the upper part of a third telescopic arm (804) is arranged on the second telescopic arm (803), and the inner side of the chute ring (805) is connected with the outer side of a chute (806);
the mould pressing equipment (2) comprises a driving motor (201), a control panel (202), a display screen (203), a heat dissipation port (204), a transmission shaft (205), a fixed table, a fixed support (207), a transmission bearing (208) and a fixed support (209), wherein the control panel (202) is embedded in the upper right end of the driving motor (201);
the fixed table comprises a fixed table framework (601), a cushion block (602), a sliding groove (603), an upper fixed plate (604), a lower fixed plate (605), a fixed limiting frame (606), a positioning block sliding groove (607) and a positioning block (608), wherein the lower end of the cushion block (602) is bonded with the upper end of the fixed table framework (601);
the sliding groove (603) is embedded and installed at the upper end of the cushion block (602), the lower end of the upper fixing plate (604) is attached to the upper end of the sliding groove (603), the lower fixing plate (605) and the upper fixing plate (604) are at the same height, and the fixed limiting frame (606) and the fixed table framework (601) are of an integrated structure; the positioning block sliding groove (607) is embedded in the middle end of the upper fixing plate (604), the lower end of the positioning block (608) is bonded with the upper end of the positioning block sliding groove (607), the front end of the transmission shaft (205) is attached to the rear end of the driving motor (201), the transmission bearing (208) is embedded in the middle end of the fixing support (207), and the fixing support (207) and the fixing table framework (601) are of an integrated structure;
the fluorescent device (3) comprises a display screen (301), screws (302), an object table (303), a fixed frame (304), a machine body (305), a power interface (306), support legs (307), a pressure gauge (308), an operation board (309), an adjusting switch (310), a positioning device, an applicator (312), an emergency stop button (313), an object (314), a cabinet door (315) and a handle (316);
the positioning device comprises an FET (1101), a shell (1102), a supporting ring (1103), a window (1104), pins (1105), a base (1106), a circuit element (1107), a thermoelectric plate (1108) and a filter lens (1109), wherein the FET (1101) is positioned at the upper end of the circuit element (1107), the shell (1102) and the window (1104) are of an integrated structure, the supporting ring (1103) is positioned inside the shell (1102), the pins (1105) penetrate through the base (1106), the circuit element (1107) is positioned inside the shell (1102), and the lower surface of the thermoelectric plate (1108) is attached to the upper surface of the filter lens (1109);
when the positioning device is used, the positioning device is installed on a machine body (305), a power supply is switched on, an object is mapped on a filter lens (1109) through a window (1104), an analog signal is transmitted to a thermoelectric plate (1108) through the filter lens (1109), the signal is transmitted to a circuit element (1107) through the thermoelectric plate (1108), the analog signal is converted into a digital signal through the circuit element (1107), the digital signal is transmitted to the machine body (305) through an FET (1101), and coating is started.
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CN201711434910.0A CN108231982B (en) | 2017-12-26 | 2017-12-26 | LED packaging process |
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CN201711434910.0A CN108231982B (en) | 2017-12-26 | 2017-12-26 | LED packaging process |
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CN108231982A CN108231982A (en) | 2018-06-29 |
CN108231982B true CN108231982B (en) | 2020-10-30 |
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CN110767109B (en) * | 2019-10-31 | 2021-07-20 | 湖南合利来智慧显示科技有限公司 | LED screen manufacturing method for improving yield |
CN113782471A (en) * | 2021-09-14 | 2021-12-10 | 深圳市兆驰晶显技术有限公司 | LED screen packaging process based on LED flip chip packaging technology and LED screen |
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CN103065983A (en) * | 2011-10-24 | 2013-04-24 | 安华高科技Ecbuip(新加坡)私人有限公司 | Simultaneous silicone dispension on coupler |
CN204834687U (en) * | 2015-07-31 | 2015-12-02 | 黄山市展硕半导体科技有限公司 | Back of body light source chip's wafer seals equipment of glue |
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CN101694861A (en) * | 2009-10-15 | 2010-04-14 | 苏州中泽光电科技有限公司 | Encapsulation method preventing LED fluorescent powder from precipitation |
CN103296184A (en) * | 2013-05-31 | 2013-09-11 | 左洪波 | Manufacturing method for light-emitting diode (LED) lamp strip using sapphire as chip support |
CN103762298A (en) * | 2014-02-02 | 2014-04-30 | 芜湖市神龙新能源科技有限公司 | LED wafer combination package material and technology |
CN104091877A (en) * | 2014-07-01 | 2014-10-08 | 东莞市万丰纳米材料有限公司 | LED production process |
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CN103065983A (en) * | 2011-10-24 | 2013-04-24 | 安华高科技Ecbuip(新加坡)私人有限公司 | Simultaneous silicone dispension on coupler |
CN204834687U (en) * | 2015-07-31 | 2015-12-02 | 黄山市展硕半导体科技有限公司 | Back of body light source chip's wafer seals equipment of glue |
CN106505141A (en) * | 2016-12-29 | 2017-03-15 | 深圳市微恒自动化设备有限公司 | A kind of bonder and die-bonding method |
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