CN204834687U - Back of body light source chip's wafer seals equipment of glue - Google Patents
Back of body light source chip's wafer seals equipment of glue Download PDFInfo
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- CN204834687U CN204834687U CN201520573050.9U CN201520573050U CN204834687U CN 204834687 U CN204834687 U CN 204834687U CN 201520573050 U CN201520573050 U CN 201520573050U CN 204834687 U CN204834687 U CN 204834687U
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Abstract
The utility model relates to a back of body light source chip's wafer seals equipment of glue, including the bottom plate, set up the guide rail on the bottom plate, can follow the gliding layer board of guide rail, support that perpendicular bottom plate set up, be provided with on the support with guide rail looks vertically spout, still be provided with the fixed block that can follow the spout and remove on the support, being provided with the packing element on the fixed block, being connected with the trachea on the packing element, the aerostatic press is connected to the tracheal other end, be provided with the spacing boss of multiunit and wafer looks adaptation on the layer board, and a plurality of open slots of being convenient for draw the wafer are seted up to the left and right sides of layer board. The utility model discloses can effectively solve present wafer and seal and glue technology and exist and need grain of operating personnel to seal to glue, work efficiency is slow, and easily takes place to touch wafer and aluminum wire, and damages the product, influence the problem of product yield and quality, and simple structure, easy and simple to handle, but wide application in back of the body light source chip's a wafer gluey field.
Description
Technical field
The utility model relates to a kind of wafer sealing equipment of backlight chip.
Background technology
LCD is the display unit of non-luminescent, just need can reach the function of display by backlight.The quality of backlight performance is except can directly affect except LCD video picture quality, and the cost of backlight accounts for the 3-5% of LCD module, and the electric power consumed more accounts for 75% of module, can say it is considerable spare part in LCD module.Fine, large-sized LCD, high performance backlight technology must be had to coordinate with it, therefore, while LCD industry makes great efforts developing new opplication field, the high performance of backlight technology (as high brightness, cost degradation, power reducing, lightening etc.) also plays the role of person who has rendered outstanding service behind the scenes.
In the production process of backlight, after giving the binding of backlight chip die bond, need with casting glue product is airtight, to play the effect of protection and increase brightness.In sealing, usually need operating personnel to carry out sealing with one one, syringe needle, operating efficiency is slow, and easily touches wafer and aluminum steel, and damages product, affects yield and the quality of product.
Utility model content
The purpose of this utility model is to provide a kind of wafer sealing equipment of backlight chip, solve existing wafer sealing adhesive process to also exist and need operating personnel's grain to carry out sealing, operating efficiency is slow, and easily touches wafer and aluminum steel, and damage product, affect the problem of product yield and quality.
The utility model solves the wafer sealing equipment that technical scheme that its technical problem adopts is a kind of backlight chip, comprises base plate, is arranged on the guide rail on base plate, can along the supporting plate of slide, the support that vertical base plate is arranged; Support is provided with the chute perpendicular with guide rail, support is also provided with can along the fixed block of chute movement; Fixed block is provided with packing element, packing element is connected with tracheae, the other end of tracheae connects aerostatic press; Supporting plate is provided with many groups and the suitable positive stop lug boss of wafer, and the left and right sides of supporting plate offers multiple open slot being convenient to extraction wafer.
In order to more convenient dismounting and location packing element, fixed block is also provided with mounting panel, mounting panel is provided with the appliance stand suitable with packing element; Mounting panel is also provided with and organizes installing hole more, on appliance stand detachable apparatus one group of installing hole wherein.
In order to more convenient dismounting and fixing packing element, appliance stand is provided with upper placement hole, lower placement hole that packing element upper/lower terminal side face is suitable respectively, be provided with the split ring that circumference is adjustable in upper placement hole, upper placement hole is also provided with the rotary screw suitable with split ring outer wall.
Treating a glue product to better locate, supporting plate being provided with and organizing positive stop lug boss more, often organizing positive stop lug boss has four, suitable with the corner of product respectively.
Preferably, support is door font, and chute is arranged on the crossbeam of support.
In order to meet the demand of product for positive stop lug boss of different size, and be convenient to extract product, supporting plate is provided with two-layer, and comprise steel plate layer and the Ya Geli flaggy of detachable apparatus in steel plate layer, positive stop lug boss and open slot are arranged on Ya Geli flaggy.
The beneficial effects of the utility model: disposablely can carry out sealing to wafer in many by the wafer sealing equipment of this backlight chip, substantially increase the efficiency of sealing, and due in operating process, without the need to manually contacting sealing position, can effectively avoid because touching wafer and aluminum steel, and cause the damage of product, affect the problem of product quality and yield.
The utility model effectively can solve existing wafer sealing adhesive process and also exist and need operating personnel's grain to carry out sealing, operating efficiency is slow, and easily touch wafer and aluminum steel, and damage product, affect the problem of product yield and quality, and structure is simple, easy and simple to handle, the wafer sealing field of backlight chip can be widely used in.
Below with reference to drawings and Examples, the utility model is described in detail.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Fig. 2 is the structural representation of mounting panel and appliance stand.
Embodiment
Embodiment, the wafer sealing equipment of a kind of backlight chip as shown in Figure 1 and Figure 2, is characterized in that: comprise base plate 1, is arranged on the guide rail 2 on base plate 1, the supporting plate 3 that can slide along guide rail 2, the support 4 that vertical base plate 1 is arranged; Support 4 is provided with the chute 5 perpendicular with guide rail 2, support 4 is also provided with can along the fixed block 6 of chute 5 movement; Fixed block 6 is provided with packing element 7, packing element 7 is connected with tracheae 15, the other end of tracheae 15 connects aerostatic press 16; Supporting plate 1 is provided with many groups and the suitable positive stop lug boss 14 of wafer, and the left and right sides of supporting plate 1 offers multiple open slot 15 being convenient to extraction wafer.Supporting plate 3 is provided with two-layer, and comprise steel plate layer 18 and the Ya Geli flaggy 19 of detachable apparatus in steel plate layer 18, positive stop lug boss 14 is arranged on Ya Geli flaggy 19.Fixed block 6 drives it to slide on chute 5 by driving mechanism, base plate 1 is provided with the control button 17 starting driving mechanism.
Fixed block 6 is also provided with mounting panel 8, mounting panel 8 is provided with the appliance stand 9 suitable with packing element 7; Mounting panel 8 is also provided with many group installing holes 20, on appliance stand 9 detachable apparatus one group of installing hole 20 wherein.Appliance stand 9 is provided with upper placement hole 10, lower placement hole 11 that packing element 7 upper/lower terminal side face is suitable respectively, be provided with the adjustable split ring of circumference 12 in upper placement hole 10, upper placement hole 10 is also provided with the rotary screw 13 suitable with split ring 12 outer wall.Supporting plate 3 is provided with many group positive stop lug boss 14, often group restriction boss 14 has four, suitable with the corner of product respectively.Support 4 is in door font, and chute 5 is on the crossbeam of support 4.
Operation principle: chip device on supporting plate, undertaken spacing by restriction boss, then promote supporting plate, supporting plate slides to desired location on guide rail.Simultaneously in the upper placement hole of glue cylinder fixing device on appliance stand and lower placement hole, then controlled the closed degree of split ring by rotary screw, packing element can firmly be fixed.The height of packing element is regulated again by installing hole.When the height of packing element reaches desired location, start control button, driving mechanism drives fixed block to move on chute, drives packing element transverse movement, and regulates the air pressure in packing element by aerostatic press, and the wafer enable is covered sealing by the glue flowed out in packing element.
Claims (6)
1. the wafer sealing equipment of a backlight chip, it is characterized in that: comprise base plate (1), be arranged on the guide rail (2) on base plate (1), the supporting plate (3) that can slide along guide rail (2), the support (4) that vertical base plate (1) is arranged; Support (4) is provided with the chute (5) perpendicular with guide rail (2), support (4) is also provided with can along the fixed block (6) of chute (5) movement; Fixed block (6) is provided with packing element (7), packing element (7) is connected with tracheae (15), the other end of tracheae (15) connects aerostatic press (16); Supporting plate (1) is provided with many groups and the suitable positive stop lug boss (14) of wafer, and the left and right sides of supporting plate (1) offers multiple open slot (15) being convenient to extraction wafer.
2. the wafer sealing equipment of backlight chip according to claim 1, it is characterized in that: fixed block (6) is also provided with mounting panel (8), mounting panel (8) is provided with the appliance stand (9) suitable with packing element (7); Mounting panel (8) is also provided with and organizes installing hole (20) more, on appliance stand (9) detachable apparatus one group of installing hole (20) wherein.
3. the wafer sealing equipment of backlight chip according to claim 2, it is characterized in that: appliance stand (9) is provided with upper placement hole (10), lower placement hole (11) that packing element (7) upper/lower terminal side face is suitable respectively, be provided with the adjustable split ring of circumference (12) in upper placement hole (10), upper placement hole (10) be also provided with the rotary screw (13) suitable with split ring (12) outer wall.
4. the wafer sealing equipment of the backlight chip according to claims 1 to 3 any one, is characterized in that: often organizing positive stop lug boss (14) has four, suitable with the corner of product respectively.
5. the wafer sealing equipment of backlight chip according to claim 4, is characterized in that: support (4) is in door font, and chute (5) is arranged on the crossbeam of support (4).
6. the wafer sealing equipment of backlight chip according to claim 5, it is characterized in that: supporting plate (3) is provided with two-layer, comprise steel plate layer (18) and the Ya Geli flaggy (19) of detachable apparatus in steel plate layer (18), positive stop lug boss (14) is arranged on Ya Geli flaggy (19).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520573050.9U CN204834687U (en) | 2015-07-31 | 2015-07-31 | Back of body light source chip's wafer seals equipment of glue |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520573050.9U CN204834687U (en) | 2015-07-31 | 2015-07-31 | Back of body light source chip's wafer seals equipment of glue |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204834687U true CN204834687U (en) | 2015-12-02 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520573050.9U Active CN204834687U (en) | 2015-07-31 | 2015-07-31 | Back of body light source chip's wafer seals equipment of glue |
Country Status (1)
| Country | Link |
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| CN (1) | CN204834687U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108231982A (en) * | 2017-12-26 | 2018-06-29 | 杭州迅盈光电科技有限公司 | A kind of LED packaging technologies |
-
2015
- 2015-07-31 CN CN201520573050.9U patent/CN204834687U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108231982A (en) * | 2017-12-26 | 2018-06-29 | 杭州迅盈光电科技有限公司 | A kind of LED packaging technologies |
| CN108231982B (en) * | 2017-12-26 | 2020-10-30 | 台州市领拓塑业有限公司 | LED packaging process |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |