CN209133476U - Automate sealed in unit - Google Patents
Automate sealed in unit Download PDFInfo
- Publication number
- CN209133476U CN209133476U CN201920018054.9U CN201920018054U CN209133476U CN 209133476 U CN209133476 U CN 209133476U CN 201920018054 U CN201920018054 U CN 201920018054U CN 209133476 U CN209133476 U CN 209133476U
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- heating
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- solidification equipment
- sealed
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Abstract
The utility model relates to sealed in unit fields, in particular to a kind of automation sealed in unit, including controlling cabinet, the control cabinet upper surface is provided with transport device, the transport device side is provided with point glue equipment, the other side is provided with transfer device, the side of the transfer device is provided with jig disk, control system is provided in the control cabinet, the transport device, point glue equipment, transfer device is connected to the control system respectively, the rear end of the transport device is provided with solidification equipment, the solidification equipment and transport device are seamlessly connected, the solidification equipment side is provided with heating device, the heating device is connected with solidification equipment, the heating device is connected to the control system.Compared with prior art, the automation sealed in unit of the utility model has saved cost, and saved the space of place apparatus, has shortened curing time, improved production efficiency without in addition being solidified with a solder reflow device to product.
Description
[technical field]
The utility model relates to sealed in unit fields, in particular to automation sealed in unit.
[background technique]
Existing bonder die bond process is first by feed mechanism bracket or pcb board to be transmitted to operating position, then by dispensing
Bracket or pcb board are needed on the location point of bonding wafer silver paste or tin to starch by mechanism, then bonding arm by chip be placed on silver paste or
Bonding is completed on tin slurry.The chip being bonded is transported to a solder reflow device by cutting agency, by Reflow Soldering high temperature and
Solidify the production for completing product for a long time.
Prior art completion product solidifies the bonding for needing to use bonder to chip, then needs to be set with a Reflow Soldering
The standby solidification carried out to product, thus very big to equipment occupation space requirement, the efficiency of fixed line is lower, and cost is relatively
It is high.
[utility model content]
In order to overcome the above problem, the utility model proposes the automation encapsulation that one kind can effectively solve the above problems to set
It is standby.
The utility model solves a kind of technical solution that above-mentioned technical problem provides: providing a kind of automation and encapsulates and sets
It is standby, including cabinet is controlled, the control cabinet upper surface is provided with transport device, and the transport device side is provided with a mucilage binding
It sets, the other side is provided with transfer device, and the side of the transfer device is provided with jig disk, is provided with control in the control cabinet
System processed, the transport device, point glue equipment, transfer device are connected to the control system respectively, the rear end of the transport device
It is provided with solidification equipment, the solidification equipment and transport device are seamlessly connected, and the solidification equipment side is provided with heating device,
The heating device is connected with solidification equipment, and the heating device is connected to the control system.
Preferably, the solidification equipment includes rail bed, and heating track, the heating track is arranged above rail bed
Top covers track cover board, and the side of the heating track opens up multiple bottoming holes, heating rod is plugged in the bottoming hole, described
Heating rod is connected to heating device, and temperature control hole is arranged between adjacent two bottoming hole, electroheat pair, electroheat pair is arranged in the temperature control hole
It is connected to heating device, the side of the track cover board offers multiple ventholes, and venthole is connected to track cover board and heating
Suction nozzle is arranged on venthole in the covering surface of track.
Preferably, multiple screw holes are opened up on the track cover board, screw connection track cover board is worn in screw hole and is added
Hot orbit.
Preferably, two heating rods are set in the bottoming hole.
Preferably, Heat Conduction Material is filled in the bottoming hole.
Preferably, the bottoming hole runs through heating track.
Compared with prior art, the automation sealed in unit of the utility model is provided with solid by the rear end in transport device
Makeup is set, so that bracket or pcb board are by transporting apparatus transports to solidification equipment, heating device heats solidification equipment,
Bracket or pcb board are after the solidification equipment of high temperature, and silver paste or tin slurry complete solidification, and wafer package is completed, without in addition with one
Platform solder reflow device solidifies product, has saved cost, and has saved the space of place apparatus, shortens curing time, mentions
High efficiency.
[Detailed description of the invention]
Fig. 1 is that a kind of structure for automating sealed in unit of the utility model overlooks block diagram；
Fig. 2 is a kind of solidification equipment three-dimensional structure diagram for automating sealed in unit of the utility model；
Fig. 3 is a kind of solidification equipment overlooking structure figure for automating sealed in unit of the utility model.
[specific embodiment]
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation
Example, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is only used for explaining
The utility model is not used to limit the utility model.
It is to be appreciated that the directional instruction (such as up, down, left, right, before and after ...) of institute in the utility model embodiment
It is only limitted to the relative position in given view, rather than absolute position.
In addition, the description for being such as related to " first ", " second " in the present invention is used for description purposes only, and cannot manage
Solution is its relative importance of indication or suggestion or the quantity for implicitly indicating indicated technical characteristic.Define as a result, " the
One ", the feature of " second " can explicitly or implicitly include at least one of the features.It is " more in the description of the present invention,
It is a " it is meant that at least two, such as two, three etc., unless otherwise specifically defined.
It please refers to Fig.1 to Fig.3, a kind of automation sealed in unit of the utility model, including control cabinet 10, the control
10 upper surface of cabinet is provided with transport device 50, and 50 side of transport device is provided with point glue equipment 40, and the other side is provided with
The side of transfer device 20, the transfer device 20 is provided with jig disk 30.It is provided with control system in the control cabinet 10,
The transport device 50, point glue equipment 40, transfer device 20 are connected to the control system respectively.The rear end of the transport device 50
It is provided with solidification equipment 60, the solidification equipment 60 is seamlessly connected with transport device 50, and 60 side of solidification equipment is provided with
Heating device 70, the heating device 70 are connected with solidification equipment 60, and the heating device 70 is connected to the control system.
It is placed with bracket or pcb board on the transport device 50, chip is placed in jig disk 30, point glue equipment 40 will prop up
Frame or pcb board need silver paste or tin slurry, transfer device 20 on the location point of bonding wafer to arrive the carrying wafers in jig disk 30
On bracket or pcb board, bracket or pcb board pass through transport device 50 and transport solidification equipment 60, and heating device 70 is to solidification equipment
60 are heated, and bracket or pcb board are after the solidification equipment 60 of high temperature, and silver paste or tin slurry complete solidification, and wafer package is completed.
The solidification equipment 60 includes rail bed 61, and heating track 62, rail bed 61 is arranged above rail bed 61
Play a supportive role to heating track 62, above the heating track 62 cover track cover board 63, track cover board 63 prevent air into
Enter heating track 62, protection product is not easy to be oxidized.The side of the heating track 62 opens up multiple bottoming holes 64, the heating
Heating rod 65 is plugged in hole 64, the heating rod 65 is connected to heating device 70, and heating device 70 passes through the 65 pairs of heating of heating side
Track 62 carries out heat temperature raising.Temperature control hole 66 is set between adjacent two bottoming hole 64, electroheat pair, electricity are set in the temperature control hole 66
Thermocouple is connected to heating device 70, and the heating temperature of heating rod 65 is controlled by heating device 70.The side of the track cover board 63
Portion offers multiple ventholes 67, and venthole 67 is connected to the covering surface of track cover board 63 Yu heating track 62, on venthole 67
Suction nozzle 68 is set, and suction nozzle 68 is passed through nitrogen protection, more preferable to protect product not oxidized.It is opened up on the track cover board 63 more
A screw hole 69 wears screw connection track cover board 63 and heating track 62 in screw hole 69.
Two heating rods 65 are set in the bottoming hole 64, are conducive to improve heating efficiency.Filling is led in the bottoming hole 64
Hot material is conducive to improve heat transfer efficiency, further increases heating rod 65 to the heating efficiency of heating track 62.The bottoming hole 64
Through heating track 62.
Compared with prior art, the automation sealed in unit of the utility model in the rear end of transport device 50 by being provided with
Solidification equipment 60, so that bracket or pcb board transport solidification equipment 60 by transport device 50, heating device 70 is to solidification equipment
60 are heated, and bracket or pcb board are after the solidification equipment 60 of high temperature, and silver paste or tin slurry complete solidification, and wafer package is completed,
Without in addition being solidified with a solder reflow device to product, cost is saved, and saved the space of place apparatus, shortened
Curing time improves production efficiency.
The above is only the preferred embodiment of the present invention, and therefore it does not limit the scope of the patent of the utility model,
All any modifications made within the design of the utility model, equivalent replacement and improvement etc. should be included in the utility model
Scope of patent protection in.
Claims (6)
1. automating sealed in unit, which is characterized in that including controlling cabinet, the control cabinet upper surface is provided with transport dress
It sets, the transport device side is provided with point glue equipment, and the other side is provided with transfer device, the side setting of the transfer device
Have jig disk, be provided with control system in the control cabinet, the transport device, point glue equipment, transfer device respectively with control
System processed is connected, and the rear end of the transport device is provided with solidification equipment, and the solidification equipment and transport device are seamlessly connected,
The solidification equipment side is provided with heating device, and the heating device is connected with solidification equipment, the heating device and control
System processed is connected.
2. automation sealed in unit as described in claim 1, which is characterized in that the solidification equipment includes rail bed, rail
Heating track is set above road pedestal, covers track cover board above the heating track, the side of the heating track opens up more
A bottoming hole plugs heating rod in the bottoming hole, and the heating rod is connected to heating device, is arranged between adjacent two bottoming hole
Electroheat pair is arranged in the temperature control hole for temperature control hole, and electroheat pair is connected to heating device, and the side of the track cover board offers more
A venthole, venthole are connected to the covering surface of track cover board and heating track, suction nozzle are arranged on venthole.
3. automation sealed in unit as claimed in claim 2, which is characterized in that open up multiple screws on the track cover board
Hole wears screw connection track cover board and heating track in screw hole.
4. automation sealed in unit as claimed in claim 2, which is characterized in that two heating rods are arranged in the bottoming hole.
5. automation sealed in unit as claimed in claim 2, which is characterized in that fill Heat Conduction Material in the bottoming hole.
6. automation sealed in unit as claimed in claim 2, which is characterized in that the bottoming hole runs through heating track.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920018054.9U CN209133476U (en) | 2019-01-03 | 2019-01-03 | Automate sealed in unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920018054.9U CN209133476U (en) | 2019-01-03 | 2019-01-03 | Automate sealed in unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209133476U true CN209133476U (en) | 2019-07-19 |
Family
ID=67249726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920018054.9U Active CN209133476U (en) | 2019-01-03 | 2019-01-03 | Automate sealed in unit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209133476U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112885744A (en) * | 2021-01-18 | 2021-06-01 | 深圳市华星光电半导体显示技术有限公司 | Die bonder for SMT (surface mount technology) |
-
2019
- 2019-01-03 CN CN201920018054.9U patent/CN209133476U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112885744A (en) * | 2021-01-18 | 2021-06-01 | 深圳市华星光电半导体显示技术有限公司 | Die bonder for SMT (surface mount technology) |
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