CN205488054U - Transport of smart card chip and packaging hardware - Google Patents
Transport of smart card chip and packaging hardware Download PDFInfo
- Publication number
- CN205488054U CN205488054U CN201620018539.4U CN201620018539U CN205488054U CN 205488054 U CN205488054 U CN 205488054U CN 201620018539 U CN201620018539 U CN 201620018539U CN 205488054 U CN205488054 U CN 205488054U
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- China
- Prior art keywords
- axis
- chip
- slide block
- soup stick
- vertical
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a transport of smart card chip and packaging hardware, including the moving mechanism who encapsulates the head and be connected with the encapsulation head, moving mechanism is including the X axle moving mechanism, Y axle moving mechanism and the Z axle moving mechanism that connect gradually, the encapsulation head is connected on Z axle moving mechanism, still include chip suction means, this chip suction means includes soup stick, rotary mechanism and vertical moving mechanism, wherein, vertical passing through is followed to the soup stick the encapsulation head, the lower extreme of this soup stick is equipped with the suction nozzle, and this soup stick is connected with vacuum device, the upper end and the rotary mechanism of soup stick are connected, and this rotary mechanism and vertical moving mechanism are connected, and this vertical moving mechanism is connected with Y axle moving mechanism's moving member. The utility model discloses a can rotate the chip as required in chip transport and the packaging hardware working process, make it to accord with different orientation and require, improve the production flexibility, satisfy diversified production demand.
Description
Technical field
This utility model relates to smart card and produces equipment, is specifically related to a kind of intelligent card chip carrying and encapsulation dress
Put.
Background technology
In the production process of contact intelligent card, need in chip package to the chip slot of card body.Entering
Row chip package adds man-hour, first is transported to encapsulate station by card body to be packaged by card transport, connects
And by chip blanking apparatus, the chip on chip belt is swept away, finally carried by chip and packaging system is by stamping-out
Good chip is carried and is encapsulated in the chip slot of card body.The carrying of existing chip and packaging system are mainly by sealing
The travel mechanism of dress suction nozzle and driving encapsulation suction nozzle movement in three dimensions is constituted, and wherein, described encapsulation is inhaled
Head is connected with negative pressure device, draws and carries chip, be provided with heating in encapsulation header by the way of vac sorb
Element, for heating the adhesive glue on chip, is allowed to melted and bonds with card body.Existing chip carrying and
In packaging system, described travel mechanism is by X-axis travel mechanism, Y-axis moving mechanism and Z axis travel mechanism
Constitute, realize chip movement in three dimensions and location by the linear motion in three directions, actual raw
Product has the disadvantage that
Owing to chip placing direction on card body has fixing requirement, existing travel mechanism by chip from
Blanking apparatus is transported to encapsulate station time, chip towards immobilizing, following when, this
Travel mechanism just cannot meet production requirement: 1, in having twin-core (two chips) or the card of multicore,
Chip towards general the most different, existing travel mechanism can not meet all chips towards requiring；2、
When chip blanking apparatus chips band arrangement change time, chip towards also changing, original
Travel mechanism is the most applicable.
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art, it is provided that a kind of intelligent card chip carrying and
Packaging system, can rotate chip in the carrying of this chip and packaging system work process as required,
It is allowed to meet different towards requiring, improves production chains, meet variation Production requirement.
This utility model solves the technical scheme of above-mentioned technical problem:
A kind of intelligent card chip carrying and packaging system, including encapsulation header and the moving machine that is connected with encapsulation header
Structure, described travel mechanism includes that the X-axis travel mechanism, Y-axis moving mechanism and the Z axis that are sequentially connected with move
Mechanism, described encapsulation header is connected in Z axis travel mechanism；It is characterized in that, also include chip pick-up mechanism,
This chip pick-up mechanism includes soup stick, rotating mechanism and vertically movable mechanism, and wherein, described soup stick is vertically
Passing through described encapsulation header, the lower end of this soup stick is provided with suction nozzle, and this soup stick is connected with negative pressure device；Described soup stick
Upper end be connected with rotating mechanism, this rotating mechanism is connected with vertically movable mechanism, this vertically movable mechanism and Y
The moving member of axle travel mechanism connects.
A preferred version of the present utility model, wherein, in chip pick-up mechanism, described rotating mechanism by
Rotary cylinder is constituted, and the rotating output shaft of this rotary cylinder is connected with soup stick；Described vertically movable mechanism includes
Vertical motor, vertical slide rail, vertical slide block and vertical lead-screw drive mechanism, wherein, described vertical motor
Being arranged on the moving member of Y-axis moving mechanism with vertical slide rail, described vertical slide block is arranged on vertical slide rail,
It is connected by described vertical lead-screw drive mechanism between described vertical slide block with vertical motor, described rotary cylinder
Cylinder body be fixed on vertical slide block.Pass through said structure, it is achieved the rotation of soup stick and vertically movable；Additionally,
Described rotating mechanism can also can be exported the actuating unit of rotary motion and constitute by motor etc., described vertical shifting
Motivation structure can the actuating unit of linear movement output can also be made up of cylinder, linear electric motors etc..
A preferred version of the present utility model, wherein, the top of described soup stick is connected on contiguous block, should
Contiguous block is fixed on the rotating output shaft of rotary cylinder；Described soup stick is hollow structure, on described contiguous block
Being provided with and the vacuum passage of soup stick inner space, this vacuum passage is connected with negative pressure device.By said structure,
Realize the connection of the connection of the rotating output shaft of soup stick and rotary cylinder and soup stick and negative pressure device.
A preferred version of the present utility model, wherein: described X-axis travel mechanism includes X-axis pedestal, X
Spindle motor, X-axis slide rail, X-axis slide block and X-axis lead-screw drive mechanism, wherein, X-axis motor and X-axis
Slide rail is connected on X-axis pedestal, and described X-axis slide block is arranged on X-axis slide rail, described X-axis slide block and X
Connected by described X-axis lead-screw drive mechanism between the main shaft of spindle motor；
Described Y-axis moving mechanism includes Y-axis pedestal, y-axis motor, Y-axis slide rail, Y-axis slide block and Y
Axle lead-screw drive mechanism, wherein, Y-axis pedestal is fixed on X-axis slide block, and y-axis motor and Y-axis slide rail are even
Being connected on Y-axis pedestal, described Y-axis slide block is arranged on Y-axis slide rail, described Y-axis slide block and Y-axis electricity
Connected by described Y-axis lead-screw drive mechanism between the main shaft of machine；Y-axis described in described Y-axis slide block composition
The moving member of travel mechanism；
It is sliding that described Z axis travel mechanism includes that Z axis pedestal and Z axis cylinder, described Z axis pedestal are connected to Y-axis
On block, and downwardly extend relative to Y-axis slide block；The expansion link of described Z axis cylinder passes through connecting plate and encapsulation
Head connects；Described vertical motor is fixed on Z axis pedestal.
A preferred version of the present utility model, wherein, described Z axis pedestal is made up of top base and bottom base,
Wherein, described vertical motor is fixed on the top of top base, and this top base is integrally fixed with Y-axis slide block；
Described vertical slide rail is arranged on the side of bottom base, and described Z axis cylinder is arranged on the opposite side of bottom base.
Operation principle of the present utility model is:
During work, under X-axis travel mechanism and Y-axis moving mechanism control, soup stick arrives chip blanking apparatus
Above the chip to be packaged that middle stamping-out is good, in chip pick-up mechanism under the control of vertically movable mechanism, soup stick
Move downward and chip is picked up；X-axis travel mechanism and Y-axis moving mechanism control to drive soup stick toward encapsulation subsequently
Moving at station, in this moving process, chip is moved up by the vertically movable mechanism in chip pick-up mechanism
It is allowed to contact with encapsulation header, thus chip is preheated, and before chip contact encapsulation header, if needed
Chip to be adjusted towards, the rotating mechanism in chip pick-up mechanism carries out certain angle to chip as required
Rotation；After chip arrives encapsulation station, vertically movable mechanism and Z axis in chip pick-up mechanism move
Mechanism drives soup stick and encapsulation header to move down respectively simultaneously, is finally embedded in the chip slot of card body by chip,
Chip is pressed in chip slot heating certain time by encapsulation header so that the adhesive glue on chip melted and with card
Body is bonded together, and completes one single chip encapsulation, carries out the encapsulation work of next chip subsequently.
This utility model compared with prior art has a following beneficial effect:
1, in carrying chip processes, chip can be revolved due to the rotating mechanism in chip pick-up mechanism
Turn, therefore no matter on card chip towards how or chip sweep away device chips towards how, all
Can in handling process by chip towards being adjusted to suitable angle, improve production chains, meet
Variation Production requirement.
2, chip can therefore be worked as at vertically movable chip due to the vertically movable mechanism in chip pick-up mechanism
After being picked up (when being necessary, chip being rotated), it is possible to contact moving on it with encapsulation header rapidly,
So that it is guaranteed that chip can preheat in transfer process, improve the efficiency of encapsulation.
Accompanying drawing explanation
Fig. 1-Fig. 4 is intelligent card chip of the present utility model carrying and a detailed description of the invention of packaging system
Structural representation, wherein, Fig. 1 is front view, and Fig. 2 is left view, and Fig. 3 is top view, and Fig. 4 is axonometric chart.
Fig. 5-Fig. 7 is the carrying of intelligent card chip shown in Fig. 1-Fig. 4 and packaging system ZhongZZhou travel mechanism and chip are inhaled
Taking the structural representation of mechanism, wherein, Fig. 5 is front view, and Fig. 6 is left view, and Fig. 7 is axonometric chart.
Detailed description of the invention
Below in conjunction with embodiment and accompanying drawing, this utility model is described in further detail, but this utility model
Embodiment be not limited to this.
Seeing Fig. 1-Fig. 4, intelligent card chip of the present utility model carrying and packaging system include frame 1, encapsulation
5 travel mechanisms being connected with encapsulation header 5 and chip pick-up mechanism 6, wherein, described travel mechanism wraps
Include X-axis travel mechanism 2, Y-axis moving mechanism 3 and the Z axis travel mechanism 4 being sequentially connected with, described encapsulation
5 are connected in Z axis travel mechanism 4；Described chip pick-up mechanism 6 include soup stick 6-1, rotating mechanism and
Vertically movable mechanism, wherein, described soup stick 6-1 vertically passes through described encapsulation header 5, under this soup stick 6-1
End is provided with suction nozzle, and this soup stick 6-1 is connected with negative pressure device；The upper end of described soup stick 6-1 is connected with rotating mechanism,
This rotating mechanism is connected with vertically movable mechanism, this vertically movable mechanism and the moving member of Y-axis moving mechanism 3
Connect.
Seeing Fig. 5-Fig. 7, in chip pick-up mechanism 6, described rotating mechanism is made up of rotary cylinder 6-2,
The rotating output shaft 6-21 of this rotary cylinder 6-2 is connected with soup stick 6-1；Described vertically movable mechanism includes erecting
To motor 6-3, vertical slide rail 6-4, vertical slide block 6-5 and vertical lead-screw drive mechanism 6-6, wherein, institute
State vertical motor 6-3 and vertical slide rail 6-4 to be arranged on the moving member of Y-axis moving mechanism 3, described vertical cunning
Block 6-5 is arranged on vertical slide rail 6-4, by described between described vertical slide block 6-5 and vertical motor 6-3
Vertical lead-screw drive mechanism 6-6 connects, and the cylinder body of described rotary cylinder 6-2 is fixed on vertical slide block 6-5.
Pass through said structure, it is achieved the rotation of soup stick 6-1 and vertically movable.
Seeing Fig. 5-Fig. 7, the top of described soup stick 6-1 is connected on contiguous block 6-7, and this contiguous block 6-7 is solid
It is scheduled on the rotating output shaft 6-21 of rotary cylinder 6-2；Described soup stick 6-1 is hollow structure, described connection
Block 6-7 is provided with and the vacuum passage 6-71 of soup stick 6-1 inner space, and this vacuum passage 6-71 fills with negative pressure
Put connection.Pass through said structure, it is achieved the company of the rotating output shaft 6-21 of soup stick 6-1 and rotary cylinder 6-2
Connect and the connection of soup stick 6-1 and negative pressure device.
Seeing Fig. 1-Fig. 4, described X-axis travel mechanism 2 includes X-axis pedestal 2-2, X-axis motor 2-1, X
Axle slide rail 2-3, X-axis slide block 2-4 and X-axis lead-screw drive mechanism 2-5, wherein, X-axis pedestal 2-2 is solid
Being scheduled in frame 1, X-axis motor 2-1 and X-axis slide rail 2-3 is connected on X-axis pedestal 2-2, described X
Axle slide block 2-4 is arranged on X-axis slide rail 2-3, described X-axis slide block 2-4 and the main shaft of X-axis motor 2-1
Between by described X-axis lead-screw drive mechanism 2-5 connect.
Described Y-axis moving mechanism 3 includes Y-axis pedestal 3-2, y-axis motor 3-1, Y-axis slide rail 3-3, Y
Axle slide block 3-4 and Y-axis lead-screw drive mechanism 3-5, wherein, Y-axis pedestal 3-2 is fixed on X-axis slide block 2-4
On, y-axis motor 3-1 and Y-axis slide rail 3-3 is connected on Y-axis pedestal 3-2, described Y-axis slide block 3-4
It is arranged on Y-axis slide rail 3-3, between described Y-axis slide block 3-4 and the main shaft of y-axis motor 3-1, passes through institute
State Y-axis lead-screw drive mechanism 3-5 to connect；Y-axis moving mechanism 3 described in described Y-axis slide block 3-4 composition
Moving member.
Described Z axis travel mechanism 4 includes Z axis pedestal 4-1 and Z axis cylinder 4-2, described Z axis pedestal 4-1
It is connected on Y-axis slide block 3-4, and downwardly extends relative to Y-axis slide block 3-4；Described Z axis cylinder 4-2
Expansion link be connected with encapsulation header 5 by connecting plate 4-3；Described vertical motor 6-3 is fixed on Z axis pedestal
On 4-1.
See Fig. 5-Fig. 7, described Z axis pedestal 4-1 to be made up of top base 4-11 and bottom base 4-12, wherein,
Described vertical motor 6-3 is fixed on the top of top base 4-11, and this top base 4-11 and Y-axis slide block 3-4 is solid
Fixed integral；Described vertical slide rail 6-4 is arranged on the side of bottom base 4-12, and described Z axis cylinder 4-2 sets
Put the opposite side at bottom base 4-12.
Operation principle of the present utility model is:
See Fig. 1-Fig. 7, during work, under X-axis travel mechanism 2 and Y-axis moving mechanism 3 control, inhale
Bar 6-1 arrives above the chip to be packaged that in chip blanking apparatus, stamping-out is good, vertical in chip pick-up mechanism 6
Under the control of travel mechanism, soup stick 6-1 moves downward and is picked up by chip；X-axis travel mechanism 2 and Y subsequently
Axle travel mechanism 3 controls to drive soup stick 6-1 to move at encapsulation station, in this moving process, and chip pick-up machine
Chip is moved up and is allowed to contact with encapsulation header 5 by the vertically movable mechanism in structure 6, thus carries out chip
Preheating, and before chip contact encapsulation header 5, if need to adjust chip towards, chip pick-up mechanism 6
In rotating mechanism as required chip is carried out the rotation of certain angle；After chip arrives encapsulation station,
Vertically movable mechanism and Z axis travel mechanism 4 in chip pick-up mechanism 6 drive soup stick 6-1 and encapsulation respectively
5 move down simultaneously, are finally embedded in the chip slot of card body by chip, and chip is compressed by encapsulation header 5
Chip slot heats certain time so that the adhesive glue on chip is melted and is bonded together with card body, complete
Become one single chip encapsulation, carry out the encapsulation work of next chip subsequently.
Above-mentioned for this utility model preferably embodiment, but embodiment of the present utility model is not by above-mentioned
The restriction of content, other any without departing from the change made under spirit of the present utility model and principle,
Modify, substitute, combine, simplify, all should be the substitute mode of equivalence, be included in guarantor of the present utility model
Within the scope of protecting.
Claims (5)
1. intelligent card chip carrying and a packaging system, including encapsulation header and the movement that is connected with encapsulation header
Mechanism, described travel mechanism includes that the X-axis travel mechanism, Y-axis moving mechanism and the Z axis that are sequentially connected with move
Motivation structure, described encapsulation header is connected in Z axis travel mechanism；It is characterized in that, also include chip pick-up machine
Structure, this chip pick-up mechanism includes soup stick, rotating mechanism and vertically movable mechanism, wherein, described soup stick edge
Vertically passing through described encapsulation header, the lower end of this soup stick is provided with suction nozzle, and this soup stick is connected with negative pressure device；Described
The upper end of soup stick is connected with rotating mechanism, and this rotating mechanism is connected with vertically movable mechanism, this vertically movable machine
Structure is connected with the moving member of Y-axis moving mechanism.
Intelligent card chip the most according to claim 1 carrying and packaging system, it is characterised in that at core
In sheet draw frame machine, described rotating mechanism is made up of rotary cylinder, the rotating output shaft of this rotary cylinder and suction
Bar connects；Described vertically movable mechanism includes vertical motor, vertical slide rail, vertical slide block and vertical leading screw
Drive mechanism, wherein, described vertical motor and vertical slide rail are arranged on the moving member of Y-axis moving mechanism,
Described vertical slide block is arranged on vertical slide rail, between described vertical slide block and vertical motor by described vertically
Lead-screw drive mechanism connects, and the cylinder body of described rotary cylinder is fixed on vertical slide block.
Intelligent card chip the most according to claim 2 carrying and packaging system, it is characterised in that described
The top of soup stick is connected on contiguous block, and this contiguous block is fixed on the rotating output shaft of rotary cylinder；Described
Soup stick is hollow structure, and described contiguous block is provided with and the vacuum passage of soup stick inner space, this vacuum passage
It is connected with negative pressure device.
4. carry and packaging system according to the intelligent card chip described in Claims 2 or 3, it is characterised in that
Wherein:
Described X-axis travel mechanism includes X-axis pedestal, X-axis motor, X-axis slide rail, X-axis slide block and X
Axle lead-screw drive mechanism, wherein, X-axis motor and X-axis slide rail are connected on X-axis pedestal, and described X-axis is sliding
Block is arranged on X-axis slide rail, by described X-axis leading screw between described X-axis slide block and the main shaft of X-axis motor
Drive mechanism connects；
Described Y-axis moving mechanism includes Y-axis pedestal, y-axis motor, Y-axis slide rail, Y-axis slide block and Y
Axle lead-screw drive mechanism, wherein, Y-axis pedestal is fixed on X-axis slide block, and y-axis motor and Y-axis slide rail are even
Being connected on Y-axis pedestal, described Y-axis slide block is arranged on Y-axis slide rail, described Y-axis slide block and Y-axis electricity
Connected by described Y-axis lead-screw drive mechanism between the main shaft of machine；Y-axis described in described Y-axis slide block composition
The moving member of travel mechanism；
It is sliding that described Z axis travel mechanism includes that Z axis pedestal and Z axis cylinder, described Z axis pedestal are connected to Y-axis
On block, and downwardly extend relative to Y-axis slide block；The expansion link of described Z axis cylinder passes through connecting plate and encapsulation
Head connects；Described vertical motor is fixed on Z axis pedestal.
Intelligent card chip the most according to claim 4 carrying and packaging system, it is characterised in that described
Z axis pedestal is made up of top base and bottom base, and wherein, described vertical motor is fixed on the top of top base, should
Top base is integrally fixed with Y-axis slide block；Described vertical slide rail is arranged on the side of bottom base, described Z axis
Cylinder is arranged on the opposite side of bottom base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620018539.4U CN205488054U (en) | 2016-01-07 | 2016-01-07 | Transport of smart card chip and packaging hardware |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620018539.4U CN205488054U (en) | 2016-01-07 | 2016-01-07 | Transport of smart card chip and packaging hardware |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205488054U true CN205488054U (en) | 2016-08-17 |
Family
ID=56664268
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620018539.4U Expired - Fee Related CN205488054U (en) | 2016-01-07 | 2016-01-07 | Transport of smart card chip and packaging hardware |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205488054U (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107293512A (en) * | 2017-08-05 | 2017-10-24 | 广州明森科技股份有限公司 | A kind of chip packaging device of multicore smart card |
| CN107986013A (en) * | 2017-12-13 | 2018-05-04 | 广州明森科技股份有限公司 | A kind of handling system for burning chip equipment |
| CN108405896A (en) * | 2018-02-07 | 2018-08-17 | 广州方阁建筑工程技术开发有限公司 | A kind of modified slick boring device |
| CN108421999A (en) * | 2018-02-07 | 2018-08-21 | 广州方阁建筑工程技术开发有限公司 | A kind of novel slick boring device |
| CN108436125A (en) * | 2018-02-07 | 2018-08-24 | 广州方阁建筑工程技术开发有限公司 | A kind of slick boring device |
| CN109230519A (en) * | 2018-10-25 | 2019-01-18 | 广州明森合兴科技有限公司 | A kind of chip feeding device of burning chip equipment |
| CN109262230A (en) * | 2018-11-03 | 2019-01-25 | 江苏通灵电器股份有限公司 | A kind of terminal box diode batch press-in device |
| CN109230519B (en) * | 2018-10-25 | 2024-04-05 | 广州明森合兴科技有限公司 | Chip loading attachment of chip burning equipment |
-
2016
- 2016-01-07 CN CN201620018539.4U patent/CN205488054U/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107293512A (en) * | 2017-08-05 | 2017-10-24 | 广州明森科技股份有限公司 | A kind of chip packaging device of multicore smart card |
| CN107293512B (en) * | 2017-08-05 | 2023-12-05 | 广州明森科技股份有限公司 | Chip packaging device of multi-core smart card |
| CN107986013A (en) * | 2017-12-13 | 2018-05-04 | 广州明森科技股份有限公司 | A kind of handling system for burning chip equipment |
| CN108405896A (en) * | 2018-02-07 | 2018-08-17 | 广州方阁建筑工程技术开发有限公司 | A kind of modified slick boring device |
| CN108421999A (en) * | 2018-02-07 | 2018-08-21 | 广州方阁建筑工程技术开发有限公司 | A kind of novel slick boring device |
| CN108436125A (en) * | 2018-02-07 | 2018-08-24 | 广州方阁建筑工程技术开发有限公司 | A kind of slick boring device |
| CN109230519A (en) * | 2018-10-25 | 2019-01-18 | 广州明森合兴科技有限公司 | A kind of chip feeding device of burning chip equipment |
| CN109230519B (en) * | 2018-10-25 | 2024-04-05 | 广州明森合兴科技有限公司 | Chip loading attachment of chip burning equipment |
| CN109262230A (en) * | 2018-11-03 | 2019-01-25 | 江苏通灵电器股份有限公司 | A kind of terminal box diode batch press-in device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160817 Termination date: 20220107 |