CN206405649U - A kind of device for being used to compress lead frame - Google Patents

A kind of device for being used to compress lead frame Download PDF

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Publication number
CN206405649U
CN206405649U CN201621105900.3U CN201621105900U CN206405649U CN 206405649 U CN206405649 U CN 206405649U CN 201621105900 U CN201621105900 U CN 201621105900U CN 206405649 U CN206405649 U CN 206405649U
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China
Prior art keywords
pressing
adjusting means
lead frame
connecting rod
rod
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CN201621105900.3U
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Chinese (zh)
Inventor
姚剑锋
陈建雄
张帆
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FOSHAN BLUE ROCKET ELECTRONICS Co Ltd
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FOSHAN BLUE ROCKET ELECTRONICS Co Ltd
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Priority to CN201621105900.3U priority Critical patent/CN206405649U/en
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Abstract

The utility model discloses a kind of device for being used to compress lead frame, including pedestal, for the drive device for controlling to move along a straight line above and below the pedestal, it is arranged at the connecting rod on pedestal, the first pressing for compressing the extremely corresponding pin of semiconductor first, the second pressing for compressing the extremely corresponding pin of semiconductor second, the 3rd pressing of core plate is carried for compressing, and is respectively used to adjust the first adjusting means, the second adjusting means and the 3rd adjusting means at the first pressing, the second pressing and the 3rd pressing angle of inclination;First adjusting means, the second adjusting means and the 3rd adjusting means are connected with the connecting rod respectively.Extremely corresponding first pin of semiconductor first, extremely corresponding second pin of semiconductor second are compressed by the first pressing, the second pressing and the 3rd pressing respectively and core plate is carried, the compression effect of lead frame is improved, so as to improve the quality of semiconductor leads welding.

Description

A kind of device for being used to compress lead frame
Technical field
The utility model is related to semiconductor die package field, more particularly to a kind of device for being used to compress lead frame.
Background technology
In semiconductor chip(Such as power device)In encapsulation process, this process of semiconductor chip bonding wire is particularly important.It is logical Often, automatic press welder is connected the pin corresponding with lead frame of the solder joint on chip with lead using ultrasound or heat ultrasound Come, in order to ensure firm welding, it is necessary to make framework be close in orbit, so that solder joint produces high temperature in bonding wire, make lead jail Admittedly be welded on pad.
In the method for existing compression power device lead frame, generally pressed simultaneously using integral type pressing plate, i.e. pressing plate The firmly load core plate and pin of framework, this method is simple, but has the disadvantage after automatic press welder long-play, may be deposited on track In dirt, cause pressing plate so as to cause not prison welding, product can not be reduced while compress the load core plate and pin of lead frame Quality.
It can be seen that, prior art could be improved and improve.
Utility model content
In view of in place of above-mentioned the deficiencies in the prior art, the purpose of this utility model is to provide a kind of for compressing lead frame The device of frame, it is intended to compress the load core plate and pin of lead frame respectively, improves semiconductor chip welding quality.
In order to achieve the above object, the utility model takes following technical scheme:
A kind of device for being used to compress lead frame, including pedestal, for the drive for controlling to move along a straight line above and below the pedestal Dynamic device, is arranged at the connecting rod on pedestal, and for compressing the first pin of correspondence semiconductor first pole on lead frame One pressing, the second pressing for compressing the second pin of correspondence semiconductor second pole on lead frame, for compressing lead frame 3rd pressing of the load core plate on frame, and be respectively used to adjust the first pressing, the second pressing and the 3rd pressing angle of inclination First adjusting means, the second adjusting means and the 3rd adjusting means;First adjusting means, the second adjusting means and the 3rd adjust Regulating device is connected with the connecting rod respectively, and one end of first pressing is connected with the connecting rod, and first pressing can Around with the rotation of the tie point of connecting rod, second pressing and the 3rd pressing by with the first pressing identical mode respectively with institute Connecting rod connection is stated, the drive device is arranged at below the pedestal.
In the described device for compressing lead frame, the connecting rod can be by movable relative to lead frame It is adjusted, adjustment is securable on the pedestal after completing.
In a kind of described device for compressing lead frame, the connecting rod includes head rod, the second connection And the 3rd connecting rod, the head rod is connected with the first adjusting means, and one end of first pressing is rotatably with One connecting rod is connected, first pressing can around with the rotation of the tie point of head rod, second connecting rod is by with the One connecting rod identical mode is connected with the second adjusting means and the second pressing, the 3rd connecting rod by with head rod Identical mode is connected with Article 3 adjusting means and the 3rd pressing.
In a kind of described device for compressing lead frame, first adjusting means includes being connected with described first First regulating block of bar connection, and for adjusting first adjusting rod at the first pressing angle of inclination;First regulating block is set There is the first adjustment hole, first adjusting rod inserts the first adjustment hole and abuts the first pressing;Second adjusting means passes through First adjusting means identical mode is provided with the second regulating block and the second adjusting rod, the 3rd adjusting means is by with One adjusting means identical mode is provided with the 3rd regulating block and the 3rd adjusting rod.
In a kind of described device for compressing lead frame, first adjusting means also includes being used to lock first First lock-screw of adjusting rod;First regulating block side is provided with being communicated with the first adjustment hole and sets female the One locking hole, first lock-screw is screwed into from the first locking hole and abuts and compress the first adjusting rod;The second regulation dress Put by being provided with the second locking hole and the second lock-screw with the first adjusting means identical mode, the 3rd adjusting means passes through With the locking hole of the first adjusting means identical mode the 3rd and the 3rd lock-screw.
It is described it is a kind of be used to compressing in the device of lead frame, described the first regulating block and head rod surround the One groove, one end of first pressing is inserted the first described groove and is attached with head rod by contacting, institute State position corresponding with connecting rod one end on the first pressing and be provided with the first arc groove;Second pressing with first by pressing Pin identical mode is connected with the second connecting rod and is provided with the second arc groove, the 3rd pressing by with the first pressing phase Same mode is connected with the 3rd connecting rod and is provided with three-arc groove.
In a kind of described device for compressing lead frame, the drive device is cylinder or motor.
Beneficial effect:
A kind of device for being used to compress lead frame that the utility model is provided, including pedestal, for controlling the pedestal The drive device moved along a straight line up and down, is arranged at the connecting rod on pedestal, for compressing the extremely corresponding pin of semiconductor first First pressing, the second pressing for compressing the extremely corresponding pin of semiconductor second carries the 3rd pressing of core plate for compressing, with And it is respectively used to adjust the first adjusting means, second adjusting means at the first pressing, the second pressing and the 3rd pressing angle of inclination And the 3rd adjusting means;First adjusting means, the second adjusting means and the 3rd adjusting means connect with the connecting rod respectively Connect.Extremely corresponding first pin of semiconductor first, semiconductor is compressed by the first pressing, the second pressing and the 3rd pressing respectively Two extremely corresponding second pins and load core plate, improve the compression effect of lead frame, so as to improve semiconductor leads weldering The quality connect.
Brief description of the drawings
Fig. 1 provides a kind of front view for being used to compress the device of lead frame for the utility model.
Fig. 2 for the utility model provide it is a kind of be used to compress in the device of lead frame, the first pressing, the second pressing and the The schematic diagram of three pressing impaction states.
Embodiment
The utility model provides a kind of device for being used to compress lead frame, to make the purpose of this utility model, technical side Case and effect are clearer, clear and definite, and the utility model is further described the embodiment that develops simultaneously referring to the drawings.It should manage Solution, specific embodiment described herein only to explain the utility model, is not used to limit the utility model.
Fig. 1 and Fig. 2 are referred to, the utility model provides a kind of device for being used to compress lead frame 60.
The described device for being used to compress lead frame 60 includes:Pedestal 10, for controlling pedestal straight line about 10 The drive device 50 of motion, is arranged at the connecting rod 20 on pedestal 10, for compressing correspondence semiconductor first on lead frame 60 First pressing 41 of the first pin 61 of pole, for compressing the second pin 62 of correspondence semiconductor second pole on lead frame 60 Second pressing 42, for compressing the 3rd pressing 43 of the load core plate 63 on lead frame 60, and is respectively used to the pressure of regulation first Pin 41, the first adjusting means 331 of the second pressing 42 and the angle of inclination of the 3rd pressing 43, the second adjusting means and the 3rd regulation dress Put;First adjusting means 331, the second adjusting means and the 3rd adjusting means are respectively with setting in the connecting rod 20, institute The one end for stating the first pressing 41 is connected with the connecting rod, and first pressing 41 can be rotated around with the tie point of connecting rod 20, The pressing 43 of second pressing 42 and the 3rd is described by being connected respectively with the connecting rod with the identical mode of the first pressing 41 Drive device 50 is arranged at the lower section of pedestal 10.It should be noted that due to the second adjusting means, the 3rd adjusting means and the The set-up mode of one adjusting means is identical, to avoid not showing the second adjusting means and the 3rd adjusting means in burden, accompanying drawing.
Specifically, when automatic press welder be in stopped status under, the track by the lead frame 60 along automatic press welder It is sent to and treats pressure welding position so that the first pressing 41, the top of the second pressing 42 and the 3rd pressing 43 in the lead frame 60, The first adjusting means 331, the second adjusting means and the 3rd adjusting means are adjusted respectively so that the first pressing 41, the second pressing 42 and the 3rd pressing 43 push down respectively the first pin 61, the second pin 62 and carry core plate 63, it is described load core plate 63 on post Semiconductor chip 70.When automatic press welder is run, first, drive device 50 drives the pedestal 10 motion upwards, lifts the One pressing 41, the second pressing 42 and the 3rd pressing 43, then the framework automatic carry is to pressure welding position, the then driving Device 50 drives the pedestal 10 to decline, and returns to home position, first pressing 41, the second pressing 42 and the 3rd pressing 43 The first pin 61, the second pin 62 are compressed respectively and core plate 63 is carried, and then automatic press welder starts bonding wire, by 71 points of lead The pole of semiconductor first is not connected with the first pin 61, the pole of semiconductor second is connected with the second pin 62.Due to the first regulation Device 331, the second adjusting means and the 3rd adjusting means can adjust the first pressing 41, the second pressing 42 and the 3rd respectively The compression degree of pressing 43, therefore, when welding every time, the first pin 61, the second pin 62 and load core plate 63 are compacted, and are protected Welding quality is demonstrate,proved.
Further, it is described it is a kind of be used to compressing in the device of lead frame 60, the connecting rod can by relative to Lead frame 60 is movable to be adjusted, and adjustment is securable on the pedestal 10 after completing.Preferably, the connecting rod On be provided with mounting hole, the pedestal 10 and be provided with through hole, and set will be described by the bolt of the through hole and mounting hole Connecting plate and pedestal 10 are connected, and after the connecting rod, which is adjusted, to be completed, clamping screw by connecting plate so that be fixed on the base On seat 10.Because the connecting rod can be adjusted so that opposing runners framework 60 is movable, therefore improve the first pressing 41st, the second pressing 42 and the 3rd pressing 43 are accurate relative to the pressing of the first pin 61, the second pin 62 and load core plate 63 Property, further increase welding quality.
Further, in a kind of described device for compressing lead frame 60, the connecting rod includes the first connection Bar, the second connection and the 3rd connecting rod, the head rod are connected with the first adjusting means 331, first pressing 41 One end is rotatably connected with head rod, and second connecting rod with head rod identical mode with second by adjusting Regulating device and the second pressing 42 are connected, the 3rd connecting rod by with head rod identical mode and the 3rd adjusting means And the 3rd pressing 43 connect.Because the head rod, the second connection and the 3rd connecting rod can be respectively to the first pressings 41st, the second pressing 42 and the 3rd pressing 43 are adjusted, therefore can be met the pin with different shape size and be carried core The compression requirement of the semiconductor of plate 63.
Further, described a kind of device for being used to compress lead frame 60, first adjusting means 331 include with First regulating block 311 of the head rod connection, and for adjusting first adjusting rod at the angle of inclination of the first pressing 41 312;First regulating block 311 is provided with the first adjustment hole, and first adjusting rod 312 inserts the first adjustment hole and abuts the One pressing 41;Second adjusting means with the identical mode of the first adjusting means 331 by being provided with the second regulating block and Two adjusting rods, the 3rd adjusting means with the identical mode of the first adjusting means 331 by being provided with the 3rd regulating block and Three adjusting rods.Specifically, the depth of the first adjustment hole is inserted by adjusting the first adjusting rod 312, so as to change the first adjusting rod 312 angle of inclination so that the first adjusting rod 312 compresses the first pin 61;Similarly, the second adjusting rod and the 3rd adjusting rod pass through The angle of inclination of the second pressing 42 and the 3rd pressing 43 is adjusted with the identical mode of the first adjusting rod 312, so as to compress the second pipe Pin 62 and load core plate 63.The number of parts that above-mentioned adjusting means is included is few, simple to operate so that lead frame 60 is compressed and adjusted Journey rapidly and efficiently, improves production efficiency.
Further, in a kind of device for compressing lead frame 60, first adjusting means 331 also includes being used for Lock the first lock-screw 313 of the first adjusting rod 312;The side of first regulating block 311 is provided with to be communicated with the first adjustment hole And set female first locking hole, first lock-screw is screwed into from the first locking hole and abuts and compress the first regulation Bar 312;Second adjusting means with the identical mode of the first adjusting means 331 by being provided with the second locking hole and the second lock Tight screw, the 3rd adjusting means by with the locking hole of 331 identical mode of the first adjusting means the 3rd and the 3rd lock-screw.Tool Body, it is that the first lock-screw 313 is in releasing orientation, when the first adjusting rod 312 is complete when the first adjusting rod 312 is adjusted Into after regulation, the first lock-screw 313 is screwed into from the first locking hole and abuts and lock the first adjusting rod 312;Similarly, second Lock-screw and the 3rd lock-screw lock the second adjusting rod and the 3rd adjusting rod respectively in the same way.In the first locking In the presence of screw 313, the second lock-screw and the 3rd lock-screw, in welding process, the first adjusting rod 312, second is adjusted Pole and the 3rd adjusting rod are pressed respectively all the time in locking state, i.e. the first pressing 41, the second pressing 42 and pressing all the time Tight first pin 61, the second pin 62 and load core plate 63, further ensure welding quality.
Further, it is described it is a kind of be used to compressing in the device of lead frame 60, described the first regulating block 311 and the One connecting rod surrounds the first groove, and the first groove described in one end insertion of first pressing 41 simultaneously passes through with head rod Contact is attached, and position corresponding with connecting rod one end is provided with the first arc groove 411 on first pressing 41;It is described Second pressing 42 is described by being connected with the identical mode of the first pressing 41 with the second connecting rod and being provided with the second arc groove 3rd pressing 43 with the identical mode of the first pressing 41 with the 3rd connecting rod by being connected and being provided with three-arc groove.This reality Apply in example, the contact point of first pressing 41 and head rod is equivalent to tie point, when the first adjusting rod 312 applies downwards Power to the first pressing 41 on when, the first pressing 41 is rotated around the contact point of itself and head rod, so as to compress the first pin 61, because position corresponding with connecting rod one end is provided with the first arc groove 411, therefore the first pressing 41 on the first pressing 41 During rotation, one end of head rod will not encounter the first pressing 41.Above-mentioned adjusting means is simple to operate and will not occur part Collision or interference.In the present embodiment, the second described pressing 42 and the 3rd pressing 43 are identical with the method to set up of the first pressing 41, Here is omitted.
Further, in a kind of described device for compressing lead frame 60, the drive device 50 is cylinder, by It is simple and the requirement that the driving pedestal 10 moves up and down can be met in air cylinder structure, therefore reduce described one kind and be used to press The manufacturing cost of the device of tight lead frame 60.Described drive device 50 can also be motor, can be more by motor driving Accurately control the up and down motion of the pedestal 10.
The utility model provide it is a kind of be used to compress the device of lead frame, pass through the first pressing, the second pressing and the Three pressings compress extremely corresponding first pin of semiconductor first, extremely corresponding second pin of semiconductor second and carry core respectively Plate, improves the compression effect of lead frame, so as to improve the quality of semiconductor leads welding;Pass through the first adjusting rod, Two adjusting rods and the 3rd adjusting rod adjust described the first pressing, the second pressing and the 3rd pressing respectively, simple to operate, adjust Save speed fast, improve production efficiency.
It is understood that for those of ordinary skills, can according to the technical solution of the utility model and The design of its utility model is subject to equivalent substitution or change, and all these changes or replacement should all belong to appended by the utility model Scope of the claims.

Claims (7)

1. a kind of device for being used to compress lead frame, including pedestal, it is characterised in that also including for controlling the pedestal The drive device of lower linear motion, is arranged at the connecting rod on pedestal, for compressing correspondence semiconductor first pole on lead frame The first pin the first pressing, the second pressing of the second pin for compressing on lead frame correspondence semiconductor second pole, For compressing the 3rd pressing of the load core plate on lead frame, and it is respectively used to the first pressing of regulation, the second pressing and the 3rd First adjusting means, the second adjusting means and the 3rd adjusting means at pressing angle of inclination;First adjusting means, second are adjusted Regulating device and the 3rd adjusting means are connected with the connecting rod respectively, and one end of first pressing is connected with the connecting rod, First pressing can be rotated around with the tie point of connecting rod, and second pressing and the 3rd pressing pass through identical with the first pressing Mode be connected respectively with the connecting rod, the drive device is arranged at below the pedestal.
2. a kind of device for being used to compress lead frame according to claim 1, it is characterised in that the connecting rod can lead to Cross to move forward and backward relative to lead frame and be adjusted, adjustment is securable on the pedestal after completing.
3. a kind of device for being used to compress lead frame according to claim 2, it is characterised in that the connecting rod includes Head rod, the second connection and the 3rd connecting rod, the head rod are connected with the first adjusting means, first pressing One end be rotatably connected with head rod, first pressing can around with the rotation of the tie point of head rod, it is described Second connecting rod with head rod identical mode with the second adjusting means and the second pressing by being connected, the 3rd connection Bar with head rod identical mode with Article 3 adjusting means and the 3rd pressing by being connected.
4. a kind of device for being used to compress lead frame according to claim 3, it is characterised in that the first regulation dress The first regulating block including being connected with the head rod is put, and for adjusting first regulation at the first pressing angle of inclination Bar;First regulating block is provided with the first adjustment hole, and first adjusting rod inserts the first adjustment hole and abuts the first pressing; Second adjusting means is described by being provided with the second regulating block and the second adjusting rod with the first adjusting means identical mode 3rd adjusting means with the first adjusting means identical mode by being provided with the 3rd regulating block and the 3rd adjusting rod.
5. a kind of device for being used to compress lead frame according to claim 4, it is characterised in that the first regulation dress Put the first lock-screw for also including being used to lock the first adjusting rod;The first regulating block side is provided with and the first adjustment hole phase Logical and set female first locking hole, first lock-screw is screwed into from the first locking hole and abuts and compress the first tune Pole;Second adjusting means with the first adjusting means identical mode by being provided with the second locking hole and the second locking screw Nail, the 3rd adjusting means by with the locking hole of the first adjusting means identical mode the 3rd and the 3rd lock-screw.
6. a kind of device for being used to compress lead frame according to claim 5, it is characterised in that the first described regulation Block surrounds the first groove with head rod, the first groove and and head rod described in one end insertion of first pressing It is attached by contact, position corresponding with connecting rod one end is provided with the first arc groove on first pressing;It is described Second pressing with the first pressing identical mode with the second connecting rod by being connected and being provided with the second arc groove, and the described 3rd Pressing with the first pressing identical mode with the 3rd connecting rod by being connected and being provided with three-arc groove.
7. a kind of device for being used to compress lead frame according to claim 1 or 6, it is characterised in that the driving dress It is set to cylinder or motor.
CN201621105900.3U 2016-10-09 2016-10-09 A kind of device for being used to compress lead frame Active CN206405649U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201621105900.3U CN206405649U (en) 2016-10-09 2016-10-09 A kind of device for being used to compress lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201621105900.3U CN206405649U (en) 2016-10-09 2016-10-09 A kind of device for being used to compress lead frame

Publications (1)

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CN206405649U true CN206405649U (en) 2017-08-15

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111463163A (en) * 2020-04-09 2020-07-28 深圳市东昕科技有限公司 High-precision pressing device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111463163A (en) * 2020-04-09 2020-07-28 深圳市东昕科技有限公司 High-precision pressing device

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