CN108206232A - A kind of LED encapsulation package system and its packaging technology - Google Patents
A kind of LED encapsulation package system and its packaging technology Download PDFInfo
- Publication number
- CN108206232A CN108206232A CN201711435853.8A CN201711435853A CN108206232A CN 108206232 A CN108206232 A CN 108206232A CN 201711435853 A CN201711435853 A CN 201711435853A CN 108206232 A CN108206232 A CN 108206232A
- Authority
- CN
- China
- Prior art keywords
- led
- telescopic arm
- package system
- pedestal
- encapsulation package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005538 encapsulation Methods 0.000 title claims abstract description 16
- 238000012536 packaging technology Methods 0.000 title claims abstract description 7
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 26
- 239000003292 glue Substances 0.000 claims abstract description 19
- 238000000576 coating method Methods 0.000 claims abstract description 18
- 238000000465 moulding Methods 0.000 claims abstract description 18
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 12
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 11
- 230000002787 reinforcement Effects 0.000 claims abstract description 9
- 238000001816 cooling Methods 0.000 claims description 17
- 238000003780 insertion Methods 0.000 claims description 16
- 230000037431 insertion Effects 0.000 claims description 16
- 230000001105 regulatory effect Effects 0.000 claims description 6
- 230000003014 reinforcing effect Effects 0.000 claims description 6
- 239000003381 stabilizer Substances 0.000 claims description 6
- 238000003860 storage Methods 0.000 claims description 5
- 238000012856 packing Methods 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 15
- 230000000694 effects Effects 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- 230000017525 heat dissipation Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 235000005121 Sorbus torminalis Nutrition 0.000 description 4
- 244000152100 Sorbus torminalis Species 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 244000247747 Coptis groenlandica Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
Abstract
The invention discloses a kind of LED encapsulation package system and its packaging technology, including spot gluing equipment, molding apparatus and phosphor coatings equipment；The spot gluing equipment includes coulisse, work top, switch, emergency stop switch, control panel, pedestal, display screen, adjustable working table, control handle, dispensing controller, Glue dripping head, feed pipe, connecting plate, glider, and the lower surface of the frid and the upper surface of work top are mutually parallel.The present invention avoids material from situation about coming off occur by the setting of anti-slip reinforcement device.
Description
Technical field
The invention belongs to the technical field encapsulated in LED more particularly to a kind of LED encapsulation package system and its encapsulation works
Skill.
Background technology
LED on the market needs to carry out die bond to lamppost mostly using conventional package form in encapsulation process at present
Operation.205177877 U of Chinese patent CN disclose one kind《Drawing mechanism》, including pedestal, magazine and it is installed in pedestal
Control device, pedestal is equipped with guide rail, and guide rail is equipped with sliding block, and the side of sliding block is equipped with the first cylinder, and rail end is equipped with
Second cylinder, magazine are installed on sliding block, and magazine includes material stock frame and the supporting rod for being connected to material stock frame side, branch
At least provided with two, material stock frame is hinged strut with sliding block one end, and control device includes control module and is coupling in control module
Sensor, sensor is set on the end of supporting rod, and control module connects the first cylinder and the second cylinder, but the prior art
It can be shaken during discharging, make its loosening that material falls back be caused to damage and economic loss.
Invention content
In view of the above-mentioned problems, the present invention provide it is a kind of discharge stablize, lamp bead LED encapsulation package system not easily to fall off and
Its packaging technology.
To achieve these goals, the present invention uses following technical scheme：A kind of LED encapsulation package system, including point
Gluing equipment, molding apparatus and phosphor coatings equipment；The spot gluing equipment include coulisse, work top, switch, emergency stop switch,
Control panel, pedestal, display screen, adjustable working table, control handle, dispensing controller, Glue dripping head, feed pipe, connecting plate, cunning
Row device, the lower surface of the frid and the upper surface of work top are mutually parallel;The molding apparatus includes supporting rod, fixation
Bar, driving motor, cooling fin, support plate, pedestal, sliding rail, conveyer belt, handle, pallet, anti-slip reinforcement device, reinforcing bar, it is described
The side of supporting rod is connected with the side of fixed link, and the front of the driving motor is equipped with cooling fin.On the spot gluing equipment
There is provided adjustable working tables, and the top of work top is mounted on by sliding slot, and it is adjustable to adjust it according to its situation for dispensing glue
Workbench；The molding apparatus structure is equipped with anti-slip reinforcement device, by the way that material is put into anti-slip rubber in fixed outer ring
Centre, and air chamber can be also squeezed the external world by extraneous extruding so as to fastening material, and anti-slip rubber is equipped with anti-skid chequer
Make its not easily to fall off, increase its stationarity, prevent loss caused by coming off.
Further, the adjustable working table is by workbench, the first telescopic arm, the second telescopic arm, third telescopic arm, cunning
Grooved ring, sliding slot composition.It is connected above the lower section of the workbench and the first telescopic arm, the rear side peace of first telescopic arm
Front side loaded on the second telescopic arm is installed on the second telescopic arm above the third telescopic arm, the inside of the runner ring
The runner ring that is connected on the outside of sliding slot is moved forward and backward its position on the chute, when being moved to required position, according to circumstances adjusts
Its height is saved, the second telescopic arm is pulled out from sliding slot, and third telescopic arm page is pulled out from sliding slot therewith, when also needing raising, is drawn
Going out the first telescopic arm makes workbench be in highest position, makes it have the effect of adjustable working table, makes its dispensing process
It is more convenient.
Further, the bottom end insertion of the cooling fin is installed on the top of support plate, and the support plate is located at pedestal
Top, the side of the sliding rail and the side of conveyer belt fit, and the side of the conveyer belt is equipped with pedestal, the handle insertion
It is installed on the side of pallet, is connected above the lower section of the pallet and sliding rail, the lower section insertion installation of the reinforcing bar
In the top of pedestal, the cooling fin makes the heat sent out more effectively be transmitted on cooling fin, then is dispersed into week through cooling fin
It encloses in air, there is good heat dissipation effect.
Further, the lower surface of the adjustable working table is installed on the top of work top, the control handle with
Dispensing controller is electrically connected, and the Glue dripping head is connected with feed pipe, and the top insertion of the feed pipe is installed on glider
Inside, the rear side of the connecting plate are connected with glider, described that adjustable working table is provided on spot gluing equipment, make its tool
There is the effect of adjustable working table, the dispensing process for making it is more convenient.
Further, the phosphor coatings equipment include display screen, screw, object table, fixed frame, body, power interface,
Stabilizer blade, pressure gauge, operation panel, regulating switch, positioning device, applicator, scram button, object, cabinet door, handle, the positioning
Device includes FET pipes, shell, support ring, window, pin, pedestal, circuit original paper, thermoelectric plate, filter lens, the FET pipes position
In the upper end of circuit original paper, the shell is integrated with window, and the support ring is located at the inside of shell, the pin
Through pedestal, the circuit original paper is located at the inside of shell, the lower surface of the thermoelectric plate and the upper surface phase of filter lens
Fitting, this phosphor coatings equipment, structure are equipped with positioning device, and positioning device is mounted on body, is powered on, object leads to
It crosses window to be mapped on filter lens, analog signal is passed to by thermoelectric plate by filter lens, conveyed signal by thermoelectric plate
Circuit original paper is given, analog signal is converted by digital signal by circuit original paper, digital signal is passed to by machine by FET pipes
Body starts to coat, article position is thus accurately positioned, and ensures that the coating of object is uniform.
The invention also discloses a kind of packaging technologies, include the following steps：
S1：Elargol on point, later by die bonding to elargol, obtains LED on stent；
S2：Die bond operation is carried out to LED with bonder；
S3：First time molding is carried out to LED with molding apparatus；
S4：Fluorescent film is coated to LED with phosphor coatings equipment；
S5：Second is carried out to LED with molding apparatus to be molded；
S6：Finally LED is packed with packing machine, and packaged LED is put in storage.
Further, dryer is used to toast 2H to LED at 150 DEG C after die bond is carried out in the step S2.
Further, after the completion of the step S5 then LED testing, sortings are packed.
After the completion of the further step S5 packaging and storage is carried out to LED testing, sortings and then by the LED of normal operation.
The present invention is packaged chip using elargol, into being connected without gold thread, is less prone to bonding wire and comes off and make
Into the situation of LED failure, service life is long；And the LED package product that this kind of packaging method obtains is small while also thinner, gold
Belong to substrate to the most effective heat dissipation path only 0.2mm of radiator, along with die bond is using elargol, used relative to conventional package
Insulating cement, heat-conducting effect more preferably, substantially increase LED product service life；In addition, fluorescence is coated through being molded twice during sealing
Film covering transparent adhesive tape can also improve product colour consistency while protecting fluorescent glue, and brightness can also be promoted accordingly and energy
Enough heat dissipation problems for effectively solving conventional package, so as to improve LED service lifes.
In conclusion the present invention has the following advantages：There is provided anti-skidding reinforcings, are prevented by the way that material is put into fixed outer ring
The centre of sliding rubber, and air chamber can be also squeezed the external world by extraneous extruding so as to fastening material, and anti-slip rubber is set
There is anti-skid chequer to make its not easily to fall off, increase its stationarity.
Description of the drawings
Fig. 1 is the structural diagram of the present invention.
Fig. 2 is the structure diagram of the spot gluing equipment of the present invention.
Fig. 3 is the structure diagram of fixed station in present invention point plastic structure.
Fig. 4 is the structure diagram of molding apparatus of the present invention.
Fig. 5 is the structure diagram of fixed station in molding apparatus of the present invention.
Fig. 6 is the structure diagram of fluorescent powder coating equipment of the present invention.
Fig. 7 is the structure diagram of the section of fluorescent powder coating equipment positioning device of the present invention.
Specific embodiment
In order to which those skilled in the art is made to be better understood from the present invention program, below in conjunction in the embodiment of the present invention
Attached drawing carries out the technical solution in the embodiment of the present invention clear, complete description.
A kind of LED encapsulation package system as shown in figs. 1-7, is set including spot gluing equipment 1, molding apparatus 2 and phosphor coatings
Standby 3；The spot gluing equipment 1 includes coulisse 111, work top 112, work top 113, emergency stop switch 114, control panel
115th, pedestal 116, display screen 30117, adjustable working table 118, control handle 119, dispensing controller 120, Glue dripping head 121,
Feed pipe 122, connecting plate 123, glider 124, the lower surface of the frid 111 are mutually flat with the upper surface of work top 112
Row, the back side insertion of the work top 113 are installed on the inside of work top 112, the back fitting of the emergency stop switch 114
In the front side of work top 112, the control panel 115 is electrically connected with work top 112, the upper surface of the pedestal 116 with
The lower surface of work top 112 fits, and the lower surface insertion of the display screen 30117 is installed on the inside of work top 112,
The lower surface of the adjustable working table 118 is installed on the top of work top 112, and the control handle 119 is controlled with dispensing
Device 120 is electrically connected, and the Glue dripping head 121 is connected with feed pipe 122, and the top insertion of the feed pipe 122, which is installed on, slides
The inside of device 124, the rear side of the connecting plate 123 are connected with glider 124, and the adjustable working table 118 is by workbench
801st, the first telescopic arm 802, the second telescopic arm 803, third telescopic arm 804, runner ring 805, sliding slot 806 form, the work
The lower section of platform 801 is connected with the top of the first telescopic arm 802, and the rear side of first telescopic arm 802 is installed on second and stretches
The front side of arm 803, the top of the third telescopic arm 804 are installed on the second telescopic arm 803, the inside of the runner ring 805
Be connected with the outside of sliding slot 806, the work top 113 be rectangular parallelepiped structure, a diameter of 1cm of the control handle 4, institute
The right side for stating dispensing controller 120 is welded in the left side of work top 112, and the lower section of the coulisse 111 is upper with pedestal 116
Side is parallel, and second telescopic arm 803 is connected by sliding slot 806 with work top 112, and the control handle 119 is by pvc
Particle is made, and has durable effect, and the display screen 30117 is made of TN, has effect at low cost.
For the word explanation of work top 113 described in this patent to open and close, the control handle 4 is turned with manual
Manual element.
The top of work top is mounted on by sliding slot 806 when being used, adjusting it according to its situation for dispensing glue can
Workbench 118 is adjusted, runner ring 805 is moved forward and backward its position on sliding slot 806, when being moved to required position, according to circumstances
Its height is adjusted, the second telescopic arm 803 is pulled out from sliding slot 806, and third telescopic arm page 804 is pulled out from sliding slot 806 therewith, when
When also needing raising, pulling out the first telescopic arm 802 makes workbench 801 be in highest position.
It is poor to the height regulating effect of workbench to solve the prior art, leads to cumbersome during dispensing ask
Topic by being combined with each other for above-mentioned component, adjustable working table is provided in its structure, makes it have adjustable working table
Effect, the dispensing process for making it is more convenient, described in detail below:
The adjustable working table 118 by workbench 801, the first telescopic arm 802, the second telescopic arm 803, third telescopic arm 804,
Runner ring 805, sliding slot 806 form, and the lower section of the workbench 801 is connected with the top of the first telescopic arm 802, and described first
The rear side of telescopic arm 802 is installed on the front side of the second telescopic arm 803, and the top of the third telescopic arm 804 is installed on second and stretches
On contracting arm 803, the inside of the runner ring 805 is connected with the outside of sliding slot 806.
It is poor to solve the quantitative effect to glue of the prior art, leads to occur excessive glue or mistake in glue dispensing and packaging
The problem of few glue, by being combined with each other for above-mentioned component, is provided with quantitative point glue device in its structure, make which raises
The quantitative effect to glue makes to be not in excessive glue or very few glue during glue dispensing and packaging.
Described its structure of die bond equipment 2 includes supporting rod 201, fixed link 202, driving motor 203, cooling fin 204, support
Plate 205, pedestal 206, sliding rail 207, conveyer belt 208, handle 209, pallet 210, anti-slip reinforcement device, reinforcing bar 212, the branch
The side of strut 201 is connected with the side of fixed link 202, and the front of the driving motor 203 is equipped with cooling fin 204, described
The bottom end insertion of cooling fin 204 is installed on the top of support plate 205, and the support plate 205 is located at the top of pedestal 206, described
The side of sliding rail 207 and the side of conveyer belt 208 fit, and the side of the conveyer belt 208 is equipped with pedestal 206, the handle
209 insertions are installed on the side of pallet 210, and the lower section of the pallet 210 is connected with the top of sliding rail 207, the reinforcing
The lower section insertion of bar 212 is installed on the top of pedestal 206, the anti-slip reinforcement device 11 include thread 1101, bolt 1102,
Fixed outer ring 1103, anti-slip rubber 1104, air chamber 1105, the thread 1101 are integrated with bolt 1102, institute
It states the insertion of bolt 1102 to be installed on fixed outer ring 1103, the inner surface of the fixed outer ring 1103 is affixed with anti-slip rubber 1104
It closes, the anti-slip rubber 1104 is internally provided with air chamber 1105, and the inner surface of the fixed outer ring 1103 is outer with pallet 210
Surface fits, and the insertion of driving motor 203 is installed in support plate 205, top and the sliding rail 207 of the pedestal 206
Lower section is connected, and the outer surface of the pallet 210 is equipped with anti-slip reinforcement device 11., a length of 30cm, the width of the support plate 205
For 21cm, the cuboid of a height of 1.5cm, the pedestal 206 has aluminium alloy to be made, and has stronger hardness, the anti-slip rubber
1104 be rubber material, has soft, durability.
Cooling fin 204 described in this patent is a kind of device of the easy heat-generating electronic elements heat dissipation in electric appliance, mostly by aluminium
Alloy, brass or bronze make plate, sheet, splintery etc., as cpu central processing unit will use sizable heat dissipation in computer
Piece, power supply pipe in television set, row pipe, the power tube in amplifirer will use cooling fin, and general cooling fin in use will be
Electronic component applies last layer heat-conducting silicone grease with radiating rib contact surface, and the heat that component is sent out is made more effectively to be transmitted to cooling fin
On, then be dispersed into surrounding air through cooling fin, 1102 machine components of bolt, adapted nut it is cylindrical threaded
Fastener by head and screw rod a kind of fastener dimerous, need to coordinate with nut, for being fastenedly connected two with logical
The part in hole, this type of attachment claim to be bolted, and such as nut are screwed off from bolt, and can separate the two parts,
Therefore it is to belong to be detachably connected to be bolted.
When bonder discharges, by the way that material to be put into the centre of anti-slip rubber 1104 in fixed outer ring 1103, and air
Room 1105 can be also squeezed so as to fastening material the external world by extraneous extruding, and the anti-skid chequer that is equipped with of anti-slip rubber 1104 makes it
It is not easily to fall off, then its device is made to be secured firmly to state on pallet 210 by the thread 1101 on bolt 1102.
Solving the prior art can shake during discharging, make its loosening that material falls back be caused to damage and pass through
The problem of loss of Ji, by being combined with each other for above-mentioned component, structure is equipped with anti-slip reinforcement device, solid by the way that material is put into
Determine the centre of anti-slip rubber in outer ring, and air chamber can be also squeezed the external world by extraneous extruding so as to fastening material, and prevent
The anti-skid chequer that is equipped with of sliding rubber makes its not easily to fall off, increases its stationarity, prevents loss caused by coming off.
Specifically, the phosphor coatings equipment 3 includes display screen 301, screw 302, object table 303, fixed frame 304, machine
Body 305, power interface 306, stabilizer blade 307, pressure gauge 308, operation panel 309, regulating switch 310, positioning device, applicator 312,
Scram button 313, object 314, cabinet door 315, handle 316, the display screen 301 are electrically connected with operation panel 309, the object table
303 are located at the lower end of object 314, and the power interface 306 is located at the left end of body 305, the pressure gauge 308 and operation panel
309 electrical connections, the regulating switch 310 are located at the right end of pressure gauge 308, and the regulating switch 310 is electrically connected with operation panel 309
It connects, the positioning device is located at the upper end of object 314, and the applicator 312 is located at the lower end of operation panel 309, and the emergency stop is pressed
Button 313 is electrically connected with body 305, and the cabinet door 315 is welded with 316 phase of handle, and the cabinet door 315 is located at the front end of body 305,
The positioning device includes FET pipes 1101, shell 1102, support ring 1103, window 1104, pin 1105, pedestal 1106, circuit
Original paper 1107, thermoelectric plate 1108, filter lens 1109, the FET pipes 1101 are located at the upper end of circuit original paper 1107, the shell
1102 are integrated with window 1104, and the support ring 1103 is located at the inside of shell 1102, and the pin 1105 runs through
In pedestal 1106, the circuit original paper 1107 is located at the inside of shell 1102, and the lower surface of the thermoelectric plate 1108 is saturating with filtering
The upper surface of mirror 1109 fits, and the screw 302 is threadedly coupled with fixed frame 304, the lower surface of the body 305 and stabilizer blade
307 upper surface is mutually welded, and the pin 1105 is electrically connected with body 305, a length of 5cm of the stabilizer blade 307, width 3cm, high
For 8cm, the stabilizer blade 307 is rectangular parallelepiped structure, and the object table 303 is made of stainless steel, and hardness is high and is not easy to get rusty.
Display screen 301 described in this patent is the I/O equipment for belonging to computer, i.e. input-output equipment, it is a kind of by one
Fixed electronic document is shown to the show tools that human eye is re-reflected on screen, the screw 302 by specific transmission device
It is the physics and mathematical principle of the inclined-plane circular rotating and frictional force that utilize object, fastens the work of implements parts by easy stages
Tool, screw are the general sayings of fastener, and daily pet phrase, screw is industrial necessity indispensable in daily life, such as
The general screw of the minimum screw that camera, glasses, clock and watch, electronics etc. use, TV, electric product, musical instrument, furniture etc.,
As for engineering, building, bridge then using large-scale screw, nut, traffic tool, aircraft, electric car, automobile etc. then for big primary screw simultaneously
With screw industrially bears vital task, as long as there is industry on the earth, then the function of screw is forever important, and screw is
Joint invention in people's production and living over the past thousands of years, from the point of view of application field, it is the first major invention of the mankind.
Positioning device is mounted on body 305 when being used, is powered on, object is mapped in by window 1104
On filter lens 1109, analog signal is passed to by thermoelectric plate 1108 by filter lens 1109, by thermoelectric plate 1108 by signal
Circuit original paper 1107 is conveyed to, analog signal is converted by digital signal by circuit original paper 1107, by FET pipes 1101 by number
Word signal passes to body 305, starts to coat, article position is thus accurately positioned, and ensures that the coating of object is uniform.
Solves prior art position calibration position inaccurate, it may appear that the phenomenon that offset, cause fluorescent powder coating uneven
The problem of even, by being combined with each other for above-mentioned component, positioning device is mounted on body, is powered on, object passes through window
It is mapped on filter lens, analog signal is passed to by thermoelectric plate by filter lens, circuit is transmitted signal to by thermoelectric plate
Original paper, digital signal is converted by circuit original paper by analog signal, and digital signal is passed to body by FET pipes, is started
Coating, is thus accurately positioned article position, ensures that the coating of object is uniform.
A kind of packaging technology using above-mentioned LED package systems includes the following steps：S1：By spot gluing equipment in stent
Elargol on upper point, later by die bonding to elargol, obtains LED；S2：Die bond operation is carried out to LED with die bond mechanism, specifically
Principle is the prior art, and so it will not be repeated；Later using dryer at a temperature of 150 DEG C, 2h is toasted to LED；S3：With molding
Equipment carries out LED first time molding, and coining operation and principle are the prior art, and so it will not be repeated；S4：With phosphor coatings equipment
Fluorescent film is coated to LED, the specific principle that coats repeats no more；S5：Second is carried out to LED with molding apparatus to be molded；S6：It is right
LED testing, sortings, testing, sorting mainly be powered to LED, test whether can normal use, normally then packed
Storage；Finally LED is packed with packing machine, and packaged LED is put in storage, packing machine is the prior art, no longer
It repeats.
Obviously, described embodiment is only the part of the embodiment of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without making creative work
Embodiment should all belong to the scope of protection of the invention.
Claims (8)
1. a kind of LED encapsulation package system, including spot gluing equipment（1）, molding apparatus（2）And phosphor coatings equipment（3）, it is described
Spot gluing equipment（1）Including coulisse（111）, work top（112）, display screen（117）, adjustable working table（118）, control rotation
Button（119）, Glue dripping head（121）And feed pipe；The frid（111）Lower surface and work top（112）Upper surface it is mutual
It is parallel;The molding apparatus（2）Including supporting rod（201）, fixed link（202）, driving motor（203）, cooling fin（204）, branch
Fagging（205）, pedestal（206）, sliding rail（207）, conveyer belt（208）, handle（209）, pallet（210）, anti-slip reinforcement device, plus
Gu bar（212）, the supporting rod（201）Side and fixed link（202）Side be connected, the driving motor（203）'s
Front is equipped with cooling fin（204）.
2. LED encapsulation package system according to claim 1, it is characterised in that：The adjustable working table（118）By
Workbench（801）, the first telescopic arm（802）, the second telescopic arm（803）, third telescopic arm（804）, runner ring（805）, sliding slot
（806）Composition.
3. LED encapsulation package system according to claim 2, it is characterised in that：The workbench（801）Lower section with
First telescopic arm（802）Top be connected, first telescopic arm（802）Rear side be installed on the second telescopic arm（803）'s
Front side, the third telescopic arm（804）Top be installed on the second telescopic arm（803）On, the runner ring（805）Inside with
Sliding slot（806）Outside be connected.
4. LED encapsulation package system according to claim 1, it is characterised in that：The cooling fin（204）Bottom end it is embedding
Enter to be installed on support plate（205）Top, the support plate（205）Positioned at pedestal（206）Top, the sliding rail（207）'s
Side and conveyer belt（208）Side fit, the conveyer belt（208）Side be equipped with pedestal（206）, the handle
（209）Insertion is installed on pallet（210）Side on, the pallet（210）Lower section and sliding rail（207）Top be connected,
The reinforcing bar（212）Lower section insertion be installed on pedestal（206）Top.
5. LED encapsulation package system according to claim 1, it is characterised in that：The anti-slip reinforcement device includes spiral shell
Line tooth（1101）, bolt（1102）, fixed outer ring（1103）, anti-slip rubber（1104）, air chamber（1105）, the thread
（1101）With bolt（1102）It is integrated, the bolt（1102）Insertion is installed on fixed outer ring（1103）On, it is described
Fixed outer ring（1103）Inner surface and anti-slip rubber（1104）It fits, the anti-slip rubber（1104）Be internally provided with air
Room（1105）, the fixed outer ring（1103）Inner surface and pallet（210）Outer surface fit.
6. LED encapsulation package system according to claim 2, it is characterised in that：The adjustable working table（118）'s
Lower surface is installed on work top（112）Top, the control handle（119）With dispensing controller（120）Electrical connection, it is described
Glue dripping head（121）With feed pipe（122）It is connected, the feed pipe（122）Top insertion be installed on glider（124）It is interior
Portion, the connecting plate（123）Rear side and glider（124）It is connected.
7. LED encapsulation package system according to claim 1, it is characterised in that：The phosphor coatings equipment（3）Including
Display screen（301）, screw（302）, object table（303）, fixed frame（304）, body（305）, power interface（306）, stabilizer blade
（307）, pressure gauge（308）, operation panel（309）, regulating switch（310）, positioning device（311）, applicator（312）, emergency stop presses
Button（313）, object（314）, cabinet door（315）, handle（316）.
8. according to the packaging technology of the package system of the LED of the claim 1, include the following steps：
S1：Elargol on point, later by die bonding to elargol, obtains LED on stent；
S2：Die bond operation is carried out to LED with bonder；
S3：First time molding is carried out to LED with molding apparatus；
S4：Fluorescent film is coated to LED with phosphor coatings equipment；
S5：Second is carried out to LED with molding apparatus to be molded；
S6：Finally LED is packed with packing machine, and packaged LED is put in storage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711435853.8A CN108206232B (en) | 2017-12-26 | 2017-12-26 | Packaging system for LED packaging and packaging process thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711435853.8A CN108206232B (en) | 2017-12-26 | 2017-12-26 | Packaging system for LED packaging and packaging process thereof |
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| Publication Number | Publication Date |
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| CN108206232A true CN108206232A (en) | 2018-06-26 |
| CN108206232B CN108206232B (en) | 2020-12-29 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101694861A (en) * | 2009-10-15 | 2010-04-14 | 苏州中泽光电科技有限公司 | Encapsulation method preventing LED fluorescent powder from precipitation |
| CN103762298A (en) * | 2014-02-02 | 2014-04-30 | 芜湖市神龙新能源科技有限公司 | LED wafer combination package material and technology |
| CN104091877A (en) * | 2014-07-01 | 2014-10-08 | 东莞市万丰纳米材料有限公司 | LED production process |
| CN107464869A (en) * | 2017-06-07 | 2017-12-12 | 东莞中之光电股份有限公司 | A kind of LED light source preparation method with special photochromic wave band |
-
2017
- 2017-12-26 CN CN201711435853.8A patent/CN108206232B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101694861A (en) * | 2009-10-15 | 2010-04-14 | 苏州中泽光电科技有限公司 | Encapsulation method preventing LED fluorescent powder from precipitation |
| CN103762298A (en) * | 2014-02-02 | 2014-04-30 | 芜湖市神龙新能源科技有限公司 | LED wafer combination package material and technology |
| CN104091877A (en) * | 2014-07-01 | 2014-10-08 | 东莞市万丰纳米材料有限公司 | LED production process |
| CN107464869A (en) * | 2017-06-07 | 2017-12-12 | 东莞中之光电股份有限公司 | A kind of LED light source preparation method with special photochromic wave band |
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| CN108206232B (en) | 2020-12-29 |
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Effective date of registration: 20201208 Address after: 337000 Building 1, artificial intelligence Industrial Park, Anyuan Industrial Park, Anyuan District, Pingxiang City, Jiangxi Province Applicant after: Jiangxi Tianyou Semiconductor Co.,Ltd. Address before: 310000 287, room 3, 1 Ting Ting Road, Cang Qian Road, Yuhang District, Hangzhou, Zhejiang, China Applicant before: HANGZHOU SUNWIN PHOTOELECTRIC TECHNOLOGY Co.,Ltd. |
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Denomination of invention: A packaging system and packaging process for LED packaging Granted publication date: 20201229 Pledgee: Agricultural Bank of China Limited Pingxiang Anyuan Branch Pledgor: Jiangxi Tianyou Semiconductor Co.,Ltd. Registration number: Y2024980024222 |