CN206059347U - LED bonders and its thimble structure - Google Patents
LED bonders and its thimble structure Download PDFInfo
- Publication number
- CN206059347U CN206059347U CN201621086086.5U CN201621086086U CN206059347U CN 206059347 U CN206059347 U CN 206059347U CN 201621086086 U CN201621086086 U CN 201621086086U CN 206059347 U CN206059347 U CN 206059347U
- Authority
- CN
- China
- Prior art keywords
- thimble
- led
- matrix
- integrated
- bonders
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
This application discloses a kind of LED bonders and its thimble structure, the thimble structure includes：Integrated thimble, and for assembling the mounting assembly of the integrated thimble, the integrated thimble includes：Thimble matrix and be arranged on the thimble matrix at least two for the thimble tip that contacts with LED chip diverse location.So, LED chip size and electrode position matching are referred to the integrated thimble for being adapted to quantity and position thimble tip, can make LED chip by stress during thimble structure jack-up evenly, prevent crooked or top bad electrode etc., die bond quality is effectively improved, product quality is improve.
Description
Technical field
The application is related to LED field, more particularly to one kind is used for LED bonders and its thimble structure.
Background technology
Light emitting diode（Light Emitting Diode, LED）It is a kind of luminous unit that can convert electrical energy into luminous energy
Part.With the maturation of LED technology, the field such as LED product is progressively applied to illuminate, shows, signal designation.In terms of illumination,
It is as the use to brightness requirement more and more higher, big chips and flip-chip is the main flow direction of recent years but various
Technique is still in exploration.
LED chip is typically concentrated by supplier and is bonded on thin film, in LED die bond techniques, it is necessary first to use thimble
By LED chip, the jack-up from thin film makes itself and thin film separation to structure, then draws LED chip with vacuum mechanical-arm again and is removed
It is transported to specified backing positions.In the face of big LEDs chip when, traditional thimble structure due to only one of which thimble tip, in jack-up
Would generally cause due to LED chip discontinuity during LED chip that LED chip is crooked, topple over, normally cannot inhale so as to cause
Take LED chip.In the face of flip LED chips when, as LED chip centre bit is equipped with electrode, thimble tip contacts stress appearance
The electrode of easy damaged LED chip.
The content of the invention
The application is intended at least solve one of above-mentioned technical problem to a certain extent.
According to the application's in a first aspect, the application provides a kind of thimble structure for LED bonders, including：It is integrated
Thimble, and for assembling the mounting assembly of the integrated thimble, the integrated thimble includes：Thimble matrix and it is arranged at institute
At least two on thimble matrix are stated for the thimble tip that contacts with LED chip diverse location.
Further, the mounting assembly includes：For assembling the thimble bar assembly of the integrated thimble, and for filling
Mounting bracket assembly with the thimble bar assembly.
Further, the thimble bar assembly includes：For the thimble rod assembled with the thimble matrix phase, and by institute
State the thimble nut that thimble matrix is fixed on the thimble rod.
Further, between the thimble matrix and the thimble rod by the first retaining structure arrange with realize part it
Between fixation in thimble structure radially.
Further, first retaining structure is realized in the following way：The thimble matrix be in cube, the thimble
Bar one end is provided with the first square draw-in groove matched with the thimble base shape.
Further, the mounting bracket assembly includes：Mounting seat, with run through for the thimble tip through hole and with
The thimble cap that the mounting seat is mutually assembled, and the thimble cap nut that the thimble cap is fixed in the mounting seat.
Further, arrange to realize between part by the second retaining structure between the thimble cap and the mounting seat
In thimble structure fixation radially.
Further, second retaining structure is realized in the following way：One end margin of the thimble cap is square, institute
State mounting seat one end and be provided with the second square draw-in groove matched with described thimble cap one end edge shape.
Further, suitable number is matched according to the size and/or electrode position of the LED chip on the integrated thimble
The thimble tip of amount, position and form.
According to the second aspect of the application, the application provides a kind of LED bonders, including：It is used for LED die bonds described above
The thimble structure of machine.
The beneficial effect of the application is：
By providing a kind of LED bonders and its thimble structure, the thimble structure includes：Integrated thimble, and for filling
Mounting assembly with the integrated thimble, the integrated thimble include：Thimble matrix and it is arranged on the thimble matrix
At least two for the thimble tip that contacts with LED chip diverse location.So, LED chip size and electrode position are referred to
Matching is put with the integrated thimble for being adapted to quantity and position thimble tip, can make LED chip by stress during thimble structure jack-up more
Uniformly, crooked or top bad electrode etc. is prevented, die bond quality is effectively improved, is improve product quality.
Description of the drawings
Dimensional structure diagrams of the Fig. 1 for the thimble structure for LED bonders of the embodiment of the present application one.
Front views of the Fig. 2 for the thimble structure for LED bonders of the embodiment of the present application one.
Upward views of the Fig. 3 for the thimble structure for LED bonders of the embodiment of the present application one.
Top views of the Fig. 4 for the thimble structure for LED bonders of the embodiment of the present application one.
AA ' face sectional views of the Fig. 5 for Fig. 2.
Fig. 6 is the enlarged drawing of details B in Fig. 5.
Exploded views of the Fig. 7 for the thimble structure for LED bonders of the embodiment of the present application one.
Fig. 8 is the enlarged drawing of details C in Fig. 7.
Fig. 9 is the enlarged drawing of detail D in Fig. 7.
Figure 10 is the enlarged drawing of details E in Fig. 7.
Figure 11 is the enlarged drawing of details F in Fig. 7.
Specific embodiment
Embodiments herein is described below in detail, the example of the embodiment is shown in the drawings, wherein from start to finish
Same or similar label represents same or similar element or the element with same or like function.Below with reference to attached
The embodiment of figure description is exemplary, it is intended to for explaining the application, and it is not intended that restriction to the application.
In the description of the present application, it is to be understood that term " " center ", " longitudinal direction ", " horizontal ", " length ", " width ",
" thickness ", " on ", D score, "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom " " interior ", " outward ", " up time
The orientation or position relationship of the instruction such as pin ", " counterclockwise " is, based on orientation shown in the drawings or position relationship, to be for only for ease of
Description the application and simplified description, rather than indicate or imply that the device or element of indication must have specific orientation, Yi Te
Fixed azimuth configuration and operation, therefore it is not intended that restriction to the application.
Additionally, term " first ", " second " are only used for describing purpose, and it is not intended that indicating or implying relative importance
Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can express or
Implicitly include one or more this feature.In the description of the present application, " multiple " are meant that two or more,
Unless otherwise expressly limited specifically.
In this application, unless otherwise clearly defined and limited, term " installation ", " being connected ", " connection ", " fixation " etc.
Term should be interpreted broadly, for example, it may be being fixedly connected, or being detachably connected, or be integrally connected；It can be machine
Tool connects, or electrically connects；Can be joined directly together, it is also possible to be indirectly connected to by intermediary, can be two units
Connection inside part.For the ordinary skill in the art, above-mentioned term can be understood in this Shen as the case may be
Please in concrete meaning.
In this application, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or D score
The first and second feature directly contacts can be included, it is also possible to be not directly contact including the first and second features but by it
Between other characterisation contact.And, fisrt feature second feature " on ", " top " and " above " it is special including first
Levy directly over second feature and oblique upper, or fisrt feature level height is merely representative of higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " below ", or be merely representative of immediately below second feature and obliquely downward including fisrt feature
Fisrt feature level height is less than second feature.
Accompanying drawing is combined below by specific embodiment to be described in further detail the application.
Embodiment one：
Present embodiments provide a kind of thimble structure, the thimble structure can be assemblied in LED bonders, and with LED die bonds
Driving means in machine are mutually assembled, and the elevating movement for completing wherein integrated thimble drives.
Fig. 1-11 are refer to, above-mentioned thimble structure mainly includes：Integrated thimble 4, and for assembling the peace of integrated thimble 4
Arrangement, integrated thimble 4 include：Thimble matrix 41 and be arranged on thimble matrix 41 at least two be used for and LED chip
The thimble tip 42 of diverse location contact.LED chip includes two kinds of structures in the present embodiment：A kind of is the tradition of 4mil sizes
Little chip 8, another kind are the long chips 9 of 10 × 23mil sizes.Although 42 quantity of thimble tip is 2 and almost in the present embodiment
Parallel Design, but the quantity of thimble tip 42 and position etc. are designed and are not limited to this in other embodiments.
In the present embodiment, mounting assembly includes：For assembling the thimble bar assembly of integrated thimble 4, and for assembling
The mounting bracket assembly of thimble bar assembly.Specifically, thimble bar assembly includes：For the thimble rod 3 mutually assembled with thimble matrix 41,
And the thimble nut 5 that thimble matrix 41 is fixed on thimble rod 3.And mounting bracket assembly includes：Mounting seat 1, with supply top
The thimble cap 6 that is through hole 61 and mutually assembling with mounting seat 1 that needle tip 42 runs through, and thimble cap 6 is fixed in mounting seat 1
Thimble cap nut 2.
To realize the fixation between part in thimble structure radially, to prevent position when thimble works from offseting, top
Between pin matrix 41 and thimble rod 3 by the first retaining structure arrange, specifically, thimble matrix 41 be in cube, 3 one end of thimble rod
It is provided with the first square draw-in groove 31 with 41 mating shapes of thimble matrix.Pass through the second screens between thimble cap 6 and mounting seat 1
Structure setting, specifically, 6 one end margin of thimble cap is square, and 1 one end of mounting seat is provided with and 6 one end edge shape of thimble cap
The the second square draw-in groove 11 for matching.
Embodiment two：
The present embodiment is essentially consisted in above-described embodiment difference：In addition to the structures such as above-mentioned square draw-in groove, in the present embodiment,
Between thimble matrix 41 and thimble rod 3, between thimble cap 6 and mounting seat 1 can also by the one kind in other various ways come
Screens is realized, various profiled shapes can be used, or using pin, welding or glue bonding etc..
Embodiment three：
The present embodiment is essentially consisted in above-described embodiment difference：In the present embodiment, carry out thimble tip quantity, position and
During form Design, on integrated thimble 4 can according to the size of LED chip and/or electrode position match other suitable quantities, position and
The thimble tip of form.
The many thimble structure operation principles of LED of above-mentioned the present embodiment approximately as：
When LED bonders work, the thin film 7 for placing LED chip is close to thimble cap 6, is done by driving integrated thimble 4
Lower motion, punctures thin film 7 through thimble cap 6 and carrys out jack-up LED chip 8 or 9.
So, when big LEDs chip or strip-like chip is processed, due to for the corresponding difference tip of chip matching
Integrated thimble 4, multiple tips when making thimble jack-up chip while exert oneself, uniform force, it is to avoid chip is crooked, while can be directed to
Property the fragile position such as the electrode avoided on chip, more accurate detailed treatment and reduce the fraction defective of LED product, carry significantly
High product quality.
In the description of this specification, reference term " embodiment ", " some embodiments ", " an enforcement
Example ", " some embodiments ", " example ", " specific example ", or the description of " some examples " etc. mean with reference to the embodiment or example
The specific features of description, structure, material or feature are contained at least one embodiment or example of the application.In this explanation
In book, identical embodiment or example are not necessarily referring to the schematic representation of above-mentioned term.And, the concrete spy of description
Levy, structure, material or feature can be combined in one or more any embodiment or example in an appropriate manner.
Above content is the further description made to the application with reference to specific embodiment, it is impossible to assert this Shen
Being embodied as please is confined to these explanations.For the application person of an ordinary skill in the technical field, do not taking off
On the premise of conceiving from the application, some simple deduction or replace can also be made.
Claims (10)
1. a kind of thimble structure for LED bonders, it is characterised in that include：Integrated thimble, and for assembling the collection
Into the mounting assembly of thimble, the integrated thimble includes：Thimble matrix and be arranged on the thimble matrix at least two
For the thimble tip contacted with LED chip diverse location.
2. the thimble structure of LED bonders is used for as claimed in claim 1, it is characterised in that the mounting assembly includes：With
In the thimble bar assembly for assembling the integrated thimble, and for assembling the mounting bracket assembly of the thimble bar assembly.
3. the thimble structure of LED bonders is used for as claimed in claim 2, it is characterised in that the thimble bar assembly includes：
For the thimble rod assembled with the thimble matrix phase, and the thimble spiral shell that the thimble matrix is fixed on the thimble rod
It is female.
4. the as claimed in claim 3 thimble structure for being used for LED bonders, it is characterised in that the thimble matrix with it is described
Arrange to realize the fixation between part in thimble structure radially by the first retaining structure between thimble rod.
5. the thimble structure of LED bonders is used for as claimed in claim 4, it is characterised in that first retaining structure leads to
Cross following manner realization：The thimble matrix is in cube, and described thimble rod one end is provided with and the thimble base shape phase
The the first square draw-in groove matched somebody with somebody.
6. the thimble structure of LED bonders is used for as claimed in claim 2, it is characterised in that the mounting bracket assembly includes：
Mounting seat, with the thimble cap that is through hole and mutually assembling with the mounting seat run through for the thimble tip, and will be described
The thimble cap nut that thimble cap is fixed in the mounting seat.
7. the thimble structure of LED bonders is used for as claimed in claim 6, it is characterised in that the thimble cap and the peace
Arrange to realize the fixation between part in thimble structure radially by the second retaining structure between dress seat.
8. the thimble structure of LED bonders is used for as claimed in claim 7, it is characterised in that second retaining structure leads to
Cross following manner realization：One end margin of the thimble cap is square, and described mounting seat one end is provided with and described thimble cap one end
The second square draw-in groove that edge shape matches.
9. the thimble structure of LED bonders is used for as claimed in claim 1, it is characterised in that basis on the integrated thimble
The thimble tip of the size of the LED chip and/or electrode position matching suitable quantity, position and form.
10. a kind of LED bonders, it is characterised in that include：It is used for LED bonders as claimed in any one of claims 1-9 wherein
Thimble structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621086086.5U CN206059347U (en) | 2016-09-28 | 2016-09-28 | LED bonders and its thimble structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621086086.5U CN206059347U (en) | 2016-09-28 | 2016-09-28 | LED bonders and its thimble structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206059347U true CN206059347U (en) | 2017-03-29 |
Family
ID=58367675
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621086086.5U Active CN206059347U (en) | 2016-09-28 | 2016-09-28 | LED bonders and its thimble structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206059347U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111398312A (en) * | 2020-02-19 | 2020-07-10 | 深圳市海铭德科技有限公司 | Thimble test head structure |
-
2016
- 2016-09-28 CN CN201621086086.5U patent/CN206059347U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111398312A (en) * | 2020-02-19 | 2020-07-10 | 深圳市海铭德科技有限公司 | Thimble test head structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102683509B (en) | Led module | |
| JP4754850B2 (en) | Manufacturing method of LED mounting module and manufacturing method of LED module | |
| CN104952864B (en) | LED filament and its manufacture method | |
| CN106025040B (en) | A kind of single side goes out the light emitting component and its production method of light | |
| CN108075024B (en) | Fingerprint identification module and its manufacturing method with light-emitting function | |
| CN100342558C (en) | Ceramic package light-emitting diode an dits package method | |
| CN107683534A (en) | Light emitting module | |
| CN206059347U (en) | LED bonders and its thimble structure | |
| CN207320151U (en) | A kind of die bond mechanism of LED bonders | |
| CN208240677U (en) | A kind of LED packaging and display panel | |
| JPH0267769A (en) | Led light-emitting device and manufacture of light-emitting block used in the same device | |
| CN207529596U (en) | LED support, LED module, LED component and display screen | |
| CN104637930B (en) | A kind of dual-colored LED lamp bead and the packaging technology based on the light bar of the lamp bead and the lamp bead | |
| CN206600642U (en) | A kind of LED bar graph light source and LED filament lamp | |
| CN110324986A (en) | The preparation method of charactron | |
| CN205645864U (en) | LED support and LED lamp pearl | |
| CN101170154A (en) | High power LED encapsulation method | |
| CN208507717U (en) | Light-emitting diode encapsulation structure, photoelectric sensor and finance device | |
| CN208655692U (en) | A kind of adopting surface mounted LED | |
| CN206122108U (en) | Led glue dispensing fixture | |
| CN102966868A (en) | Novel light-emitting diode (LED) lighting lamp | |
| CN206516291U (en) | A kind of LED display cell board | |
| CN207558826U (en) | A kind of LED package of adjustable focus | |
| CN207006056U (en) | A kind of screw-type LED light bar lamp | |
| CN200972865Y (en) | Package structure of high power LED |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Baoan District Peace Village Fuyong town Shenzhen city Guangdong province 518000 Heping Road Ruiming Industrial Park building C8 Patentee after: Shenzhen Xinyichang Science and Technology Co., Ltd. Address before: Baoan District Peace Village Fuyong town Shenzhen city Guangdong province 518000 Heping Road Ruiming Industrial Park building C8 Patentee before: Shenzhen Xinyichang Automatic Equipment Co., Ltd. |
|
| CP01 | Change in the name or title of a patent holder |