JPH0267769A - Led light-emitting device and manufacture of light-emitting block used in the same device - Google Patents
Led light-emitting device and manufacture of light-emitting block used in the same deviceInfo
- Publication number
- JPH0267769A JPH0267769A JP63219675A JP21967588A JPH0267769A JP H0267769 A JPH0267769 A JP H0267769A JP 63219675 A JP63219675 A JP 63219675A JP 21967588 A JP21967588 A JP 21967588A JP H0267769 A JPH0267769 A JP H0267769A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting block
- lead
- led
- block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 25
- 238000000034 method Methods 0.000 claims abstract description 30
- 229920005989 resin Polymers 0.000 claims abstract description 26
- 239000011347 resin Substances 0.000 claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 6
- 238000005520 cutting process Methods 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 6
- 230000005611 electricity Effects 0.000 abstract 2
- 239000010410 layer Substances 0.000 description 27
- 239000011241 protective layer Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 229920003002 synthetic resin Polymers 0.000 description 6
- 239000000057 synthetic resin Substances 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 5
- 239000002699 waste material Substances 0.000 description 4
- 238000005476 soldering Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229940052586 pro 12 Drugs 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
- B60Q1/00—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor
- B60Q1/26—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to indicate the vehicle, or parts thereof, or to give signals, to other traffic
- B60Q1/2696—Mounting of devices using LEDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
この発明は、発光体としてＬＥＤを使ったＬＥＤ発光装
置並びに該装置に用いる発光ブロックの製造方法に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to an LED light emitting device using an LED as a light emitter and a method for manufacturing a light emitting block used in the device.
［従来の技術］
発光体としてＬＥＤを使ったＬＥＤ発光装置の一従来例
として、第８図に示すものが知られている。[Prior Art] As a conventional example of an LED light emitting device using an LED as a light emitter, the one shown in FIG. 8 is known.
この発光装置は、プリント基板１の表面に多数のＬ Ｅ
Ｄランプ２を配列したもので、通常、まず基板１の部
品取り付け穴（スルーホール）ｌａに各Ｌ Ｅ Ｄラン
プ２のリードピン３ａ、３ｂを１通させ、しかる後、こ
れらのリードピン３ａ、３ｂを基板１の裏面にプリント
された電極配線４に半田付けすることによって製造され
る。This light emitting device has a large number of L E on the surface of a printed circuit board 1.
It is an array of D lamps 2. Normally, one lead pin 3a, 3b of each LED lamp 2 is passed through the component mounting hole (through hole) la of the board 1, and then these lead pins 3a, 3b are inserted. It is manufactured by soldering to the electrode wiring 4 printed on the back surface of the substrate 1.
［発明が解決しようとする課題］
ところが、この従来装置の場合、多数のＬＥＤランプ２
について、一つ一つ基板１へ位置決メジてゆかねばなら
ないため、生産性が非常に悪いという問題があった。[Problem to be solved by the invention] However, in the case of this conventional device, a large number of LED lamps 2
However, since the positions must be adjusted one by one onto the substrate 1, there is a problem in that productivity is extremely low.
また、ＬＥＤランプ２を基板１に位置決めする場合に、
基板１に対して正確に垂直に立てるのは容易でなく、し
かも、半田付けする際にＬＥＤランプ２が動き易いこと
もあり、結果的に、第９図に示すように、各ＬＥＤラン
プ２の光軸方向ｐが不揃いになり、発光装置全体として
は輝度むらが生じるという問題もあった。Moreover, when positioning the LED lamp 2 on the board 1,
It is not easy to stand the LED lamps 2 accurately perpendicular to the board 1, and the LED lamps 2 tend to move easily during soldering.As a result, as shown in FIG. There is also a problem that the optical axis direction p becomes irregular, resulting in uneven brightness of the light emitting device as a whole.
また、前記発光装置を、例えば、極めて高い輝度か要求
される自動車用ストップランプ等に利用する場合、予め
、各ＬＥＤランプ２に高輝度のものを用いなければなら
ないが、高輝度のＬＥＤランプは一般に輝度のばらつき
が大きいため、ＬＥＤランプを予め選別して発光装置毎
に輝度の揃ったものを準備しなければならない。Furthermore, when the light emitting device is used, for example, as a stop lamp for an automobile that requires extremely high brightness, each LED lamp 2 must be of high brightness. Generally, there is a large variation in brightness, so it is necessary to sort LED lamps in advance and prepare LED lamps with uniform brightness for each light emitting device.
しかし、ＬＥＤランプ２は、第８図にも示すように、一
対のり−ドビン３ａ、３ｂの外に、り一ドビン相互を一
定の間隔で固定するための底部ケース３ｃ、一方のリー
ドピン３ａ上に接着されるＬＥＤチップ３ｄ、このチッ
プ３ｄと他方のリードピン３ｂとを電気的に接続する導
線３ｅ、前記チップ３ｄの周囲を覆うケースを兼ねたレ
ンズ部３ｆ等の部材が必要で、幾つもの工程を経て製造
される。However, as shown in FIG. 8, the LED lamp 2 is mounted on a bottom case 3c for fixing the glue dowels at regular intervals in addition to the pair of glue dowels 3a and 3b, and on one lead pin 3a. It requires members such as the LED chip 3d to be bonded, a conductive wire 3e for electrically connecting this chip 3d and the other lead pin 3b, and a lens part 3f that also serves as a case to cover the periphery of the chip 3d, and requires several steps. It is manufactured after
このように、幾つもの工程を経て製造したものを選別に
かけるということは、多数の部材、工程が無駄にされ、
結果的に、製造コストが高価になるという問題もあった
。In this way, when products manufactured through multiple processes are subjected to sorting, many parts and processes are wasted.
As a result, there was also a problem that the manufacturing cost became high.
この発明は、前記事情に鑑みてなされたもので、高輝度
の発光が要求されるような場合でも、多数の部材および
工程を費やしたＬＥＤランプを選別にかけるような無駄
を省くことができ、しかも、１、 Ｅ Ｄランプを一つ
一つ基板上に位置ぎめするような作業も必要にならず、
製造コストの低減および生産性の向上の点で優れたＬＥ
Ｄ発光装置を提供することを目的としており、さらには
、該ＬＥＤ発光装置に用いる発光ブロックを得るに際し
て、ＬＥＤの発光の光軸の不揃いに起因した輝度むらの
発生を防止することのできる発生ブロックの製造方法を
提供することを目的とする。This invention has been made in view of the above circumstances, and even in cases where high-intensity light emission is required, it is possible to eliminate the waste of sorting out LED lamps that require a large number of parts and processes. Moreover, 1. There is no need for work such as positioning the ED lamps one by one on the board,
LE is superior in terms of reducing manufacturing costs and improving productivity
The object of the present invention is to provide a light-emitting device, and further, to provide a light-emitting block that can prevent the occurrence of uneven brightness due to uneven optical axes of light emitted from LEDs when obtaining a light-emitting block for use in the LED light-emitting device. The purpose is to provide a manufacturing method for.
［課題を解決するための手段］
前述の目的を達成するため、本発明のＬＥＤ発光装置に
おいては、複数個のＬＥＤチップか平面状に並ぶ発光ブ
ロックと、前記複数個のＬＥＤチップに給電するために
該発光ブロックの裏面に重ね合わせる給電用基板と、Ｌ
ＥＤチップの発光を活かすために前記発光ブロックの表
面に重ね合わせるレンズブロックとを備える。[Means for Solving the Problems] In order to achieve the above-mentioned object, the LED light emitting device of the present invention includes a plurality of LED chips or a light emitting block arranged in a plane, and a method for feeding power to the plurality of LED chips. a power supply substrate overlaid on the back surface of the light emitting block;
A lens block is provided which is superimposed on the surface of the light emitting block in order to take advantage of the light emission of the ED chip.
しかも、前記発光ブロックは、複数個のＬ Ｅ Ｉ）チ
ップと、各ＬＥＤチップに給電するための複数対のリー
ドピンと、これらのＬＥＤチップとリードピンとを向き
・間隔を揃えて保持する樹脂層とを具備するとともに、
前記樹脂層によって全体として一体化されて、樹脂層の
裏面にリードピンの基端部を突出させた構成をなし、
さらに、前記給電用基板においては、前記発光ブロック
から突出するリードピンの配列に合わせて、リードピン
を差し込む部品取り付け穴と、この部品取り付け穴に差
し込まれたリードピンに給電するための給電回路とを具
備した構成をなし、前記レンズブロックにおいては、一
体成形によって形成され、かつ、発光ブロックにおける
ＬＥＤチップの配列に合わせて複数個の集光レンズを平
面状に配列した構成をなしている。Moreover, the light emitting block includes a plurality of L E I) chips, a plurality of pairs of lead pins for feeding power to each LED chip, and a resin layer that holds these LED chips and lead pins in the same orientation and spacing. In addition to being equipped with
The structure is integrated as a whole by the resin layer, and the base ends of the lead pins protrude from the back surface of the resin layer.Furthermore, in the power supply board, the base ends of the lead pins are arranged in accordance with the arrangement of the lead pins protruding from the light emitting block. The lens block has a component mounting hole into which a lead pin is inserted, and a power supply circuit for supplying power to the lead pin inserted into the component mounting hole. It has a configuration in which a plurality of condensing lenses are arranged in a plane in accordance with the arrangement of the LED chips.
また、前記ＬＥＤ発光装置における発光ブロックの製造
方法においては、
ほぼ棒状をなす複数本のリードピン部とこれらのリード
ピン部の基端部を連結する連結用帯部とを一体に形成し
たリードフレームを用意し、該リードフレームの中間部
を未硬化樹脂に埋設させ、前記樹脂の硬化後に前記リー
ドフレームの連結用帯部を切除することによって、樹脂
層の裏面にリードピンの端部を突出させた構造を得るこ
とを特徴とする。Further, in the method for manufacturing a light emitting block in the LED light emitting device, a lead frame is prepared in which a plurality of lead pin portions having a substantially rod shape and a connecting band portion connecting the base ends of these lead pin portions are integrally formed. Then, by embedding the middle part of the lead frame in uncured resin and cutting off the connecting band of the lead frame after the resin has hardened, a structure is created in which the ends of the lead pins protrude from the back surface of the resin layer. It is characterized by obtaining.
し作用］
この発明のＬＥＤ発光装置は、独立したＬＥＤランプを
使用するものではなく、複数個のＬＥＤチップおよび複
数対のリードピンを一体化した発光プロ、りとレンズブ
ロックとを重ね合わせることによって、等測的に、複数
個のＬＥＤランプを集合させたＬＥＤ集合体を構成する
ものである。Function] The LED light emitting device of the present invention does not use an independent LED lamp, but by overlapping a light emitting device that integrates a plurality of LED chips and a plurality of pairs of lead pins and a lens block. Isometrically, a plurality of LED lamps are assembled to form an LED assembly.
したがって、高輝度の発光が要求されるような場合には
、発光ブロックを製造する際に、ＬＥＤチップの段階で
選別を行えば良（、多数の部材、工程を費やしたＬＥＤ
ランプの段階で選別にかけるような無駄を省くことがで
きる。Therefore, if high-intensity light emission is required, it is best to select the LED chips at the stage of manufacturing the light-emitting block (which requires a large number of parts and processes).
Wastes such as sorting at the lamp stage can be eliminated.
また、給電用基板における部品取り付け穴の配列を、前
記発光ブロックの裏面から突出するり一ドビンの配列に
合わせているため、前記発光ブロックの裏面に給電用基
板を重ね合わせるだけで、複数対のリードピンを一括し
て対応する部品取り付け穴に挿通した状態にすることが
でき、独立した多数のＬＥＤランプを基板上に一つ一つ
位置ぎめするような手間のかかる作業が必要にならない
。In addition, the arrangement of the component mounting holes on the power supply board is matched to the arrangement of the holes protruding from the back surface of the light emitting block, so that multiple pairs of holes can be created by simply stacking the power supply board on the back surface of the light emitting block. The lead pins can be inserted into the corresponding component mounting holes all at once, and there is no need for the time-consuming work of positioning a large number of independent LED lamps one by one on the board.
したがって、本発明のＬＥＤ発光装置においては、製造
コストを低減させるだけでなく、生産性を向上させるこ
ともできる。Therefore, in the LED light emitting device of the present invention, it is possible not only to reduce manufacturing costs but also to improve productivity.
また、前記発光ブロックの製造に際しては、複数本のリ
ードピン部が連結用帯部によって相互に連結されたリー
ドフレームを用意しておいて、各リードピン部相互の位
置関係を樹脂層で固定した後に連結用帯部を切除するこ
とによって、複数本のリードピンの端部を樹脂層の裏面
に突出させた構造を得るため、リードピン相互の向きを
合わせるような作業が一切不要であり、確実に総てのリ
ードピンの向きが揃った状態を得ることができ、また、
これによって、リードピンの上に接着されるＬＥＤチッ
プの向きも揃えることができる。In addition, when manufacturing the light emitting block, a lead frame in which a plurality of lead pin parts are connected to each other by a connecting band part is prepared, and the positional relationship of each lead pin part is fixed with a resin layer, and then the leads are connected. By cutting off the strip, a structure is obtained in which the ends of multiple lead pins protrude from the back side of the resin layer, so there is no need to align the directions of the lead pins, and all The lead pins can be aligned in the same direction, and
This allows the orientation of the LED chips bonded onto the lead pins to be aligned.
したがって、本発明の製造方法によれば、ＬＥＤの発光
の光軸の不揃いに起因した輝度むらの発生を防止して、
品質の向上を図るとともに製品歩留りの向上を図ること
ができる。Therefore, according to the manufacturing method of the present invention, the occurrence of uneven brightness due to the unevenness of the optical axes of the light emitted from the LEDs can be prevented.
It is possible to improve quality and product yield.
［実施例］
以下、本発明の一実施例であるＬＥＤ発光装置と、この
ＬＥＤ発光装置における発光ブロックの製造方法とを説
明する。[Example] Hereinafter, an LED light emitting device which is an example of the present invention and a method for manufacturing a light emitting block in this LED light emitting device will be described.
第１図は、本発明の一実施例であるＬＥＤ発光装置を使
った自動車用ストップランプの横断面を示したものであ
る。FIG. 1 shows a cross section of an automobile stop lamp using an LED light emitting device, which is an embodiment of the present invention.
このストップランプは、車体の高位置に配置されるハイ
マウントタイプのもので、不透明な合成樹脂等によって
形成されて車体に組み込まれる外ケース６と、この外ケ
ース６の前面開口部を覆う透明（又は半透明）のレンズ
板７と、一実施例のＬＥＤ発光装置８とから構成されて
いる。This stop lamp is a high-mount type that is placed at a high position on the vehicle body, and includes an outer case 6 that is made of opaque synthetic resin and is incorporated into the vehicle body, and a transparent ( It is composed of a lens plate 7 (or translucent) and an LED light emitting device 8 of one embodiment.
この一実施例のＬＥＤ発光装置８は、発光ブロック１０
と、給電用基板１１と、レンズプロ・ツク１２との３つ
のユニットとからなり、これらのユニ、１・を重ね合わ
せることによって形成されている。The LED light emitting device 8 of this embodiment includes a light emitting block 10
It consists of three units: a power feeding board 11, and a lens pro 12, and is formed by overlapping these units.
各ユニットについて詳述すると、前記発光ブロック１０
は、複数個のＬＥＤチップ１４と、各ＬＥＤチップ１４
に給電するための複数対のリードピン１５ａ、１５ｂと
、これらのＬＥＤチップ１４とリードピン１５ａ、１５
ｂとを向き・間隔を揃えて保持する樹脂層１６とを具備
しており、前記樹脂層１６によって全体として一体化さ
れている。To explain each unit in detail, the light emitting block 10
includes a plurality of LED chips 14 and each LED chip 14.
A plurality of pairs of lead pins 15a, 15b for supplying power to the LED chip 14 and the lead pins 15a, 15.
b, and a resin layer 16 that holds the parts 1 and 2 in the same direction and at the same intervals, and is integrated as a whole by the resin layer 16.
互いに対をなすリードピン１５ａ、１５ｂは、後述の製
造方法の項で説明するリードフレーム（第３図参照）に
よって提供されるもので、同じす−ドフレームを２個並
列に配置することによって、平行に２列に並ぶ配列を得
ている（第７図参照）。The pair of lead pins 15a and 15b are provided by a lead frame (see Fig. 3), which will be explained in the manufacturing method section below. (See Figure 7).
これらのリードピン１５ａ、１５ｂは、金属板をプレス
加工機で打ち抜くことによって形成されている。また、
それぞれのリードピン１５ａ、１５ｂは、ほぼ棒状を呈
していて、基端部が樹脂層１６の裏面側（第１図で下側
）に突出している。These lead pins 15a, 15b are formed by punching out a metal plate using a press machine. Also,
Each of the lead pins 15a, 15b has a substantially rod-like shape, and a base end thereof protrudes toward the back side of the resin layer 16 (lower side in FIG. 1).
また、一方のリードピン１５ａは、十の電極となるもの
で、その先端部には、前記ＬＥＤチップ１４を載せるた
めの反射器１７が形成されている。Further, one lead pin 15a serves as an electrode, and a reflector 17 on which the LED chip 14 is placed is formed at its tip.
この反射器１７は、リードピン１５ａの先端面にプレス
加工によって窪部を形成したもので、その底部１７ａは
ピンの長平方向に直交する平坦面に形成され、この底部
１７Ｈの周囲を囲う周壁部１７ｂは先端側に向けて徐々
に径を広げたコーン形に形成されている。この反射器１
７は、底部１７ａに載置したＬＥＤチップ１４の発光に
よる光りが側方に散乱するのを防止して、光量をｕｐさ
せる。This reflector 17 has a recess formed by press working on the tip end surface of a lead pin 15a, the bottom 17a of which is formed into a flat surface perpendicular to the longitudinal direction of the pin, and a peripheral wall 17b surrounding the bottom 17H. It is formed into a cone shape that gradually widens in diameter toward the tip. This reflector 1
7 prevents the light emitted from the LED chip 14 placed on the bottom portion 17a from scattering to the side, thereby increasing the amount of light.
底部１７ａに載置されるＬＥＤチップ１４の下面は、導
電性接着剤により底部１７ａに固定され、また、−この
ＬＥＤチップ１４の上面は、導線（材質としては、例え
ば、金、あるいは銅、あるいはアルミニウム等が使用さ
れる）１８を介して、の電極となる他方のリードピン１
５ｂに電気的に接続されている。The lower surface of the LED chip 14 placed on the bottom 17a is fixed to the bottom 17a with a conductive adhesive, and the upper surface of the LED chip 14 is fixed to the bottom 17a with a conductive wire (for example, gold, copper, or The other lead pin 1 serves as the electrode of the
5b.
前記樹脂層１６は、前述の複数対のリードピン１５ａ、
１５ｂ柑互を一定の間隔で、しがも総てのリードピンの
向きを揃えた状態で固定するピン固定層１６ａと、前述
の導線１８やＬＥＤチップ１４を埋設状態にして保護す
る保護層１６ｂとからなる。The resin layer 16 includes the plurality of pairs of lead pins 15a described above,
A pin fixing layer 16a that fixes the lead pins 15b at regular intervals with all the lead pins aligned in the same direction, and a protective layer 16b that protects the conductive wires 18 and LED chips 14 by embedding them. Consisting of
また、この一実施例のものの場合、固定層１６ａは、各
リードピン１５ａ、１５ｂの先端部を露呈させる窪み１
６ｃを有している。そして、前記保護層１６ｂは、前記
窪み１６ｃを透明な合成樹脂（例えば、エポキシ樹脂）
によって埋めたものである。なお、窪み１６ｃの側面は
、第１図にも示すように、傾斜している。この傾斜は、
ＬＥＤチップ１４からの光りをレンズブロック１２側に
行き易くしている。Further, in the case of this embodiment, the fixed layer 16a has a recess 1 exposing the tip of each lead pin 15a, 15b.
It has 6c. The protective layer 16b is made of transparent synthetic resin (for example, epoxy resin) to form the recess 16c.
It was filled in by Note that the side surface of the depression 16c is inclined, as also shown in FIG. This slope is
Light from the LED chip 14 is made easier to reach the lens block 12 side.
以上のような構成によって、発光ブロック１０は、複数
個のＬＥＤチップ１４を平面状に並べて一体化したユニ
ットとなっている。With the above configuration, the light emitting block 10 is a unit in which a plurality of LED chips 14 are arranged in a plane and integrated.
前記給電用基板１１は、発光ブロック１０上の複数個の
ＬＥＤチップ１４に給電するために発光ブロック１０の
裏面に重ね合わすプリント基板で、前記発光ブロック１
０の裏面に突出するリードピア１５ａ、１５ｂの配列に
合わせて、リードピンを差し込む部品取り付け穴１１ａ
が貫通形成されている。また、該基板１１の裏面には、
これらの部品取り付け穴１１ａに差し込まれたリードピ
ン１５ａ、１５ｂに給電するため給電回路（図示略）が
プリントされている。The power supply board 11 is a printed circuit board that is superimposed on the back surface of the light emitting block 10 in order to supply power to the plurality of LED chips 14 on the light emitting block 10.
Component mounting holes 11a into which lead pins are inserted in accordance with the arrangement of lead piers 15a and 15b protruding from the back surface of 0.
is formed through it. Moreover, on the back surface of the substrate 11,
A power supply circuit (not shown) is printed to supply power to the lead pins 15a and 15b inserted into these component mounting holes 11a.
したがって、前記発光ブロック１０の各リードピン１５
ａ、１５ｂは、発光ブロック１０の裏面に基板１１を重
ね合わせた状態にすることによって、基板１１における
部品取り付け穴１１ｂに一括して挿通させることができ
、また、基板１１の裏面に突出した各リードピンを半田
付けすることによって、各リードピンと給電回路とが電
気的に接続される。Therefore, each lead pin 15 of the light emitting block 10
a and 15b can be inserted all at once into the component mounting holes 11b in the board 11 by overlapping the board 11 on the back side of the light emitting block 10, and each of the parts a and 15b protruding from the back side of the board 11 By soldering the lead pins, each lead pin and the power supply circuit are electrically connected.
前記レンズブロック１２は、発光ブロック１゜のＬＥＤ
チップ１４の発光を活かすために、前記発光ブロック１
０の表面に重ね合わせるもので、発光ブロック１０にお
けるＬＥＤチップの配列に合わせて複数個の集光レンズ
１２ａを平面状に連続させて配列した構造をなす。この
レンズブロック１２は、透明の合成樹脂等の一体成形に
より形成されている。このレンズブロックＩ２は、例え
ば、接着剤によって発光ブロック１ｏの上面に固定され
、このレンズブロック１２と発光ブロック１０との一体
化によって、等測的に、複数個のしＥＤランプを集合さ
せたＬＥＤ集合体が構成される。The lens block 12 is a light emitting block 1° LED.
In order to utilize the light emission of the chip 14, the light emitting block 1
It has a structure in which a plurality of condensing lenses 12a are consecutively arranged in a plane in accordance with the arrangement of LED chips in the light emitting block 10. This lens block 12 is formed by integral molding of transparent synthetic resin or the like. This lens block I2 is fixed to the upper surface of the light emitting block 1o by, for example, an adhesive, and by integrating the lens block 12 and the light emitting block 10, an LED is created in which a plurality of LED lamps are assembled isometrically. An aggregate is formed.
以上の如きＬＥＤ発光装置８においては、高輝度の発光
が要求されるような場合には、発光プロ・ツクｌＯを製
造する際に、ＬＥＤチップの段階で選別を行えば良く、
多数の部材及び工程を費やしたＬＥＤランプの段階で選
別にかけるような無駄を省くことができる。In the LED light-emitting device 8 as described above, if high-intensity light emission is required, selection may be performed at the LED chip stage when manufacturing the light-emitting block 10.
It is possible to eliminate the waste of sorting at the LED lamp stage, which requires a large number of parts and processes.
また、前述したように、前記発光ブロック１０の裏面に
給電用基板１１を重ね合わせるだけで、複数対のリード
ピン１５ａ、１５ｂの総てを一括して対応する部品取り
付け穴１１ａに挿通した状態にすることができ、独立し
た多数のＬＥＤランプを基板上に一つ一つ位置ぎめする
ような手間のかかる作業が必要にならない。Further, as described above, simply by overlapping the power supply board 11 on the back surface of the light emitting block 10, all the pairs of lead pins 15a, 15b can be inserted into the corresponding component mounting holes 11a at once. This eliminates the need for time-consuming work such as positioning a large number of independent LED lamps one by one on the board.
したがって、実施例のＬＥＤ発光装置８においては、製
造コストを低減させるだけでなく、生産性を向上させる
こともできる。Therefore, in the LED light emitting device 8 of the example, it is possible not only to reduce manufacturing costs but also to improve productivity.
また、この実施例のＬＥＤ発光装置８においては、ＬＥ
Ｄチップ１４が反射器１７上にセットされていて、ＬＥ
Ｄチップ１４の側面からでた光が該反射器によって集光
レンズ１２Ｈの方向に集められるため、分散による損失
が効果的に防止され、光量のｕｐを図ることができる。Further, in the LED light emitting device 8 of this embodiment, the LED
The D chip 14 is set on the reflector 17, and the LE
Since the light emitted from the side surface of the D-chip 14 is collected by the reflector in the direction of the condenser lens 12H, loss due to dispersion is effectively prevented, and the amount of light can be increased.
次に、前記発光ブロック１０の製造方法を第３図〜第７
図に基づいて説明する。Next, a method for manufacturing the light emitting block 10 will be explained in FIGS. 3 to 7.
This will be explained based on the diagram.
まず、第３図に示すようなリードフレーム２５を２本用
意する。このリードフレーム２５は、後にリードピン１
５ａ、１５ｂとなる複数対のリードピン部２５ａ、２５
ｂと、これらのリードピン部２５ａ、２５ｂの下部を連
結する連結用帯部２５ｃ、２５ｄとを一体に形成したも
ので、金属板をプレス加工で打ち抜くことによって形成
されている。そして、それぞれのリードピン部２５ａ。First, two lead frames 25 as shown in FIG. 3 are prepared. This lead frame 25 will later be attached to the lead pin 1.
Plural pairs of lead pin portions 25a, 25, 5a, 15b
b, and connecting band portions 25c and 25d that connect the lower portions of these lead pin portions 25a and 25b are integrally formed, and are formed by punching out a metal plate by press working. And each lead pin part 25a.
２５ｂは、ほぼ棒状をなすとともに、延在する方向が揃
えられている。また、後にリードピン１５ａとなるリー
ドピン部２５ａの先端部には、前述の反射器１７が形成
されている。この反射器１７は、前述のようにプレス加
工によってリードピン部２５ａの先端面に窪みを形成し
たもので、ＬＥＤチップ１４の載置部となる。25b is substantially rod-shaped and extends in the same direction. Furthermore, the aforementioned reflector 17 is formed at the tip of the lead pin portion 25a, which will later become the lead pin 15a. The reflector 17 is formed by forming a depression on the tip end surface of the lead pin portion 25a by press working as described above, and serves as a mounting portion for the LED chip 14.
そして、次には、第４図に示すように、固定層１６ａを
形成する工程と、チップ１４を反射器１７にセットして
、このチップ１４と他方のリードビン部２５ｂの先端と
導線１８で接続する工程とを行う。これらの工程は、ど
ちらを先に行っても良いが、チップ１４と導線１８とを
セットする工程を後にしたほうが、作業が行い易い。Next, as shown in FIG. 4, there is a step of forming a fixed layer 16a, setting the chip 14 on a reflector 17, and connecting this chip 14 to the tip of the other lead bin part 25b with a conductive wire 18. and the process of doing so. Although either of these steps may be performed first, it is easier to perform the work if the step of setting the chip 14 and the conductive wire 18 is performed later.
固定層１６ａを形成する工程は、２本のリードフレーム
２５を平行に立てた状態にし、この状態でそれぞれのリ
ードフレーム２５の中間部等を成形型の中に位置決めす
る。そして、成形型内に不透明の未硬化の合成樹脂を充
填して、リードビン部２５ａ、２５ｂの中間から先端ま
での部分を樹脂中に埋設した状態にする。そして、前記
樹脂が硬化したら、リードフレーム２５を型から取り出
せば良い。In the step of forming the fixed layer 16a, the two lead frames 25 are placed in a parallel state, and in this state, the intermediate portions of each lead frame 25 are positioned in a mold. Then, the mold is filled with an opaque, uncured synthetic resin, so that the portions of the lead bin portions 25a, 25b from the middle to the tip are embedded in the resin. After the resin has hardened, the lead frame 25 can be taken out of the mold.
次には、第５図に示すように、保護層１６ｂを形成する
。この保護層１６ｂの形成は、前記固定層］、 ６ ａ
の窪み１６Ｃに透明または半透明の合成樹脂（例えば、
エポキシ樹脂）等を充填させて、硬化させれば良い。Next, as shown in FIG. 5, a protective layer 16b is formed. The formation of this protective layer 16b is based on the above-mentioned fixed layer], 6 a
Transparent or translucent synthetic resin (for example,
It is sufficient to fill it with epoxy resin or the like and harden it.
前述の固定層１６ａおよび保護層１６ｂの成形法として
は、例えば、射出成形法、圧縮成形法、キャスティング
成形法等の既存の成形法だけでなく、既存のものに改良
を加えた方法も利用することができる。As the molding method for the above-mentioned fixed layer 16a and protective layer 16b, for example, not only existing molding methods such as injection molding method, compression molding method, and casting molding method, but also methods in which improvements are made to existing methods are used. be able to.
次には、第６図に示すように、連結用帯部２５ｃ、
２５ｄを切除する。この切除によって、今まで連結状態
にあった各リードビン部２５ａ、２５ｂが独立して、リ
ードピン１５ａ、１５ｂとなり、発光ブロック１０か完
成する。Next, as shown in FIG. 6, the connecting band portion 25c,
Excise 25d. By this cutting, the lead bin parts 25a and 25b, which have been in a connected state up until now, become independent and become lead pins 15a and 15b, and the light emitting block 10 is completed.
なお、第６図は第５図におけるＶＩ−ＶＩ線の位置での
断面図であり、第７図は第５図における矢印■方向から
の矢視図である。6 is a cross-sectional view taken along line VI--VI in FIG. 5, and FIG. 7 is a sectional view taken from the direction of arrow {circle around (2)} in FIG. 5.
以上のような製造方法によって発光ブロック１０を製造
した場合では、リードピン１５ａ、１５ｂ相互の向きを
一致させるための位置調整作業が一切不要であり、確実
に総てのリードピン１５ａ１５ｂの向きが揃った状態を
得ることができ、また、これによって、リードピン１５
ａの上に接青されるＬＥＤチップ１４の向きも揃えるこ
とかできる。When the light emitting block 10 is manufactured by the above manufacturing method, there is no need for any position adjustment work to align the directions of the lead pins 15a and 15b, and it is possible to ensure that all the lead pins 15a and 15b are aligned in the same direction. can be obtained, and by this, the lead pin 15
It is also possible to align the orientation of the LED chips 14 that are attached to the top of a.
したがって、この製造方法によれば、ＬＥＤの発光の光
軸の不揃いに起因した輝度むらの発生を防止して、品質
の向上を図るとともに製品歩留りの向上を図ることがで
きる。Therefore, according to this manufacturing method, it is possible to prevent the occurrence of brightness unevenness due to irregularities in the optical axes of the light emitted from the LEDs, thereby improving quality and product yield.
なお、この製造方法で使用したリードフレーム２５は、
一対のリードピン２５ａ、２５ｂを交互に一列に配列し
たものであるが、ＬＥＤチップ１４の向きを揃えるとい
う効果を得るためだけであれば、ＬＥＤチップ１４を載
せるリードピン部２５ａだけを一定間隔で並べたリード
フレームを作ることも考えることができる。Note that the lead frame 25 used in this manufacturing method is
Although a pair of lead pins 25a and 25b are arranged alternately in a line, if only the effect of aligning the directions of the LED chips 14 is to be obtained, only the lead pin portions 25a on which the LED chips 14 are placed may be arranged at regular intervals. You can also consider making a lead frame.
また、前述の方法では、樹脂層１６を固定層１６ａと保
護層１６ｂとの２層に分けて、各層毎に工程を分けて形
成したが、使用する合成樹脂の種類や成形法を適宜選定
することによって、−工程で形成したり、−層の構造に
することもできる。In addition, in the method described above, the resin layer 16 is divided into two layers, the fixed layer 16a and the protective layer 16b, and a separate process is performed for each layer. However, the type of synthetic resin used and the molding method may be selected as appropriate. Depending on the process, it can be formed in a -step or can have a -layer structure.
［発明の効果コ
この発明のＬＥＤ発光装置は、独立したＬＥＤランプを
使用するものではなく、複数個のＬＥＤチップおよび複
数対のリードピンを一体化した発光プロ、りとレンズブ
ロックとを重ね合わせることによって、等測的に、複数
個のＬＥＤランプを集合させたＬＥＤ集合体を構成する
ものである。[Effects of the Invention] The LED light emitting device of this invention does not use independent LED lamps, but uses a light emitting device that integrates multiple LED chips and multiple pairs of lead pins, and overlaps a lens block. Accordingly, a plurality of LED lamps are assembled isometrically to form an LED assembly.
したがって、高輝度の発光が要求されるような場合には
、発光ブロックを製造する際に、ＬＥＤチップの段階で
選別を行えば良く、多数の部材、工程を費やしたＬＥＤ
ランプの段階で選別にかけるような無駄を省（ことがで
きる。Therefore, if high-intensity light emission is required, it is sufficient to select the LED chips at the stage of manufacturing the light-emitting block, which eliminates the need for LEDs that require a large number of parts and processes.
It is possible to eliminate waste such as sorting at the lamp stage.
また、給電用基板における部品取り付け穴の配列を、前
記発光ブロックの裏面から突出するリードピンの配列に
合わせているため、前記発光ブロックの裏面に給電用基
板を重ね合わせるだけで、複数対のリードピンを一括し
て対応する部品取り付け穴に挿通した状態にすることが
でき、独立した多数のＬＥＤランプを基板上に一つ一つ
位置ぎめするような手間のかかる作業が必要にならない
。In addition, the arrangement of the component mounting holes on the power supply board matches the arrangement of the lead pins protruding from the back surface of the light emitting block, so multiple pairs of lead pins can be installed by simply stacking the power supply board on the back surface of the light emitting block. They can be inserted into the corresponding component mounting holes all at once, and there is no need for the time-consuming work of positioning a large number of independent LED lamps one by one on the board.
したがって、本発明のＬＥＤ発光装置においては、製造
コストを低減させるだけでなく、生産性を向上させるこ
ともできる。Therefore, in the LED light emitting device of the present invention, it is possible not only to reduce manufacturing costs but also to improve productivity.
また、前記ＬＥＤ発光装置における発光ブロックの製造
方法においては、複数本のリードピン部が連結用帯部に
よって相互に連結されたリードフレームを用意しておい
て、各リードピン部相互の位置関係を樹脂層で固定した
後に連結用帯部を切除することによって、複数本のリー
ドピンの端部を樹脂層の裏面に突出させた構造を得るた
め、リードビン相互の向きを合わせるような作業が一切
不要であり、確実に総てのリードピンの向きが揃った状
態を得ることができ、また、これによって、リードピン
の上に接着されるＬＥＤチップの向きも揃えることがで
きる。Further, in the method for manufacturing a light emitting block in the LED light emitting device, a lead frame in which a plurality of lead pin portions are connected to each other by a connecting band portion is prepared, and the mutual positional relationship of each lead pin portion is determined by a resin layer. By cutting off the connecting band after fixing with the resin layer, a structure is obtained in which the ends of the multiple lead pins protrude from the back side of the resin layer, so there is no need to align the directions of the lead bins. It is possible to ensure that all the lead pins are oriented in the same direction, and thereby the LED chips bonded onto the lead pins can also be oriented in the same direction.
したがって、本発明の製造方法によれば、ＬＥＤの発光
の光軸の不揃いに起因した輝度むらの発生を防止して、
品質の向上を図るとともに製品歩留りの向上を図ること
ができる。Therefore, according to the manufacturing method of the present invention, the occurrence of uneven brightness due to the unevenness of the optical axes of the light emitted from the LEDs can be prevented.
It is possible to improve quality and product yield.
第１図は本発明のＬＥＤ発光装置の一実施例の横断面図
、第２図は第１図の要部の斜視図、第３図〜第７図は前
記一実施例における発光ブロックの製造方法を説明する
ためのもので、第３図は該方法に使用するリードフレー
ムの構造説明図、第４図は固定層を形成する工程の説明
図、第５図は保護層を形成する工程の説明図、第６図は
第５図におけるＶＩ−ＶＩ線に沿う位置で断面した場合
の図でリードフレームの連結用帯部を切除する工程の説
明図、第７図は第５図における矢印■による矢視図、第
８図は従来のＬＥＤ発光装置の構成説明図、第９図はこ
の従来装置における問題点の説明図である。
８・・・・・・ＬＥＤ発光装置、１０・・・・・・発光
ブロック、１１・・・・・・給電用基板、ｌｌａ・・・
・・・部品取り付け穴、１２・・・・・・レンズブロッ
ク、１２ａ・・・・・集光レンズ、１４・・・・・・Ｌ
ＥＤチップ、１５ａ、１５ｂ・・・・・・リードピン、
１６・・・・・・樹脂層、１６ａ・・・・・・固定層、
１６ｂ・・・・・・保護層、１７・・・・・・反射皿、
１８・・・・・・導線。FIG. 1 is a cross-sectional view of an embodiment of the LED light emitting device of the present invention, FIG. 2 is a perspective view of the main part of FIG. 1, and FIGS. 3 to 7 are manufacturing of the light emitting block in the embodiment These are for explaining the method. Figure 3 is an explanatory diagram of the structure of a lead frame used in the method, Figure 4 is an explanatory diagram of the process of forming a fixed layer, and Figure 5 is an explanatory diagram of the process of forming a protective layer. Explanatory drawing, Fig. 6 is a cross-sectional view taken along line VI-VI in Fig. 5, and is an explanatory drawing of the process of cutting out the connecting band portion of the lead frame, and Fig. 7 is a cross-sectional view taken along line VI-VI in Fig. 5. 8 is an explanatory diagram of the configuration of a conventional LED light emitting device, and FIG. 9 is an explanatory diagram of problems in this conventional device. 8... LED light emitting device, 10... light emitting block, 11... power supply board, lla...
...Parts mounting hole, 12...Lens block, 12a...Condensing lens, 14...L
ED chip, 15a, 15b...Lead pin,
16... Resin layer, 16a... Fixed layer,
16b...protective layer, 17...reflection plate,
18... Conductor.
Claims (1)
と、前記複数個のＬＥＤチップに給電するために該発光
ブロックの裏面に重ね合わせる給電用基板と、ＬＥＤチ
ップの発光を活かすために前記発光ブロックの表面に重
ね合わせるレンズブロックとを備え、 前記発光ブロックは、複数個のＬＥＤチップと、各ＬＥ
Ｄチップに給電するための複数対のリードピンと、これ
らのＬＥＤチップとリードピンとを向き・間隔を揃えて
保持する樹脂層とを具備するとともに、前記樹脂層によ
って全体として一体化されて、樹脂層の裏面にリードピ
ンの基端部を突出させた構成をなし、 一方、前記給電用基板は、前記発光ブロックから突出す
るリードピンの配列に合わせて、リードピンを差し込む
部品取り付け穴と、この部品取り付け穴に差し込まれた
リードピンに給電するための給電回路とを具備した構成
をなし、 前記レンズブロックは、一体成形によって形成され、か
つ、発光ブロックにおけるＬＥＤチップの配列に合わせ
て複数個の集光レンズを平面状に配列した構成をなして
いることを特徴とするＬＥＤ発光装置。 ２、請求項１記載のＬＥＤ発光装置における発光ブロッ
クの製造方法であって、 ほぼ棒状をなす複数本のリードピン部とこれらのリード
ピン部の基端部を連結する連結用帯部とを一体に形成し
たリードフレームを用意し、該リードフレームの中間部
を未硬化樹脂に埋設させ、前記樹脂の硬化後に前記リー
ドフレームの連結用帯部を切除することによって、樹脂
層の裏面にリードピンの基端部を突出させた構造を得る
ことを特徴とした発光ブロックの製造方法。[Scope of Claims] 1. A light emitting block in which a plurality of LED chips are arranged in a planar manner, a power supply substrate superimposed on the back surface of the light emitting block to supply power to the plurality of LED chips, and a light emitting block of the LED chips; and a lens block superimposed on the surface of the light emitting block in order to take advantage of the light emitting block, and the light emitting block includes a plurality of LED chips and each
It includes a plurality of pairs of lead pins for feeding power to the D chip, and a resin layer that holds these LED chips and lead pins in the same orientation and spacing, and is integrated as a whole by the resin layer, and the resin layer The base end of the lead pin protrudes from the back surface of the light emitting block, and the power supply board has a component mounting hole into which the lead pin is inserted in accordance with the arrangement of the lead pins protruding from the light emitting block, and a component mounting hole into which the lead pin is inserted. The lens block includes a power supply circuit for supplying power to the inserted lead pins, and the lens block is formed by integral molding, and a plurality of condensing lenses are arranged in a plane according to the arrangement of the LED chips in the light emitting block. An LED light emitting device characterized by having a configuration in which the LEDs are arranged in a shape. 2. A method for manufacturing a light emitting block in an LED light emitting device according to claim 1, comprising integrally forming a plurality of substantially rod-shaped lead pin portions and a connecting band portion connecting base ends of these lead pin portions. By preparing a lead frame, embedding the middle part of the lead frame in uncured resin, and cutting off the connecting band of the lead frame after the resin hardens, the proximal ends of the lead pins are embedded on the back side of the resin layer. A method for producing a light-emitting block, characterized by obtaining a structure in which the light-emitting block protrudes.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63219675A JP2504533B2 (en) | 1988-09-02 | 1988-09-02 | LED light emitting device and method of manufacturing light emitting block used in the device |
| DE3929125A DE3929125A1 (en) | 1988-09-02 | 1989-09-01 | LED array with diode coupled pins - has light emitting block with several LED chips on power supply substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63219675A JP2504533B2 (en) | 1988-09-02 | 1988-09-02 | LED light emitting device and method of manufacturing light emitting block used in the device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0267769A true JPH0267769A (en) | 1990-03-07 |
| JP2504533B2 JP2504533B2 (en) | 1996-06-05 |
Family
ID=16739214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63219675A Expired - Fee Related JP2504533B2 (en) | 1988-09-02 | 1988-09-02 | LED light emitting device and method of manufacturing light emitting block used in the device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2504533B2 (en) |
| DE (1) | DE3929125A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005235520A (en) * | 2004-02-18 | 2005-09-02 | Ichikoh Ind Ltd | Vehicular lighting fixture |
| US9222645B2 (en) | 2010-11-29 | 2015-12-29 | RTC Industries, Incorporated | LED lighting assembly and method of lighting for a merchandise display |
| US11274808B2 (en) | 2010-06-17 | 2022-03-15 | Rtc Industries, Inc. | LED lighting assembly and method of lighting for a merchandise display |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2792722B2 (en) * | 1990-07-16 | 1998-09-03 | 三菱電機株式会社 | Semiconductor light emitting device |
| FR2680859B1 (en) * | 1991-09-02 | 1993-10-29 | Valeo Vision | OPTICAL COLLIMATION ELEMENT AND ITS ASSOCIATED SUPPORT ELEMENT, IN PARTICULAR FOR A MOTOR VEHICLE SIGNALING LIGHT. |
| FR2680862B1 (en) * | 1991-09-02 | 1997-08-08 | Valeo Vision | SIGNAL LIGHT WITH LIGHT EMITTING ELEMENTS, PARTICULARLY FOR MOTOR VEHICLE. |
| DE4311937A1 (en) * | 1993-04-10 | 1994-10-13 | Telefunken Microelectron | Light-emitting device |
| EP0632511A3 (en) * | 1993-06-29 | 1996-11-27 | Mitsubishi Cable Ind Ltd | A light emitting diode aggregate module and a method for manufacturing a light emitting diode aggregate module. |
| DE19741585C1 (en) * | 1997-09-20 | 1998-10-01 | Parsytec Computer Gmbh | Production of light emitting diode LED matrix |
| FR2794927B1 (en) * | 1999-06-09 | 2001-08-10 | Ass Pour La Promotion Et Le De | POLYCHROMATIC LIGHTING DEVICE WITH LIGHT EMITTING DIODES |
| EP1153792A1 (en) * | 2000-05-09 | 2001-11-14 | SIDLER GMBH & CO | Lighting device with a plurality of LEDs |
| FR2809796B1 (en) | 2000-06-05 | 2002-07-12 | Zedel | PORTABLE LIGHTING LIGHT WITH LIGHT EMITTING DIODES |
| CA2410978A1 (en) | 2002-11-04 | 2004-05-04 | John Spencer | Solid state illuminator for bi-colour ported water level gauges |
| US20150295154A1 (en) * | 2005-02-03 | 2015-10-15 | Epistar Corporation | Light emitting device and manufacturing method thereof |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS472070U (en) * | 1971-01-27 | 1972-08-23 | ||
| JPS5667772U (en) * | 1979-10-30 | 1981-06-05 | ||
| JPS5871671A (en) * | 1981-10-23 | 1983-04-28 | Idec Izumi Corp | Light emitting diode lamp |
| JPS6049652U (en) * | 1983-09-14 | 1985-04-08 | スタンレー電気株式会社 | Two-color light emitting semiconductor device |
| JPS6079758U (en) * | 1983-11-04 | 1985-06-03 | スタンレー電気株式会社 | Multicolor light emitting semiconductor device |
| JPS61113290A (en) * | 1984-11-08 | 1986-05-31 | Sanyo Electric Co Ltd | Linear light source |
| JPS61158606A (en) * | 1984-12-28 | 1986-07-18 | 株式会社小糸製作所 | Lighting apparatus |
| JPS61181002A (en) * | 1985-02-05 | 1986-08-13 | 株式会社小糸製作所 | Lighting apparatus |
| JPS634009U (en) * | 1986-06-27 | 1988-01-12 | ||
| JPS63120303U (en) * | 1987-01-28 | 1988-08-04 |
-
1988
- 1988-09-02 JP JP63219675A patent/JP2504533B2/en not_active Expired - Fee Related
-
1989
- 1989-09-01 DE DE3929125A patent/DE3929125A1/en not_active Withdrawn
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS472070U (en) * | 1971-01-27 | 1972-08-23 | ||
| JPS5667772U (en) * | 1979-10-30 | 1981-06-05 | ||
| JPS5871671A (en) * | 1981-10-23 | 1983-04-28 | Idec Izumi Corp | Light emitting diode lamp |
| JPS6049652U (en) * | 1983-09-14 | 1985-04-08 | スタンレー電気株式会社 | Two-color light emitting semiconductor device |
| JPS6079758U (en) * | 1983-11-04 | 1985-06-03 | スタンレー電気株式会社 | Multicolor light emitting semiconductor device |
| JPS61113290A (en) * | 1984-11-08 | 1986-05-31 | Sanyo Electric Co Ltd | Linear light source |
| JPS61158606A (en) * | 1984-12-28 | 1986-07-18 | 株式会社小糸製作所 | Lighting apparatus |
| JPS61181002A (en) * | 1985-02-05 | 1986-08-13 | 株式会社小糸製作所 | Lighting apparatus |
| JPS634009U (en) * | 1986-06-27 | 1988-01-12 | ||
| JPS63120303U (en) * | 1987-01-28 | 1988-08-04 |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005235520A (en) * | 2004-02-18 | 2005-09-02 | Ichikoh Ind Ltd | Vehicular lighting fixture |
| US10619824B2 (en) | 2010-06-17 | 2020-04-14 | Rtc Industries, Inc. | LED lighting assembly and method of lighting for a merchandise display |
| US11274808B2 (en) | 2010-06-17 | 2022-03-15 | Rtc Industries, Inc. | LED lighting assembly and method of lighting for a merchandise display |
| US9222645B2 (en) | 2010-11-29 | 2015-12-29 | RTC Industries, Incorporated | LED lighting assembly and method of lighting for a merchandise display |
| US9829178B2 (en) | 2010-11-29 | 2017-11-28 | Rtc Industries, Inc. | LED lighting assembly and method of lighting for a merchandise display |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2504533B2 (en) | 1996-06-05 |
| DE3929125A1 (en) | 1990-03-22 |
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