JPS63293584A - Light emitting display body - Google Patents
Light emitting display bodyInfo
- Publication number
- JPS63293584A JPS63293584A JP62128099A JP12809987A JPS63293584A JP S63293584 A JPS63293584 A JP S63293584A JP 62128099 A JP62128099 A JP 62128099A JP 12809987 A JP12809987 A JP 12809987A JP S63293584 A JPS63293584 A JP S63293584A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- light
- emitting display
- molded body
- emitting element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 16
- 239000000853 adhesive Substances 0.000 claims description 13
- 230000001070 adhesive effect Effects 0.000 claims description 13
- 230000003287 optical effect Effects 0.000 description 14
- 238000010586 diagram Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000010931 gold Substances 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000012788 optical film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Led Device Packages (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、発光ダイオードや固体ランプ等の発光素子を
用いて構成される発光表示体の改良に関するものである
。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to improvement of a light-emitting display constructed using light-emitting elements such as light-emitting diodes and solid-state lamps.
第４図は従来の発光表示体の概略構造図である。 FIG. 4 is a schematic structural diagram of a conventional light emitting display.
第４図に示す従来の発光表示体は、点灯回路を構成する
導電パターンが形成され且つ発光ダイオード等の発光素
子５１がドントマトリソクス状に多数個配設されてなる
発光表示体基板５２上に、各発光素子５１と対応する各
部位に空洞が形成された表面板５３を接着剤などを介し
て重ねあわせ、各空洞内に透明エポキシ樹脂５４を注入
して固化したものである。The conventional light-emitting display shown in FIG. 4 has a light-emitting display substrate 52 on which a conductive pattern constituting a lighting circuit is formed and a large number of light-emitting elements 51 such as light-emitting diodes are arranged in a matrix pattern. , surface plates 53 in which cavities are formed in respective portions corresponding to the respective light emitting elements 51 are laminated together with an adhesive or the like, and a transparent epoxy resin 54 is injected into each cavity and solidified.
また、図示しないが、従来より発光表示体として、各発
光ダイオードがすでに単独に透明エポキシ樹脂内に埋設
固定された、いわゆる発光ダイオードランプを、ドント
マトリソクス状の点灯回路を構成する導電パターンが形
成されたプリント基板上に多数個配置し、且つその各ラ
ンプ間を等間隔に固定するためと配色上のコントラスト
の問題から、各発光ダイオードランプに対応する各部位
に空洞を設けた表示板（セパレーター）の各空洞に発光
ダイオードランプをはめこんだものがすでに知られてい
る。Although not shown, a conductive pattern constituting a donto matrix lighting circuit is formed on a so-called light-emitting diode lamp, in which each light-emitting diode is already individually embedded and fixed in transparent epoxy resin, as a light-emitting display body. In order to arrange a large number of light-emitting diode lamps on a printed circuit board, and to fix the lamps at equal intervals, and also because of the problem of color contrast, we used a display board (separator) with cavities in each part corresponding to each light-emitting diode lamp. ) in which each cavity is fitted with a light-emitting diode lamp is already known.
しかしながら、これらの構造のものにおいては次のよう
な問題点があった。However, these structures have the following problems.
すなわち、前者の場合は、発光表示体の製造工程で、空
洞に透明樹脂を注入するが、透明樹脂の表面張力の問題
から設計どおりの樹脂曲面が得られず、したがって配光
特性上良好なものが得られないので問題となっていた。That is, in the former case, transparent resin is injected into the cavity during the manufacturing process of the light emitting display, but due to the problem of the surface tension of the transparent resin, the resin curved surface as designed cannot be obtained, and therefore the light distribution characteristics are not good. This was a problem because it could not be obtained.
この点を解決するために特開昭６１−２３７４８５号に
おいて、金型を用いて、各発光素子部位に樹脂注入孔と
空気抜き孔とを併設することによって光学的特性の改善
を図っている。しかし、かかる製法で製造された発光表
示体は空洞内に残留気泡が残りやすく、また発光素子上
に空洞を有する金枠をのせ、その空洞に透明樹脂を注入
して製造しているので、各発光素子と空洞との位置を個
別に調整することができず、各発光素子と透明樹脂とを
光学的に最適の位置に配置することは不可能であった。To solve this problem, Japanese Patent Application Laid-Open No. 61-237485 attempts to improve optical characteristics by using a mold and providing resin injection holes and air vent holes at each light emitting element site. However, the light-emitting displays manufactured by this method tend to have residual air bubbles in the cavities, and since they are manufactured by placing a metal frame with a cavity over the light-emitting element and injecting transparent resin into the cavity, each It has been impossible to individually adjust the positions of the light emitting elements and the cavity, and it has been impossible to arrange each light emitting element and the transparent resin at optimal optical positions.
このため、歩留りあるいは光学特性・配光特性の点で問
題があった。Therefore, there were problems in terms of yield, optical characteristics, and light distribution characteristics.
また、後者の場合は発光素子と導電パターンが形成され
たプリン）Ｗ板とが分離した構造になって、形状的に厚
みのある大型のものになり、且つ特に全点灯した時の発
熱の問題があった。In addition, in the latter case, the light emitting element and the printed W board on which the conductive pattern is formed are separated, resulting in a thick and large shape, and there is a problem of heat generation especially when all the lights are turned on. was there.
本発明は、上記事情に基づいてなされたものであり、光
学特性、配光特性及び放熱特性の優れた発光表示体を提
供することを目的とする。The present invention has been made based on the above circumstances, and an object of the present invention is to provide a light emitting display with excellent optical properties, light distribution properties, and heat dissipation properties.
上記の目的を達成するための本発明は、表面に点灯回路
を構成する導電パターンが形成された発光表示体基板と
、該発光表示体基板の導電パターン上に複数個配置され
た発光素子と、透明樹脂からなり前記発光表示体基板に
接着する接着部に凹部が形成され且つ該凹部に前記発光
素子を収納するように前記発光表示体基板に透明接着剤
を用いて接着された成型体とを設けたものである。To achieve the above object, the present invention includes: a light-emitting display substrate on which a conductive pattern constituting a lighting circuit is formed; a plurality of light-emitting elements disposed on the conductive pattern of the light-emitting display substrate; A molded body made of a transparent resin and having a recess formed in an adhesive part to be adhered to the light emitting display substrate and adhered to the light emitting display substrate using a transparent adhesive so as to house the light emitting element in the recess. It was established.
本発明は前記の構成にｒることによって、発光表示体基
板上に突出した各車−の発光素子を、光学設計のなされ
た独立した成型体の凹部に収納することにより、成型体
を発光素子に対して光学設計上適正な箇所に配すること
、たとえば各々の発光素子と成型体との光軸を揃えるこ
とが可能となった。これにより、各発光素子が発した光
を効率よ（前方に送ることができると共に、各発光素子
が発する光のバラツキが少なくなり、全体としても光学
特性、配光特性の向上を図ることができる。According to the present invention, the light emitting elements of each car protruding onto the light emitting display substrate are accommodated in the recesses of an independent molded body having an optical design, thereby converting the molded body into a light emitting element. In contrast, it has become possible to arrange the light emitting elements at appropriate locations in terms of optical design, for example, to align the optical axes of each light emitting element and the molded body. This allows the light emitted by each light-emitting element to be sent forward efficiently, reduces the variation in the light emitted by each light-emitting element, and improves the optical characteristics and light distribution characteristics as a whole. .
また、各発光素子毎に成型体が設けられ、各成型体は各
々独立した状態で発光表示体基板上に接着されているの
で、放熱特性の向上を図ることができる。Moreover, since a molded body is provided for each light emitting element and each molded body is adhered to the light emitting display substrate in an independent state, it is possible to improve heat dissipation characteristics.
以下に本発明の第１の実施例を第１図及び第２図を参照
して説明する。第１図は本発明の第１の実施例である発
光表示体の概略構造図である。第１図において、１は発
光表示体基板、２はたとえば発光ダイオードチップ等よ
りなる発光素子、３は透明樹脂からなる成型体、４は透
明接着剤、５は銀ペーストからなる導電パターンである
。A first embodiment of the present invention will be described below with reference to FIGS. 1 and 2. FIG. 1 is a schematic structural diagram of a light emitting display according to a first embodiment of the present invention. In FIG. 1, 1 is a light emitting display substrate, 2 is a light emitting element such as a light emitting diode chip, 3 is a molded body made of transparent resin, 4 is a transparent adhesive, and 5 is a conductive pattern made of silver paste.
第２図は本発明の第１の実施例である発光表示体の成型
体の製造に用いる金型の概略断面図である。第２図にお
いて、２１は内部が弾丸状に形成された金型である。成
型体３は透明樹脂を金型２１に注入し、加熱・固化した
後、金型２１から取り出すことにより得られる。ここで
、金型２１の材質として、透明樹脂に対して濡れ性の良
好なものを使用することによって、第２図に示すように
凹球面状の凹部が形成された接着部３ａを有する成型体
３を製造することができる。FIG. 2 is a schematic cross-sectional view of a mold used for manufacturing a molded body of a light-emitting display according to a first embodiment of the present invention. In FIG. 2, 21 is a mold whose inside is formed into a bullet shape. The molded body 3 is obtained by injecting transparent resin into a mold 21, heating and solidifying it, and then taking it out from the mold 21. Here, by using a material with good wettability for transparent resin as the material of the mold 21, a molded product having an adhesive part 3a in which a concave spherical concave part is formed as shown in FIG. 3 can be manufactured.
本発明の第１の実施例である発光表示体を製造するには
、予め上記の金型を用いて光学特性、配光特性の優れた
成型体３を造る。また、発光表示体基板１の表面には、
ドントマトリノクス状に配線されたｉ艮ペーストからな
る導電パターン５を形成する。次に、複数個の発光素子
２を銀ペースト６を用いて導電パターン５のカソード側
５ａに導電性を保つように固着し、また金ボンディング
ワイヤ７を用いて各発光素子２を導電パターン５のアノ
ード側５ｂに接続する。最後に、予め造っておいた成型
体３に形成された接着部３ａの凹部に透明接着剤４を注
入し、その成型体３を第１図矢印に示す方向から発光素
子２に被せ、接着部３ａの凹部内に発光素子２を収納す
るようにして発光表示体基板１に接着する。In order to manufacture the light-emitting display according to the first embodiment of the present invention, a molded body 3 having excellent optical properties and light distribution properties is made in advance using the above-mentioned mold. Further, on the surface of the light emitting display substrate 1,
A conductive pattern 5 made of i-containing paste and wired in a straight pattern is formed. Next, a plurality of light emitting elements 2 are fixed to the cathode side 5a of the conductive pattern 5 using silver paste 6 so as to maintain conductivity, and each light emitting element 2 is attached to the conductive pattern 5 using a gold bonding wire 7. Connect to the anode side 5b. Finally, transparent adhesive 4 is injected into the recess of the adhesive part 3a formed in the molded body 3 that has been made in advance, and the molded body 3 is placed over the light emitting element 2 from the direction shown by the arrow in FIG. The light emitting device 2 is adhered to the light emitting display substrate 1 so as to be accommodated in the recessed portion 3a.
上記の第１の実施例によれば、予め金型により光学膜８
１のなされた成型体を製造し、その成型体を発光素子２
の軸光度を測定する等の手段を用いながら各発光素子毎
に接着するので、発光素子上に空洞を有する金枠をのせ
、その空洞に透明樹脂を注入して製造していた従来の発
光表示体に比べて、成型体を発光素子に対して光学設計
上適正な箇所に配すること、たとえば各発光素子と成型
体との光軸を揃えることができる。これにより、各発光
素子が発した光を効率よく前方に送ることができると共
に、各発光素子が発する光のバラツキが少なくなり、発
光表示体の光学特性、配光特性が向上する。According to the first embodiment described above, the optical film 8 is formed by molding in advance.
A molded body made from 1 is manufactured, and the molded body is used as a light emitting element 2.
Since each light-emitting element is adhered using means such as measuring the axial luminous intensity of the light-emitting element, conventional light-emitting displays are manufactured by placing a metal frame with a cavity on top of the light-emitting element and injecting transparent resin into the cavity. Compared to the body, it is possible to arrange the molded body at an appropriate location in terms of optical design with respect to the light emitting element, for example, to align the optical axes of each light emitting element and the molded body. Thereby, the light emitted by each light emitting element can be efficiently sent forward, and variations in the light emitted by each light emitting element are reduced, and the optical characteristics and light distribution characteristics of the light emitting display are improved.
また、上記の第１の実施例によれば、各発光素子毎に成
型体が設けられ、しかもその成型体は各々独立した状態
で発光表示体基板に接着されているので、放熱特性が向
上する。Further, according to the first embodiment, a molded body is provided for each light emitting element, and each of the molded bodies is independently adhered to the light emitting display substrate, so that heat dissipation characteristics are improved. .
また、上記の第１の実施例によれば、透明接着剤は接着
部の凹部に注入すればよいので、気泡を生ずることなく
容易に透明接着剤を注入することができる。これにより
、発光表示体の製造が容易となる。Furthermore, according to the first embodiment, the transparent adhesive can be injected into the recessed portion of the bonded portion, so that the transparent adhesive can be easily injected without creating bubbles. This facilitates manufacturing of the light emitting display.
更に、上記の第１の実施例によれば、発光素子は発光表
示体基板の導電パターン上に直接載置しであるので、発
光表示体を薄型で堅牢なものとすることができる。Furthermore, according to the first embodiment, since the light emitting elements are placed directly on the conductive pattern of the light emitting display substrate, the light emitting display can be made thin and robust.
第３図は本発明の第２の実施例である発光表示体の概略
構成図である。第３図おいて、３１は透明樹脂である。FIG. 3 is a schematic diagram of a light emitting display according to a second embodiment of the present invention. In FIG. 3, 31 is a transparent resin.
尚、第３図において、第１図に示す第１の実施例と同一
の機能を有するものは同一の符号を付すことにより、そ
の詳細な説明を省略する。In FIG. 3, parts having the same functions as those in the first embodiment shown in FIG. 1 are given the same reference numerals, and detailed explanation thereof will be omitted.
第２の実施例が第１の実施例と異なるのは、発光素子２
と金ポンディングワイヤ７とを、それらの部分に予め透
明樹脂を滴下する等の手段により該透明樹脂で被ってい
ることである。これにより、発光素子２や極細の金ボン
ディングワイヤ７を傷つけることなく、成型体３に迅速
に収納することができるので、生産性の向上を図ること
ができる。The second embodiment differs from the first embodiment in that the light emitting element 2
and gold bonding wire 7 are covered with transparent resin by means of dropping transparent resin onto those parts in advance. Thereby, the light emitting element 2 and the ultra-fine gold bonding wire 7 can be quickly housed in the molded body 3 without damaging them, so that productivity can be improved.
その他の作用・効果は第１の実施例と同様である。Other functions and effects are similar to those of the first embodiment.
以上説明したように本発明によれば、各発光素子毎に、
予め光学設計のなされた成型体に収納され、しかも各成
型体は各々独立して発光表示体基板に接着されているの
で、光学特性、配光特性及び放熱特性の優れた発光表示
体を提供することができる。As explained above, according to the present invention, for each light emitting element,
The light-emitting display is housed in a molded body having an optical design in advance, and each molded body is independently adhered to the light-emitting display substrate, thereby providing a light-emitting display with excellent optical characteristics, light distribution characteristics, and heat dissipation characteristics. be able to.
第１図は本発明の第１の実施例である発光表示体の概略
構造図、第２図は本発明の第１の実施例である発光表示
体の成型体の製造に用いる金型の概略断面図、第３図は
本発明の第２の実施例である発光表示体の概略構成図、
第４図は従来の発光表示体の概略構造図である。
１０１０発光表示体基板、２・・・発光素子、３・・・
成型体、３ａ・・・接着部、４・・・透明接着剤、５・
・・導電パターン、６・・・恨ペースト、７・・・金ボ
ンディングワイヤ、２１・・・金型、３１・・・透明樹
脂。FIG. 1 is a schematic structural diagram of a light-emitting display body that is a first embodiment of the present invention, and FIG. 2 is a schematic diagram of a mold used for manufacturing a molded body of a light-emitting display body that is a first embodiment of the present invention. A cross-sectional view, and FIG. 3 is a schematic configuration diagram of a light emitting display according to a second embodiment of the present invention.
FIG. 4 is a schematic structural diagram of a conventional light emitting display. 1010 light emitting display substrate, 2... light emitting element, 3...
Molded body, 3a...Adhesive part, 4...Transparent adhesive, 5.
...Conductive pattern, 6...Golden paste, 7...Gold bonding wire, 21...Mold, 31...Transparent resin.
Claims (2)
れた発光表示体基板と、該発光表示体基板の導電パター
ン上に複数個配置された発光素子と、透明樹脂からなり
前記発光表示体基板に接着する接着部に凹部が形成され
且つ該凹部に前記発光素子を収納するように前記発光表
示体基板に透明接着剤を用いて接着された成型体とを具
備する発光表示体。(1) A light emitting display substrate formed with a conductive pattern constituting a lighting circuit on its surface, a plurality of light emitting elements arranged on the conductive pattern of the light emitting display substrate, and the light emitting display substrate made of a transparent resin. a molded body, the molded body being bonded to the light emitting display substrate using a transparent adhesive so that a recess is formed in an adhesive portion to which the light emitting display is adhered, and the light emitting element is accommodated in the recess.
れていることを特徴とする特許請求の範囲第１項記載の
発光表示体。(2) The light-emitting display according to claim 1, wherein a concave spherical recess is formed in the bonded portion of the molded body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62128099A JPS63293584A (en) | 1987-05-27 | 1987-05-27 | Light emitting display body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62128099A JPS63293584A (en) | 1987-05-27 | 1987-05-27 | Light emitting display body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63293584A true JPS63293584A (en) | 1988-11-30 |
Family
ID=14976370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62128099A Pending JPS63293584A (en) | 1987-05-27 | 1987-05-27 | Light emitting display body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63293584A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007088081A (en) * | 2005-09-20 | 2007-04-05 | Matsushita Electric Works Ltd | Light-emitting device |
| JP2007116075A (en) * | 2005-09-20 | 2007-05-10 | Matsushita Electric Works Ltd | Light-emitting apparatus |
| JP2007142279A (en) * | 2005-11-21 | 2007-06-07 | Matsushita Electric Works Ltd | Light-emitting apparatus and manufacturing method thereof |
| JP2007165815A (en) * | 2005-09-20 | 2007-06-28 | Matsushita Electric Works Ltd | Light-emitting device |
| JP2008159705A (en) * | 2006-12-21 | 2008-07-10 | Matsushita Electric Works Ltd | Light-emitting device |
| US7956372B2 (en) | 2005-09-20 | 2011-06-07 | Panasonic Electric Works Co., Ltd. | Light emitting device |
-
1987
- 1987-05-27 JP JP62128099A patent/JPS63293584A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007088081A (en) * | 2005-09-20 | 2007-04-05 | Matsushita Electric Works Ltd | Light-emitting device |
| JP2007116075A (en) * | 2005-09-20 | 2007-05-10 | Matsushita Electric Works Ltd | Light-emitting apparatus |
| JP2007165815A (en) * | 2005-09-20 | 2007-06-28 | Matsushita Electric Works Ltd | Light-emitting device |
| US7956372B2 (en) | 2005-09-20 | 2011-06-07 | Panasonic Electric Works Co., Ltd. | Light emitting device |
| JP2007142279A (en) * | 2005-11-21 | 2007-06-07 | Matsushita Electric Works Ltd | Light-emitting apparatus and manufacturing method thereof |
| US7767475B2 (en) | 2005-11-21 | 2010-08-03 | Panasonic Electric Works Co., Ltd. | Light emitting device |
| JP2008159705A (en) * | 2006-12-21 | 2008-07-10 | Matsushita Electric Works Ltd | Light-emitting device |
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