JPH0422351B2 - - Google Patents

Info

Publication number
JPH0422351B2
JPH0422351B2 JP59216938A JP21693884A JPH0422351B2 JP H0422351 B2 JPH0422351 B2 JP H0422351B2 JP 59216938 A JP59216938 A JP 59216938A JP 21693884 A JP21693884 A JP 21693884A JP H0422351 B2 JPH0422351 B2 JP H0422351B2
Authority
JP
Japan
Prior art keywords
die bonding
tie bar
lead frame
bonding part
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59216938A
Other languages
Japanese (ja)
Other versions
JPS6195583A (en
Inventor
Hoichiro Kashiwabara
Osamu Waki
Hiroo Sakai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Priority to JP59216938A priority Critical patent/JPS6195583A/en
Publication of JPS6195583A publication Critical patent/JPS6195583A/en
Publication of JPH0422351B2 publication Critical patent/JPH0422351B2/ja
Granted legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)

Description

【発明の詳細な説明】 （産業上の利用分野） この発明は、車両用灯具や表示装置等の光源と
して利用できるLEDを用いた面光源体の製造方
法に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method of manufacturing a surface light source body using LEDs that can be used as a light source for vehicle lamps, display devices, and the like.

（従来の技術） 車両用灯具等の光源としてLEDが用いられる
ことがあり、この場合、LEDを縦横に規則正し
く配設した面光源体が形成される。(Prior Art) LEDs are sometimes used as light sources for vehicle lamps and the like, and in this case, a surface light source body is formed in which LEDs are regularly arranged vertically and horizontally.

この面光源体は、通常プリント基板に所定の配
線を施し、この配線の規定の箇所にLEDチツプ
をダイボンデイングすると共に、チツプ抵抗を取
付けて点灯回路を形成するようになつている。 This surface light source usually has a printed circuit board with predetermined wiring, die bonding LED chips to the predetermined locations of the wiring, and attaching chip resistors to form a lighting circuit.

（発明が解決しようとする問題点） 前記従来の面光源体においては、LEDチツプ
が露出状態となるため外力に対して無防備で損傷
しやすいばかりでなく、LEDチツプの光線利用
率を高めるためにはレンズが必要であり、しかも
各LEDチツプに対応させてレンズカツトを形成
し、かつレンズの取付けの際にレンズカツトと
LEDチツプとの位置合せを厳密にしなければな
らない等の不都合があつた。本発明は、このよう
な従来の問題点を解決しようとするものである。(Problems to be Solved by the Invention) In the conventional surface light source body, the LED chips are exposed and are therefore vulnerable to external forces and easily damaged. requires a lens, and in addition, a lens cut must be formed to correspond to each LED chip, and the lens cut and
There were inconveniences such as the need for strict alignment with the LED chip. The present invention attempts to solve these conventional problems.

（問題点を解決するための手段） 上記の問題点を解決するために、本発明は
LEDチツプのダイボンデイング部と、チツプ抵
抗の装着部と、回路形成用のタイバーカツト部と
を備えたリードフレームを形成し、このリードフ
レームに合成樹脂をインサートモールドして前記
ダイボンデイング部と、装着部と、タイバーカツ
ト部とをそれぞれ開口部としたハウジングを形成
し、ダイボンデイング部にはLEDチツプを、装
着部にはチツプ抵抗をそれぞれ取付けると共に、
タイバーカツト部を切除して点灯回路を形成し、
かつダイボンデイング部の開口部に合成樹脂をモ
ールドして配光レンズを形成することを要旨とす
るものである。(Means for solving the problems) In order to solve the above problems, the present invention
A lead frame is formed that includes a die bonding part for the LED chip, a mounting part for the chip resistor, and a tie bar cut part for forming a circuit, and a synthetic resin is insert molded into this lead frame to attach the die bonding part and the mounting part. A housing is formed with openings in the die bonding part and the tie bar cut part, and an LED chip is attached to the die bonding part and a chip resistor is attached to the mounting part, respectively.
Cut out the tie bar cut part to form the lighting circuit,
The gist of the present invention is to form a light distribution lens by molding a synthetic resin into the opening of the die bonding part.

（実施例） 以下、本発明の実施例を添付図面により具体的
に説明すると、１は導電性金属からなる格子状の
リードフレームであり、縦方向に連続する線部１
ａと、不連続線部１ｂとが交互に形成され、不連
続線部のうち小さな間隔の切断部は、LEDチツ
プを取付けるダイボンデイング部２とし、大きな
間隔の切断部は、チツプ抵抗の装着部３とする一
方、連続線部１ａと横線部１ｃとの交叉部分はタ
イバーカツト部４としてある。(Example) Hereinafter, an example of the present invention will be described in detail with reference to the accompanying drawings. Reference numeral 1 denotes a grid-like lead frame made of conductive metal, and line portions 1 continuous in the vertical direction.
A and discontinuous line portions 1b are alternately formed, and the cut portions at small intervals among the discontinuous line portions are used as the die bonding portions 2 for attaching the LED chip, and the cut portions at large intervals are used as the attachment portions for the chip resistor. 3, while the intersection portion between the continuous line portion 1a and the horizontal line portion 1c is a tie bar cut portion 4.

このリードフレーム１は第５，６図に示すよう
に、合成樹脂５をインサートモールドしてハウジ
ング６を形成すると共に、前記ダイボンデイング
部２、チツプ抵抗の装着部３及びタイバーカツト
部４はそれぞれ開口部６ａとなしてある。 As shown in FIGS. 5 and 6, this lead frame 1 has a housing 6 formed by insert molding a synthetic resin 5, and the die bonding section 2, the chip resistor mounting section 3, and the tie bar cut section 4 each have an opening. It is designated as part 6a.

つぎに、これらの開口部６ａを利用して第７，
８図のようにダイボンデイング部２にはLEDチ
ツプ７が、装着部３にはチツプ抵抗８がそれぞれ
取付けられ、前記ダイバーカツト部４は切断除去
される。この結果、第９図に示すように前記リー
ドフレーム１の上下の横線部１ｄ，１ｅに対して
並列に接続された点灯回路９が構成され、各列に
は直列に接続された複数個のLEDチツプ７と１
個のチツプ抵抗８が包含されることになる。 Next, using these openings 6a, the seventh,
As shown in FIG. 8, an LED chip 7 is attached to the die bonding section 2, a chip resistor 8 is attached to the mounting section 3, and the diver cut section 4 is cut and removed. As a result, as shown in FIG. 9, a lighting circuit 9 is constructed which is connected in parallel to the upper and lower horizontal line portions 1d and 1e of the lead frame 1, and each column has a plurality of LEDs connected in series. Chips 7 and 1
chip resistors 8 are included.

この後、前記LEDチツプ７を装着した開口部
６ａには、エポキシ樹脂等の透光性合成樹脂がモ
ールドされて、配光レンズ１０がそれぞれ形成さ
れる。 Thereafter, a light-transmitting synthetic resin such as epoxy resin is molded into the openings 6a to which the LED chips 7 are attached, and light distribution lenses 10 are respectively formed.

（作用） 本発明方法により形成された面光源体１１は上
記の構成を有し、前記リードフレーム１の横線部
１ｄ，１ｅにリード線を接続して通電すれば、各
LEDチツプ７を同時に発光させることができ、
かつ前記配光レンズ１０を通して光線を有効に照
射することができる。(Function) The surface light source 11 formed by the method of the present invention has the above-mentioned configuration, and if the lead wires are connected to the horizontal line portions 1d and 1e of the lead frame 1 and energized, each
LED chips 7 can be emitted at the same time,
Moreover, the light beam can be effectively irradiated through the light distribution lens 10.

（発明の効果） 以上の説明から明らかなように、本発明によれ
ば各LEDチツプが樹脂モールドされているので
外的要因に対して十分保護され、しかもその樹脂
モールドが配光レンズとなつているからLEDチ
ツプの光線利用率を著しく高めると共に、従来必
要とされたレンズが不要となる。また、合成樹脂
をインサートモールドすることによりハウジング
が形成されているので、従来のようにプリント基
板を取付けるハウジングが不要となり、かつハウ
ジングがきわめて薄いので灯具等の薄型化が図
れ、部品点数の減少からコストダウンも図れる。
さらに、本発明方法によれば、LEDチツプ、及
びチツプ抵抗の取付けが容易かつ高能率にできて
量産性に富み、回路構成の段階で透かすようにし
て見れば点灯回路のチエツクが簡単にできる利点
もある。(Effects of the Invention) As is clear from the above explanation, according to the present invention, each LED chip is molded with resin, so it is sufficiently protected from external factors, and moreover, the resin mold serves as a light distribution lens. This significantly increases the light utilization efficiency of LED chips, and eliminates the need for lenses that were previously required. In addition, since the housing is formed by insert molding synthetic resin, there is no need for a conventional housing to attach a printed circuit board, and since the housing is extremely thin, it is possible to make light fixtures etc. thinner, resulting in a reduction in the number of parts. Cost reduction can also be achieved.
Further, according to the method of the present invention, the LED chips and chip resistors can be mounted easily and efficiently, making it suitable for mass production, and the lighting circuit can be easily checked by looking through it at the circuit configuration stage. There is also.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、本発明方法により形成された面光源
体の正面図、第２図は、その断面図、第３図は、
リードフレームの正面図、第４図は、その側面
図、第５図は、合成樹脂をインサートモールドし
て形成したハウジングの正面図、、第６図は、そ
の断面図、第７図は、回路形成時の面光源体の正
面図、第８図は、その断面図、第９図は、その回
路図である。 １……リードフレーム、２……ダイボンデイン
グ部、３……装着部、４……タイバーカツト部、
５……合成樹脂、６……ハウジング、６ａ……開
口部、７……LEDチツプ、８……チツプ抵抗、
９……点灯回路、１０……配光レンズ。 FIG. 1 is a front view of a surface light source formed by the method of the present invention, FIG. 2 is a sectional view thereof, and FIG. 3 is a
FIG. 4 is a front view of the lead frame, FIG. 4 is a side view thereof, FIG. 5 is a front view of a housing formed by insert molding synthetic resin, FIG. 6 is a sectional view thereof, and FIG. 7 is a circuit diagram. FIG. 8 is a front view of the surface light source body when it is formed, FIG. 8 is a sectional view thereof, and FIG. 9 is a circuit diagram thereof. 1... Lead frame, 2... Die bonding part, 3... Mounting part, 4... Tie bar cut part,
5... Synthetic resin, 6... Housing, 6a... Opening, 7... LED chip, 8... Chip resistor,
9...Lighting circuit, 10...Light distribution lens.

Claims (1)

【特許請求の範囲】[Claims] １ LEDチツプのダイボンデイング部と、チツ
プ抵抗の装着部と、回路形成用のタイバーカツト
部とを備えたリードフレームを形成し、このリー
ドフレームに合成樹脂をインサートモールドして
前記ダイボンデイング部と、装着部と、タイバー
カツト部とをそれぞれ開口部としたハウジングを
形成し、ダイボンデイング部にLEDチツプを、
装着部にチツプ抵抗をそれぞれ取付けると共に、
タイバーカツト部を切除して点灯回路を形成し、
かつダイボンデイング部の開口部に合成樹脂をモ
ールドして配光レンズを形成することを特徴とす
るLEDを用いた面光源体の製造方法。1. A lead frame is formed that includes a die bonding part for the LED chip, a mounting part for the chip resistor, and a tie bar cut part for forming a circuit, and a synthetic resin is insert molded into this lead frame to connect the die bonding part to the die bonding part. A housing is formed with the mounting part and the tie bar cut part as openings, and the LED chip is placed in the die bonding part.
Attach each chip resistor to the mounting part,
Cut out the tie bar cut part to form the lighting circuit,
A method for manufacturing a surface light source using an LED, characterized in that a synthetic resin is molded into the opening of the die bonding part to form a light distribution lens.
JP59216938A 1984-10-16 1984-10-16 Manufacture of surface light source using led Granted JPS6195583A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59216938A JPS6195583A (en) 1984-10-16 1984-10-16 Manufacture of surface light source using led

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59216938A JPS6195583A (en) 1984-10-16 1984-10-16 Manufacture of surface light source using led

Publications (2)

Publication Number Publication Date
JPS6195583A JPS6195583A (en) 1986-05-14
JPH0422351B2 true JPH0422351B2 (en) 1992-04-16

Family

ID=16696278

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59216938A Granted JPS6195583A (en) 1984-10-16 1984-10-16 Manufacture of surface light source using led

Country Status (1)

Country Link
JP (1) JPS6195583A (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0268459U (en) * 1988-11-15 1990-05-24
JPH07104183B2 (en) * 1990-11-30 1995-11-13 日本電装株式会社 Self-luminous pointer
TWI228304B (en) * 2003-10-29 2005-02-21 Advanced Semiconductor Eng Method for manufacturing ball grid package
US8168989B2 (en) 2005-09-20 2012-05-01 Renesas Electronics Corporation LED light source and method of manufacturing the same
JP2014212139A (en) * 2011-12-06 2014-11-13 加藤　宣和 Led package and method of manufacturing led package
WO2014171492A1 (en) * 2013-04-19 2014-10-23 シャープ株式会社 Production method for light emitting devices and production method for illumination device
CN104183582A (en) * 2014-07-24 2014-12-03 厦门市瀚锋光电科技有限公司 LED lamp core combined light source

Also Published As

Publication number Publication date
JPS6195583A (en) 1986-05-14

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