JP3331720B2 - Light emitting diode - Google Patents

Light emitting diode

Info

Publication number
JP3331720B2
JP3331720B2 JP00235694A JP235694A JP3331720B2 JP 3331720 B2 JP3331720 B2 JP 3331720B2 JP 00235694 A JP00235694 A JP 00235694A JP 235694 A JP235694 A JP 235694A JP 3331720 B2 JP3331720 B2 JP 3331720B2
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
lead wires
printed circuit
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP00235694A
Other languages
Japanese (ja)
Other versions
JPH07211937A (en
Inventor
聡 畠中
忠昭 池田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP00235694A priority Critical patent/JP3331720B2/en
Publication of JPH07211937A publication Critical patent/JPH07211937A/en
Application granted granted Critical
Publication of JP3331720B2 publication Critical patent/JP3331720B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Led Device Packages (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【産業上の利用分野】本発明は、プリント基板に対して
効率よく、しかも、不揃いを生じることなく座りよく表
面実装できる発光ダイオードに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting diode which can be efficiently mounted on a printed circuit board and can be surface-mounted on a printed circuit board without any irregularities.

【０００２】[0002]

【従来の技術】図２に示す従来の発光ダイオードは２チ
ップ形式のもので、発光色の相異なる第１および第２の
発光ダイオードチップ（ＬＥＤチップ）１，２がセンタ
ーのリード線３の一端面上に搭載されている。センター
のリード線３は両サイドのリード線４，５とともにイン
ライン配列されており、両ＬＥＤチップ１，２の各カソ
ードは銀層６，７を介してセンターのリード線３に接続
され、各アノードは金線８，９を介して両サイドのリー
ド線４，５にそれぞれ接続されている。そして、３本の
リード線３，４，５の各一端部および両ＬＥＤチップ
１，２が透光性のエポキシ樹脂からなる樹脂モールド１
０に埋設されている。2. Description of the Related Art A conventional light emitting diode shown in FIG. 2 is of a two-chip type, and first and second light emitting diode chips (LED chips) 1 and 2 having different emission colors are connected to a lead wire 3 at a center. It is mounted on the end face. The center lead wire 3 is arranged in-line with the lead wires 4 and 5 on both sides, and the cathodes of both LED chips 1 and 2 are connected to the center lead wire 3 via silver layers 6 and 7, Are connected to lead wires 4 and 5 on both sides via gold wires 8 and 9, respectively. A resin mold 1 in which one end of each of the three lead wires 3, 4, 5 and both LED chips 1, 2 are made of translucent epoxy resin.
It is buried in 0.

【０００３】３本のリード線３，４，５は当初、リード
フレームを形成していたので一体のものであった。この
リードフレームのタイバー部分が切除されて個々のリー
ド線３，４，５に分離されたので、タイバー部分の痕跡
が各リード線３，４，５の中腹部に突起３ａ，４ａ，５
ａとして残っている。[0003] The three lead wires 3, 4, and 5 were originally formed as a single unit since they formed a lead frame. Since the tie bar portions of the lead frame were cut off and separated into individual lead wires 3, 4, 5, traces of the tie bar portions were formed on the middle portions of the lead wires 3, 4, 5 by protrusions 3 a, 4 a, 5.
It remains as a.

【０００４】このような構成の発光ダイオードをプリン
ト基板上に実装するには、３本のリード線３，４，５を
プリント基板の３個の小穴に挿通し、半田付けをするこ
とになるが、前記挿通にさいして突起３ａ，４ａ，５ａ
をストッパーに利用すると、発光ダイオードをプリント
基板上に高さを揃えて実装することができる。In order to mount a light emitting diode having such a configuration on a printed circuit board, three lead wires 3, 4, and 5 are inserted into three small holes of the printed circuit board and soldered. , 3a, 4a, 5a
When the light emitting diode is used as a stopper, the light emitting diode can be mounted on the printed circuit board at a uniform height.

【０００５】[0005]

【発明が解決しようとする課題】しかし、プリント基板
に多数の小穴を設けたり、この小穴に発光ダイオードの
リード線を挿通する作業は少なからぬ時間と労力を要す
る。また、タイバー部分の切除によって副次的に生じた
突起３ａ，４ａ，５ａは不確実なものであるから、常に
ストッパーの役割を果たすとは限らず、発光ダイオード
に高さの不揃いを生じたり、傾きを生じたりしやすいと
いう課題があった。However, it takes a considerable amount of time and effort to provide a large number of small holes in a printed circuit board and to insert lead wires of light-emitting diodes into the small holes. In addition, since the projections 3a, 4a, and 5a secondary to the cutting of the tie bar portion are uncertain, they do not always function as stoppers, and the light emitting diodes may be uneven in height. There was a problem that inclination was easily caused.

【０００６】したがって本発明の目的は、プリント基板
に対して効率よく、しかも、高さ等に不揃いを生じるこ
となく座りよく実装できる発光ダイオードを提供するこ
とにある。Accordingly, it is an object of the present invention to provide a light emitting diode which can be mounted on a printed circuit board efficiently and without any irregularities in height or the like.

【０００７】[0007]

【課題を解決するための手段】本発明によると上述した
目的を達成するために、ＬＥＤチップを埋設した樹脂モ
ールド内に一端部を置く少なくとも３本のインライン配
列されたリード線が、樹脂モールドから一方向に突出し
た所定長の位置において、インライン配列の方向に対し
ほぼ直角に、かつ、交互に方向を相反させて折り曲げら
れていることを特徴とする発光ダイオードが提供され
る。According to the present invention, in order to achieve the above-mentioned object, at least three in-line arranged lead wires having one end placed in a resin mold in which an LED chip is embedded are removed from the resin mold. There is provided a light emitting diode characterized by being bent at a position of a predetermined length protruding in one direction substantially at right angles to the direction of the in-line arrangement and alternately in opposite directions.

【０００８】[0008]

【作用】本発明においては、樹脂モールドから一方向に
突出した少なくとも３本のリード線が、所定長の位置に
おいて、インライン配列の方向に対しほぼ直角に、か
つ、交互に方向を相反させて折り曲げられるので、軸方
向に対して直角な全方向において座りがよく、しかも、
プリント基板上に載せてリフロー半田付けを施すだけで
高さ等に不揃いを生じることなく、効率よく表面実装す
ることができる。According to the present invention, at least three lead wires protruding in one direction from the resin mold are bent at a predetermined length substantially at right angles to the direction of the in-line arrangement and alternately in opposite directions. So that it sits well in all directions perpendicular to the axial direction, and
The surface mounting can be performed efficiently without causing irregularities in the height and the like simply by performing reflow soldering on the printed circuit board.

【０００９】[0009]

【実施例】つぎに本発明の一実施例を、図面を参照しつ
つ説明する。Next, an embodiment of the present invention will be described with reference to the drawings.

【００１０】図１に示す発光ダイオードは２チップ形式
のもので、発光色の相異なる第１および第２のＬＥＤチ
ップ１１，１２がセンターのリード線１３の一端面上に
搭載されている。センターのリード線１３は両サイドの
リード線１４，１５とともにインライン配列されてお
り、両ＬＥＤチップ１１，１２の各カソードは銀層１
６，１７によってセンターのリード線１３に接続され、
各アノードは金線１８，１９によって両サイドのリード
線１４，１５にそれぞれ接続されている。そして、３本
のリード線１３，１４，１５の各一端部および両ＬＥＤ
チップ１１，１２が透光性のエポキシ樹脂からなる樹脂
モールド２０に埋設されている。The light emitting diode shown in FIG. 1 is of a two-chip type, and first and second LED chips 11 and 12 having different emission colors are mounted on one end surface of a lead wire 13 at the center. The center lead wire 13 is arranged in-line with the lead wires 14 and 15 on both sides, and each cathode of both LED chips 11 and 12 is
6, 17 connected to the center lead wire 13,
Each anode is connected to lead wires 14 and 15 on both sides by gold wires 18 and 19, respectively. Then, one end of each of the three lead wires 13, 14, 15 and both LEDs
The chips 11 and 12 are embedded in a resin mold 20 made of a translucent epoxy resin.

【００１１】樹脂モールド２０内に一端部を置く３本の
リード線１３，１４，１５は、樹脂モールド２０から一
方向に突出した所定長の位置ａにおいて、インライン配
列の方向ｂに対しほぼ直角に、かつ、交互に方向を相反
させて折り曲げられている。つまり、両サイドのリード
線１４，１５が方向ｂに対して右側に、そして、センタ
ーのリード線１３が方向ｂに対して左側にそれぞれほぼ
直角に折り曲げられている。なお、図示例における位置
ａは、タイバー痕跡部分の各上縁付近に選ばれており、
タイバー痕跡部分の下縁付近以下は切り落とされてい
る。つまり、折り曲げ部分１３ａ，１４ａ，１５ａはタ
イバー痕跡部分とほぼ対応している。The three lead wires 13, 14, 15 whose one end is placed in the resin mold 20 are substantially perpendicular to the direction b of the in-line arrangement at a position a of a predetermined length protruding in one direction from the resin mold 20. And are alternately bent in opposite directions. That is, the lead wires 14 and 15 on both sides are bent to the right with respect to the direction b, and the lead wire 13 at the center is bent to the left with respect to the direction b at substantially right angles. In addition, the position a in the illustrated example is selected near each upper edge of the tie bar trace portion,
The portion below the lower edge of the trace of the tie bar is cut off. That is, the bent portions 13a, 14a, and 15a substantially correspond to the tie bar trace portions.

【００１２】このように、インライン配列された３本の
リード線１３，１４，１５が、隣り合うもの同士で互い
に反対方向に折り曲げられると、発光ダイオードはその
軸方向に直角な全方向において座りが良くなる。また、
プリント基板に表面実装したときの発光ダイオードのプ
リント基板に対する接触面積が拡大する。逆にいうと、
３本のリード線１３，１４，１５の各折り曲げ部分１３
ａ，１４ａ，１５ａの長さ（水平張り出し長）をより一
層短小にしても、プリント基板との間に必要な接触面積
を確保することができる。As described above, when the three lead wires 13, 14, and 15 arranged in-line are bent in mutually opposite directions between adjacent ones, the light emitting diode sits in all directions perpendicular to the axial direction. Get better. Also,
The contact area of the light emitting diode with the printed circuit board when mounted on the printed circuit board is increased. Conversely,
Each bent portion 13 of the three lead wires 13, 14, 15
Even if the lengths (horizontal overhang lengths) of a, 14a, and 15a are further reduced, a necessary contact area with the printed circuit board can be secured.

【００１３】このように、３本のリード線に対して単に
折り曲げ加工を施すだけで、プリント基板上に座りよく
表面実装できる発光ダイオードが得られ、しかも、その
折り曲げ部分１３ａ，１４ａ，１５ａの水平張り出し長
はわずかでよいので、多数の発光ダイオードを高密度で
配列するパネルディスプレイ等にも対応できる。そのう
え、折り曲げ加工後の発光ダイオードは、エンボステー
プを用いたテーピング包装ができるのみならず、発光面
はフラットに形成できるので、既存の実装機を適用して
吸着による搬送も可能である。また、樹脂モールド２０
が透光性を有していることから実装機の画像認識が困難
であっても、樹脂モールド２０の下部における外形状を
図示のように角形に形成しておくことによって形状認識
ができるので、既存の実装機を適用できる。As described above, by simply bending the three lead wires, a light emitting diode which can be mounted on a printed circuit board and surface-mounted on the printed circuit board can be obtained, and the horizontal portions of the bent portions 13a, 14a, 15a can be obtained. Since the overhang length is small, it can be applied to a panel display or the like in which a large number of light emitting diodes are arranged at high density. In addition, the folded light emitting diode can not only be taped and wrapped using an embossed tape, but also can be formed to have a flat light emitting surface, so that it can be transported by suction using an existing mounting machine. Also, the resin mold 20
Even if it is difficult to recognize the image of the mounting machine because of having the translucency, the outer shape at the lower part of the resin mold 20 can be recognized by forming a rectangular shape as shown in the figure, Existing mounting machines can be applied.

【００１４】上述した実施例における３本のリード線１
３，１４，１５は、２個のＬＥＤチップ１１，１２に対
するものであったが、１個のＬＥＤに対する２本と、補
強用の１本との組合せであってもよい。また、リード線
は３本に限定されず、３本以上であればよい。ＬＥＤは
１個であっても複数個であってもよい。The three lead wires 1 in the embodiment described above
3, 14, and 15 are for two LED chips 11 and 12, but may be a combination of two for one LED and one for reinforcement. Also, the number of lead wires is not limited to three, and may be any number as long as it is three or more. The number of LEDs may be one or more.

【００１５】[0015]

【発明の効果】以上のように本発明によると、表面実装
に適した座りのよい発光ダイオードを単にリード線の折
り曲げ加工によって低コストで得ることができ、高さに
不揃いを生じたり傾きを生じたりすることなく、発光ダ
イオードをプリント基板にリフロー半田付けによって効
率よく表面実装することができる。また、実装用のプリ
ント基板に薄手のものを使用できるほか、発光ダイオー
ドをプリント基板に高い密度で実装できるので、プリン
ト基板の必要枚数の削減や、セットの小型化が可能とな
る。As described above, according to the present invention, a light-emitting diode suitable for surface mounting can be obtained at a low cost simply by bending a lead wire, and the height of the light-emitting diode becomes uneven or tilted. The light emitting diode can be efficiently surface-mounted on the printed circuit board by reflow soldering without any trouble. In addition, a thin printed circuit board for mounting can be used, and a light emitting diode can be mounted on the printed circuit board at a high density, so that the required number of printed circuit boards can be reduced and the set can be reduced in size.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明の一実施例の発光ダイオードの一部破断
斜視図FIG. 1 is a partially cutaway perspective view of a light emitting diode according to an embodiment of the present invention.

【図２】従来の発光ダイオードの一部破断斜視図FIG. 2 is a partially cutaway perspective view of a conventional light emitting diode.

【符号の説明】[Explanation of symbols]

１１，１２ ＬＥＤチップ １３，１４，１５ リード線 ２０ 樹脂モールド 11,12 LED chip 13,14,15 Lead wire 20 Resin mold

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平５−315653（ＪＰ，Ａ) 特開 平４−360587（ＪＰ，Ａ) 実開 平４−56355（ＪＰ，Ｕ) 実開 平４−82874（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 33/00 ＪＩＣＳＴファイル（ＪＯＩＳ)──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-5-315653 (JP, A) JP-A-4-360587 (JP, A) JP-A-4-56355 (JP, U) JP-A-4-56355 82874 (JP, U) (58) Field surveyed (Int. Cl. 7 , DB name) H01L 33/00 JICST file (JOIS)

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】 ＬＥＤチップを埋設した樹脂モールド内
に一端部を置き、リードフレームのタイバー部分が切除
されて個々に分離された少なくとも３本のインライン配
列されたリード線が、樹脂モールドから一方向に突出し
た前記樹脂モールド部とタイバー痕跡部分の間の所定長
の位置において、インライン配列の方向に対しほぼ直角
に、かつ、交互に方向を相反させて折り曲げられ、折り
曲げ部分がタイバー痕跡部分と対応していることを特徴
とする発光ダイオード。 Location-out one end to 1. A LED chip resin molds buried, tie bars of the lead frame is cut
At least three in-line arranged lead wires which are individually separated by a predetermined length between the resin mold portion and the tie bar trace portion projecting in one direction from the resin mold, in the direction of the in-line arrangement. substantially perpendicularly, and it is bent by reciprocal directions alternately, folding
A light emitting diode, wherein a bent portion corresponds to a trace of a tie bar .
JP00235694A 1994-01-14 1994-01-14 Light emitting diode Expired - Fee Related JP3331720B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP00235694A JP3331720B2 (en) 1994-01-14 1994-01-14 Light emitting diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP00235694A JP3331720B2 (en) 1994-01-14 1994-01-14 Light emitting diode

Publications (2)

Publication Number Publication Date
JPH07211937A JPH07211937A (en) 1995-08-11
JP3331720B2 true JP3331720B2 (en) 2002-10-07

Family

ID=11526997

Family Applications (1)

Application Number Title Priority Date Filing Date
JP00235694A Expired - Fee Related JP3331720B2 (en) 1994-01-14 1994-01-14 Light emitting diode

Country Status (1)

Country Link
JP (1) JP3331720B2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4055373B2 (en) * 2001-05-31 2008-03-05 日亜化学工業株式会社 Method for manufacturing light emitting device
JP4196114B2 (en) 2004-07-01 2008-12-17 パナソニック株式会社 Electroacoustic transducer and electronic device using the same
JP2006054234A (en) 2004-08-10 2006-02-23 Agilent Technol Inc Light-emitting diode and its manufacturing method
DE102008048259B4 (en) * 2008-09-22 2024-10-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Housing for an optoelectronic component, side-emitting component with a housing and method for producing a housing
JP4997220B2 (en) * 2008-12-22 2012-08-08 星和電機株式会社 Semiconductor device and surface mounting method of semiconductor device
US11955466B2 (en) 2020-08-25 2024-04-09 Nichia Corporation Light emitting device
US12002909B2 (en) 2020-08-25 2024-06-04 Nichia Corporation Surface-mounted multi-colored light emitting device

Also Published As

Publication number Publication date
JPH07211937A (en) 1995-08-11

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