JPH0690028A - Manufacture of surface package type led - Google Patents
Manufacture of surface package type ledInfo
- Publication number
- JPH0690028A JPH0690028A JP4264138A JP26413892A JPH0690028A JP H0690028 A JPH0690028 A JP H0690028A JP 4264138 A JP4264138 A JP 4264138A JP 26413892 A JP26413892 A JP 26413892A JP H0690028 A JPH0690028 A JP H0690028A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- led
- led chip
- transparent resin
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は発光ダイオード（以
下、ＬＥＤという。）、特にプリント基板等の表面に実
装される表面実装型ＬＥＤの製造方法に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a light emitting diode (hereinafter referred to as LED), particularly a surface mount type LED mounted on the surface of a printed circuit board or the like.
【０００２】[0002]
【従来の技術】従来、表面実装型ＬＥＤは、例えば図７
に示すように構成されている。図７において、表面実装
型ＬＥＤ１は、側方に突出している張り出し部２ａ，３
ａを備えた二つの導電性金属材料から成るリードフレー
ム２，３と、該リードフレーム２，３の一方、例えばリ
ードフレーム３の拡大された上端に載置されたＬＥＤチ
ップ４と、張り出し部２ａ，３ａを台座状に包囲し且つ
該張り出し部２ａ，３ａの先端及びリードフレーム２，
３の上部を露出させるように、樹脂モールドにより形成
されたベース部５と、このベース部５の上方にて、該リ
ードフレーム２，３の上端及びＬＥＤチップ４を包囲す
るように透明樹脂の樹脂モールドにより成形されたレン
ズ部６とから構成されている。2. Description of the Related Art Conventionally, a surface-mounted LED is shown in FIG.
It is configured as shown in. In FIG. 7, the surface-mounted LED 1 has a projecting portion 2a, 3 protruding laterally.
a, lead frames 2 and 3 made of two conductive metal materials, one of the lead frames 2 and 3, for example, an LED chip 4 mounted on the enlarged upper end of the lead frame 3, and an overhang portion 2a. , 3a are surrounded by a pedestal, and the tips of the projecting portions 2a, 3a and the lead frame 2,
A base portion 5 formed by resin molding so as to expose the upper portion of the lead frame 3, and a transparent resin resin that surrounds the upper ends of the lead frames 2 and 3 and the LED chip 4 above the base portion 5. The lens unit 6 is formed by molding.
【０００３】上記ＬＥＤチップ４は、リードフレーム３
の上端面にダイボンディングされると共に、その上面
が、他方のリードフレーム２の上端面に対してワイヤボ
ンディングにより電気的に接続されている。また、上記
張り出し部２ａ，３ａの先端をベース部５の側面に露出
させることにより、表面実装型ＬＥＤ１をプリント基板
等に実装する際に、電極部として利用され、該プリント
基板上に形成された導電パターン等に対して、ハンダ付
けされ得るようになっている。The LED chip 4 includes a lead frame 3
Is die-bonded to the upper end surface of the lead frame 2 and the upper surface thereof is electrically connected to the upper end surface of the other lead frame 2 by wire bonding. Further, by exposing the tips of the projecting portions 2a and 3a to the side surface of the base portion 5, the surface mounting LED 1 is used as an electrode portion when mounted on a printed circuit board or the like, and is formed on the printed circuit board. It can be soldered to a conductive pattern or the like.
【０００４】このように構成された表面実装型ＬＥＤ１
によれば、プリント基板への実装は以下のように行なわ
れる。先ず表面に所定の導電パターンが形成されたプリ
ント基板７の実装位置に、本表面実装型ＬＥＤ１を載置
し、プリント基板７の導電パターンに対して、ベース部
５の側面に露出している張り出し部２ａ，３ａを、それ
ぞれアノード端子またはカソード端子として位置合わせ
する。この際、該表面実装型ＬＥＤ１は、そのベース部
５の底面が、プリント基板７の表面に当接することか
ら、安定して支持され得るので、上記位置合わせが容易
に行なわれることとなる。The surface-mounted LED 1 thus constructed
According to the method, mounting on a printed circuit board is performed as follows. First, the surface-mounted LED 1 is placed at the mounting position of the printed circuit board 7 on the surface of which a predetermined conductive pattern is formed, and the overhang which is exposed on the side surface of the base portion 5 with respect to the conductive pattern of the printed circuit board 7. The parts 2a and 3a are aligned as an anode terminal or a cathode terminal, respectively. At this time, since the bottom surface of the base portion 5 of the surface-mounted LED 1 is in contact with the surface of the printed circuit board 7, the surface-mounted LED 1 can be stably supported, and thus the alignment can be easily performed.
【０００５】続いて、上記張り出し部２ａ，３ａの側面
に接触するように、クリームハンダＰをプリント基板７
の表面に置き、この状態から、本表面実装型ＬＥＤ１を
プリント基板７と共に、例えば図示しない炉内で加熱す
ることにより、このクリームハンダＰを溶融させて、該
張り出し部２ａ，３ａとプリント基板７上の導電パター
ンの双方に付着させた後、炉から外に出して冷却する。
これによりクリームハンダＰは硬化して、張り出し部２
ａ，３ａがそれぞれ上記導電パターンに対して電気的に
接続されることになり、実装作業が完了する。Subsequently, the cream solder P is applied to the printed circuit board 7 so as to come into contact with the side surfaces of the projecting portions 2a and 3a.
The surface mount type LED 1 is heated together with the printed circuit board 7 in this state, for example, in a furnace (not shown) to melt the cream solder P, and the protruding portions 2a, 3a and the printed circuit board 7 are placed. After depositing on both of the conductive patterns above, remove from the furnace and cool.
As a result, the cream solder P is hardened and the overhanging portion 2
Since a and 3a are electrically connected to the conductive pattern, the mounting work is completed.
【０００６】[0006]
【発明が解決しようとする課題】ところで、このように
構成された表面実装型ＬＥＤ１においては、製造の際、
リードフレーム２，３は、図７（Ｂ）に示すように前以
て下方に長く延びて支持部材８に一体的に連結され且つ
複数個が連続している状態でプレス加工等により形成さ
れ、この支持部材８に設けられたピッチ孔９に図示しな
い製造用治具が嵌入することにより、自動送りされるよ
うになっている。このように形成されたリードフレーム
２，３は、上記のように一体化され且つ連続的に連結さ
れた状態のままで、各張り出し部２ａ，３ａの周りを包
囲するように、例えばインサート成形によりベース部５
が一体的に成形されると共に、一方のリードフレーム３
の上端面にＬＥＤチップ４がダイボンディングされ、他
方のリードフレーム２に対してワイヤボンディングによ
り接続され、最後にリードフレーム２，３を所定位置で
切断することにより、本表面実装型ＬＥＤ１が多数同時
に製造されることになるが、上述したインサート成形に
よるベース部５の一体成形は、金型が複雑であることか
らコストが高くなってしまい、またスライド金型を使用
する場合にはバリ等が生ずることがあり、信頼性に欠け
るという問題があった。By the way, in the surface mount type LED 1 having such a structure,
As shown in FIG. 7 (B), the lead frames 2 and 3 are formed by pressing or the like in a state in which they extend long downward and are integrally connected to the supporting member 8 and a plurality of them are continuous. When a manufacturing jig (not shown) is fitted into the pitch hole 9 provided in the support member 8, it is automatically fed. The lead frames 2 and 3 formed in this way are, for example, by insert molding so as to surround each of the projecting portions 2a and 3a in the state of being integrated and continuously connected as described above. Base part 5
Is integrally molded, and one of the lead frames 3
The LED chip 4 is die-bonded to the upper end surface of the, and is connected to the other lead frame 2 by wire bonding. Finally, the lead frames 2 and 3 are cut at predetermined positions, so that a large number of the surface-mounted LEDs 1 are simultaneously manufactured. Although it is manufactured, the integral molding of the base portion 5 by the above-described insert molding is expensive because the mold is complicated, and burrs and the like are generated when a slide mold is used. However, there was a problem of lack of reliability.
【０００７】さらに、ベース部５とレンズ部６とは別体
であることから、工程数が多くなってしまい、コストが
高くなってしまうという問題もあった。Further, since the base portion 5 and the lens portion 6 are separate bodies, there is a problem that the number of steps is increased and the cost is increased.
【０００８】この発明は、以上の点に鑑み、低コストで
製造され得ると共に、信頼性の高い表面実装型ＬＥＤを
提供することを目的としている。In view of the above points, the present invention has an object to provide a surface mount LED which can be manufactured at low cost and has high reliability.
【０００９】[0009]
【課題を解決するための手段】上記目的を達成するた
め、この発明による表面実装型ＬＥＤの製造方法は、張
り出し部を備えた一対のリードフレームを有していて、
一方のリードフレームの上端面にＬＥＤチップをダイボ
ンディングし且つ該ＬＥＤチップを他方のリードフレー
ムの上端面に対してワイヤボンディングすると共に、該
一対のリードフレームを樹脂型内に流し込んだ透明樹脂
内に挿入し、該透明樹脂を硬化させた後、該リードフレ
ームの張り出し部の下側で、リードフレーム及び透明樹
脂をダイサー等を用いて切断することにより、該一対の
リードフレームを支持するベース部と上記ＬＥＤチップ
から出射する光を上方に導くレンズ部とを一体に成形す
ると共に、該リードフレームの張り出し部の先端を該ベ
ース部の側面から外部に露出させて、接続電極部として
利用するようにしたことを特徴としている。In order to achieve the above object, a method of manufacturing a surface mount LED according to the present invention has a pair of lead frames having an overhang portion,
An LED chip is die-bonded to the upper end surface of one lead frame and the LED chip is wire-bonded to the upper end surface of the other lead frame, and the pair of lead frames is placed in a transparent resin poured into a resin mold. After inserting and curing the transparent resin, the lead frame and the transparent resin are cut under a protruding portion of the lead frame by using a dicer or the like to form a base portion supporting the pair of lead frames. A lens part that guides the light emitted from the LED chip upward is integrally formed, and the tip of the protruding part of the lead frame is exposed to the outside from the side surface of the base part so that it can be used as a connection electrode part. It is characterized by having done.
【００１０】[0010]
【作用】上記構成によれば、前以てＬＥＤチップを実装
したリードフレームを、樹脂型内に流し込んだ透明樹脂
内に挿入することにより、ベース部及びレンズ部が一体
に成形されるので、工程数が少なくて済み、透明樹脂が
硬化した後に、該リードフレームの張り出し部の下側
で、リードフレーム及び透明樹脂をダイサー等を用いて
切断することにより、ベース部の下面にバリ等が残って
しまうようなことがないことから、高い信頼性が得られ
ることになる。さらに、この樹脂型は、インサート成形
を行なう必要がないので、比較的簡単な構成であるか
ら、低コストで製造される。According to the above construction, the base portion and the lens portion are integrally molded by inserting the lead frame on which the LED chip is mounted in advance into the transparent resin which is poured into the resin mold. After the transparent resin has hardened, the number of burrs is left on the lower surface of the base by cutting the lead frame and the transparent resin with a dicer or the like below the protruding portion of the lead frame. Since there is no such a case, high reliability can be obtained. Further, since this resin mold does not require insert molding, it has a relatively simple structure and can be manufactured at low cost.
【００１１】[0011]
【実施例】以下、図面に示した実施例に基づいて、この
発明を詳細に説明する。図１はこの発明により製造され
る表面実装型ＬＥＤの一実施例を示している。表面実装
型ＬＥＤ１０は、側方に突出している張り出し部１１
ａ，１２ａを備えた二つの導電性金属材料から成るリー
ドフレーム１１，１２と、該リードフレーム１１，１２
の一方、例えばリードフレーム１２の拡大された上端に
載置されたＬＥＤチップ１３と、該張り出し部１１ａ，
１２ａを台座状に包囲し且つ該張り出し部１１ａ，１２
ａの先端を外部に露出させ、且つリードフレーム１１，
１２の上端及びＬＥＤチップ１３を包囲するように透明
樹脂により成形された樹脂モールド部１４（鎖線図示）
とから構成されている。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to the embodiments shown in the drawings. FIG. 1 shows an embodiment of a surface mount LED manufactured by the present invention. The surface-mounted LED 10 has a projecting portion 11 protruding laterally.
lead frames 11 and 12 made of two conductive metal materials provided with a and 12a, and the lead frames 11 and 12
On the other hand, for example, the LED chip 13 mounted on the enlarged upper end of the lead frame 12 and the protruding portion 11a,
12a surrounds the pedestal and has the protruding portions 11a, 12
The tip of a is exposed to the outside, and the lead frame 11,
A resin mold portion 14 (shown by a chain line) formed of a transparent resin so as to surround the upper end of 12 and the LED chip 13.
It consists of and.
【００１２】上記ＬＥＤチップ１３は、リードフレーム
１２の上端に対してダイボンディングされると共に、他
方のリードフレーム１１の上端に対してワイヤボンディ
ングにより電気的に接続されている。尚、上記リードフ
レーム１１，１２は、図２に示すように、互いに連結さ
れた状態で、複数個が連続して成形されている。The LED chip 13 is die-bonded to the upper end of the lead frame 12 and is electrically connected to the upper end of the other lead frame 11 by wire bonding. As shown in FIG. 2, the lead frames 11 and 12 are continuously formed in a state of being connected to each other.
【００１３】以上の構成は図７に示した従来の表面実装
型ＬＥＤ１と同様の構成であるが、この発明による表面
実装型ＬＥＤ１０においては、図２に示すように互いに
連結されたリードフレーム１１，１２に対して、前以て
ＬＥＤチップ１３を実装した状態から、樹脂モールド型
１４が以下のように形成されるようになっている。The above structure is similar to that of the conventional surface mount type LED 1 shown in FIG. 7, but in the surface mount type LED 10 according to the present invention, as shown in FIG. The resin mold 14 is formed in the following manner from the state where the LED chip 13 is mounted on the LED 12 in advance.
【００１４】即ち、図３に示すように、各表面実装型Ｌ
ＥＤ１０の樹脂モールド部１４の形状に対応する形状の
樹脂型１５を並べて配置して、各樹脂型１５内にエポキ
シ樹脂等の透明樹脂を流し込んでおく。このようにし
て、該樹脂型１５内に、上記各リードフレーム１１，１
２を逆さまにして挿入し、各リードフレーム１１，１２
の張り出し部１１ａ，１２ａまで透明樹脂中に入るよう
にする。この状態から、該透明樹脂を硬化させた後、樹
脂型１５から型抜きすることにより、図４に示すよう
に、リードフレーム１１，１２に対して、樹脂モールド
部１４が一体に形成されることとなる。That is, as shown in FIG. 3, each surface mount type L
A resin mold 15 having a shape corresponding to the shape of the resin mold portion 14 of the ED 10 is arranged side by side, and a transparent resin such as an epoxy resin is poured into each resin mold 15. In this way, the lead frames 11, 1 are placed in the resin mold 15.
Insert 2 upside down and insert each lead frame 11, 12
The protrusions 11a and 12a of the transparent resin are made to enter the transparent resin. From this state, the transparent resin is cured, and then the resin mold 15 is die-cut to form the resin mold portion 14 integrally with the lead frames 11 and 12, as shown in FIG. Becomes
【００１５】その後、リードフレーム１１，１２及び樹
脂モールド部１４は、図５にて点線で示すように、各リ
ードフレーム１１，１２の張り出し部１１ａ，１２ａの
下側で、例えばダイサー等によって切断される。これに
より、樹脂モールド部１４の成形時に、表面張力により
凹状に盛り上がった部分１４ａが同時に切断され得るこ
とになり、表面実装型ＬＥＤ１０が完成する。After that, the lead frames 11 and 12 and the resin mold portion 14 are cut by, for example, a dicer or the like below the projecting portions 11a and 12a of the lead frames 11 and 12, as shown by the dotted lines in FIG. It As a result, when the resin mold portion 14 is molded, the portion 14a that is raised in a concave shape due to surface tension can be cut at the same time, and the surface-mounted LED 10 is completed.
【００１６】この発明による表面実装型ＬＥＤ１０は以
上のように構成されており、製造の際には、リードフレ
ーム１１，１２は、図７に示した従来の表面実装型ＬＥ
Ｄ１の場合と同様に、支持部材１６に一体的に連結され
且つ複数個が連続している状態で、プレス加工等により
形成され、さらに支持部材１６により連結された状態
で、各リードフレーム１１，１２の先端を樹脂型１５内
に挿入することにより、樹脂モールド部１４が形成され
ることになる。このように形成された樹脂モールド部１
４に対して、その実装面となるべき下面が、切断により
確実に平坦面として成形されることになるので、精密な
金型を使用することなく、高い信頼性が得られることに
なる。また、リードフレーム１１，１２を支持すべきベ
ース部とＬＥＤチップ１３から出射する光を上方に導く
レンズ部とが、樹脂モールド部１４として一体に成形さ
れることから、工程数が少なくて済み、コストが低減さ
れ得ることになる。The surface mount LED 10 according to the present invention is constructed as described above, and the lead frames 11 and 12 are manufactured by the conventional surface mount LE shown in FIG.
In the same manner as in the case of D1, in the state where the plurality of lead frames 11 are integrally connected to the support member 16 and are continuous, they are formed by press working or the like, and further connected by the support member 16 in the respective lead frames 11, By inserting the tip of 12 into the resin mold 15, the resin mold portion 14 is formed. Resin mold portion 1 formed in this way
On the other hand, since the lower surface which should be the mounting surface is surely molded as a flat surface by cutting, the high reliability can be obtained without using a precise mold. Further, since the base portion that should support the lead frames 11 and 12 and the lens portion that guides the light emitted from the LED chip 13 upward are integrally formed as the resin mold portion 14, the number of steps can be reduced. Costs can be reduced.
【００１７】[0017]
【発明の効果】以上述べたように、この発明によれば、
前以てＬＥＤチップを実装したリードフレームを、樹脂
型内に流し込んだ透明樹脂内に挿入することにより、ベ
ース部及びレンズ部が一体に成形されるので、工程数が
少なくて済む。そして、透明樹脂が硬化した後に、リー
ドフレームの張り出し部の下側で、リードフレーム及び
透明樹脂をダイサー等により切断すれば、ベース部の下
面にバリ等が残ってしまうようなことがないから、高い
信頼性が得られることになる。さらに、樹脂型はインサ
ート成形を行なう必要がないので、比較的簡単な構成で
あるから、低コストで製造され、従って本表面実装型Ｌ
ＥＤもコストが低減される。かくして、低コストで製造
され得ると共に、信頼性の高い、極めて優れた表面実装
型ＬＥＤが提供される。As described above, according to the present invention,
By inserting the lead frame on which the LED chip is mounted in advance into the transparent resin that has been poured into the resin mold, the base portion and the lens portion are integrally molded, so that the number of steps can be reduced. Then, after the transparent resin has hardened, if the lead frame and the transparent resin are cut with a dicer or the like on the lower side of the protruding portion of the lead frame, burrs or the like will not remain on the lower surface of the base portion. High reliability can be obtained. Furthermore, since the resin mold does not need to be insert-molded, it has a relatively simple structure and is therefore manufactured at low cost.
The cost of the ED is also reduced. Thus, a highly reliable surface mount LED that can be manufactured at low cost and is highly reliable is provided.
【図１】この発明により製造される表面実装型ＬＥＤの
一実施例を示す概略断面図である。FIG. 1 is a schematic cross-sectional view showing an embodiment of a surface mount LED manufactured by the present invention.
【図２】図１の表面実装型ＬＥＤの樹脂モールド部形成
前の状態を示す概略側面図である。FIG. 2 is a schematic side view showing a state before forming a resin mold portion of the surface mount LED of FIG.
【図３】図１の表面実装型ＬＥＤの樹脂モールド部を成
形するための樹脂型の概略斜視図である。3 is a schematic perspective view of a resin mold for molding a resin mold portion of the surface mount LED of FIG.
【図４】図３の樹脂型により樹脂モールド部を一体的に
成形した状態を示す表面実装型ＬＥＤの概略斜視図であ
る。FIG. 4 is a schematic perspective view of a surface-mounted LED showing a state in which a resin mold portion is integrally molded with the resin mold of FIG.
【図５】リードフレーム切断前の状態を示す表面実装型
ＬＥＤの概略側面図である。FIG. 5 is a schematic side view of the surface-mounted LED before cutting the lead frame.
【図６】完成した表面実装型ＬＥＤを示すもので、
（Ａ）は斜視図、（Ｂ）は断面図である。FIG. 6 shows a completed surface mount LED,
(A) is a perspective view and (B) is a sectional view.
【図７】従来の表面実装型ＬＥＤの一例を示す概略断面
図である。FIG. 7 is a schematic cross-sectional view showing an example of a conventional surface mount LED.
１０ 表面実装型ＬＥＤ １１ リードフレーム １１ａ 張り出し部 １２ リードフレーム １２ａ 張り出し部 １３ ＬＥＤチップ １４ 樹脂モールド部 １５ 樹脂型 １６ 支持部材 10 Surface Mount LED 11 Lead Frame 11a Overhanging Part 12 Lead Frame 12a Overhanging Part 13 LED Chip 14 Resin Molding Part 15 Resin Mold 16 Supporting Member
Claims (1)
チップをダイボンディングし且つ該ＬＥＤチップを他方
のリードフレームの上端面に対してワイヤボンディング
した、張り出し部を有する一対のリードフレームを、樹
脂型内に流し込んだ透明樹脂内に挿入して、該透明樹脂
を硬化させた後、上記リードフレームの張り出し部の下
側で、リードフレーム及び透明樹脂をダイサー等にて切
断することにより、該一対のリードフレームを支持する
ベース部と該ＬＥＤチップから出射する光を上方へ導く
レンズ部とを一体に成形すると共に、該リードフレーム
の張り出し部の先端を該ベース部の側面から外部に露出
させて接続電極部として利用するようにしたことを特徴
とする、表面実装型ＬＥＤの製造方法。1. An LED is provided on an upper end surface of one lead frame.
A pair of lead frames each having a projecting portion, in which a chip is die-bonded and the LED chip is wire-bonded to the upper end surface of the other lead frame, are inserted into a transparent resin poured into a resin mold, and the transparent After the resin is cured, the lead frame and the transparent resin are cut off by a dicer or the like below the overhanging portion of the lead frame, and the light is emitted from the base portion supporting the pair of lead frames and the LED chip. A lens portion that guides light upward is integrally formed, and the tip of the protruding portion of the lead frame is exposed to the outside from the side surface of the base portion to be used as a connection electrode portion. Method for manufacturing surface-mounted LED.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4264138A JP2594207B2 (en) | 1992-09-08 | 1992-09-08 | Method of manufacturing surface mount type LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4264138A JP2594207B2 (en) | 1992-09-08 | 1992-09-08 | Method of manufacturing surface mount type LED |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0690028A true JPH0690028A (en) | 1994-03-29 |
| JP2594207B2 JP2594207B2 (en) | 1997-03-26 |
Family
ID=17398990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4264138A Expired - Lifetime JP2594207B2 (en) | 1992-09-08 | 1992-09-08 | Method of manufacturing surface mount type LED |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2594207B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006222425A (en) * | 2005-02-07 | 2006-08-24 | Agilent Technol Inc | System and method for improving stability of surface mounting of lamp |
| KR100840942B1 (en) * | 2006-03-24 | 2008-06-24 | 조영찬 | Power LED module and method for fabricating the same |
| CN100442546C (en) * | 2001-12-07 | 2008-12-10 | 日立电线株式会社 | Luminance element and making method thereof and lead frame for making said element |
| CN101471418A (en) * | 2006-12-27 | 2009-07-01 | 财团法人工业技术研究院 | Lead wire holder of LED |
-
1992
- 1992-09-08 JP JP4264138A patent/JP2594207B2/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100442546C (en) * | 2001-12-07 | 2008-12-10 | 日立电线株式会社 | Luminance element and making method thereof and lead frame for making said element |
| JP2006222425A (en) * | 2005-02-07 | 2006-08-24 | Agilent Technol Inc | System and method for improving stability of surface mounting of lamp |
| KR100840942B1 (en) * | 2006-03-24 | 2008-06-24 | 조영찬 | Power LED module and method for fabricating the same |
| CN101471418A (en) * | 2006-12-27 | 2009-07-01 | 财团法人工业技术研究院 | Lead wire holder of LED |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2594207B2 (en) | 1997-03-26 |
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