JP3139613B2 - Surface mounted semiconductor light emitting device and method of manufacturing the same - Google Patents
Surface mounted semiconductor light emitting device and method of manufacturing the sameInfo
- Publication number
- JP3139613B2 JP3139613B2 JP08133038A JP13303896A JP3139613B2 JP 3139613 B2 JP3139613 B2 JP 3139613B2 JP 08133038 A JP08133038 A JP 08133038A JP 13303896 A JP13303896 A JP 13303896A JP 3139613 B2 JP3139613 B2 JP 3139613B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- semiconductor light
- light emitting
- emitting element
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Led Device Packages (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、半導体発光装置、
特にプリント基板に固着した半導体発光素子を樹脂パッ
ケージで封止した表面実装型半導体発光装置及びその製
造方法に関する。The present invention relates to a semiconductor light emitting device,
In particular, the present invention relates to a surface-mounted semiconductor light-emitting device in which a semiconductor light-emitting element fixed to a printed board is sealed with a resin package, and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】回路基板上に固着した半導体発光素子を
被覆する光透過性樹脂から成る樹脂パッケージを基板に
形成したミニモールド型半導体発光装置は公知である。
例えば特開昭６２−１１２３３３号公報に示されるよう
に、ミニモールド型半導体発光装置の製造には、多数の
スルーホールの隣り合う一対の列の間に複数の半導体発
光素子を並置した列をスルーホールの列と交互に且つ並
行に形成したプリント基板が使用される。半導体発光素
子が並ぶ一列毎に半導体発光素子を被覆する透光性樹脂
が畝状に形成されるが、形成される透光性樹脂はプリン
ト基板の切断すべき各列のスルーホールの中心を通るカ
ットライン上には突出しない。その後、プリント基板を
スルーホールの列に沿う縦方向のカットラインで切断す
ると共に、プリント基板及び畝状樹脂をカットラインと
直角な横方向に切断して、個別の半導体発光素子に分割
する。2. Description of the Related Art A mini-mold type semiconductor light emitting device in which a resin package made of a light transmitting resin for covering a semiconductor light emitting element fixed on a circuit board is formed on a substrate is known.
For example, as disclosed in Japanese Patent Application Laid-Open No. 62-112333, in manufacturing a mini-mold type semiconductor light emitting device, a row in which a plurality of semiconductor light emitting elements are juxtaposed between a pair of adjacent rows of a large number of through holes is formed. A printed circuit board formed alternately and in parallel with the row of holes is used. The light-transmitting resin covering the semiconductor light-emitting element is formed in a ridge shape for each row in which the semiconductor light-emitting elements are arranged, and the formed light-transmitting resin passes through the center of the through hole in each row of the printed circuit board to be cut. Does not protrude above the cut line. Thereafter, the printed circuit board is cut along a vertical cut line along the row of through holes, and the printed circuit board and the ridge-shaped resin are cut in a horizontal direction perpendicular to the cut line to be divided into individual semiconductor light emitting elements.
【０００３】[0003]
【発明が解決しようとする課題】ところで、前記の製造
方法では、樹脂パッケージの長さ方向に対して直角方向
で且つ半導体発光素子の間を通る第１のカットライン及
びスルーホールの列に沿う第２のカットラインに沿って
プリント基板を横方向と縦方向の２方向に切断するた
め、製造工程が複雑になり且つ製造時間が長くなる欠点
がある。また、従来では、複数個の発光素子を基板上に
搭載した多色型のミニモールド型半導体発光装置等を効
率的に製造する方法は提案されていない。そこで、本発
明は、プリント基板に固着した半導体発光素子を樹脂パ
ッケージで封止して効率的に製造できる表面実装型の半
導体発光装置及びその製造方法を提供することを目的と
する。By the way, in the above-mentioned manufacturing method, the first cut line and the through-hole line extending in a direction perpendicular to the length direction of the resin package and passing between the semiconductor light emitting elements are arranged. Since the printed circuit board is cut in two directions, that is, the horizontal direction and the vertical direction along the cut line 2, the manufacturing process is complicated and the manufacturing time is long. Conventionally, no method has been proposed for efficiently manufacturing a multicolor mini-mold type semiconductor light emitting device or the like in which a plurality of light emitting elements are mounted on a substrate. Therefore, an object of the present invention is to provide a surface-mounted semiconductor light emitting device capable of efficiently manufacturing a semiconductor light emitting element fixed to a printed board by sealing it with a resin package, and a method of manufacturing the same.
【０００４】[0004]
【課題を解決するための手段】本発明による表面実装型
半導体発光装置では、プリント基板(2)上に形成された
第１の電極体(4)に半導体発光素子(12)の下面側の電極
を固着し、プリント基板(2)上に形成された第２の電極
体(6)に半導体発光素子(12)の上面側の電極をリード細
線(5)により接続し、半導体発光素子(12)を光透過性の
樹脂パッケージ(11)で被覆する。第１の電極体(4)は、
プリント基板(2)の平坦な一方の主面(2a)上に形成され
た第１の一方の電極(4a)と、横方向間隙(9)を介して第
１の一方の電極(4a)から離間してプリント基板(2)の平
坦な一方の主面(2a)上に形成された第１の他方の電極(4
b)とを備えている。第２の電極体(6)は、縦方向間隙(8)
を介して第１の一方の電極(4a)から離間してプリント基
板(2)の平坦な一方の主面(2a)上に形成された第２の一
方の電極(6a)と、横方向間隙(9)を介して第２の一方の
電極(6a)から離間し且つ縦方向間隙(8)を介して第１の
他方の電極(4b)から離間してプリント基板(2)の平坦な
一方の主面(2a)上に形成された第２の他方の電極(6b)と
を備えている。半導体発光素子(12)は、第１の一方の電
極(4a)に下面側の電極が固着された第１の半導体発光素
子(12a)と、第１の他方の電極(4b)に下面側の電極が固
着された第２の半導体発光素子(12b)とを備えている。
リード細線(5)は、第１の半導体発光素子(12a)の上面側
の電極と第２の一方の電極(6a)とを接続する第１のリー
ド細線(5a)と、第２の半導体発光素子(12b)の上面側の
電極と第２の他方の電極(6b)とを接続する第２のリード
細線(5b)とを備えている。第１の半導体発光素子(12
a)、第２の半導体発光素子(12b)、第１のリード細線(5
a)及び第２のリード細線(5b)を樹脂パッケージ(11)によ
り共通に被覆する。第１の一方の電極(4a)と第１の他方
の電極(4b)との間及び第２の一方の電極(6a)と第２の他
方の電極(6b)との間を分離する切欠部(10)が設けられ
る。In the surface-mount type semiconductor light emitting device according to the present invention, a first electrode body (4) formed on a printed circuit board (2) is provided with an electrode on the lower surface side of the semiconductor light emitting element (12). The electrode on the upper surface side of the semiconductor light emitting element (12) is connected to the second electrode body (6) formed on the printed board (2) by the thin lead wire (5), and the semiconductor light emitting element (12) Is covered with a light-transmitting resin package (11). The first electrode body (4)
The first one electrode (4a) formed on one flat main surface (2a) of the printed circuit board (2) and the first one electrode (4a) through a lateral gap (9) The first other electrode (4) formed on one flat main surface (2a) of the printed circuit board (2) at a distance.
b). The second electrode body (6) has a longitudinal gap (8).
A second electrode (6a) formed on one flat main surface (2a) of the printed circuit board (2) at a distance from the first one electrode (4a) via One flat surface of the printed circuit board (2) separated from the second one electrode (6a) through (9) and separated from the first other electrode (4b) through the longitudinal gap (8). And a second other electrode (6b) formed on the main surface (2a). The semiconductor light emitting element (12) includes a first semiconductor light emitting element (12a) in which a lower electrode is fixed to a first electrode (4a), and a lower electrode in a first other electrode (4b). A second semiconductor light-emitting element (12b) having electrodes fixed thereto.
The first lead wire (5a) connecting the electrode on the upper surface side of the first semiconductor light emitting element (12a) and the second electrode (6a) is connected to the second lead wire (5a). A second lead wire (5b) for connecting the electrode on the upper surface side of the element (12b) and the second other electrode (6b) is provided. The first semiconductor light emitting device (12
a), the second semiconductor light emitting element (12b), the first lead wire (5
a) and the second fine lead wire (5b) are commonly covered with a resin package (11). Notch for separating between the first one electrode (4a) and the first other electrode (4b) and between the second one electrode (6a) and the second other electrode (6b) (10) is provided.
【０００５】プリント基板(2)の平坦な一方の主面(2a)
上に形成された第１の一方の電極(4a)及び第１の他方の
電極(4b)上にそれぞれ第１の半導体発光素子(12a)及び
第２の半導体発光素子(12b)が固着されるので、第１の
半導体発光素子(12a)と第２の半導体発光素子(12b)とか
ら成る一対の半導体発光素子(12)を含む半導体発光装置
(20)を効率的に製造することができる。また、第１の一
方の電極(4a)、第１の他方の電極(4b)、第２の一方の電
極(6a)及び第２の他方の電極(6b)は縦方向間隙(8)、横
方向間隙(9)及び切欠部(10)により電気的に絶縁される
ので、第１の半導体発光素子(12a)と第２の半導体発光
素子(12b)とを効率的かつ確実に電気的に分離できる。One flat main surface (2a) of the printed circuit board (2)
A first semiconductor light emitting element (12a) and a second semiconductor light emitting element (12b) are fixed on a first one electrode (4a) and a first other electrode (4b) formed thereon, respectively. Therefore, a semiconductor light emitting device including a pair of semiconductor light emitting elements (12) including a first semiconductor light emitting element (12a) and a second semiconductor light emitting element (12b)
(20) can be manufactured efficiently. In addition, the first one electrode (4a), the first other electrode (4b), the second one electrode (6a) and the second other electrode (6b) are separated by a vertical gap (8), The first semiconductor light emitting element (12a) and the second semiconductor light emitting element (12b) are efficiently and reliably electrically separated from each other because they are electrically insulated by the directional gap (9) and the notch (10). it can.
【０００６】本発明による表面実装型半導体発光装置の
製造方法では、複数の長孔(1)及び隣り合う一対の長孔
(1)の間に形成された連結部(3)を備えるプリント基板
(2)を用意する工程と、プリント基板(2)の連結部(3)の
一方の主面(3a)上に第１の電極体(4)と、第２の電極体
(6)と、第１の電極体(4)と第２の電極体(6)とを分離し
て連結部(3)の長さ方向に沿って延伸する縦方向間隙(8)
と、第１の電極体(4)及び第２の電極体(6)がそれぞれ横
方向間隙(9)の端部側で連結部(3)の長さ方向に連続させ
て、縦方向間隙(8)に対して直交して第１の電極体(4)を
第１の一方の電極(4a)及び第１の他方の電極(4b)に分割
し且つ第２の電極体(6)を第２の一方の電極(6a)及び第
２の他方の電極(6b)に分割する横方向間隙(9)とを形成
する工程と、第１の一方の電極(4a)及び第１の他方の電
極(4b)にぞれぞれ半導体発光素子(12)の第１の半導体発
光素子(12a)及び第２の半導体発光素子(12b)の各下面側
の電極を固着することにより第１の電極体(4)に半導体
発光素子(12)の下面側の電極を固着する工程と、第１の
半導体発光素子(12a)及び第２の半導体発光素子(12b)の
各上面側の電極と第２の一方の電極(6a)及び第２の他方
の電極(6b)とをぞれぞれリード細線(5)の第１のリード
細線(5a)及び第２のリード細線(5b)により接続すること
により、半導体発光素子(12)の上面側の電極をリード細
線(5)により第２の電極体(6)に接続する工程と、第１の
半導体発光素子(12a)及び第２の半導体発光素子(12b)が
並ぶ列毎に樹脂パッケージ(11)により連結部(3)に沿っ
て半導体発光素子(12)を被覆することにより、半導体発
光素子(12)を光透過性の樹脂パッケージ(11)で被覆する
工程と、第１の半導体発光素子(12a)と、第２の半導体
発光素子(12b)と、横方向間隙(9)とを含む半導体発光装
置(20)の各切断片に、樹脂パッケージ(11)の長さ方向に
対して直角方向のカットラインに沿ってプリント基板
(2)と樹脂パッケージ(11)とを切断することにより、プ
リント基板(2)を切断して複数の半導体発光装置(20)に
分割する工程とを含む。横方向間隙(9)の端部側での連
続部分をスタンピング又はエッチングで除去して、横方
向間隙(9)の端部側で連続する第１の一方の電極(4a)及
び第１の他方の電極(4b)を電気的に分離し且つ第２の一
方の電極(6a)及び第２の他方の電極(6b)を電気的に分離
する。In the method of manufacturing a surface-mounted semiconductor light emitting device according to the present invention, a plurality of long holes (1) and a pair of adjacent long holes are used.
Printed circuit board with connecting part (3) formed between (1)
(2) preparing a first electrode body (4) and a second electrode body on one main surface (3a) of a connecting portion (3) of a printed circuit board (2);
(6) and a longitudinal gap (8) which separates the first electrode body (4) and the second electrode body (6) and extends along the length direction of the connecting portion (3).
And the first electrode body (4) and the second electrode body (6) are respectively continuous in the length direction of the connecting portion (3) on the end side of the horizontal gap (9), and the vertical gap ( 8), the first electrode body (4) is divided into a first one electrode (4a) and a first other electrode (4b), and the second electrode body (6) is Forming a lateral gap (9) that divides the first electrode (6a) and the second other electrode (6b) into a first electrode (4a) and a first other electrode. The first electrode body is fixed by fixing the electrodes on the lower surfaces of the first semiconductor light emitting element (12a) and the second semiconductor light emitting element (12b) of the semiconductor light emitting element (12), respectively. (4) fixing the electrode on the lower surface side of the semiconductor light-emitting element (12) to the first and second semiconductor light-emitting elements (12a) and (12b); The first lead of the lead wire (5), with one of the electrodes (6a) and the second other electrode (6b); Connecting the electrode on the upper surface side of the semiconductor light emitting element (12) to the second electrode body (6) by the lead wire (5) by connecting the wire (5a) and the second lead wire (5b). By coating the semiconductor light emitting element (12) along the connecting portion (3) with the resin package (11) for each row in which the first semiconductor light emitting element (12a) and the second semiconductor light emitting element (12b) are arranged. Covering the semiconductor light-emitting element (12) with a light-transmitting resin package (11), a first semiconductor light-emitting element (12a), a second semiconductor light-emitting element (12b), and a lateral gap (9). The printed circuit board is cut along a cut line perpendicular to the length direction of the resin package (11) on each cut piece of the semiconductor light emitting device (20) including
(2) cutting the printed board (2) by cutting the resin package (11) to divide the printed circuit board (2) into a plurality of semiconductor light emitting devices (20). The continuous portion on the end side of the lateral gap (9) is removed by stamping or etching, and the first one electrode (4a) and the first other electrode continuous on the end side of the lateral gap (9). Electrode (4b) is electrically separated and the second one electrode (6a) and the second other electrode (6b) are electrically separated.
【０００７】長孔(1)により予め分割されたプリント基
板(2)の連結部(3)を切断して、第１の半導体発光素子(1
2a)と第２の半導体発光素子(12b)とから成る一対の半導
体発光素子(12)を含む半導体発光装置(20)を直ちに製造
できるので、第１の半導体発光素子(12a)と第２の半導
体発光素子(12b)とを備えた表面実装型半導体発光装置
の製造工程を簡素化することができる。また、プリント
基板(2)の平坦な一方の主面(2a)上に第１の一方の電極
(4a)、第１の他方の電極(4b)、第２の一方の電極(6a)及
び第２の他方の電極(6b)を形成すると共に、第１の一方
の電極(4a)及び第１の他方の電極(4b)にそれぞれ第１の
半導体発光素子(12a)及び第２の半導体発光素子(12b)を
固着するので、半導体発光装置(20)を効率的に製造する
ことができる。[0007] The connecting portion (3) of the printed circuit board (2) divided in advance by the elongated hole (1) is cut, and the first semiconductor light emitting element (1) is cut.
Since a semiconductor light emitting device (20) including a pair of semiconductor light emitting elements (12) composed of 2a) and a second semiconductor light emitting element (12b) can be manufactured immediately, the first semiconductor light emitting element (12a) and the second semiconductor light emitting element (12b) can be manufactured. The manufacturing process of the surface-mounted semiconductor light emitting device including the semiconductor light emitting element (12b) can be simplified. A first one electrode is provided on one flat main surface (2a) of the printed circuit board (2).
(4a), a first other electrode (4b), a second one electrode (6a) and a second other electrode (6b) are formed, and the first one electrode (4a) and the first Since the first semiconductor light emitting element (12a) and the second semiconductor light emitting element (12b) are fixed to the other electrode (4b), the semiconductor light emitting device (20) can be manufactured efficiently.
【０００８】本発明による製造方法の実施の形態では、
例えば、長孔(1)の壁面(1a)に沿ってスタンピングによ
り切欠部(10)を連結部(3)に形成して第１の一方の電極
(4a)及び第１の他方の電極(4b)並びに第２の一方の電極
(6a)及び第２の他方の電極(6b)の横方向間隙(9)の端部
側を電気的に分離する。切欠部(10)を形成した後に、第
１の一方の電極(4a)及び第１の他方の電極(4b)にそれぞ
れ第１の半導体発光素子(12a)及び第２の半導体発光素
子(12b)を固着してもよく、第１の半導体発光素子(12a)
及び第２の半導体発光素子(12b)の固着後、第１のリー
ド細線(5a)及び第２のリード細線(5b)の接続後又は樹脂
パッケージ(11)の形成後に、切欠部(10)を形成してもよ
い。In an embodiment of the manufacturing method according to the present invention,
For example, a notch (10) is formed in the connecting portion (3) by stamping along the wall surface (1a) of the long hole (1) to form the first one electrode.
(4a) and the first other electrode (4b) and the second one electrode
(6a) and the other end of the lateral gap (9) between the other electrode (6b) are electrically separated. After the notch (10) is formed, the first semiconductor light emitting element (12a) and the second semiconductor light emitting element (12b) are respectively applied to the first one electrode (4a) and the first other electrode (4b). May be fixed to the first semiconductor light emitting device (12a).
After fixing the second semiconductor light emitting element (12b), connecting the first thin lead wire (5a) and the second thin lead wire (5b), or forming the resin package (11), the cutout (10) is formed. It may be formed.
【０００９】[0009]
【発明の実施の形態】以下、表面実装型発光ダイオード
装置に適用した本発明による表面実装型半導体発光装置
及びその製造方法の実施の形態を図１〜図１１について
説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a surface-mounted semiconductor light-emitting device according to the present invention applied to a surface-mounted light-emitting diode device and a method of manufacturing the same will be described below with reference to FIGS.
【００１０】まず、図１及び図２に示すように、本発明
の第１の実施の形態では、互いに並行に且つ一定間隔で
形成した複数の長孔(1)と、隣り合う一対の長孔(1)の間
に形成された連結部(3)とを備えたプリント基板(2)を用
意する。プリント基板(2)の一方の主面(2a)に互いに対
向して形成された第１の電極体(4)及び第２の電極体(6)
は、互いに対向し且つ長孔(1)が延伸する方向に並列に
且つ隣り合う長孔(1)の間の連結部(3)上に形成される
が、第１の電極体(4)と第２の電極体(6)との間の短絡を
防止するため、長孔(1)と略並行に縦方向間隙(8)が連結
部(3)に形成され、縦方向間隙(8)に略直角に交差して一
定間隔で横方向間隙(9)が連結部(3)に形成される。従っ
て、縦方向間隙(8)と横方向間隙(9)では、プリント基板
(2)の一方の主面(2a)が露出する。第１の電極体(4)と第
２の電極体(6)は連結部(3)の長さ方向に沿って縦方向間
隙(8)を介して間欠的に形成される。横方向間隙(9)は長
孔(1)の壁面(1a)には達しないが、壁面(1a)付近まで延
びている。完成した発光ダイオードの表面実装を可能に
するため、図３に示すように、連結部(3)の一方の主面
(3a)に設けられた第１の電極体(4)及び第２の電極体(6)
は長孔(1)の壁面(1a)を通りプリント基板(2)の他方の主
面(2b)、即ち連結部(3)の第２の主面(3b)まで達する。
プリント基板(2)は例えばセラミックで形成され、第１
の電極体(4)及び第２の電極体(6)は銅で形成される。First, as shown in FIGS. 1 and 2, in a first embodiment of the present invention, a plurality of long holes (1) formed in parallel with each other and at regular intervals, and a pair of adjacent long holes are formed. A printed circuit board (2) including a connecting portion (3) formed between (1) is prepared. A first electrode body (4) and a second electrode body (6) formed on one main surface (2a) of the printed circuit board (2) so as to face each other;
Are formed in parallel with each other and in the direction in which the elongated hole (1) extends, and on the connecting portion (3) between the adjacent elongated holes (1), and are formed with the first electrode body (4). In order to prevent a short circuit with the second electrode body (6), a vertical gap (8) is formed in the connecting portion (3) substantially in parallel with the long hole (1), and the vertical gap (8) is formed in the vertical gap (8). A transverse gap (9) is formed in the connecting portion (3) at a certain interval so as to intersect at a substantially right angle. Therefore, in the vertical gap (8) and the horizontal gap (9),
One main surface (2a) of (2) is exposed. The first electrode body (4) and the second electrode body (6) are formed intermittently along a longitudinal direction of the connecting portion (3) via a vertical gap (8). The lateral gap (9) does not reach the wall surface (1a) of the long hole (1), but extends to near the wall surface (1a). To enable surface mounting of the completed light emitting diode, as shown in FIG.
The first electrode body (4) and the second electrode body (6) provided in (3a)
Reaches the other main surface (2b) of the printed circuit board (2), that is, the second main surface (3b) of the connecting portion (3) through the wall surface (1a) of the long hole (1).
The printed circuit board (2) is formed of, for example, ceramic and has a first
The electrode body (4) and the second electrode body (6) are formed of copper.
【００１１】次に、図４及び図５に示すように、横方向
間隙(9)の各端部を含み長孔(1)の壁面(1a)に沿って連結
部(3)にスタンピングを行い、切欠部(10)を形成して、
第１の電極体(4)及び第２の電極体(6)をそれぞれ分離す
る。Next, as shown in FIGS. 4 and 5, stamping is performed on the connecting portion (3) along the wall surface (1a) of the elongated hole (1) including each end of the lateral gap (9). , Forming a notch (10),
The first electrode body (4) and the second electrode body (6) are separated from each other.
【００１２】続いて、図６及び図７に示すように、半導
体発光素子としての発光ダイオードチップ(12)の各下面
に設けられた電極を連結部(3)の長さ方向に沿って第１
の電極体(4)に固着し、発光ダイオードチップ(12)の上
面に設けられた電極にリード細線(5)の一端を固着（ボ
ンディング）すると共に、リード細線(5)の他端を第２
の電極体(6)に接続する。横方向間隙(9)を挟んで異なる
発光色の発光ダイオードチップ(12)が第１の電極体(4)
に固着される。その後、図８及び図９に示すように、エ
ポキシ樹脂等の透光性樹脂による樹脂パッケージ(11)を
発光ダイオードチップ(12)を被覆するように連結部(3)
に周知のトランスファモールド法によって畝状に形成す
る。樹脂パッケージ(11)は略台形断面を有し、発光ダイ
オードチップ(12)と、リード細線(5)と、第１の電極体
(4)及び第２の電極体(6)の各一部を被覆するが、切欠部
(10)には達しない。最後に、図８に示すように、樹脂パ
ッケージ(11)の長さ方向に対して直角方向のカットライ
ン(13)に沿い隣り合う発光ダイオードチップ(12)の間で
プリント基板(2)の連結部(3)と樹脂パッケージ(11)とを
切断し、図１０に示す２個の発光ダイオードチップ(12)
を含む半導体発光装置としての発光ダイオード装置(20)
が形成される。Subsequently, as shown in FIGS. 6 and 7, electrodes provided on each lower surface of the light emitting diode chip (12) as a semiconductor light emitting element are connected to the first portion along the length direction of the connecting portion (3).
And one end of the lead wire (5) is fixed (bonded) to an electrode provided on the upper surface of the light emitting diode chip (12), and the other end of the lead wire (5) is connected to the second electrode body.
To the electrode body (6). The light emitting diode chips (12) of different emission colors sandwich the lateral gap (9) with the first electrode body (4).
To be fixed. Thereafter, as shown in FIGS. 8 and 9, a resin package (11) made of a translucent resin such as an epoxy resin is connected to the connecting portion (3) so as to cover the light emitting diode chip (12).
Is formed in a ridge shape by a well-known transfer molding method. The resin package (11) has a substantially trapezoidal cross section, and includes a light emitting diode chip (12), a fine lead wire (5), and a first electrode body.
(4) and each part of the second electrode body (6) is covered,
(10) is not reached. Finally, as shown in FIG. 8, the printed circuit board (2) is connected between the adjacent light emitting diode chips (12) along a cut line (13) perpendicular to the length direction of the resin package (11). The part (3) and the resin package (11) are cut, and two light emitting diode chips (12) shown in FIG.
Light emitting diode device as a semiconductor light emitting device including (20)
Is formed.
【００１３】図１０に示すように、この実施の形態によ
る発光ダイオード装置(20)では、第１の電極体(4)は、
第１の一方の電極(4a)と、横方向間隙(9)を介して第１
の一方の電極(4a)から離間して形成された第１の他方の
電極(4b)とを備えている。また、第２の電極体(6)は、
縦方向間隙(8)を介して第１の一方の電極(4a)から離間
して形成された第２の一方の電極(6a)と、横方向間隙
(9)を介して第２の一方の電極(6a)から離間し且つ縦方
向間隙(8)を介して第１の他方の電極(4b)から離間して
形成された第２の他方の電極(6b)とを備えている。発光
ダイオードチップ(12)は、第１の一方の電極(4a)に下面
側の電極が固着された第１の半導体発光素子としての第
１の発光ダイオードチップ(12a)と、第１の他方の電極
(4b)に下面側の電極が固着された第２の半導体発光素子
としての第２の発光ダイオードチップ(12b)とを備え、
リード細線(5)は、第１の発光ダイオードチップ(12a)の
上面側の電極と第２の一方の電極(6a)とを接続する第１
のリード細線(5a)と、第２の発光ダイオードチップ(12
b)の上面側の電極と第２の他方の電極(6b)とを接続する
第２のリード細線(5b)とを備えている。樹脂パッケージ
(11)は、第１の発光ダイオードチップ(12a)、第２の発
光ダイオードチップ(12b)、第１のリード細線(5a)及び
第２のリード細線(5b)を共通に被覆する。As shown in FIG. 10, in the light emitting diode device (20) according to this embodiment, the first electrode body (4)
The first electrode (4a) and the first electrode (4a)
And the first other electrode (4b) formed separately from the one electrode (4a). Also, the second electrode body (6)
A second one electrode (6a) formed apart from the first one electrode (4a) through a vertical gap (8);
A second other electrode formed apart from the second one electrode (6a) via (9) and separated from the first other electrode (4b) via the longitudinal gap (8); (6b). The light-emitting diode chip (12) includes a first light-emitting diode chip (12a) as a first semiconductor light-emitting element having a lower electrode fixed to a first one electrode (4a), and a first other light-emitting diode chip (12a). electrode
(4b) a second light-emitting diode chip (12b) as a second semiconductor light-emitting element having a lower surface-side electrode fixed thereto,
The thin lead wire (5) connects the first electrode (6a) to the electrode on the upper surface of the first light emitting diode chip (12a).
And the second light emitting diode chip (12a).
A second lead wire (5b) for connecting the electrode on the upper surface side of (b) and the second other electrode (6b) is provided. Resin package
(11) covers the first light emitting diode chip (12a), the second light emitting diode chip (12b), the first lead wire (5a) and the second lead wire (5b) in common.
【００１４】本発明では、長孔(1)によりプリント基板
(2)が予め分割されているため、プリント基板(2)及び樹
脂パッケージ(11)を１回切断して表面実装型半導体発光
装置を直ちに製造することができ、製造工程を簡素化す
ることができる。第１の実施の形態では、切欠部(10)を
形成した後に、発光ダイオードチップ(12)の固着、リー
ド細線(5)の接続及び樹脂パッケージ(11)の形成を行う
が、発光ダイオードチップ(12)の固着後、リード細線
(5)の接続後又は樹脂パッケージ(11)の形成後に切欠部
(10)を形成してもよい。In the present invention, the printed circuit board is formed by the slot (1).
Since (2) is divided in advance, the printed circuit board (2) and the resin package (11) can be cut once to immediately manufacture a surface-mounted semiconductor light-emitting device, thereby simplifying the manufacturing process. it can. In the first embodiment, after the notch (10) is formed, the fixing of the light emitting diode chip (12), the connection of the fine lead wire (5), and the formation of the resin package (11) are performed. 12) After fixation, fine lead wire
Notch after connection of (5) or formation of resin package (11)
(10) may be formed.
【００１５】図１１に示す本発明の第２の実施の形態で
は、樹脂パッケージ(11)の形成後に切欠部(10)を形成し
ている。即ち、連結部(3)の長さ方向に沿って第１の電
極体(4)と第２の電極体(6)に縦方向間隙(8)に対し直交
する複数の横方向間隙(9)を形成し、横方向間隙(9)を挟
んで複数の発光ダイオードチップ(12)を第１の電極体
(4)に固着し、樹脂パッケージ(11)を形成した後、横方
向間隙(9)の各端部を含み長孔(1)の壁面(1a)に沿って連
結部(3)にスタンピングを行い、切欠部(10)を形成して
いる。第１及び第２の実施の形態では、第１及び第２の
電極体(4)(6)を切欠部(10)の形成によって電気的に分離
しているが、第１及び第２の電極体(4)(6)の横方向間隙
(9)の端部側での連続部分をエッチング等で除去して分
離することもできる。In the second embodiment of the present invention shown in FIG. 11, the notch (10) is formed after the formation of the resin package (11). That is, a plurality of horizontal gaps (9) orthogonal to the vertical gaps (8) in the first electrode body (4) and the second electrode body (6) along the length direction of the connecting portion (3). And a plurality of light-emitting diode chips (12) sandwiched by a lateral gap (9) in a first electrode body.
After fixing to (4) and forming the resin package (11), stamping is performed on the connecting portion (3) along the wall surface (1a) of the long hole (1) including each end of the lateral gap (9). The notch (10) is formed. In the first and second embodiments, the first and second electrode bodies (4) and (6) are electrically separated by the formation of the notch (10). Transverse gap between bodies (4) and (6)
The continuous portion on the end side of (9) can be separated by removing it by etching or the like.
【００１６】[0016]
【発明の効果】前記の通り、本発明では、製造工程を簡
素化して、表面実装型半導体発光装置を効率的に製造す
ることができる。即ち、プリント基板の平坦な一方の主
面上に形成された第１の一方の電極及び第１の他方の電
極上にそれぞれ第１の半導体発光素子及び第２の半導体
発光素子が固着されるので、一対の半導体発光素子を含
む半導体発光装置を効率的に製造することができる。ま
た、第１の一方の電極、第１の他方の電極、第２の一方
の電極及び第２の他方の電極は縦方向間隙及び横方向間
隙により電気的に絶縁されるので、第１の半導体発光素
子と第２の半導体発光素子とを効率的かつ確実に電気的
に分離できる。As described above, according to the present invention, the manufacturing process can be simplified, and the surface-mounted semiconductor light emitting device can be manufactured efficiently. That is, the first semiconductor light emitting element and the second semiconductor light emitting element are respectively fixed on the first one electrode and the first other electrode formed on one flat main surface of the printed circuit board. Thus, a semiconductor light emitting device including a pair of semiconductor light emitting elements can be efficiently manufactured. Further, the first one electrode, the first other electrode, the second one electrode, and the second other electrode are electrically insulated by the vertical gap and the horizontal gap, so that the first semiconductor The light-emitting element and the second semiconductor light-emitting element can be electrically separated efficiently and reliably.
【図１】 本発明による表面実装型半導体発光装置の製
造方法に使用するプリント基板の斜視図FIG. 1 is a perspective view of a printed circuit board used in a method for manufacturing a surface-mounted semiconductor light emitting device according to the present invention.
【図２】 図１の略示平面図FIG. 2 is a schematic plan view of FIG.
【図３】 図１に示すプリント基板の断面図FIG. 3 is a sectional view of the printed circuit board shown in FIG. 1;
【図４】 図１のプリント基板に切欠部を形成した状態
を示す斜視図FIG. 4 is a perspective view showing a state in which a notch is formed in the printed circuit board of FIG. 1;
【図５】 図４の略示平面図FIG. 5 is a schematic plan view of FIG. 4;
【図６】 図４に示すプリント基板に発光ダイオードチ
ップを固着し且つリード細線により電極を接続した状態
を示す斜視図6 is a perspective view showing a state in which a light emitting diode chip is fixed to the printed circuit board shown in FIG. 4 and electrodes are connected by thin lead wires.
【図７】 図６の断面図FIG. 7 is a sectional view of FIG. 6;
【図８】 図６のプリント基板に樹脂パッケージを形成
した状態を示す斜視図8 is a perspective view showing a state where a resin package is formed on the printed circuit board of FIG. 6;
【図９】 図８の断面図9 is a sectional view of FIG.
【図１０】 本発明により得られた発光ダイオード装置
の斜視図FIG. 10 is a perspective view of a light emitting diode device obtained according to the present invention.
【図１１】 樹脂パッケージを形成した後切欠部を形成
する本発明の第２の実施の形態を示す斜視図FIG. 11 is a perspective view showing a second embodiment of the present invention in which a notch is formed after forming a resin package.
(1)・・長孔、 (1a)・・壁面、 (2)・・プリント基
板、 (3)・・連結部、(4)・・第１の電極体、 (4a)・
・第１の一方の電極、 (4b)・・第１の他方の電極、
(5)・・リード細線、 (5a)・・第１のリード細線、
(5b)・・第２のリード細線、 (6)・・第２の電極体、
(6a)・・第２の一方の電極、 (6b)・・第２の他方の
電極、 (8)・・縦方向間隙、 (9)・・横方向間隙、
(10)・・切欠部、 (11)・・樹脂パッケージ、 (12)・
・発光ダイオードチップ（半導体発光素子）、 (12a)
・・第１の発光ダイオードチップ（第１の半導体発光素
子）、 (12b)・・第２の発光ダイオードチップ（第２
の半導体発光素子）、 (20)・・発光ダイオード装置
（半導体発光装置）、(1) ··· Long hole, (1a) ··· Wall surface, (2) ··· Printed circuit board, (3) ··· Connection part, (4) ··· First electrode body, (4a) ·
A first one electrode, (4b) a first other electrode,
(5) ··· Fine lead wire, (5a) · · · First lead fine wire,
(5b) ··· Second lead wire, (6) ··· Second electrode body,
(6a) ··· second one electrode, (6b) ··· second other electrode, (8) ··· vertical gap, (9) ··· horizontal gap,
(10) ・ ・ Notch, (11) ・ ・ Resin package, (12) ・
・ Light emitting diode chip (semiconductor light emitting element), (12a)
..First light-emitting diode chip (first semiconductor light-emitting element), (12b).
(20) ··· Light emitting diode device (semiconductor light emitting device),
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 33/00 ──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int. Cl. 7 , DB name) H01L 33/00
Claims (5)
体に半導体発光素子の下面側の電極を固着し、プリント
基板上に形成された第２の電極体に前記半導体発光素子
の上面側の電極をリード細線により接続し、前記半導体
発光素子を光透過性の樹脂パッケージで被覆した表面実
装型半導体発光装置において、 前記第１の電極体は、前記プリント基板の平坦な一方の
主面上に形成された第１の一方の電極と、横方向間隙を
介して前記第１の一方の電極から離間して前記プリント
基板の平坦な前記一方の主面上に形成された第１の他方
の電極とを備え、 前記第２の電極体は、縦方向間隙を介して前記第１の一
方の電極から離間して前記プリント基板の平坦な前記一
方の主面上に形成された第２の一方の電極と、前記横方
向間隙を介して前記第２の一方の電極から離間し且つ前
記縦方向間隙を介して前記第１の他方の電極から離間し
て前記プリント基板の平坦な前記一方の主面上に形成さ
れた第２の他方の電極とを備え、 前記半導体発光素子は、前記第１の一方の電極に下面側
の電極が固着された第１の半導体発光素子と、前記第１
の他方の電極に下面側の電極が固着された第２の半導体
発光素子とを備え、 前記リード細線は、前記第１の半導体発光素子の上面側
の電極と前記第２の一方の電極とを接続する第１のリー
ド細線と、前記第２の半導体発光素子の上面側の電極と
前記第２の他方の電極とを接続する第２のリード細線と
を備え、 前記第１の半導体発光素子、第２の半導体発光素子、第
１のリード細線及び第２のリード細線を前記樹脂パッケ
ージにより共通に被覆し、 前記第１の一方の電極と第１の他方の電極との間及び前
記第２の一方の電極と第２の他方の電極との間を分離す
る切欠部を備えたことを特徴とする表面実装型半導体発
光装置。An electrode on a lower surface side of a semiconductor light emitting element is fixed to a first electrode body formed on a printed board, and an upper surface side of the semiconductor light emitting element is fixed on a second electrode body formed on the printed board. In a surface-mounted semiconductor light-emitting device in which the above-mentioned electrodes are connected by thin lead wires and the semiconductor light-emitting element is covered with a light-transmitting resin package, the first electrode body is formed on one of the flat main surfaces of the printed circuit board. And a first other electrode formed on the flat one main surface of the printed circuit board and separated from the first one electrode via a lateral gap. An electrode, wherein the second electrode body is formed on the flat one main surface of the printed circuit board so as to be separated from the first one electrode via a vertical gap. And the second electrode through the lateral gap. A second other electrode formed on the flat one main surface of the printed circuit board and separated from the one electrode and separated from the first other electrode via the longitudinal gap. The semiconductor light emitting element includes a first semiconductor light emitting element in which an electrode on a lower surface side is fixed to the first one electrode;
A second semiconductor light emitting element in which a lower electrode is fixed to the other electrode of the first semiconductor light emitting element. The thin lead wire connects the upper electrode and the second one electrode of the first semiconductor light emitting element to each other. A first thin lead wire for connection, a second thin lead wire for connecting an electrode on the upper surface side of the second semiconductor light emitting element and the second other electrode, A second semiconductor light emitting element, a first thin lead wire and a second thin lead wire are commonly covered with the resin package, and the second semiconductor light emitting element, the first thin lead wire, and the second thin lead wire are covered with the resin package. A surface-mounted semiconductor light emitting device comprising a notch for separating one electrode from a second other electrode.
の間に形成された連結部を備えるプリント基板を用意す
る工程と、 前記プリント基板の前記連結部の一方の主面上に第１の
電極体と、第２の電極体と、前記第１の電極体と前記第
２の電極体とを分離して前記連結部の長さ方向に沿って
延伸する縦方向間隙と、前記第１の電極体及び前記第２
の電極体がそれぞれ横方向間隙の端部側で前記連結部の
長さ方向に連続させて、前記縦方向間隙に対して直交し
て前記第１の電極体を第１の一方の電極及び第１の他方
の電極に分割し且つ前記第２の電極体を第２の一方の電
極及び第２の他方の電極に分割する前記横方向間隙とを
形成する工程と、 前記第１の一方の電極及び前記第１の他方の電極にぞれ
ぞれ前記半導体発光素子の第１の半導体発光素子及び第
２の半導体発光素子の各下面側の電極を固着することに
より前記第１の電極体に前記半導体発光素子の下面側の
電極を固着する工程と、 前記第１の半導体発光素子及び前記第２の半導体発光素
子の各上面側の電極と前記第２の一方の電極及び前記第
２の他方の電極とをぞれぞれリード細線の第１のリード
細線及び第２のリード細線により接続することにより、
前記半導体発光素子の上面側の電極を前記リード細線に
より前記第２の電極体に接続する工程と、 前記第１の半導体発光素子及び前記第２の半導体発光素
子が並ぶ列毎に樹脂パッケージにより前記連結部に沿っ
て前記半導体発光素子を被覆することにより、前記半導
体発光素子を光透過性の樹脂パッケージで被覆する工程
と、 前記第１の半導体発光素子と、前記第２の半導体発光素
子と、横方向間隙とを含む前記半導体発光装置の各切断
片に、前記樹脂パッケージの長さ方向に対して直角方向
のカットラインに沿って前記プリント基板と前記樹脂パ
ッケージとを切断することにより、前記プリント基板を
切断して複数の半導体発光装置に分割する工程とを含む
表面実装型半導体発光装置の製造方法において、 前記横方向間隙の端部側での連続部分をスタンピング又
はエッチングで除去して、前記横方向間隙の端部側で連
続する前記第１の一方の電極及び前記第１の他方の電極
を電気的に分離し且つ前記第２の一方の電極及び前記第
２の他方の電極を電気的に分離する工程とを含むことを
特徴とする表面実装型半導体発光装置の製造方法。2. A step of preparing a printed circuit board having a plurality of long holes and a connecting portion formed between a pair of adjacent long holes, and a step of forming a printed circuit board on one main surface of the connecting portion of the printed circuit board. A first electrode body, a second electrode body, a vertical gap that separates the first electrode body and the second electrode body and extends along a length direction of the connecting portion; The first electrode body and the second electrode body
Electrode bodies are respectively continuous in the longitudinal direction of the connecting portion on the end side of the lateral gap, and the first electrode body is orthogonal to the longitudinal gap and the first electrode body and the first electrode body are orthogonal to the longitudinal gap. Forming the lateral gap that divides the second electrode body into one second electrode and a second one electrode and a second other electrode; and the first one electrode And fixing the electrodes on the lower surfaces of the first semiconductor light emitting element and the second semiconductor light emitting element of the semiconductor light emitting element to the first other electrode, respectively, so that the first electrode body is fixed to the first electrode body. Fixing the electrode on the lower surface side of the semiconductor light emitting element, the electrode on the upper surface side of each of the first semiconductor light emitting element and the second semiconductor light emitting element, the second electrode and the second other electrode. To the first and second lead wires of the lead wires, respectively. By connecting Ri,
Connecting the electrode on the upper surface side of the semiconductor light emitting element to the second electrode body by the thin lead wire; and providing a resin package for each row in which the first semiconductor light emitting element and the second semiconductor light emitting element are arranged. A step of coating the semiconductor light-emitting element with a light-transmitting resin package by coating the semiconductor light-emitting element along a connecting portion; and the first semiconductor light-emitting element and the second semiconductor light-emitting element; Cutting the printed circuit board and the resin package along a cut line in a direction perpendicular to a length direction of the resin package on each cut piece of the semiconductor light emitting device including a lateral gap; Cutting a substrate to divide the substrate into a plurality of semiconductor light emitting devices, the method comprising the steps of: A portion is removed by stamping or etching to electrically separate the first one electrode and the first other electrode that are continuous on the end side of the lateral gap and the second one electrode And a step of electrically separating the second other electrode. A method of manufacturing a surface-mounted semiconductor light-emitting device, comprising:
より切欠部を前記連結部に形成して前記第１の一方の電
極及び前記第１の他方の電極並びに前記第２の一方の電
極及び前記第２の他方の電極の前記横方向間隙の端部側
を電気的に分離する請求項２に記載の表面実装型半導体
発光装置の製造方法。3. A notch is formed in said connecting portion by stamping along a wall surface of said elongated hole, and said first one electrode, said first other electrode, said second one electrode and said notch are formed. 3. The method of manufacturing a surface-mounted semiconductor light emitting device according to claim 2, wherein an end side of said second gap of said second other electrode is electrically separated.
一方の電極及び前記第１の他方の電極にそれぞれ前記第
１の半導体発光素子及び前記第２の半導体発光素子を固
着する請求項３に記載の表面実装型半導体発光装置の製
造方法。4. After forming the notch, the first semiconductor light emitting element and the second semiconductor light emitting element are fixed to the first one electrode and the first other electrode, respectively. 4. The method for manufacturing a surface-mounted semiconductor light-emitting device according to item 3.
の半導体発光素子の固着後、前記第１のリード細線及び
前記第２のリード細線の接続後又は前記樹脂パッケージ
の形成後に、前記切欠部を形成する請求項３に記載の表
面実装型半導体発光装置の製造方法。5. The first semiconductor light emitting device and the second semiconductor light emitting device.
4. The surface-mounted semiconductor light emitting device according to claim 3, wherein the cutout portion is formed after the semiconductor light emitting element is fixed, after the first thin lead wire and the second thin lead wire are connected, or after the resin package is formed. Manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP08133038A JP3139613B2 (en) | 1996-05-28 | 1996-05-28 | Surface mounted semiconductor light emitting device and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP08133038A JP3139613B2 (en) | 1996-05-28 | 1996-05-28 | Surface mounted semiconductor light emitting device and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09321345A JPH09321345A (en) | 1997-12-12 |
| JP3139613B2 true JP3139613B2 (en) | 2001-03-05 |
Family
ID=15095366
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP08133038A Expired - Fee Related JP3139613B2 (en) | 1996-05-28 | 1996-05-28 | Surface mounted semiconductor light emitting device and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3139613B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014005615A (en) * | 2012-06-22 | 2014-01-16 | Urban Vision Architect & Design Office | Mobile building |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1204151A4 (en) * | 2000-04-24 | 2006-10-18 | Rohm Co Ltd | Edge-emitting light-emitting semiconductor device and method of manufacture thereof |
| US6833563B2 (en) | 2001-09-25 | 2004-12-21 | Intel Corporation | Multi-stack surface mount light emitting diodes |
| KR100646630B1 (en) * | 2004-10-08 | 2006-11-23 | 서울반도체 주식회사 | Manufacturing process of Printed circuit board for Light Emitting Diode and Printed circuit board for Light Emitting Diode |
| KR100600856B1 (en) * | 2004-12-16 | 2006-07-18 | 알티전자 주식회사 | Lead frame used in power LED package and method for producing the same |
| JP2006295084A (en) * | 2005-04-14 | 2006-10-26 | Citizen Electronics Co Ltd | Package structure of light emitting diode |
| JP2008153698A (en) * | 2008-03-07 | 2008-07-03 | Matsushita Electric Ind Co Ltd | Surface-mounting photoelectric conversion device |
| JP4911635B2 (en) * | 2008-05-29 | 2012-04-04 | 三洋電機株式会社 | Semiconductor device |
| JP2008205515A (en) * | 2008-05-29 | 2008-09-04 | Sanyo Electric Co Ltd | Manufacturing method of semiconductor device |
-
1996
- 1996-05-28 JP JP08133038A patent/JP3139613B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014005615A (en) * | 2012-06-22 | 2014-01-16 | Urban Vision Architect & Design Office | Mobile building |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH09321345A (en) | 1997-12-12 |
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