JP4065051B2 - Surface mount LED and manufacturing method thereof - Google Patents

Surface mount LED and manufacturing method thereof Download PDF

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Publication number
JP4065051B2
JP4065051B2 JP12273398A JP12273398A JP4065051B2 JP 4065051 B2 JP4065051 B2 JP 4065051B2 JP 12273398 A JP12273398 A JP 12273398A JP 12273398 A JP12273398 A JP 12273398A JP 4065051 B2 JP4065051 B2 JP 4065051B2
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conductive block
insulating portion
emitting diode
insulating
light emitting
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JPH11307820A (en
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佳子 田口
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Stanley Electric Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
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    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
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    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting

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  • Engineering & Computer Science (AREA)
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  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、表面実装型発光ダイオ−ドの構造及びその製造方法に関するものであり、特に表面実装型発光ダイオ−ド（以下表面実装型ＬＥＤ）のうち、特に高出力で大電流を必要とする場合に熱的問題が大きくなる用途に用いる時に最適である。詳細には、赤外ＬＥＤや、車両用灯具として多数ＬＥＤを使用した場合に好適である。
【０００２】
【従来の技術】
従来のこの種の表面実装型ＬＥＤの製造方法を工程の順に示すものが図１４〜図２１であり、先ず最初の工程としては、図１４に示すようにガラスファイバ−、不織布などにエポキシなどを含浸させた基材８１の上下の面を圧延銅８２などの導電性物質にて挟みプリント基板を形成する。この時、導電性物質は、アンカ−効果にて接着している。図１５は、このようにして出来たプリント基板９０を示す。次に図１６に示すようにプリント基板９０を適宜間隔で表裏面に貫通するスロット９１をプレス加工などにより形成する。
【０００３】
この状態では、プリント基板９０の側面および上記で形成されたスロット９１の内面には、導電性皮膜が形成されていないので、図１７に示すように、無電解メッキなどの手段で前記側面及びスロット９１の内面に銅などによる導電性皮膜９２を形成し、前記プリント基板９０の外面の全てが導電性皮膜９２で覆われるものとして表裏面を電気的に接続する。
【０００４】
次いで、図１８に示すように前記プリント基板９０の表面側のスロット９１には、エッチングなどの手段で前記圧延銅８２を除去することで、パット部９３と配線部９４とを形成し、同時に裏面側においてもスロット９１間で略長方形に圧延銅８２を除去することで絶縁部９５を形成し、これにより、プリント基板９０が完成する。
【０００５】
続いて、図１９に示すように前記パット部９３にＬＥＤチップ９６を一方の極に例えば導電性接着剤などによりマウントし、このＬＥＤチップ９６の他方の極と前記配線部９４との配線を金線などのワイヤ９７で行ない、更に、図１９に示すように前記ＬＥＤチップ９６とワイヤ９７とを透明樹脂若しくは半透明樹脂でモ−ルドしレンズ部９８を形成する。
【０００６】
そして、図２０に示すように前記プリント基板９０を夫々のＬＥＤチップ９６の中間の位置となる切断面Ａで切断を行なえば、前記プリント基板９０は、スロット９１の部分で個々の素子基板８１に分割され、図２１に示すような面実装型ＬＥＤ素子９９が複数得られる。
【０００７】
【発明が解決しようとする課題】
しかしながら、上記説明の製造方法にもあるように上下の導通をとるために、図１７でも示すような無電解メッキなどの手法で全面を銅などの導電性皮膜で覆う工程が必要である。従って、コストが高くなるばかりでなく、生産性も著しく低下してしまう。また、プリント基板部分の加工の制度から発生する誤差と、メッキ工程によるメッキ厚みの誤差により、仕上がり寸法の精度が低下してしまう問題も抱えている。
【０００８】
更に、赤外ＬＥＤや車両用灯具等として多数表面実装型ＬＥＤを使用する場合、その他通信機器に搭載するのにも、熱による劣化の問題があり放熱対策が求められる。本発明は、これらの点に鑑みて作り出されたものであり、これらの問題を解決させるためにコストパフォ−マンス及び放熱性に優れた表面実装型ＬＥＤを提供することにより課題を解決するものである。
【０００９】
【課題を解決するための手段】
本発明は、上記した問題点を解決するための具体的手段として、その構造は、１対となった導電ブロック部に挟まれた第一の絶縁部と、
前記導電ブロック部にまたがって導電的に固定された発光ダイオ−ドチップと、
前記発光ダイオ−ドチップを所定の間隔をもって取り囲むように前記導電ブロック部及び前記第一の絶縁部上に設けられた第二の絶縁部と、
表面を覆う透明樹脂又は半透明樹脂とを有し、
前記第一の絶縁部と前記第二の絶縁部が、同一材料で一体に形成される表面実装型発光ダイオ−ドである。
【００１０】
また、前記絶縁部は、反射ホ−ンとして作用し、前記導電ブロック部は、高温はんだであることも特徴である。更に、製造方法は、従来の製造方法と比較して工程数が少なくコスト的メリットがうかがえるものとなっている。
【００１１】
詳細には、平板状導電ブロック部を平行に複数枚並べる工程と前記導電ブロック部により挟持される第一の絶縁部と、前記導電ブロック部および前記第一の絶縁部上に略円形若しくは略楕円形の凹部を、該凹部底面に前記第一の絶縁部が前記導電ブロック部に挟持された状態で露出するよう形成する第二の絶縁部とを、同一材料で同時に形成する工程と、前記導電ブロック部に前記第一の絶縁部をまたがってＬＥＤチップを実装する工程と、前記凹部に透明樹脂をモ−ルドする工程と各々一つずつの表面実装型発光ダイオ−ドに裁断する工程とからなる表面実装型ＬＥＤの製造方法によって、導電ブロック部に挟まれ且つ該導電ブロック部の上に略円形若しくは楕円形の絶縁部からなる凹部を形成し、該凹部底面には、導電ブロック部が絶縁部を挟持した状態で露出し、該導電ブロック部に発光ダイオ−ドチップが電気的に接続されて、前記凹部に透明樹脂にてモ−ルドされている表面実装型発光ダイオ−ドを提供することを目的としたものである。
【００１２】
【発明の実施の形態】
本発明の実施形態について説明する。図１〜図７には、第一の実施の形態を示す。
【００１３】
最初に図１には、平板状の導電性ブロック部１を平行に複数枚ならべる工程を示す。この平板状ブロック部１は、使用条件から体積抵抗率が０．０７Ω・ｍ未満、熱伝導率が６０Ｗ／( ｍ・Ｋ) 以上が望ましい。この数値をクリアする材質に限る。しかしながら、たいていの金属であればこの数値を満足している。又、高温はんだでも可能である。
【００１４】
続いて図２に示すように、図１で並べた平板状の導電性ブロック部１に絶縁部２を一体に成形する。この時絶縁部２が平板状導電ブロック部１挟持されると同時に、この平板状の導電性ブロック部１、１の上にまたがるように略楕円形の凹部３が成形される。導電性ブロック部に挟持される絶縁部２を第一の絶縁部、凹部を形成する絶縁部２を第二の絶縁部として、異なる材料で、別々の工程で作成しても良いが、本実施形態では同一材料で同時に形成されるものとする。この凹部３の底面に前記平板状導電ブロック部１に絶縁部２が挟持された状態で露出するような状態に一体成形される工程を図２に示してある。絶縁部２は、使用条件から光（可視光、赤外光）の反射率の高いもの、耐熱性に優れるもの、形成が容易なものが望ましい。
【００１５】
このことから、プラスチック（特にベクトラ、ＰＰＳ）などの熱可塑性樹脂、エポキシなどの熱硬化性樹脂が望ましい。図３は、図２のＢ−Ｂ断面を示した図である。図３に示される凹部３は、絶縁部２によって、形成された反射ホ−ンである。図４に図３に示す断面図にＬＥＤチップ４を導電性接着剤やはんだ等で電気的に接続する工程を示す。ここでは、はんだ５にて接合している。続いて図５は、図４の凹部３を透明樹脂若しくは、半透明樹脂でモ−ルドし、レンズ部６を形成する工程である。モ−ルドする樹脂として、透明エポキシ樹脂が最適である。ただし、用途によって拡散剤を添加したものを使用する場合もある。図５では、凹部３を越える高さでモ−ルドされているが、下回る高さでも特に問題ない。図６は、図５でできた透明樹脂等をモ−ルドしレンズ部６を形成した複数のＬＥＤチップが実装されたユニットが示されており、破線に沿ってダイサ−等で裁断する工程を示す図である。
【００１６】
図７は、図６から取出した一個の表面実装型ＬＥＤの完成品を示す図である。図７からもわかるように、通常のプリント基板を使った表面実装型ＬＥＤと比べ導電部１が占める体積が大きいため、放熱性が向上する。また、体積だけでなく導電部１の占める表面積も増えるので接触面積の増加に伴い電気的接続をより容易にすることが予想される。更に、プリント基板を使用した表面実装型ＬＥＤと比べメッキ等の工程がない為に、コストダウンも期待できる。
【００１７】
次に本発明の第二の実施形態について説明する。図８〜図１３である。最初に第一の実施形態同様に図１のように平板状の導電性ブロック部１を平行に複数枚ならべる。使用条件は、体積抵抗率が０．０７Ω・ｍ未満，熱伝導率が６０Ｗ／（ｍ・Ｋ) 以上が望ましい。この数値をクリアする材質に限る。しかしながら、たいていの金属であればこの数値を満足している。又、高温はんだでも可能である。
【００１８】
続いて図８に示すように、図１で並べた平板状ブロック部１、１に絶縁部７を一体に成形する。この時絶縁部７が平板状導電ブロック部１、１に挟持されると同時に、この平板状導電ブロック部１の上にまたがるように略円形の凹部８がテ−パ−を持って成形される。この凹部８の底面に前記平板状導電ブロック部１に絶縁部７が挟持された状態で露出するような状態に一体成形される工程を図８に示してある。絶縁部７は、使用条件から光（可視光、赤外光）の反射率の高いもの、耐熱性に優れるもの、形成が容易なものが望ましい。このことから、プラスチック（特にベクトラ、ＰＰＳ）などの熱可塑性樹脂、エポキシなどの熱硬化性樹脂が望ましい。
【００１９】
図９は、図８のＣ−Ｃ断面を示した図である。図９に示されるテ−パ−を持った凹部８は、絶縁部７によって、形成された反射ホ−ンであり傾斜面９を持つ。図１０に図９に示す断面図にＬＥＤチップ１０を導電性接着剤やはんだ等で電気的に接続する工程を示す。ここでは、はんだ１１にて接合している。
【００２０】
続いて図１１は、図１０の凹部８を透明樹脂若しくは、半透明趣旨でモ−ルドし、レンズ部１２を形成する工程である。モ−ルドする樹脂として、透明エポキシ樹脂が最適である。ただし、用途によって拡散剤を添加したものを使用する場合もある。
【００２１】
図１１では、凹部８を越えない高さでモ−ルドしており、これは製品の小型化及び樹脂の節約の為である。レンズ効果を考え凹部を越えてもかまわない。図１２は、図１１でできた透明樹脂等を凹部８にモ−ルドしレンズ部１２を形成した複数のＬＥＤチップが実装されたユニットが示されており、破線に沿ってダイサ−等で裁断する工程を示す図である。図１３は、図１２から取出した一個の表面実装型ＬＥＤの完成品を示す図である。図１３を見てもわかるように、通常のプリント基板を使った表面実装型ＬＥＤと比べ導電部１が占める体積が大きいため、放熱性が向上する。また、体積だけでなく導電部１の占める表面積も増えるので接触面積の増加に伴い電気的接続をより容易にすることが予想される。更に、プリント基板を使用した表面実装型ＬＥＤと比べメッキ等の工程がない為に、コストダウンも期待できる。
【００２２】
このように、二つの実施形態から、絶縁部に形成される凹部３，８に相当する反射ホ−ンは、必要な配向に合わせその時必要なな形状に形成される。また、モ−ルド樹脂を凹部３，８にポッティングするときも、小型・軽量化で樹脂料が少なくて済みコスト的にメリットがあることからも凹部を越えない高さでのレンズ化が効果を奏する。
【００２３】
第一、第二の実施形態ともに、各１個のＬＥＤチップを有するように裁断したが、必要に応じて、複数のＬＥＤチップを並列又は直列接続となるように裁断しても良い。又その場合、ＬＥＤチップの発光色を変える等も考えられる。これにより、複数色や混合色のＬＥＤ発光色が得られる。
【００２４】
【発明の効果】
以上説明したように、本発明による表面実装型ＬＥＤとその製造方法には、さまざまな効果が挙げられる。製造方法では、プリント基板を使用したものに比べプレス加工によるスロットを形成させる工程やスロット内面にプリント基板の上下導通をとる為無電解メッキによる導電性被膜の形成といった工程をなくすことにより、工程の簡略化をはかり大幅にコストを低減させることができる。また、導電性ブロック部の体積が、従来品と比べ大幅に増えているので、放熱性も良く従来品にない放熱効果が期待できる。更に、可視光及び赤外光の反射率の高いものを絶縁部材として使用し凹部を形成し、反射ホ−ンとしておりさまざまな形状を作り出すことによって配向を変えることも可能である。以上述べたように、従来に比べ工程の大幅減によるコスト削減及び放熱性の改善及び用途に応じた配向を形成できる表面実装型ＬＥＤを提供している。
【図面の簡単な説明】
【図１】 本発明における表面実装型ＬＥＤの製造方法で平板状の導電性ブロック部を並べる工程。
【図２】 同じく絶縁部材を形成する工程を示す図である。
【図３】 同じく絶縁性部材を形成する工程のＢ−Ｂ断面図である。
【図４】 同じくＬＥＤチップをダイボンドする工程である。
【図５】 同じく樹脂モ−ルドしてレンズ部を形成する工程である。
【図６】 同じく複数のＬＥＤチップをダイボンドしたユニットを破線によって裁断する工程である。
【図７】 図６で裁断された完成品の表面実装型ＬＥＤを示す図である。
【図８】 本発明における表面実装型ＬＥＤの製造方法で第二の実施形態を示す図で同じく絶縁部材を形成する工程を示す図である。
【図９】 同じく絶縁性部材を形成する工程のＢ−Ｂ断面図である。
【図１０】 同じくＬＥＤチップをダイボンドする工程である。
【図１１】 同じく樹脂モ−ルドしてレンズ部を形成する工程である。
【図１２】 同じく複数のＬＥＤチップをダイボンドしたユニットを破線によって裁断する工程である。
【図１３】 図１２で裁断された完成品の表面実装型ＬＥＤを示す図である。
【図１４】 基材の上下の面を圧延銅などの導電性物質にて挟みプリント基板を形成する工程。
【図１５】 図１４でできたプリント基板を示す図。
【図１６】 プリント基板を適宜間隔で表裏面に貫通するスロットをプレス加工などにより形成する工程。
【図１７】 無電解メッキなどの手段で側面及びスロットの内面に導電性被膜を形成する工程。
【図１８】 プリント基板の表面側のスロットには、エッチングなどの手段で圧延銅を除去し、パット部と配線部とを形成し、同時に裏面側においてもスロット間で略長方形に圧延銅を除去することで絶縁部を形成しする工程。
【図１９】 図１８の断面図である。
【図２０】 複数のＬＥＤ素子をダイボンドしたプリント基板を夫々のＬＥＤチップの中間の位置となるＡ−Ａ断面で切断する工程。
【図２１】 面実装型ＬＥＤ素子の完成品を示す図。
【符号の説明】
１ 平板状の導電性ブロック部
２，７ 絶縁部
３，８ 凹部
４，１０ ＬＥＤチップ
５，１１ はんだ
６，１２ 透明樹脂（レンズ部）
９ 傾斜面
８１ 基材
８２ 圧延銅
９０ プリント基板
９１ スロット
９２ 導電性被膜
９３ パット部
９４ 配線部
９５ 絶縁部
９６ ＬＥＤチップ
９７ 導電性ワイヤ
９８ 透明樹脂（レンズ部）
９９ 従来の表面実装型ＬＥＤ[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a structure of a surface-mounted light-emitting diode and a manufacturing method thereof, and particularly requires a high output and a large current among surface-mounted light-emitting diodes (hereinafter referred to as surface-mounted LEDs). It is optimal when used in applications where thermal problems are significant. In detail, it is suitable when many LEDs are used as an infrared LED or a vehicular lamp.
[0002]
[Prior art]
FIGS. 14 to 21 show a conventional method for manufacturing a surface-mounted LED of this type in the order of steps. First, as shown in FIG. 14, an epoxy or the like is applied to a glass fiber, a nonwoven fabric, or the like. The upper and lower surfaces of the impregnated base material 81 are sandwiched between conductive materials such as rolled copper 82 to form a printed board. At this time, the conductive substance is bonded by the anchor effect. FIG. 15 shows a printed circuit board 90 made in this way. Next, as shown in FIG. 16, a slot 91 penetrating the printed circuit board 90 through the front and back surfaces at appropriate intervals is formed by pressing or the like.
[0003]
In this state, a conductive film is not formed on the side surface of the printed circuit board 90 and the inner surface of the slot 91 formed as described above. Therefore, as shown in FIG. A conductive film 92 made of copper or the like is formed on the inner surface of 91, and the front and back surfaces are electrically connected assuming that the entire outer surface of the printed circuit board 90 is covered with the conductive film 92.
[0004]
Next, as shown in FIG. 18, in the slot 91 on the front surface side of the printed circuit board 90, the rolled copper 82 is removed by means such as etching to form a pad portion 93 and a wiring portion 94, and at the same time the back surface Also on the side, the insulating portion 95 is formed by removing the rolled copper 82 in a substantially rectangular shape between the slots 91, whereby the printed circuit board 90 is completed.
[0005]
Subsequently, as shown in FIG. 19, an LED chip 96 is mounted on one of the electrodes on the pad portion 93 by, for example, a conductive adhesive, and the wiring between the other electrode of the LED chip 96 and the wiring portion 94 is made of gold. Then, as shown in FIG. 19, the LED chip 96 and the wire 97 are molded with a transparent resin or a translucent resin to form a lens portion 98.
[0006]
Then, as shown in FIG. 20, if the printed circuit board 90 is cut at a cutting plane A that is an intermediate position between the LED chips 96, the printed circuit board 90 is formed on each element substrate 81 at the slot 91. A plurality of surface-mounted LED elements 99 as shown in FIG. 21 are obtained.
[0007]
[Problems to be solved by the invention]
However, as shown in the manufacturing method described above, in order to achieve vertical conduction, a process of covering the entire surface with a conductive film such as copper is required by a technique such as electroless plating as shown in FIG. Therefore, not only the cost is increased, but the productivity is significantly reduced. Further, there is a problem that the accuracy of the finished dimension is lowered due to an error generated from the processing system of the printed circuit board portion and an error of the plating thickness due to the plating process.
[0008]
Further, when a large number of surface-mounted LEDs are used as infrared LEDs, vehicular lamps, etc., there is a problem of deterioration due to heat in order to mount them on other communication devices, and a heat dissipation measure is required. The present invention was created in view of these points, and in order to solve these problems, the present invention solves the problems by providing a surface-mounted LED excellent in cost performance and heat dissipation. is there.
[0009]
[Means for Solving the Problems]
As a specific means for solving the above-described problems, the present invention includes a first insulating portion sandwiched between a pair of conductive block portions,
And Dochippu, - said conductive block emission is conductively secured across the portion diode
And said Dochippu to surround with a predetermined interval conductive block portion and the second insulating portion provided on the first insulating portion on, - the light emitting diode
Having transparent resin or translucent resin covering the surface ,
In the surface-mount type light emitting diode, the first insulating portion and the second insulating portion are integrally formed of the same material .
[0010]
The insulating portion acts as a reflection horn, and the conductive block portion is high-temperature solder. Furthermore, the manufacturing method has fewer steps than the conventional manufacturing method, and the cost advantage can be seen.
[0011]
Specifically, a step of arranging a plurality of flat conductive block parts in parallel, a first insulating part sandwiched by the conductive block part, and a substantially circular or elliptical shape on the conductive block part and the first insulating part a recess shape, and a second insulating portion formed so as to expose in a state where the the recess bottom surface the first insulating portion is sandwiched to the conductive block portion, and forming at the same time by using the same material, the conductive From the step of mounting the LED chip across the first insulating portion on the block portion, the step of molding the transparent resin in the concave portion, and the step of cutting each one into a surface-mounted light emitting diode By forming the surface-mount type LED manufacturing method, a concave portion made of a substantially circular or elliptical insulating portion is formed on the conductive block portion, and the conductive block portion is insulated on the bottom surface of the concave portion. A surface-mounted light-emitting diode that is exposed in a state where the light-emitting diode is sandwiched, is electrically connected to the conductive block portion, and is molded with a transparent resin in the concave portion. It is intended.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
An embodiment of the present invention will be described. 1 to 7 show a first embodiment.
[0013]
First, FIG. 1 shows a step of arranging a plurality of flat conductive block portions 1 in parallel. The flat block portion 1 desirably has a volume resistivity of less than 0.07 Ω · m and a thermal conductivity of 60 W / (m · K) or more from the usage conditions. Limited to materials that clear this value. However, this value is satisfied for most metals. High temperature soldering is also possible.
[0014]
Subsequently, as shown in FIG. 2, the insulating portion 2 is formed integrally with the flat conductive block portions 1 arranged in FIG. 1. At this time, the insulating portion 2 is sandwiched between the flat conductive block portions 1, and at the same time, a substantially elliptical recess 3 is formed so as to straddle the flat conductive block portions 1, 1. Although the insulating part 2 sandwiched between the conductive block parts may be made as a first insulating part and the insulating part 2 forming the concave part as a second insulating part, they may be made of different materials and in separate steps. In the form, the same material is formed at the same time. FIG. 2 shows a process of integrally molding the bottom surface of the recess 3 so as to be exposed in a state where the insulating portion 2 is sandwiched by the flat conductive block portion 1. The insulating part 2 is preferably one having a high light reflectance (visible light, infrared light), one having excellent heat resistance, and one that can be easily formed, depending on use conditions.
[0015]
For this reason, thermoplastic resins such as plastic (particularly Vectra, PPS), and thermosetting resins such as epoxy are desirable. FIG. 3 is a view showing a BB cross section of FIG. 2. The recess 3 shown in FIG. 3 is a reflection horn formed by the insulating portion 2. FIG. 4 is a cross-sectional view shown in FIG. 3 showing a process of electrically connecting the LED chip 4 with a conductive adhesive, solder, or the like. Here, it joins with the solder 5. FIG. Next, FIG. 5 is a process of forming the lens portion 6 by molding the concave portion 3 of FIG. 4 with a transparent resin or a translucent resin. A transparent epoxy resin is optimal as the resin to be molded. However, depending on the application, a material to which a diffusing agent is added may be used. In FIG. 5, the mold is molded at a height exceeding the recess 3. FIG. 6 shows a unit on which a plurality of LED chips in which the transparent resin or the like made in FIG. 5 is molded to form the lens portion 6 is mounted, and the process of cutting with a dicer or the like along the broken line is shown. FIG.
[0016]
FIG. 7 is a view showing a finished product of one surface-mounted LED taken out from FIG. As can be seen from FIG. 7, since the volume occupied by the conductive portion 1 is larger than that of a surface-mounted LED using a normal printed circuit board, heat dissipation is improved. Further, since not only the volume but also the surface area occupied by the conductive portion 1 is increased, it is expected that the electrical connection becomes easier as the contact area increases. Furthermore, since there are no steps such as plating as compared with surface-mounted LEDs using a printed circuit board, cost reduction can be expected.
[0017]
Next, a second embodiment of the present invention will be described. 8 to 13. First, as in the first embodiment, a plurality of plate-like conductive block portions 1 are arranged in parallel as shown in FIG. The usage conditions are preferably a volume resistivity of less than 0.07 Ω · m and a thermal conductivity of 60 W / (m · K) or more. Limited to materials that clear this value. However, this value is satisfied for most metals. High temperature soldering is also possible.
[0018]
Then, as shown in FIG. 8, the insulating part 7 is integrally formed in the flat block parts 1 and 1 arranged in FIG. At this time, the insulating portion 7 is sandwiched between the flat conductive block portions 1 and 1 and at the same time, a substantially circular concave portion 8 is formed with a taper so as to straddle the flat conductive block portion 1. . FIG. 8 shows a process of integrally molding the bottom surface of the concave portion 8 so that the insulating portion 7 is exposed while being sandwiched by the flat conductive block portion 1. The insulating portion 7 is preferably one having a high light (visible light, infrared light) reflectance, excellent heat resistance, and one that can be easily formed in accordance with usage conditions. For this reason, thermoplastic resins such as plastic (particularly Vectra, PPS), and thermosetting resins such as epoxy are desirable.
[0019]
FIG. 9 is a view showing a CC cross section of FIG. A recess 8 having a taper shown in FIG. 9 is a reflection horn formed by the insulating portion 7 and has an inclined surface 9. FIG. 10 is a cross-sectional view shown in FIG. 9 showing a process of electrically connecting the LED chip 10 with a conductive adhesive, solder, or the like. Here, it joins with the solder 11. FIG.
[0020]
Next, FIG. 11 is a step of forming the lens portion 12 by molding the concave portion 8 of FIG. 10 with a transparent resin or a semi-transparent effect. A transparent epoxy resin is optimal as the resin to be molded. However, depending on the application, a material to which a diffusing agent is added may be used.
[0021]
In FIG. 11, the mold is molded at a height that does not exceed the recess 8 for the purpose of downsizing the product and saving the resin. In consideration of the lens effect, the concave portion may be exceeded. FIG. 12 shows a unit on which a plurality of LED chips in which the transparent resin or the like made in FIG. 11 is molded in the concave portion 8 to form the lens portion 12 is mounted, and is cut along a broken line with a dicer or the like. It is a figure which shows the process to do. FIG. 13 is a view showing a finished product of one surface-mounted LED taken out from FIG. As can be seen from FIG. 13, since the volume occupied by the conductive portion 1 is larger than that of a surface-mounted LED using a normal printed circuit board, heat dissipation is improved. Further, since not only the volume but also the surface area occupied by the conductive portion 1 is increased, it is expected that the electrical connection becomes easier as the contact area increases. Furthermore, since there are no steps such as plating as compared with surface-mounted LEDs using a printed circuit board, cost reduction can be expected.
[0022]
As described above, according to the two embodiments, the reflective horn corresponding to the concave portions 3 and 8 formed in the insulating portion is formed in a necessary shape in accordance with a required orientation. In addition, when potting mold resin into the recesses 3 and 8, a lens with a height that does not exceed the recesses is effective because it is small and light and requires less resin. Play.
[0023]
Although both the first and second embodiments are cut so as to have one LED chip, a plurality of LED chips may be cut in parallel or in series as necessary. In that case, it is also possible to change the emission color of the LED chip. Thereby, LED emission colors of multiple colors or mixed colors are obtained.
[0024]
【The invention's effect】
As described above, the surface-mounted LED and the manufacturing method thereof according to the present invention have various effects. The manufacturing method eliminates the process of forming a slot by press processing compared to the one using a printed circuit board and the process of forming a conductive film by electroless plating to make the printed circuit board vertically conductive on the inner surface of the slot. Simplification can be made and the cost can be greatly reduced. Moreover, since the volume of the conductive block portion is greatly increased compared to the conventional product, the heat dissipation is good and a heat dissipation effect not found in the conventional product can be expected. Further, a material having a high reflectance of visible light and infrared light is used as an insulating member to form a recess, and a reflection horn can be used to change the orientation by creating various shapes. As described above, the present invention provides a surface-mounted LED capable of forming an orientation according to cost reduction, heat dissipation improvement, and application by significantly reducing the number of processes as compared with the prior art.
[Brief description of the drawings]
FIG. 1 shows a step of arranging flat conductive blocks in a method for producing a surface-mounted LED according to the present invention.
FIG. 2 is a view similarly showing a step of forming an insulating member.
FIG. 3 is a cross-sectional view taken along the line BB in the same step of forming an insulating member.
FIG. 4 is a process for die-bonding LED chips in the same manner.
FIG. 5 is a step of forming a lens portion by resin molding in the same manner.
FIG. 6 is a step of cutting a unit in which a plurality of LED chips are die-bonded by a broken line.
7 is a view showing a finished surface-mounted LED cut in FIG. 6. FIG.
FIG. 8 is a view showing a second embodiment in the method for manufacturing a surface-mounted LED in the present invention, and is a view showing a process of forming an insulating member in the same manner.
FIG. 9 is a cross-sectional view taken along the line B-B in the same step of forming an insulating member.
FIG. 10 is a process for die-bonding LED chips in the same manner.
FIG. 11 is a process for forming a lens portion by resin molding in the same manner.
FIG. 12 is a step of cutting a unit in which a plurality of LED chips are die-bonded by a broken line.
13 is a view showing a finished surface-mounted LED cut in FIG. 12. FIG.
FIG. 14 is a process of forming a printed circuit board by sandwiching the upper and lower surfaces of a base material with a conductive material such as rolled copper.
FIG. 15 is a view showing a printed circuit board made in FIG. 14;
FIG. 16 is a step of forming slots penetrating the printed circuit board at appropriate intervals on the front and back surfaces by pressing or the like.
FIG. 17 shows a step of forming a conductive film on the side surface and the inner surface of the slot by means such as electroless plating.
FIG. 18 Removes rolled copper from the surface side slot of the printed circuit board by means such as etching to form a pad portion and a wiring portion, and simultaneously removes the rolled copper into a substantially rectangular shape between the slots on the back side. The process of forming an insulating part by doing.
FIG. 19 is a cross-sectional view of FIG.
FIG. 20 is a process of cutting a printed circuit board obtained by die-bonding a plurality of LED elements along an AA section that is an intermediate position between the LED chips.
FIG. 21 is a view showing a finished product of a surface-mounted LED element.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Flat conductive block part 2,7 Insulating part 3,8 Recessed part 4,10 LED chip 5,11 Solder 6,12 Transparent resin (lens part)
DESCRIPTION OF SYMBOLS 9 Inclined surface 81 Base material 82 Rolled copper 90 Printed circuit board 91 Slot 92 Conductive film 93 Pad part 94 Wiring part 95 Insulation part 96 LED chip 97 Conductive wire 98 Transparent resin (lens part)
99 Conventional surface mount LED

Claims (5)

１対となった導電ブロック部に挟まれた第一の絶縁部と、
前記導電ブロック部にまたがって導電的に固定された発光ダイオ−ドチップと、
前記発光ダイオ−ドチップを所定の間隔をもって取り囲むように前記導電ブロック部及び前記第一の絶縁部上に設けられた第二の絶縁部と、
表面を覆う透明樹脂又は半透明樹脂とを有し、
前記第一の絶縁部と前記第二の絶縁部が、同一材料で一体に形成される表面実装型発光ダイオ−ド。A first insulating part sandwiched between a pair of conductive block parts;
And Dochippu, - said conductive block emission is conductively secured across the portion diode
And said Dochippu to surround with a predetermined interval conductive block portion and the second insulating portion provided on the first insulating portion on, - the light emitting diode
Having transparent resin or translucent resin covering the surface ,
A surface-mounted light emitting diode in which the first insulating portion and the second insulating portion are integrally formed of the same material . 前記第一の絶縁部と前記第二の絶縁部は、前記導電ブロックに一体成形される請求項１記載の表面実装型発光ダイオード。The surface-mount light-emitting diode according to claim 1, wherein the first insulating portion and the second insulating portion are formed integrally with the conductive block. 前記第ニの絶縁部は、反射ホ−ンとして作用することを特徴とする請求項１または請求項２記載の表面実装型発光ダイオ−ド。 3. The surface mount type light emitting diode according to claim 1, wherein the second insulating portion functions as a reflection horn. 前記導電ブロック部は、高温はんだであることを特徴とする請求項１乃至３のいずれかに記載の表面実装型発光ダイオ−ド。The conductive block portion, a surface-mount type light emitting diode according to any one of claims 1 to 3, characterized in that a high temperature solder - de. 導電ブロック部からなる平板状ブロック体を平行に複数枚並べる工程と、
前記導電ブロック部により挟持される第一の絶縁部と、前記導電ブロック部および前記第一の絶縁部上に略円形若しくは略楕円形の凹部を、該凹部底面に前記第一の絶縁部が前記導電ブロック部に挟持された状態で露出するよう形成する第二の絶縁部とを、同一材料で同時に形成する工程と、
前記導電ブロック部に前記第一の絶縁部をまたがって発光ダイオ−ドチップを実装する工程と、
前記凹部に透明樹脂若しくは、半透明樹脂をモ−ルドする工程と、
個々又は複数の発光ダイオ−ドチップを有する表面実装型発光ダイオ−ドに裁断する工程とを備える表面実装型発光ダイオ−ドの製造方法。Arranging a plurality of flat block bodies made of conductive block parts in parallel ;
A first insulating portion sandwiched by the conductive block portion; a substantially circular or substantially elliptical recess on the conductive block portion and the first insulating portion; and the first insulating portion on the bottom surface of the recess. and the second insulating portion to be formed to be exposed in a state of being sandwiched between the conductive block portion, and simultaneously forming the same material,
Mounting a light emitting diode chip across the first insulating portion on the conductive block portion ; and
A step of molding a transparent resin or a translucent resin in the recess ;
And a step of cutting the surface-mounted light-emitting diode having individual or a plurality of light-emitting diode chips.
JP12273398A 1998-04-17 1998-04-17 Surface mount LED and manufacturing method thereof Expired - Fee Related JP4065051B2 (en)

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