JPH1174420A - Surface mount chip and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an inexpensive device wherein reliability is improved, a circuit sealing frame is not used, a cubic substrate with high dimension accuracy, the cost reduction and the yield rate of the product are improved, and the luminance performance is increased furthermore. SOLUTION: On an insulating substrate 1 wherein an LED-element containing concave part 12 is formed and the solid made of epoxy resin is molded, a pair of upper surface electrodes 2a and 2b, lower-surface electrodes 3a and 3b and side-surface electrodes 4a and 4b connected to the upper and lower-surface electrodes are formed. An LED element 5 is fixed on one upper surface electrode 2a. A bonding wire 6 is connected to the other upper surface electrode 2b. Sealing is performed with sealing resin 8 comprising the epoxy resin. At the bottom surface and the slant surfaces at four surfaces expanding upward, a light reflecting dummy pattern is applied in a vacant space which does not interfere with the upper surface electrodes 2a and 2b, and the upward rising of luminance is achieved. Both the insulating substrate 1 and the sealing resin are epoxy resin, and the linear expansion coefficients agree. Therefore, the separation of the substrate 1 and the resin 8 does not occur. There is no worry of the damage to the LED element 5. Thus, the highly reliable and inexpensive surface- mount chip is obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount type chip component used for portable telephones, FA equipment, OA equipment and general electronic equipment, and a method of manufacturing the same.

[0002]

2. Description of the Related Art In recent years, electronic devices have been pursuing high performance and multiple functions, as well as miniaturization and weight reduction. Therefore, electronic components are often mounted on a printed circuit board and sealed with a resin. Many surface mount chip components have a substantially parallelepiped shape and are connected to a wiring pattern on a printed circuit board by a fixing means such as soldering.

An outline of the general conventional surface mount type chip component will be described with reference to the drawings.

FIGS. 7 to 15 show a conventional surface mount chip component and a method of manufacturing the same. FIG. 7 is a partial plan view of a collective insulating substrate made of a glass epoxy material. FIG. 8 is a plan view of a single electrode pattern. FIG. 9 is a perspective view of an LED element. 10 to 15 are partial perspective views showing each step. FIG.
FIG. 2 is a perspective view of a single surface mount chip component. FIG.
FIG. 6 is a sectional view taken along line AA of FIG. 6.

Referring to FIGS. 16 and 21, the surface mount type chip component 10 will be described. A pair of upper electrodes 2 opposed to the upper surface of an insulating substrate 1a made of glass epoxy resin material
a, 2b, and the pair of upper electrodes 2a, 2b have side electrodes (through-holes) connected to the lower electrodes 3a, 3b on the back and the upper electrodes 2a, 2b and the lower electrodes 3a, 3b on the side. (Electrodes) 4a and 4b are formed. The Au-plated die bond pattern of the one upper surface electrode 2a is LE-coated with a conductive adhesive 9 (silver paste).
One electrode of the D element 5 is die-pounded. In the Au-plated wire bond pattern of the other upper electrode 2b,
The other electrode of the LED element 5 is connected to a bonding wire (A
(u line) 6 and connected by wire bonding.

A circuit formed by resin molding of a liquid crystal polymer material so as to surround the LED element 5 bonded to the upper electrode 2a of the insulating substrate 1a, and printed with an adhesive 9a on a lower surface having a window 7a opened upward. The sealing frame 7 is bonded to and integrated with the insulating substrate 1a. The inclined surface 7b of the window 7a is
It has a function of improving brightness in the upper surface direction of the LED element 5.

[0007] In order to protect the LED element 5, the bonding wire 6, and the connecting portion, the circuit sealing frame 7 is provided.
The surface mount chip component 10 is completed by injecting a sealing resin 8 made of an epoxy resin into the window 7a so as to be flush with the upper surface of the chip and sealing the resin.

Referring to FIGS. 7 to 15, an outline of a method of manufacturing the surface-mounted chip component 10 will be described.
In FIG. 7, the collective insulating substrate forming step is a process of forming a plurality of collective insulating substrates 1A made of a substantially rectangular glass epoxy resin material and having upper and lower surfaces thereof covered with copper foil and having a plurality of through holes 11 for each row. Is processed in a matrix by NC cutting or the like, and a copper plating layer is formed on the entire surface including the inner surface of the through hole 11 of the collective insulating substrate 1A by electroless and electrolytic plating.

Next, a resist film is adhered, a mask is aligned, and the resist is removed after exposure, development and etching. Further, a liquid resist is applied, and after mask alignment, exposure, and development, a nickel plating layer is formed by electrolytic plating, and a gold plating layer is formed by electrolytic plating.

As described above, on the upper surface side of the collective insulating substrate 1A, as shown in FIG. 8 (part A surrounded by a dotted circle in FIG. 7), a pair of upper surface electrodes 2a and 2b opposed to each other and opposed to the lower surface side. A pair of lower electrodes (not shown) and the upper electrodes 2a, 2a
b and the through-hole electrode 4 so as to be connected to the lower electrode.
a, 4b are formed.

As shown in FIG. 9, the structure of the LED element 5 is formed by an N layer 5b and a P layer 5c with a junction 5a interposed therebetween. In the die bonding step of the LED element 5, as shown in FIG.
It is die-bonded to one upper surface electrode 2a of each of the insulating substrates formed on the collective insulating substrate 1A and fixed by a fixing means such as a conductive adhesive 9. The wire bonding process
In FIG. 11, the other electrode 5e of the LED element 5 is connected by a bonding wire 6 as shown on the other upper electrode 2b of each insulating substrate.

FIGS. 12 and 13 show the circuit sealing frame bonding step.
As shown in the figure, a collective circuit sealing frame 7A made of a liquid crystal polymer material is provided on the collective insulating substrate 1A by die bonding.
A plurality of windows 7a are formed at predetermined intervals so as to match the position of the ED element 5. The assembly circuit sealing frame 7A
Is printed with an adhesive 9a or the like in advance on the lower surface thereof,
The ED element 5 is aligned and adhered to the collective insulating substrate 1A so as to surround the periphery of the ED element 5, and integrated.

In the resin sealing step, as shown in FIG. 14, the LED element 5 is inserted into each window 7a of the collective circuit sealing frame 7A.
In order to protect the connection portions of the bonding wires 6, the resin is sealed with a sealing resin 8 made of epoxy resin so as to be substantially flush with the upper surface of the collective circuit sealing frame 7 </ b> A. The surface mount type chip component assembly 10A is completed.

In the cutting step, as shown in FIG. 15, dicing or the like is performed on the surface-mounted chip component assembly 10A along two orthogonal cut lines 2 (a cut line in the X direction passes over the through hole 11). The surface mounting chip component 1 shown in FIG.
0 is completed.

FIG. 17 to FIG. 20 each show a MID substrate.
FIG. 17 is a partial plan view of a collective insulating substrate formed of an MID substrate, which relates to another conventional surface-mounted chip component and a method of manufacturing the same. FIG. 18 is a plan view of a single electrode pattern. FIG.
9 (a) to 9 (d) are partial perspective views showing respective steps. FIG.
1 is a perspective view of a single surface mount chip component. FIG.
FIG. 21 is a sectional view taken along line BB of FIG. 20.

In FIG. 20 and FIG. 22, the MID insulating substrate 1b is made of a liquid crystal polymer material and is an injection molded circuit component in which a molded component and a three-dimensional three-dimensional circuit are integrated. Circuit formation and integrated assembly are rationalized as compared with the manufacturing process of the above.

In the figure, an LED element housing recess 12 is formed in a mortar shape on an insulating substrate 1b. Said L
A pair of upper electrodes 2a and 2b including the ED element housing recess 12 and facing the upper surface, a pair of lower electrodes 3a and 3b facing the lower surface, and the upper electrodes 2a and 2b and the lower electrodes 3a and 3b. Side electrodes (elongated through-hole electrodes) 4a and 4b are formed so as to be continuous. As described above, the LED element 5 is die-bonded to the bottom of one upper electrode 2a of the pair of upper electrodes, and the other upper electrode 2
b is connected by a bonding wire 6 made of an Au wire or the like. Since the mortar-shaped LED element housing recess 12 surrounding the periphery of the LED element 5 is plated with Au, the light emitted from the LED element 5 is reflected in the upper direction,
Since the light is condensed, the brightness is improved.

As described above, the LED element 5 and the bonding wire 6 are sealed in the LED element accommodating recess 12 of the insulating substrate 1b with a sealing resin 8 such as epoxy resin in order to protect the connection portion. Thus, the surface mount chip component 20 is completed.

[0019] The method of manufacturing the surface mount type chip component is as follows.
As in the above-described conventional method, the process is performed in a state of a collective substrate from which a large number of pieces are taken. The configuration of the collective insulating group is such that a plurality of LEDs are formed at a predetermined interval between each row of the elongated hole through holes 11a and each row of the collective insulating substrate 1B made of a liquid crystal polymer material having a substantially square shape as shown in FIG. A molded product in which the element accommodating recess 12 is formed by injection molding is shown in FIG. 18 (B surrounded by a dotted circle in FIG. 17).
(3), a three-dimensional electrode pattern is integrally plated.

Each manufacturing process is shown in FIG.
Is a die bonding step of the LED element 5, (b) is a wire bonding step, (c) is a resin sealing step, (d)
Indicates a cutting step, which is the same as the above-described conventional technique, and a description thereof will be omitted.

FIGS. 21 to 24 are sectional views showing the expansion and contraction mechanisms in the reliability test of the epoxy resin substrate and the MID substrate described above.

FIGS. 21 and 22 show a state in which the filled epoxy resin expands in the MID substrate made of a glass epoxy resin substrate and a liquid crystal polymer resin. In FIG. 21, the filled sealing resin 8 and the insulating substrate 1a are shown. Are made of the same epoxy material and have good compatibility, and there is no problem in terms of adhesion between them. However, the material of the circuit sealing frame 7 is the filled sealing resin 8.
Since these are different liquid crystal polymer materials, their linear expansion coefficients are slightly different. Further, in FIG. 22, since the material of the three-dimensionally formed insulating substrate 1b is a liquid crystal polymer, the material differs from that of the filled sealing resin 8, so that the two have slightly different coefficients of linear expansion, and there is a problem in the adhesion between the two. There is. When the filled sealing resin 8 expands, the resin expands upward without any restrictions in the direction of arrow C in the figure. At this time, at the interface between the sealing resin 8 and the circuit sealing frame 7 as shown in FIG. 21 and at the interface between the sealing resin 8 and the insulating substrate 1b (liquid crystal polymer material) as shown in FIG. Deviation occurs due to the difference in linear expansion coefficient, and a force for removing the adhesive acts upward. Further, a force for lifting the bonding wire 6 and the LED element 5 is also exerted.

FIGS. 23 and 24 show a state in which the filled epoxy resin is shrunk on the glass epoxy resin substrate and the MID substrate made of a liquid crystal polymer resin, and the sealing resin 8 (epoxy resin) shown in FIG. ) And the circuit sealing frame 7 (liquid crystal polymer), and the sealing resin 8 (epoxy resin) and the insulating substrate 1b (liquid crystal polymer) shown in FIG. There is a problem in the point. When the filled sealing resin 8 shrinks, the resin shrinks inward as shown by arrow D in the figure. The LED element 5 receives this stress.

[0024]

However, the above two conventional surface mount chip components have the following problems. That is, as described above, in a reliability test, when a product is used under severe environmental conditions such as a temperature cycle test or a high-temperature energization test, the coefficient of linear expansion is small,
The circuit sealing frame made of the liquid crystal polymer material or the three-dimensional molded substrate does not expand or shrink so much, whereas the sealing resin made of an epoxy resin having a large linear expansion coefficient expands and shrinks greatly. Causes deviation. As a result, when the filling resin expands, peeling occurs at the interface between the circuit sealing frame and the three-dimensional molded substrate. In addition, when shrinking, there is a problem in the reliability of the surface mount type chip component, for example, the stress of the resin may be applied to the fragile LED element and deteriorate the characteristics of the LED element.

In addition, since an expensive glass epoxy substrate is used as an insulating substrate, and a separate circuit sealing frame is integrated with the insulating substrate with a conductive adhesive or the like, the molding of the circuit sealing frame using a mold and the adhesive are performed. Printing, integration with an insulating substrate, and the like, which increases costs.

In addition, since an expensive three-dimensional molded substrate is used as an insulating substrate, and the wire bonding surface of the molded substrate is not smooth, wire bonding failure occurs and adversely affects the yield of the assembling process. There was a problem.

The present invention has been made in view of the above-mentioned conventional problems, and an object of the present invention is to use a material having substantially the same linear expansion coefficient for an insulating substrate and a sealing resin to be filled.
A three-dimensional molded substrate with high reliability and improved dimensional accuracy, which does not use a circuit encapsulation frame. An object of the present invention is to provide a manufacturing method thereof.

[0028]

In order to achieve the above object, a surface mount chip component according to the present invention is provided with a pair of upper electrodes facing the upper surface of an insulating substrate made of a resin material. The electrodes each have a lower surface electrode on the back surface, and a side electrode connected to the upper surface electrode and the lower surface electrode on the side surface thereof. One electrode of the electronic element is formed on the one upper surface electrode and the other upper surface electrode. In a surface-mounted chip component connected to the other electrode of the electronic element and resin-sealed, the insulating substrate and the sealing resin are both made of an epoxy resin material, and the electrode surface formed on the insulating substrate is , Formed on the surface of the ethoxy resin by plating.

Further, the insulating substrate is a three-dimensional molded substrate in which an electronic element housing concave portion is formed.

Further, the electronic device die-bonded to the electronic device housing recess of the insulating substrate is surrounded by a light reflection dummy pattern formed in an empty space which does not interfere with the upper electrode pattern. It is a feature.

Further, the dummy pattern is formed on the surface of the insulating substrate by plating.

Further, the electronic element is an LED element, the insulating substrate is a three-dimensional molded substrate having a recess for accommodating the LED element, and both the insulating substrate and the sealing resin are made of an epoxy resin material. The electrode surface is formed by plating the surface of an ethoxy resin.

In the method of manufacturing a surface-mounted chip component according to the present invention, there is provided a method of manufacturing a surface-mounted chip component, the method comprising: An electronic element housing concave portion is formed at intervals, a copper plating layer is formed on the entire surface including the inner surface of the elongated hole, a plating resist is laminated, a pattern mask is formed after exposure and development, and after pattern etching, Ni plating is performed. Forming a three-dimensional molded substrate having an electrode pattern by performing an Au plating process; and forming the electronic element on a die bond pattern extending from one upper surface electrode formed in the electronic element housing recess of the collective insulating substrate. An electronic element die bonding step of die bonding with a conductive adhesive, and the other formed in the electronic element housing recess of the collective insulating substrate. A wire bonding step of connecting a bonding wire from an electronic element to establish electrical continuity on a wire bond pattern extending from a surface electrode; and forming an epoxy resin in the electronic element housing recess to protect the bonding wire and the electronic element. A resin sealing step of injecting a sealing resin, and cutting the surface-mounted chip component assembly formed through each of the steps along two orthogonal cut lines into a single surface-mounted chip component And a cutting step for dividing.

Further, the electronic device is an LED device.

[0035]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A surface mount type chip component according to the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of a surface mount chip component according to an embodiment of the present invention. In the drawings, the same members as those of the prior art are denoted by the same reference numerals.

In FIG. 1, reference numeral 1 denotes a three-dimensionally shaped insulating substrate made of a substantially parallelepiped-shaped epoxy resin or the like.
The insulating substrate 1 has an LE
The D element 5 is fixed, and the bottom surface and the four inclined surfaces extending upward are provided with an Au-plated LE together with the upper surface electrodes 2a, 2b in an empty space that does not interfere with the upper surface electrodes 2a, 2b.
A light reflection dummy pattern 13 of D is formed. A pair of upper electrodes 2a, 2b facing the upper surface side and the inclined surface of the insulating substrate 1, lower electrodes 3a, 3b on the lower surface, and side electrodes 4a connected to the upper electrodes 2a, 2b and the lower electrodes 3a, 3b; 4b is formed. The one upper electrode 2a and the die bond pattern at its end are both Au.
The conductive adhesive 9 is plated and the die bond pattern is
The other upper surface electrode 2b and the wire bond pattern at the end of the LED element 5 are both fixed by A.
A bonding wire 6 made of Au wire or the like is wire-bonded to the u-bonded wire bond pattern. Reference numeral 8 denotes a sealing resin such as an epoxy resin of the same material as the insulating substrate 1, which is resin-sealed so as to be substantially flush with the upper surface of the insulating substrate 1 in order to protect the LED element 5 and the connection portion. I have. With the above configuration, the surface mount chip component 3
0 is formed.

A method of manufacturing the surface mount chip component 30 will be described with reference to FIGS. 2 and 4, the collective insulating substrate forming step includes a plurality of collective insulating substrates 1C made of a substantially rectangular epoxy resin and having upper and lower surfaces both of which are covered with copper foil. This is a three-dimensional molded substrate in which a plurality of long hole through holes 11A and a plurality of LED element housing recesses 12 are formed at predetermined intervals between rows. A copper plating layer is formed on the entire surface of the collective insulating substrate 1C by electroless plating, backside resist silk printing, etching (improvement of plating adhesion), catalyst (supporting Pb and Sn catalyst for Ni electroless), accelerator (Activation treatment), resist exposure (resist curing),
Through the steps of resist peeling, electroless Ni plating, resist peeling, electric Ni plating, Au plating flash + Au plating, and washing with water, a three-dimensionally formed collective insulating substrate made of epoxy resin is formed.

As shown in FIG. 3 (part C surrounded by a dotted circle in FIG. 2), a pair of opposed upper electrodes extending on the inclined surface and the bottom of the LED element housing recess 12 are provided on the upper surface side of the collective insulating substrate 1C. Light reflecting dummy patterns 13 formed by Au plating are formed on the 2a and 2b, and on the inclined surfaces of the bottom surface of the LED element accommodating recess 12 and the four peripheral surfaces of the bottom surface, in empty spaces that do not interfere with the upper electrodes 2a and 2b. Have been. On the lower surface side, a pair of lower electrodes (not shown) facing each other, and a side electrode 4 connected to the upper electrodes 2a and 2b and the lower electrode.
a, 4b are formed.

In FIG. 5, in the LED element die bonding step and the wire bonding step, the LED element 5 shown in FIG. 4A is attached to the end of one upper electrode 2a extending to the bottom surface in each LED element accommodating recess 12. It is fixed to a certain die bond pattern with a conductive adhesive 9. The LED element 5 is connected to the wire bond pattern, which is the end of the other upper surface electrode 2b, by a bonding wire 6.

The resin sealing step and the cutting step in FIG. 6 are performed to protect the connection between the LED element 5 and the bonding wire 6 in the LED element housing recess 12.
Epoxy resin sealing resin 8 of the same material as the collective insulating substrate 1C
Then, the surface mounting type chip component assembly 30A is sealed with resin so as to be substantially flush with the upper surface of the collective insulating substrate 1C.
Is formed. In the cutting step, the surface mount type chip component assembly 30A is divided into two orthogonal cut lines 2 by X,
The surface mount type chip component 30 shown in FIG. 1 is completed by dividing into single pieces by cutting means such as slicing or dicing along Y (the cut run in the X direction passes over the elongated hole 11A). .

[0041]

As described above, according to the present invention,
In the surface mount type chip parts, the three-dimensional molded substrate and the sealing resin are the same epoxy material, and therefore have the same linear expansion coefficient. There is no danger of the boundary being peeled off. Also,
There is no fear of stress on the LED element, the effect is extremely large in terms of product life, and the reliability is improved.

In the three-dimensional molded substrate, the dummy pattern for light reflection can be simultaneously formed in the electrode pattern and the empty space which does not interfere with the electrode pattern. Therefore, the brightness in the upper surface direction can be increased without extra steps. Can be planned.

Further, unlike the conventional case, since no circuit sealing frame is used, a mold is not required, and further, an operation of printing an adhesive on the circuit sealing frame and integrating the same with a substrate is also unnecessary. . In addition, the reduction in the yield of the assembly process caused by the poor quality of the substrate (the wire bonding surface is not smooth) which the conventional MID substrate has is solved.

Further, in the manufacturing method, a three-dimensional molded substrate having high dimensional accuracy is formed by using an inexpensive epoxy resin material for an insulated substrate in a collective state, and a large number of pieces are formed. Can be mass-produced inexpensively.

[Brief description of the drawings]

FIG. 1 is a perspective view of a surface mount chip component according to an embodiment of the present invention.

FIG. 2 is a partial plan view of a collective insulating substrate showing a manufacturing method of the present invention.

FIG. 3 is a plan view showing an electrode pattern of a portion indicated by a dotted circle C in FIG. 2;

FIG. 4 is a partial perspective view of the LED element and the collective insulating substrate of FIG. 2;

FIG. 5 is a partial perspective view of the collective insulating substrate showing a die bonding step and a wire bonding step for fixing the LED element of FIG. 4;

FIG. 6 is a partial perspective view of the surface mount type chip component assembly showing a resin sealing and cutting step of injecting a sealing resin into FIG. 5;

FIG. 7 is a partial plan view of a collective insulating substrate showing a conventional method of manufacturing a surface mount chip component.

FIG. 8 is a plan view showing an electrode pattern of a dotted circle A part in FIG. 7;

FIG. 9 is a perspective view of an LED element.

FIG. 10 is a partial perspective view of the collective insulating substrate showing a die bonding step of fixing the LED elements to FIG.

FIG. 11 is a partial perspective view of the collective insulating substrate showing a wire bonding step of wire bonding wires in FIG.

FIG. 12 is a partial perspective view showing a step of bonding a circuit sealing frame to the collective insulating substrate of FIG. 11;

FIG. 13 is a partial perspective view of the integrated collective insulating substrate of FIG.

FIG. 14 is a partial perspective view of the surface-mounted chip component assembly showing a resin sealing step of injecting a sealing resin into FIG.

FIG. 15 is a partial perspective view showing a cutting step of cutting into single surface mount chip components along the cutting line of FIG. 14;

FIG. 16 is a perspective view showing a conventional surface mount chip component.

FIG. 17 is a partial plan view of a collective insulating substrate showing another conventional method of manufacturing a surface mount chip component.

FIG. 18 is a plan view showing an electrode pattern of a portion indicated by a dotted circle B in FIG. 17;

FIG. 19 is a partial perspective view of the collective insulating substrate showing an LED element die bonding step, a wire bonding step, a resin sealing step, and a cutting step.

FIG. 20 is a perspective view showing another conventional surface mount chip component.

FIG. 21 is a sectional view taken along the line AA of FIG. 16 showing a mechanism of expansion in a reliability test of a conventional surface mount chip component.

FIG. 22 is a cross-sectional view taken along the line BB of FIG. 20, illustrating a mechanism of expansion in a reliability test of a conventional surface mount chip component.

FIG. 23 is a cross-sectional view taken along the line AA of FIG. 16 showing a contraction mechanism in a reliability test of a conventional surface mount chip component.

FIG. 24 is a cross-sectional view taken along the line BB of FIG. 20, illustrating a shrinkage mechanism in a reliability test of a conventional surface mount chip component.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Insulating substrate 1C Collective insulating substrate 2a, 2b Upper electrode 3a, 3b Lower electrode 4a, 4b Side electrode 5 LED element 6 Bonding wire 8 Sealing resin 9 Conductive adhesive 11A Slot through hole 12 LED element storage recess 13 Dummy pattern 30 Surface Mount Chip Component 30A Surface Mount Chip Assembly

Claims (7)

[Claims] 1. A pair of upper electrodes facing each other on an upper surface of an insulating substrate made of a resin material, wherein each of the pair of upper electrodes has a lower electrode on its back surface, and the upper electrode and the lower electrode on its side surfaces. A surface mounting chip formed by forming a side electrode connected to the first upper electrode and connecting the one electrode of the electronic element to the one upper electrode and the other electrode of the electronic element to the other upper electrode, respectively, and sealing with a resin. In the component, the insulating substrate and the sealing resin are both made of an epoxy resin material, and an electrode surface formed on the insulating substrate is formed by plating a surface of an ethoxy resin. . 2. The surface-mounted chip component according to claim 1, wherein said insulating substrate is a three-dimensional molded substrate having an electronic element housing recess formed therein. 3. An electronic device die-bonded to an electronic device housing recess of the insulating substrate, the periphery of which is surrounded by a light reflection dummy pattern formed in an empty space which does not interfere with the upper electrode pattern. The surface-mounted chip component according to claim 1, wherein: 4. The method according to claim 3, wherein the dummy pattern is formed on the surface of the insulating substrate by plating.
Surface mount type chip parts as described. 5. The electronic element is an LED element, the insulating substrate is a three-dimensional molded substrate having a recess for accommodating an LED element formed therein, and both the insulating substrate and the sealing resin are made of an epoxy resin material. 2. The surface-mounted chip component according to claim 1, wherein the electrode surface is formed by plating the surface of an ethoxy resin. 6. An elongated hole through hole is formed between each row of a plurality of collective insulating substrates made of epoxy resin, and an electronic element housing recess is formed at a predetermined interval between the elongated hole through holes. Form a copper plating layer on the entire surface including the inner surface of the through hole, laminate a plating resist, expose,
After the development, a pattern mask is formed. After pattern etching, Ni plating and Au plating are performed to form a three-dimensional molded substrate having an electrode pattern. An electronic element die bonding step of die bonding the electronic element with a conductive adhesive on a die bond pattern extending from one upper electrode, and a wire bond pattern extending from the other upper electrode formed in the electronic element housing recess of the collective insulating substrate. A wire bonding step of connecting a bonding wire from an electronic element to establish electrical continuity, and injecting a sealing resin made of epoxy resin into the electronic element housing recess to protect the bonding wire and the electronic element. A sealing step and the surface-mounted chip component formed through the above steps Two method of manufacturing a surface mount type chip components, characterized by comprising a cutting step of dividing by cutting along a cut line to a single number of surface-mounted chip component perpendicular coalescence. 7. The method according to claim 5, wherein the electronic element is an LED element.