JP6809518B2 - Resin molded products and surface mount type light emitting devices and their manufacturing methods - Google Patents

Description

The present invention relates to a surface mount type light emitting device used for a lighting fixture, a display, a backlight of a mobile phone, an auxiliary light source for moving images, and other general consumer light sources, a resin molded body suitable therefor, and a method for manufacturing the same.

A surface mount type light emitting device using a light emitting element is small, has good power efficiency, and emits bright colors. Further, since this light emitting element is a semiconductor element, there is no need to worry about running out of balls. Furthermore, it has excellent initial drive characteristics and is resistant to vibration and repeated on / off lighting. Since it has such excellent characteristics, a light emitting device using a light emitting element such as a light emitting diode (LED) or a laser diode (LD) is used as various light sources.

FIG. 11 shows a conventional surface mount type light emitting device. A conventional surface mount type light emitting device includes a light emitting element 210, a mounting lead frame 220 on which the light emitting element 210 is mounted, a connecting lead frame 230 connected to the light emitting element 210 via a lead wire, and most of each lead frame. It includes a molded body 240 to cover (see, for example, Patent Document 1). In this surface mount type light emitting device, a thermoplastic resin such as a liquid crystal polymer, PPS (polyphenylene sulfide), or nylon is often used as a light-shielding resin in the molded body 240 because the mass productivity is prioritized. Further, in general, since the thermoplastic resin used for the molded product 240 needs to have heat resistance that can withstand the heat of reflow solder, engineering polymers such as semi-aromatic polyamide, liquid crystal polymer, and PPS are used. Generally, the thermoplastic resin is produced by injection molding. This injection molding method has become the mainstream for providing a high-power surface mount type light emitting device at low cost because of its high productivity.

Japanese Patent Application Laid-Open No. 11-087780 (Claims, [0020])

Although these thermoplastic engineering polymers used in the molded body 240 of the conventional surface mount type light emitting device have excellent heat resistance, they have poor light resistance because they have an aromatic component in the molecule. Further, since the molecule does not have a hydroxyl group or the like for improving adhesiveness, there is a problem that adhesion with the lead frames 220 and 230 and the translucent sealing resin 250 cannot be obtained. Further, the output of the light emitting element has been remarkably improved in recent years, and as the output of the light emitting element has been increased, the photodegradation of the molded body 240 has become remarkable. In particular, the adhesive interface between the translucent sealing resin 250 and the thermoplastic engineering polymer 240 is easily broken due to poor adhesion, leading to peeling. Further, even if peeling does not occur, discoloration due to photodegradation progresses, and the life of the light emitting device is significantly shortened.

In order to solve these problems, there is also a technique in which the molded product is made of an inorganic material without photodegradation, for example, ceramics. However, in a molded product using this ceramic, it is difficult to insert a lead frame having good thermal conductivity, and the thermal resistance value cannot be lowered. Further, since the expansion coefficient differs from that of the translucent sealing resin by one order or more, reliability has not been obtained.

From the above, it is an object of the present invention to provide a surface mount type light emitting device having a long life and excellent mass productivity, and a molded product used for the surface mount type light emitting device. Another object of the present invention is to provide a manufacturing method thereof that is easy to manufacture.

As a result of diligent studies in order to solve the above problems, the present inventor has completed the present invention.

The present invention comprises a first resin molded body in which a light emitting element, a first lead for mounting the light emitting element, and a second lead electrically connected to the light emitting element are integrally molded, and light emitting. A surface-mounted light emitting device having a second resin molded body that covers an element, and the first resin molded body is formed with a recess having a bottom surface and a side surface, and the first resin molded body has a recess. The first lead is exposed from the bottom surface of the recess, and the light emitting element is placed on the exposed portion. The first resin molded body and the second resin molded body are thermosetting resins. The first resin molded body does not have an aromatic component in the molecule as much as possible, and the first resin molded body relates to a surface-mounted light emitting device molded by a transfer mold.

The present invention comprises a first resin molded body in which a light emitting element, a first lead for mounting the light emitting element, and a second lead electrically connected to the light emitting element are integrally molded, and light emitting. A surface-mounted light emitting device having a second resin molded body that covers the element, the first lead having a first inner lead portion and a first outer lead portion, and a first The inner lead portion of the above is mounted with a light emitting element and is electrically connected to the first electrode of the light emitting element, and the first outer lead portion is exposed from the first resin molded body. The second lead has a second inner lead portion and a second outer lead portion, and the second inner lead portion is electrically connected to the second electrode of the light emitting element. The cage and the second outer lead portion are exposed from the first resin molded body, and the first resin molded body is formed with a recess having a bottom surface and a side surface of the first resin molded body. The first inner lead portion is exposed from the bottom surface of the recess, and a light emitting element is placed on the exposed portion. The first resin molded body and the second resin molded body are thermocurable resins. The first resin molded body does not have an aromatic component in the molecule as much as possible, and the first resin molded body relates to a surface-mounted light emitting device molded by a transfer mold.

It is preferable that the back surface side of the first lead opposite to the main surface side on which the light emitting element is placed is exposed from the first resin molded body.

The first lead and the back surface side of the second lead opposite to the main surface side on which the light emitting element is placed may be exposed from the first resin molded body.

It is preferable that the exposed portion on the back surface side of the first lead and the exposed portion on the back surface side of the second lead are substantially on the same plane.

The exposed portion on the back surface side of the first inner lead portion may be arranged so that the heat radiating member comes into contact with the exposed portion.

The first resin molded body preferably reflects 30% or more of the light from the light emitting element.

The first resin molded body is preferably formed of at least one selected from the group consisting of epoxy resin, modified epoxy resin, silicone resin, modified silicone resin, acrylate resin, and urethane resin.

The first resin molded product may be mixed with at least one selected from the group consisting of fillers, diffusing agents, pigments, fluorescent substances, reflective substances, and light-shielding substances.

The second resin molded product may be mixed with at least one selected from the group consisting of fillers, diffusing agents, pigments, fluorescent substances, and reflective substances.

The present invention is a resin molded body formed by integrally molding a first lead and a second lead, and the first lead has a first inner lead portion and a first outer lead portion. The first inner lead portion is arranged in the resin molded body, the first outer lead portion is exposed from the resin molded body, and the second lead is the second inner lead portion and the second lead portion. It has an outer lead portion, a second inner lead portion is arranged in the resin molded body, the second outer lead portion is exposed from the resin molded body, and the resin molded body has a bottom surface. A recess having a side surface is formed, and a first inner lead portion and a second inner lead portion are exposed from the bottom surface of the recess of the resin molded body. The resin molded body is a heat-curable resin. The resin molded body does not have an aromatic component in the molecule as much as possible, and the resin molded body relates to a resin molded body molded by a transfer mold.

The present invention is a resin molded body formed by integrally molding a first lead and a second lead, and the first lead has a first inner lead portion and a first outer lead portion. The first inner lead portion is arranged in the resin molded body, the first outer lead portion is exposed from the resin molded body, and the second lead is the second inner lead portion and the second lead portion. It has an outer lead portion, the second inner lead portion is arranged on the resin molded body, the second outer lead portion is exposed to the outside from the resin molded body, and the resin molded body has a bottom surface. A recess having a side surface is formed, and the first inner lead portion and the second inner lead portion are exposed from the bottom surface of the recess of the resin molded body, which is opposite to the main surface side where the recess is formed. The back surface side of the first inner lead portion is exposed from the resin molded body, the resin molded body is a heat-curable resin, and the resin molded body does not have an aromatic component in the molecule as much as possible. Yes, the resin molded body relates to a resin molded body molded by a transfer mold.

It is preferable that the exposed portion on the back surface side of the first lead and the exposed portion on the back surface side of the second lead are substantially on the same plane.

The thermosetting resin is preferably at least one selected from the group consisting of epoxy resins, modified epoxy resins, silicone resins, modified silicone resins, acrylate resins, and urethane resins.

It is preferable that the recess is provided with a slope that widens in the opening direction.

The resin molded product may be mixed with at least one selected from the group consisting of fillers, diffusing agents, pigments, fluorescent substances, reflective substances, and light-shielding substances.

INDUSTRIAL APPLICABILITY The present invention manufactures a resin molded body in which a first lead and a second lead are integrally molded, and a recess having a bottom surface and a side surface is formed, and the molecule has no aromatic component as much as possible. According to the method, the upper mold forms a recess corresponding to a recess of the resin molded body, and the first lead has a first inner lead portion and a first outer lead portion, and the first lead has a first outer lead portion. The second lead has a second inner lead portion and a second outer lead portion, and the first inner lead portion, the second inner lead portion, and the first lead portion corresponding to the bottom surface of the concave portion of the resin molded body. The outer lead portion and the second outer lead portion of the above are transferred to the first step in which the upper mold and the lower mold are sandwiched, and the heat-curable resin is transferred to the recessed portion sandwiched between the upper mold and the lower mold. The present invention relates to a method for producing a resin molded body, which comprises a second step of being poured by a molding step and a third step of heating and curing the poured thermocurable resin to form a resin molded body.

In the present invention, a first resin molding is formed by integrally molding a first lead and a second lead, and has a recess having a bottom surface and a side surface, and has no aromatic component in the molecule as much as possible. A method for manufacturing a surface-mounted light emitting device having a body, a light emitting element mounted on a first lead, and a second resin molded body covering the light emitting element, wherein the upper mold is the first. A recess corresponding to a recess of the resin molded body is formed, the first lead has a first inner lead portion and a first outer lead portion, and the second lead is a second inner lead. It has a portion and a second outer lead portion, and has a first inner lead portion and a second inner lead portion corresponding to the bottom surface of a concave portion of the first resin molded body, and a first outer lead portion and a second. The outer lead portion of 2 is the first step of being sandwiched between the upper mold and the lower mold, and the first thermosetting resin is transferred to the recessed portion sandwiched between the upper mold and the lower mold. A second step of pouring in, a first step of heating and curing the poured first thermosetting resin, a third step of molding a first resin molded body, and a fourth step in which the upper mold is removed. In the above step, the light emitting element is placed on the first inner lead portion, and the first electrode and the first inner lead portion of the light emitting element are electrically connected to each other so that the light emitting element has a second. A fifth step in which the electrode and the second inner lead portion are electrically connected, a sixth step in which the second thermosetting resin is arranged in the recess in which the light emitting element is placed, and the sixth step. The present invention relates to a method for manufacturing a surface-mounted light emitting device, which comprises a seventh step of heating and curing the thermocurable resin of 2 to form a second resin molded product.

This makes it possible to provide a surface mount type light emitting device having a long life and excellent mass productivity and a molded product used for the surface mount type light emitting device.

It is a schematic sectional drawing which shows the surface mount type light emitting device which concerns on 1st Embodiment. It is a schematic plan view which shows the surface mount type light emitting device which concerns on 1st Embodiment. It is schematic cross-sectional view which shows the mounting state of the surface mount type light emitting device which concerns on 1st Embodiment. It is a schematic plan view which shows the surface mount type light emitting device which concerns on 2nd Embodiment. It is schematic cross-sectional view which shows the surface mount type light emitting device which concerns on 3rd Embodiment. It is the schematic sectional drawing which shows the surface mount type light emitting device which concerns on 4th Embodiment. It is the schematic sectional drawing which shows the surface mount type light emitting device which concerns on 5th Embodiment. It is schematic cross-sectional view which shows the mounting state of the surface mount type light emitting device which concerns on 5th Embodiment. It is schematic cross-sectional view which shows the surface mount type light emitting device which concerns on 6th Embodiment. It is schematic cross-sectional view which shows the manufacturing process of the surface mount type light emitting device which concerns on 1st Embodiment (a)-(e). It is a schematic plan view which shows the conventional surface mount type light emitting device. It is a schematic sectional drawing which shows the conventional surface mount type light emitting device.

The present invention comprises a first resin molded body formed by integrally molding a light emitting element, a first lead for mounting the light emitting element, and a second lead electrically connected to the light emitting element, and light emitting. A surface-mounted light emitting device having a second resin molded body that covers an element, and the first resin molded body is formed with a recess having a bottom surface and a side surface, and the first resin molded body has a recess. The first lead is exposed from the bottom surface of the recess, and a light emitting element is placed on the exposed portion. The first resin molded body and the second resin molded body are surfaces of thermosetting resin. Regarding a mountable light emitting device. The thermosetting resin preferably has no aromatic component in the molecule as much as possible.

This makes it possible to provide a surface mount type light emitting device having excellent heat resistance, light resistance and the like.

Further, by making the first resin molded body a thermosetting resin, it is possible to prevent peeling of the interface with the second resin molded body. This is because, unlike the thermoplastic resin, the thermosetting resin has a large number of reactive functional groups on the surface, so that a strong adhesive interface can be formed with the second resin molded product. By using a thermosetting resin as the second resin molded product, it is possible to obtain isotropic thermal expansion / contraction behavior similar to that of the first resin molded product, so that the thermal stress at the bonding interface due to temperature changes can be reduced. It can be further reduced. Then, by making the second resin molded body a thermosetting resin of the same type as the first resin molded body, not only the adhesive force is improved by reducing the interfacial tension, but also the curing reaction proceeds at the interface and extremely strong adhesion is achieved. It becomes possible to obtain sex. With regard to light resistance, since the composition of the three-dimensionally crosslinked thermosetting resin can be easily changed without impairing the heat resistance, aromatic components having poor light resistance can be easily eliminated. On the other hand, in thermoplastic resins, heat resistance and aromatic components are virtually synonymous, and it is not possible to obtain a molded product that can withstand the heat of reflow solder without the aromatic components. Therefore, by making the first resin molded body and the second resin molded body into a thermosetting resin, a surface that originally has a strong adhesive interface, has excellent peeling resistance with little photodegradation, and has little aging. A mountable light emitting device can be obtained.

The second resin molded body is arranged in the recess in which the light emitting element is placed. As a result, the light emitting element can be easily covered. Further, since the refractive index of the light emitting element and the refractive index in the air are significantly different, the light emitted from the light emitting element is not efficiently output to the outside, whereas the light emitting element is covered with the second resin molded body. By doing so, the light emitted from the light emitting element can be efficiently output to the outside. Further, the light emitted from the light emitting element is irradiated to the bottom surface and the side surface of the recess, reflected, and emitted to the main surface side on which the light emitting element is placed. As a result, the light emission output on the main surface side can be improved. Further, rather than covering the bottom surface of the recess with the first resin molded body, since the first reed is made of metal, the light reflection efficiency from the light emitting element can be improved.

For example, an epoxy resin can be used for the first resin molded product, and a hard silicone resin can be used for the second resin molded product.

The present invention comprises a first resin molded body in which a light emitting element, a first lead for mounting the light emitting element, and a second lead electrically connected to the light emitting element are integrally molded, and light emitting. A surface-mounted light emitting device having a second resin molded body that covers the element, the first lead having a first inner lead portion and a first outer lead portion, and a first The inner lead portion of the above is mounted with a light emitting element and is electrically connected to the first electrode of the light emitting element, and the first outer lead portion is exposed from the first resin molded body. The second lead has a second inner lead portion and a second outer lead portion, and the second inner lead portion is electrically connected to the second electrode of the light emitting element. The cage and the second outer lead portion are exposed from the first resin molded body, and the first resin molded body is formed with a recess having a bottom surface and a side surface of the first resin molded body. The first inner lead portion is exposed from the bottom surface of the recess, and a light emitting element is placed on the exposed portion. The first resin molded body and the second resin molded body are thermocurable resins. The present invention relates to a surface-mounted light emitting device. The thermosetting resin preferably has no aromatic component in the molecule as much as possible. This makes it possible to provide a surface mount type light emitting device having excellent heat resistance, weather resistance, and adhesion. Further, since the first resin molded body and the second resin molded body are molded using the thermosetting resin, it is necessary to prevent the interface between the first resin molded body and the second resin molded body from peeling off. Can be done. Further, since the first reed and the second reed having a predetermined length are bent and used, they can be easily electrically connected to the external electrode and can be mounted on an existing lighting fixture or the like and used as they are. ..

It is preferable that the back surface side of the first lead opposite to the main surface side on which the light emitting element is placed is exposed from the first resin molded body. When an electric current is applied to the surface mount type light emitting device, it emits light and the light emitting element generates heat. With this configuration, this heat can be efficiently released to the outside. In particular, since the heat from the light emitting element can be dissipated to the outside in the shortest distance, the heat can be dissipated extremely efficiently.

The first lead and the back surface side of the second lead opposite to the main surface side on which the light emitting element is placed may be exposed from the first resin molded body. As a result, the heat generated from the light emitting element can be efficiently dissipated to the outside. Further, since the first lead and the second lead function as electrodes, they can be connected to the external electrode extremely easily. In particular, when a thick first lead and a second lead are used, even if these leads are not easy to bend, the form is easy to mount. Further, in the manufacturing process, since the first lead and the second lead are sandwiched between the predetermined molds, the occurrence of burrs can be reduced and the mass productivity can be improved. However, it is not necessary that the entire back surface side of the first lead and the second lead is exposed, and only the portion where the occurrence of burrs is desired to be suppressed may be exposed.

It is preferable that the exposed portion on the back surface side of the first lead and the exposed portion on the back surface side of the second lead are substantially on the same plane. This makes it possible to improve the stability of the surface mount type light emitting device at the time of mounting. Further, since the exposed portion is on the same plane, it is sufficient to mount the surface mount type light emitting device on the external electrode on the flat plate by using solder to improve the mountability of the surface mount type light emitting device. Can be done. Furthermore, molding with a mold becomes extremely easy.

The exposed portion on the back surface side of the first inner lead portion may be arranged so that the heat radiating member comes into contact with the exposed portion. The heat radiating member can be arranged as an external member separately from the surface mount type light emitting device, and the heat radiating member can be attached integrally with the surface mount type light emitting device. As a result, the heat generated from the light emitting element is transmitted to the outside through the heat radiating member, so that the heat radiating property can be further improved. Further, when the heat radiating member is arranged as an external member, the mounting position of the surface mount type light emitting device can be easily determined.

The first resin molded body is molded by a transfer mold. Whereas injection molding cannot form a complex shape, transfer molding can form a compact with a complex shape. In particular, the first resin molded body having a recess can be easily molded.

The first resin molded body is preferably formed of at least one selected from the group consisting of epoxy resin, modified epoxy resin, silicone resin, modified silicone resin, acrylate resin, and urethane resin. Of these, epoxy resin, silicone resin, and modified silicone resin are preferable, and epoxy resin is particularly preferable. This makes it possible to provide a surface mount type light emitting device having excellent heat resistance, light resistance, adhesion, and mass productivity. Further, since the deterioration of the first resin molded product can be reduced by using the thermosetting resin in the first resin molded product as compared with the case of using the thermoplastic resin in the first resin molded product. The life of the surface-mounted light emitting device can be extended.

The first resin molded product may be mixed with at least one selected from the group consisting of fillers, diffusing agents, pigments, fluorescent substances, reflective substances, and light-shielding substances. Various substances are added according to the requirements of the first resin molded product. For example, this is a case where a highly translucent resin is used for the first resin molded product and a fluorescent substance is mixed with the first resin molded product. As a result, the fluorescent substance absorbs the light emitted to the side surface or the bottom surface side of the light emitting element, converts the wavelength, and emits the light, so that the desired emission color can be realized as the whole surface mount type light emitting device. For example, in order to uniformly disperse the emitted light, a filler, a diffusing agent, a reflective substance, or the like may be added to the side surface or the bottom surface side of the light emitting element. For example, in order to reduce the light output from the back surface side of the surface mount type light emitting device, a light shielding resin may be mixed. In particular, the first resin molded product is preferably a mixture of titanium oxide, silica, and alumina in an epoxy resin. This makes it possible to provide a surface mount type light emitting device having excellent heat resistance.

The second resin molded product may be mixed with at least one selected from the group consisting of fillers, diffusing agents, pigments, fluorescent substances, and reflective substances. Various substances are added as required by the second resin molded product. For example, by mixing a fluorescent substance with the second resin molded product, it is possible to realize a light emitting color different from the light emitting color emitted from the light emitting element. For example, white light can be realized by using a light emitting element that emits blue light and a fluorescent substance that emits yellow light. Further, in order to emit light uniformly, a filler, a diffusing agent and the like can be mixed.

The present invention is a resin molded body formed by integrally molding a first lead and a second lead, and the first lead has a first inner lead portion and a first outer lead portion. The first inner lead portion is arranged in the resin molded body, the first outer lead portion is exposed from the resin molded body, and the second lead is the second inner lead portion and the second lead portion. It has an outer lead portion, a second inner lead portion is arranged in the resin molded body, the second outer lead portion is exposed from the resin molded body, and the resin molded body has a bottom surface. A recess having a side surface is formed, and a first inner lead portion and a second inner lead portion are exposed from the bottom surface of the recess of the resin molded body, and the resin molded body is a resin which is a heat-curable resin. Regarding the molded body. As a result, it is possible to provide a resin molded product having excellent heat resistance, light resistance, adhesion and the like as compared with the case where the resin molded product is molded using the thermoplastic resin. In addition, the structure can be such that the light emitting element can be easily placed.

The present invention is a resin molded body formed by integrally molding a first lead and a second lead, and the first lead has a first inner lead portion and a first outer lead portion. The first inner lead portion is arranged in the resin molded body, the first outer lead portion is exposed from the resin molded body, and the second lead is the second inner lead portion and the second lead portion. It has an outer lead portion, the second inner lead portion is arranged on the resin molded body, the second outer lead portion is exposed to the outside from the resin molded body, and the resin molded body has a bottom surface. A recess having a side surface is formed, and the first inner lead portion and the second inner lead portion are exposed from the bottom surface of the recess of the resin molded body, which is opposite to the main surface side where the recess is formed. The back surface side of the first inner lead portion is exposed from the resin molded body, and the resin molded body relates to a resin molded body which is a heat-curable resin. As a result, it is possible to provide a resin molded product having excellent heat resistance, light resistance, adhesion and the like as compared with the case where the resin molded product is molded using the thermoplastic resin. In addition, the structure can be such that the light emitting element can be easily placed. Further, by exposing the first outer lead portion extending from the resin molded body, the heat generated from the light emitting element can be dissipated to the outside.

It is preferable that the exposed portion on the back surface side of the first lead and the exposed portion on the back surface side of the second lead are substantially on the same plane. This makes it possible to provide a surface mount type light emitting device using a resin molded body having good stability and easy mounting. Furthermore, it is easy to mold with a mold.

The thermosetting resin is preferably at least one selected from the group consisting of epoxy resins, modified epoxy resins, silicone resins, modified silicone resins, acrylate resins, and urethane resins. As a result, it is possible to provide a resin molded product having good mass productivity and excellent heat resistance and light resistance at low cost.

The resin molded body is molded by a transfer mold. As a result, it is possible to form a concave portion having a complicated shape, which is difficult to mold by injection molding.

The resin molded product may be mixed with at least one selected from the group consisting of fillers, diffusing agents, pigments, fluorescent substances, reflective substances, and light-shielding substances. This makes it possible to provide a resin molded product that meets the requirements. For example, when a resin molded product having an action of diffusing light is desired, a filler or a diffusing agent is mixed. Further, when a surface mount type light emitting device having a desired color tone by converting the wavelength is desired, a fluorescent substance is mixed. Further, in order to efficiently extract the light from the light emitting element to the main surface side, if it is desired to suppress the transmission of the light to the back surface side, a light-shielding substance is mixed.

The present invention is a method for manufacturing a resin molded body in which a first lead and a second lead are integrally molded to form a recess having a bottom surface and a side surface, and the upper mold is a resin molded body. The first lead has a first inner lead portion and a first outer lead portion, and the second lead has a second inner lead portion and a second lead portion. It has two outer lead portions, and the first inner lead portion and the second inner lead portion, and the first outer lead portion and the second outer lead portion corresponding to the bottom surface of the recess of the resin molded body are The first step of being sandwiched between the upper mold and the lower mold, and the second step of pouring the heat-curable resin into the recessed portion sandwiched between the upper mold and the lower mold by the transfer molding step. The present invention relates to a method for producing a resin molded body, which comprises a third step of heating and curing the poured thermosetting resin to form a resin molded body.

As a result, the first inner lead portion and the second inner lead portion are sandwiched between the upper mold and the lower mold in the first step, so that the fluttering of these leads during transfer mold molding is suppressed. It is possible to manufacture a resin molded product that does not generate burrs. In addition, the first inner lead portion corresponding to the portion on which the light emitting element is placed can be exposed. Further, since the main surface side and the back surface side of the first inner lead portion corresponding to the bottom surface of the recess are exposed, heat can be dissipated from the back surface side when the light emitting element is placed, and the heat dissipation can be improved.

Further, since the thermosetting resin is transfer-molded, a resin molded body having a concave portion having a complicated shape can be manufactured. Further, it is possible to manufacture a resin molded product having excellent mass productivity, heat resistance, light resistance, adhesion and the like. The thermoplastic resin is solidified by heating to a melting temperature and cooling. Therefore, the thermoplastic resin and the thermosetting resin have different cooling steps, and whether or not they can be reversibly cured also differ. In addition, the thermoplastic resin has a high viscosity during processing and cannot form a complicated shape.

The present invention is mounted on a first resin molded body formed by integrally molding a first lead and a second lead and having a recess having a bottom surface and a side surface, and a first lead. A method for manufacturing a surface-mounted light emitting device having a light emitting element and a second resin molded body covering the light emitting element, wherein the upper mold forms a recess corresponding to a recess of the first resin molded body. The first lead has a first inner lead portion and a first outer lead portion, and the second lead has a second inner lead portion and a second outer lead portion. The first inner lead portion and the second inner lead portion, and the first outer lead portion and the second outer lead portion corresponding to the bottom surface of the concave portion of the first resin molded body are the upper mold and the lower mold. The first step of being sandwiched between the molds and the second step of pouring the first thermosetting resin into the recessed portion sandwiched between the upper mold and the lower mold by the transfer molding step, and the pouring. The first thermosetting resin is heated and cured, and the third step of molding the first resin molded body, the fourth step of removing the upper mold, and the light emitting element are the first inner leads. The first electrode of the light emitting element and the first inner lead portion are electrically connected to each other, and the second electrode and the second inner lead portion of the light emitting element are electrically connected to each other. The fifth step of being connected to, the sixth step of arranging the second thermocurable resin in the recess in which the light emitting element is placed, and the second thermocurable resin are heated and cured. The present invention relates to a method for manufacturing a surface-mounted light emitting device, which comprises a seventh step of molding a second resin molded body. This makes it possible to manufacture a surface mount type light emitting device having good mass productivity. In particular, since a thermosetting resin is used for the first resin molded body and the second resin molded body, the first resin molded body and the second resin molded body are more than when the thermoplastic resin and the thermosetting resin are used. Adhesion with the resin molded body can be improved. Further, when the first resin molded body is manufactured by transfer molding, burrs occur because the resin fluidity is good, but burrs do not occur because these leads are firmly sandwiched between the upper mold and the lower mold. .. Since the sandwiched leads are exposed, a light emitting element can be placed on the exposed portion, or the electrodes and leads of the light emitting element can be connected by a wire or the like.

The thermosetting resin, the first thermosetting resin, and the second thermosetting resin are at least one selected from the group consisting of epoxy resin, modified epoxy resin, silicone resin, modified silicone resin, acrylate resin, and urethane resin. It is preferably a seed resin. This makes it possible to manufacture a surface mount type light emitting device having good mass productivity. Further, since it is rich in fluidity and easily heated and cured, it is possible to provide a surface mount type light emitting device having excellent moldability, heat resistance and light resistance.

Hereinafter, a surface mount type light emitting device, a resin molded product, and a method for producing the same according to the present invention will be described with reference to embodiments and examples. However, the present invention is not limited to this embodiment and examples.

<First Embodiment>
<Surface mount type light emitting device>
The surface mount type light emitting device according to the first embodiment will be described with reference to the drawings. FIG. 1 is a schematic cross-sectional view showing a surface mount type light emitting device according to the first embodiment. FIG. 2 is a schematic plan view showing a surface mount type light emitting device according to the first embodiment. FIG. 1 is a schematic cross-sectional view taken along the line II of FIG.

The surface mount type light emitting device according to the first embodiment includes a light emitting element 10, a first resin molded body 40 on which the light emitting element 10 is placed, and a second resin molded body 50 that covers the light emitting element 10. Has. The first resin molded body 40 integrally molds a first lead 20 for mounting the light emitting element 10 and a second lead 30 electrically connected to the light emitting element 10.

The light emitting element 10 has a pair of positive and negative electrodes 11 and a second electrode 12 on the same surface side. In the present specification, a device having a pair of positive and negative electrodes on the same surface side will be described, but a device having a pair of positive and negative electrodes from the upper surface and the lower surface of the light emitting element can also be used. In this case, the electrode on the lower surface of the light emitting element is electrically connected to the first lead 20 by using a die-bond member having electrical conductivity without using a wire.

The first lead 20 has a first inner lead portion 20a and a first outer lead portion 20b. The light emitting element 10 is placed on the first inner lead portion 20a via a die bond member. The first inner lead portion 20a is electrically connected to the first electrode 11 of the light emitting element 10 via a wire 60. The first outer lead portion 20b is exposed from the first resin molded body 40. The first lead 20 not only has the first outer lead portion 20b on the outer side surface of the first resin molded body 40, but also has a portion exposed on the back surface side of the first resin molded body 40. May be referred to as a first outer lead portion 20b, and the first outer lead portion 20b may be a portion electrically connected to an external electrode. Since the first lead 20 is connected to the external electrode, a metal member is used.

The second lead 30 has a second inner lead portion 30a and a second outer lead portion 30b. The second inner lead portion 30a is electrically connected to the second electrode 12 of the light emitting element 10 via the wire 60. The second outer lead portion 30b is exposed from the first resin molded body 40. The second lead 30 not only has the second outer lead portion 30b on the outer side surface of the second resin molded body 40, but also has a portion exposed on the back surface side of the second resin molded body 40. May be referred to as a second outer lead portion 30b, and the second outer lead portion 30b may be a portion electrically connected to an external electrode. Since the second lead 30 is connected to the external electrode, a metal member is used. An insulating member 90 is provided on the back surface side in a portion close to the first lead 20 and the second lead 30 so that the first lead 20 and the second lead 30 are not short-circuited.

The first resin molded body 40 forms a recess 40c having a bottom surface 40a and a side surface 40b. The first inner lead portion 20a of the first lead 20 is exposed from the bottom surface 40a of the recess 40c of the first resin molded body 40. The light emitting element 10 is placed on this exposed portion via a die bond member. The first resin molded body 40 is molded by a transfer mold. The first resin molded body 40 uses a thermosetting resin. It is preferable that the opening of the recess 40c is wider than the bottom surface 40a and the side surface 40b is inclined.

The second resin molded body 50 is arranged in the recess 40c so as to cover the light emitting element 10. The second resin molded body 50 uses a thermosetting resin. The second resin molded product 50 contains a fluorescent substance 80. Since the fluorescent substance 80 has a higher specific gravity than that of the second resin molded product 50, it has settled on the bottom surface 40a side of the recess 40c.

In the present specification, the side on which the light emitting element 10 is mounted is referred to as a main surface side, and the opposite side thereof is referred to as a back surface side.

The first resin molded body 40 and the second resin molded body 50 use a thermosetting resin, and since the physical properties such as the coefficient of expansion are similar, the adhesion is extremely good. Further, by adopting the above configuration, it is possible to provide a surface mount type light emitting device having excellent heat resistance, light resistance and the like.

Hereinafter, each component will be described in detail.

<Light emitting element>
As the light emitting element 10, a semiconductor such as GaAlN, ZnS, ZnSe, SiC, GaP, GaAlAs, AlN, InN, AlInGaP, InGaN, GaN, and AlInGaN formed on a substrate is used as a light emitting layer. Examples of the semiconductor structure include a MIS junction, a homostructure having a PIN junction and a PN junction, a heterostructure, and a double heterostructure. The emission wavelength can be variously selected from ultraviolet light to infrared light depending on the material of the semiconductor layer and its mixed crystalliteness. The light emitting layer may have a single quantum well structure or a multiple quantum well structure, which is a thin film that produces a quantum effect.

When considering outdoor use, it is preferable to use a gallium nitride-based compound semiconductor as a semiconductor material capable of forming a high-brightness light-emitting element, and in red, gallium / aluminum / arsenic-based semiconductors or aluminum / injuum / It is preferable to use a gallium-phosphorus semiconductor, but various uses can be used depending on the application.

When a gallium nitride-based compound semiconductor is used, a material such as sapphire, spinel, SiC, Si, ZnO, or a GaN single crystal is used for the semiconductor substrate. It is preferable to use a sapphire substrate in order to form gallium nitride having good crystallinity with good mass productivity. An example of 10 light emitting devices using a nitride compound semiconductor is shown. A buffer layer of GaN, AlN, etc. is formed on the sapphire substrate. On it, a first contact layer which is N or P type GaN, an active layer which is an InGaN thin film having a quantum effect, a clad layer which is P or N type AlGaN, and a second contact layer which is P or N type GaN. The contact layers can be formed in order. Gallium nitride based compound semiconductors exhibit N-type conductivity in a state where impurities are not doped. When forming a desired N-type gallium nitride semiconductor such as improving the luminous efficiency, it is preferable to appropriately introduce Si, Ge, Se, Te, C or the like as the N-type dopant.

On the other hand, when forming a P-type gallium nitride semiconductor, P-type dopands such as Zn, Mg, Be, Ca, Sr, and Ba are doped. Since a gallium nitride based semiconductor is difficult to be P-typed only by doping with a P-type dopant, it is necessary to make it P-type by annealing by heating with a furnace, low electron beam irradiation, plasma irradiation, or the like after introducing the P-type dopant. The semiconductor wafer thus formed is partially etched to form positive and negative electrodes. After that, the light emitting element can be formed by cutting the semiconductor wafer to a desired size.

A plurality of such light emitting elements 10 can be used as appropriate, and the color mixing property in white display can be improved by combining them. For example, the number of light emitting elements 10 capable of emitting green light can be two, and the number of light emitting elements 10 capable of emitting blue and red light can be one each. In order to use it as a full-color light emitting device for a display device, it is preferable that the red light emitting wavelength is 610 nm to 700 nm, the green light emitting wavelength is 495 nm to 565 nm, and the blue light emitting wavelength is 430 nm to 490 nm. When the surface-mounted light emitting device of the present invention emits white mixed color light, the light emitting wavelength of the light emitting element is 400 nm or more in consideration of the complementary color relationship with the light emitting wavelength from the fluorescent substance and the deterioration of the translucent resin. It is preferably 530 nm or less, and more preferably 420 nm or more and 490 nm or less. In order to further improve the excitation and luminous efficiency of the light emitting element and the fluorescent substance, 450 nm or more and 475 nm or less are more preferable. It should be noted that a light emitting element having an ultraviolet region shorter than 400 nm or a short wavelength region of visible light as the main emission wavelength can also be used in combination with a member that is relatively hard to be deteriorated by ultraviolet rays.

The size of the light emitting element 10 can be □ 1 mm size, and □ 600 μm, □ 320 μm size, and the like can also be mounted.

<First resin molded product>
The first resin molded body 40 has a recess 40c having a bottom surface 40a and a side surface 40b. The first resin molded body 40 integrally molds the first lead 20 and the second lead 30 extending outward from the bottom surface a of the recess 40c. The first inner lead portion 20a of the first lead 20 forms a part of the bottom surface 40a of the recess 40c. The second inner lead portion 30a of the second lead 30 forms a part of the bottom surface 40a of the recess 40c, and is separated from the first inner lead portion 20a by a predetermined distance. The light emitting element 10 is placed on the first inner lead portion 20a corresponding to the bottom surface 40a of the recess 40c. The first inner lead portion 20a corresponding to the bottom surface 40a of the recess 40c, the second inner lead portion 30a corresponding to the bottom surface 40a of the recess 40c, the first outer lead portion 20b, and the second outer lead portion 30b , Exposed from the first resin molded body 40. The first lead 20 and the second lead 30 on the back surface side are exposed. As a result, electrical connection can be made from the back surface side.

The recess 40c is inclined so as to have a wide opening in the opening direction. This makes it possible to improve the extraction of light in the forward direction. However, it is also possible to make a cylindrical recess without providing an inclination. Further, although the inclination is preferably smooth, unevenness can be provided. By providing the unevenness, the adhesion of the interface between the first resin molded body 40 and the second resin molded body 50 can be improved. The inclination angle of the recess 40c is preferably 95 ° or more and 150 ° or less as measured from the bottom surface, and particularly preferably 100 ° or more and 120 ° or less.

The shape of the first resin molded body 40 on the main surface side is rectangular, but it can also be elliptical, circular, pentagonal, hexagonal or the like. The shape of the concave portion 40c on the main surface side is elliptical, but it can also be substantially circular, rectangular, pentagonal, hexagonal or the like. A cathode mark is added in certain cases.

The material of the first resin molded body 40 is a thermosetting resin. Among the thermosetting resins, it is preferably formed by at least one selected from the group consisting of epoxy resin, modified epoxy resin, silicone resin, modified silicone resin, acrylate resin, and urethane resin, and particularly epoxy resin and modified epoxy resin. , Silicone resin, modified silicone resin are preferable. For example, an epoxy resin consisting of triglycidyl isocyanurate (Chemical formula 1), hydrided bisphenol A diglycidyl ether (Chemical formula 2), and hexahydrophthalic anhydride (Chemical formula 3), 3-methylhexahydrophthalic anhydride (Chemical formula 4). , 4-Methylhexahydrophthalic anhydride (Pthalic anhydride) and other acid anhydrides were dissolved and mixed in an epoxy resin in an equivalent amount to 100 parts by weight of a colorless and transparent mixture of DBU (1,8) as a curing accelerator. -Diazabicyclo (5,4,0) undecene-7) (Chemical formula 6) is 0.5 parts by weight, ethylene glycol (Chemical anhydride 7) is 1 part by weight as a co-catalyst, titanium oxide pigment is 10 parts by weight, and glass fiber is 50 parts by weight. A solid epoxy resin composition that has been added in parts by weight and partially cured by heating to form a B stage can be used.

The first resin molded body 40 preferably has a hard one because it has a function as a package. Further, the first resin molded body 40 may or may not have translucency, but it can be appropriately designed according to the application and the like. For example, a light-shielding substance can be mixed with the first resin molded product 40 to reduce the light transmitted through the first resin molded product 40. On the other hand, a filler and a diffusing agent may be mixed so that the light from the surface mount type light emitting device is emitted mainly to the front and side uniformly. Further, in order to reduce the absorption of light, a white pigment may be added rather than a dark pigment. As described above, the first resin molded product 40 is mixed with at least one selected from the group consisting of fillers, diffusing agents, pigments, fluorescent substances, reflective substances, and light-shielding substances in order to have a predetermined function. You can also do it.

<First lead and second lead>
The first lead 20 has a first inner lead portion 20a and a first outer lead portion 20b. The bottom surface 40a of the recess 40c of the first resin molded body 40 in the first inner lead portion 20a is exposed, and the light emitting element 10 is placed on it. The exposed first inner lead portion 20a may have an area on which the light emitting element 10 is placed, but a large area is preferable from the viewpoint of thermal conductivity, electrical conductivity, reflection efficiency and the like. .. The first inner lead portion 20a is electrically connected to the first electrode 11 of the light emitting element 10 via a wire 60. The first outer lead portion 20b is a portion exposed from the first resin molded body 40, excluding the portion on which the light emitting element 10 is placed. The first outer lead portion 20b is electrically connected to the external electrode and also has a heat transfer function.

The second lead 30 has a second inner lead portion 30a and a second outer lead portion 30b. The bottom surface 40a of the recess 40c of the first resin molded body 40 in the second inner lead portion 30a is exposed. The exposed second inner lead portion 30b may have an area that is electrically connected to the second electrode 12 of the light emitting element 10, but a large area is preferable from the viewpoint of reflection efficiency. The first outer lead portion 20b and the second outer lead portion 30b on the back surface side are exposed and form substantially the same plane. This makes it possible to improve the mounting stability of the surface mount type light emitting device. Further, in order to prevent a short circuit between the back surfaces of the first inner lead portion 20a and the second inner lead portion 30a due to soldering during soldering, the electrically insulating insulating member 90 can be thinly coated. The insulating member 90 is made of resin or the like.

The first lead 20 and the second lead 30 can be formed by using a good electric conductor such as iron, phosphor bronze, or a copper alloy. Further, in order to improve the reflectance of light from the light emitting element 10, the surfaces of the first lead 20 and the second lead 30 may be plated with a metal such as silver, aluminum, copper or gold. Further, in order to improve the reflectance of the surfaces of the first lead 20 and the second lead 30, it is preferable to smooth the surface. Further, the areas of the first lead 20 and the second lead 300 can be increased in order to improve the heat dissipation. As a result, the temperature rise of the light emitting element 10 can be effectively suppressed, and a relatively large amount of electricity can be passed through the light emitting element 10. Further, the heat dissipation can be improved by making the first lead 20 and the second lead 30 thick. In this case, since it is difficult to perform a molding process such as bending the first lead 20 and the second lead 30, the first lead 20 and the second lead 30 are cut to a predetermined size. Further, by making the first lead 20 and the second lead 30 thick, the deflection of the first lead 20 and the second lead 30 is reduced, and the light emitting element 10 can be easily mounted. .. On the contrary, by forming the first lead 20 and the second lead 30 into a thin flat plate shape, the bending step becomes easy and the molding can be formed into a predetermined shape.

The first lead 20 and the second lead 30 are a pair of positive and negative electrodes. The first lead 20 and the second lead 30 may be at least one each, but a plurality of the first leads 20 and the second lead 30 may be provided. Further, when a plurality of light emitting elements 10 are mounted on the first lead 20, it is also necessary to provide the plurality of second leads 30.

<Second resin molded product>
The second resin molded body 50 is provided to protect the light emitting element 10 from external force from the external environment, dust, moisture, and the like. In addition, the light emitted from the light emitting element 10 can be efficiently emitted to the outside. The second resin molded body 50 is arranged in the recess 40c of the first resin molded body 40.

The material of the second resin molded body 50 is a thermosetting resin. Among the thermosetting resins, it is preferably formed by at least one selected from the group consisting of epoxy resin, modified epoxy resin, silicone resin, modified silicone resin, acrylate resin, and urethane resin, and particularly epoxy resin and modified epoxy resin. , Silicone resin, modified silicone resin are preferable. The second resin molded body 50 is preferably hard in order to protect the light emitting element 10. Further, it is preferable to use a resin having excellent heat resistance, weather resistance, and light resistance for the second resin molded product 50. In order to give the second resin molded product 50 a predetermined function, at least one selected from the group consisting of a filler, a diffusing agent, a pigment, a fluorescent substance, and a reflective substance can be mixed. A diffusing agent may be contained in the second resin molded product 50. As a specific diffusing agent, barium titanate, titanium oxide, aluminum oxide, silicon oxide and the like can be preferably used. Further, an organic or inorganic coloring dye or coloring pigment can be contained for the purpose of cutting an undesired wavelength. Further, the second resin molded body 50 can also contain a fluorescent substance 80 that absorbs light from the light emitting element 10 and converts the wavelength.

(Fluorescent substance)
The fluorescent substance 80 may be any substance that absorbs the light from the light emitting element 10 and converts the wavelength into light having a different wavelength. For example, nitride-based phosphors, oxynitride-based phosphors, sialone-based phosphors, which are mainly activated by lanthanoid-based elements such as Eu and Ce, lanthanoid-based elements such as Eu, and transition metal-based elements such as Mn. Alkaline earth halogen apatite phosphor, alkaline earth metal halogen aborate phosphor, alkaline earth metal aluminate phosphor, alkaline earth silicate, alkaline earth sulfide, alkaline earth thiogallate , Alkaline earth Silicon nitride, germanate, or organic and mainly activated by lanthanoid elements such as rare earth aluminate, rare earth silicate or Eu, which are mainly activated by lanthanoid elements such as Ce. It is preferably at least one or more selected from organic complexes and the like. As a specific example, the following phosphors can be used, but are not limited thereto.

Nitride-based phosphors mainly activated by lanthanoid-based elements such as Eu and Ce are selected from M ₂ Si ₅ N ₈ : Eu and CaAlSiN ₃ : Eu (M is selected from Sr, Ca, Ba, Mg and Zn). There is at least one kind.) In addition to M ₂ Si ₅ N ₈ : Eu, M Si ₇ N ₁₀ : Eu, M _1.8 Si ₅ O _0.2 N ₈ : Eu, M _0.9 Si ₇ O _0.1 N ₁₀ : Eu (M) Is at least one selected from Sr, Ca, Ba, Mg, Zn.) And the like.

The oxynitride phosphors mainly activated by lanthanoid elements such as Eu and Ce are MSi ₂ O ₂ N ₂ : Eu (M is at least one selected from Sr, Ca, Ba, Mg and Zn). Is.) And so on.

The sialone-based phosphors mainly activated by lanthanoid-based elements such as Eu and Ce are M _{p / 2} Si _12-p-q Al _{p + q} O _q N _16-p : Ce, M-Al-Si-ON. (M is at least one selected from Sr, Ca, Ba, Mg, and Zn. Q is 0 to 2.5, and p is 1.5 to 3.).

Alkaline earth halogen apatite phosphors that are mainly activated by lanthanoid-based elements such as Eu and transition metal-based elements such as Mn include M ₅ (PO ₄ ) ₃ X: R (M is Sr, Ca, Ba). , Mg, Zn at least one selected. X is at least one selected from F, Cl, Br, I. R is any one or more of Eu, Mn, Eu and Mn. There are.) And so on.

The alkali earth metal halide halogen phosphor is at least one selected from M ₂ B ₅ O ₉ X: R (M is Sr, Ca, Ba, Mg, Zn. X is F, Cl. , Br, and at least one selected from I. R is any one or more of Eu, Mn, and Eu and Mn.) And the like.

Alkaline earth metal aluminate phosphors include SrAl ₂ O ₄ : R, Sr ₄ Al ₁₄ O ₂₅ : R, CaAl ₂ O ₄ : R, BaMg ₂ Al ₁₆ O ₂₇ : R, BaMg ₂ Al ₁₆ O ₁₂ : R, BaMgAl ₁₀ O ₁₇ : R (R is any one or more of Eu, Mn, Eu and Mn) and the like.

Alkaline earth sulfide phosphors include La ₂ O ₂ S: Eu, Y ₂ O ₂ S: Eu, Gd ₂ O ₂ S: Eu and the like.

Rare earth aluminate phosphors that are mainly activated by lanthanoid elements such as Ce include Y ₃ Al ₅ O ₁₂ : Ce, (Y _0.8 Gd _0.2 ) ₃ Al ₅ O ₁₂ : Ce, Y ₃ (Al _0.8 Ga _0.2 ) ₅ O ₁₂ : Ce, (Y, Gd) ₃ (Al, Ga) There are YAG-based phosphors represented by the composition formula of ₅ O ₁₂ . Further, there are also Tb ₃ Al ₅ O ₁₂ : Ce and Lu ₃ Al ₅ O ₁₂ : Ce in which part or all of Y is replaced with Tb, Lu or the like.

Other phosphors include ZnS: Eu, Zn ₂ GeO ₄ : Mn, Mga ₂ S ₄ : Eu (M is at least one selected from Sr, Ca, Ba, Mg, Zn. X is at least one kind. At least one selected from F, Cl, Br, and I) and the like.

The above-mentioned phosphor contains at least one selected from Tb, Cu, Ag, Au, Cr, Nd, Dy, Co, Ni and Ti in place of Eu or in addition to Eu, if desired. You can also do it.

Further, a fluorescent substance other than the above-mentioned fluorescent substance, which has the same performance and effect, can also be used.

As these phosphors, phosphors having emission spectra in yellow, red, green, and blue can be used by the excitation light of the light emitting element 10, and they also emit light in intermediate colors such as yellow, bluish green, and orange. Fluorescent materials having a spectrum can also be used. By using various combinations of these phosphors, it is possible to manufacture a surface mount type light emitting device having various light emitting colors.

For example, using a GaN-based compound semiconductor that emits blue light, a fluorescent substance of Y ₃ Al ₅ O ₁₂ : Ce or (Y _0.8 Gd _0.2 ) ₃ Al ₅ O ₁₂ : Ce is irradiated to perform wavelength conversion. Do. It is possible to provide a surface mount type light emitting device that emits white light by a mixed color of the light from the light emitting element 10 and the light from the phosphor 60.

For example, CaSi ₂ O ₂ N ₂ : Eu or SrSi ₂ O ₂ N ₂ : Eu that emits light from green to yellow and (Sr, Ca) ₅ (PO ₄ ) ₃ Cl: Eu that emits light in blue, which is a phosphor. By using a phosphor 60 composed of (Ca, Sr) ₂ Si ₅ N ₈ : Eu, which emits light in red, a surface-mounted light emitting device that emits light in white with good color rendering properties can be provided. .. Since this uses red, blue, and green, which are the three sources of color, the desired white light can be achieved only by changing the blending ratio of the first phosphor and the second phosphor. Can be done.

(Other)
The surface mount type light emitting device may be further provided with a Zener diode as a protective element. The Zener diode can be placed on the first lead 20 on the bottom surface 40a of the recess 40c apart from the light emitting element 10. Further, the Zener diode may be mounted on the first lead 20 on the bottom surface 40a of the recess 40c, and the light emitting element 10 may be mounted on the first lead 20. In addition to □ 280 μm size, □ 300 μm size and the like can also be used.

The wire 60 electrically connects the second electrode 12 and the second lead 30 of the light emitting element 10 and the first electrode 11 and the first lead 20 of the light emitting element 10. The wire 60 is required to have good ohmic properties, mechanical connectivity, electrical conductivity, and thermal conductivity with the electrodes of the light emitting element 10. The thermal conductivity is preferably 0.01 cal / (S) (cm ² ) (° C / cm) or more, more preferably 0.5 cal / (S) (cm ² ) (° C / cm) or more. A wire is stretched from directly above the light emitting element 10 to the wire bonding area of the plated wiring pattern to ensure continuity.

By adopting the above configuration, the surface mount type light emitting device according to the present invention can be provided.

<Mounting state of surface mount type light emitting device>
The mounting state electrically connected to the external electrode by using the surface mount type light emitting device is shown. FIG. 3 is a schematic cross-sectional view showing a mounted state of the surface mount type light emitting device according to the first embodiment.

A heat radiating member 110 can be provided on the back surface side of the surface mount type light emitting device via the heat radiating adhesive 100. The heat-dissipating adhesive 100 preferably has higher thermal conductivity than the material of the first resin molded body 40. As the material of the heat radiating adhesive 100, an electrically insulating epoxy resin, a silicone resin, or the like can be used. The material of the heat radiating member 110 is preferably aluminum, copper, tungsten, gold or the like having good thermoconductivity. In addition, by providing the heat radiating member 110 via the heat radiating adhesive 109 so as to contact only the first lead 20, a eutectic metal containing solder having better thermoconductivity can be used as the heat radiating adhesive. .. Since the back surface side of the surface mount type light emitting device is flat, stability at the time of mounting on the heat radiating member 110 can be maintained. In particular, since the first lead 20 and the heat radiating member 110 are provided so as to take the shortest distance from the light emitting element 10, the heat radiating property is high.

The first outer lead portion 20b of the first lead 20 and the second outer lead portion 30b of the second lead 30 are electrically connected to the external electrode. Since the first lead 20 and the second lead 30 are thick flat plates, they are electrically connected so as to be sandwiched between the external electrode and the heat radiating member 90. Lead-free solder is used for the electrical connection between the first outer lead portion 20b and the second outer lead portion 30b and the external electrode. In addition, it is also possible to electrically connect the first outer lead portion 20b or the like so as to be placed on the external electrode.

<Second Embodiment>
The surface mount type light emitting device according to the second embodiment will be described. The description of the portion having the same configuration as that of the surface mount type light emitting device according to the first embodiment will be omitted. FIG. 4 is a schematic plan view showing the surface mount type light emitting device according to the second embodiment.

In this surface mount type light emitting device, the first lead 21 and the second lead 31 are provided with irregularities to expand the contact area with the first resin molded body 40. As a result, it is possible to prevent the first lead 21 and the second lead 31 from being pulled out from the first resin molded body 40.

<Third embodiment>
The surface mount type light emitting device according to the third embodiment will be described. The description of the portion having the same configuration as that of the surface mount type light emitting device according to the first embodiment will be omitted. FIG. 5 is a schematic cross-sectional view showing a surface mount type light emitting device according to a third embodiment.

In this surface mount type light emitting device, a thin flat plate is used for the first lead 22 and the second lead 32. This makes it possible to provide a smaller and thinner surface mount type light emitting device. The thin flat plate shape can be a rectangular shape as shown in the first embodiment, or can be a shape provided with irregularities as shown in the second embodiment.

<Fourth Embodiment>
The surface mount type light emitting device according to the fourth embodiment will be described. The description of the portion having the same configuration as that of the surface mount type light emitting device according to the third embodiment will be omitted. FIG. 6 is a schematic cross-sectional view showing a surface mount type light emitting device according to a fourth embodiment.

In this surface mount type light emitting device, the first lead 23 and the second lead 33 are bent toward the main surface side. This is because the first lead 23 and the second lead 33 are thinned, so that they can be easily bent. As a result, at the time of mounting, the solder crawls up to the bent first outer lead portion 23b and the second outer lead portion 33b, and can be firmly fixed. In the transfer molding process in which the first resin is poured, since the first inner lead portion 23a and the second inner lead portion 33b are sandwiched between the upper mold and the lower mold, the first inner lead portion 23a and the first inner lead portion 23a Even if the inner lead portion 33b of No. 2 is thin, burrs do not occur.

<Fifth Embodiment>
The surface mount type light emitting device according to the fifth embodiment will be described. The description of the portion having the same configuration as that of the surface mount type light emitting device according to the third embodiment will be omitted. FIG. 7 is a schematic cross-sectional view showing a surface mount type light emitting device according to a fifth embodiment. FIG. 8 is a schematic cross-sectional view showing a mounted state of the surface mount type light emitting device according to the fifth embodiment.

In this surface mount type light emitting device, the first outer lead portion 24b and the second outer lead portion 34b are bent toward the main surface side and further bent outward. As a result, since the surface mount type light emitting device is sandwiched between the heat radiating member 90 and the external electrode, it is easy to mount and the mounting stability can be improved. Further, the connection position between the first lead 24 and the second lead 34 and the external electrode can be made higher than the fixed position between the first lead 24 and the second lead 34 and the heat radiating member 90. As a result, the entire surface mount type light emitting device excluding the light emitting surface can be hidden from the mounting board, so that the mounting board itself can be efficiently used as a reflective material.

<Sixth Embodiment>
The surface mount type light emitting device according to the sixth embodiment will be described. The description of the portion having the same configuration as that of the surface mount type light emitting device according to the third embodiment will be omitted. FIG. 9 is a schematic cross-sectional view showing the surface mount type light emitting device according to the sixth embodiment.

In this surface mount type light emitting device, the heat radiating member 91 is incorporated in the first resin molded body 41. The heat radiating member 91 is arranged on the back surface of the first inner lead portion 25a. This makes it possible to provide a surface mount type light emitting device having the heat radiating member 91 integrally. Further, it is not necessary to provide the heat radiating member 91 as a separate member, and it is not necessary to consider the adhesion between the surface mount type light emitting device and the heat radiating member 91. Further, the heat radiating member 91 can be made substantially flush with the back surface side of the first resin molded body 41, and the stability of the surface mount type light emitting device can be improved. The first outer lead portion 25b and the second outer lead portion 35b are bent into a predetermined shape.

In this surface mount type light emitting device, the first inner lead portion 25a and the second inner lead portion 35a are sandwiched between the upper mold and the lower mold, and a predetermined recess is formed between the first inner lead portion 25a and the first inner lead portion 25a. It is provided on the main surface side and the back surface side of the inner lead portion 35a of 2. As a result, it is possible to more effectively prevent the first inner lead portion 25a and the second inner lead portion 35a from being pulled out. Further, it is possible to provide a surface mount type light emitting device having a predetermined thickness.

<Manufacturing method of surface mount type light emitting device>
A method for manufacturing a surface mount type light emitting device according to the present invention will be described. This manufacturing method relates to the above-mentioned surface mount type light emitting device. 10 (a) to 10 (e) are schematic cross-sectional views showing a manufacturing process of the surface mount type light emitting device according to the first embodiment.

The first inner lead portion 20a and the second inner lead portion 30a, and the first outer lead portion 20b and the second outer lead portion 30b corresponding to the bottom surface 40a of the recess 40c of the first resin molded body 40 are formed. It is sandwiched between the upper mold 120 and the lower mold 121 (first step).

The upper mold 120 forms a recess corresponding to the recess of the first resin molded body. The portion of the upper mold 120 corresponding to the bottom surface 40a of the recess 40c of the first resin molded body 40 is formed so as to come into contact with the first inner lead portion 20a and the second inner lead portion 30a.

The first thermosetting resin is poured into the recessed portion sandwiched between the upper mold 120 and the lower mold 121 by a transfer molding step (second step).

In the transfer molding step, a pellet-shaped first thermosetting resin having a predetermined size is placed in a predetermined container. Pressure is applied to the predetermined container. The first thermosetting resin in a molten state is poured into the recessed portion sandwiched between the upper mold 120 and the lower mold 121 connected from the predetermined container. The upper mold 120 and the lower mold 121 are heated to a predetermined temperature, and the first thermosetting resin poured therein is cured. This series of processes is called a transfer molding process.

Since the first inner lead portion 20a and the second inner lead portion 30a are sandwiched, the first inner lead portion 20a and the second inner lead portion 30a do not flutter when the first thermosetting resin is poured. , The occurrence of burrs can be suppressed.

The poured first thermosetting resin is heated and cured to form the first resin molded body 40 (third step).

As a result, the first resin molded body 40 using the thermosetting resin is molded. This makes it possible to provide a package having excellent heat resistance, light resistance, adhesion and the like. Further, it is possible to provide a first resin molded body 40 using a thermosetting resin having a recess 40c having a bottom surface 40a and a side surface 40b.

The upper mold 120 and the lower mold 121 are removed (fourth step).

The upper mold 120 and the lower mold 121 are removed in order to place the light emitting element 10. If the curing is insufficient, post-curing is performed to improve the mechanical strength of the resin molded body 40 to the extent that no problem occurs in the work.

The light emitting element 10 is placed on the first inner lead portion 20a. The first electrode 11 of the light emitting element 10 and the first inner lead portion 20a are electrically connected. The second electrode 12 of the light emitting element 10 and the second inner lead portion 20b are electrically connected (fifth step).

The first electrode 11 and the first inner lead portion 20a are electrically connected via a wire 60. However, when the light emitting element 10 has electrodes on the upper surface and the lower surface, electrical connection is made only by die bonding without using wires. Next, the second electrode 12 and the second inner lead portion 30a are electrically connected via the wire 60.

The second thermosetting resin is arranged in the recess 40c on which the light emitting element 10 is placed (sixth step).

As a method for arranging the second thermosetting resin, a dropping means, an injection means, an extrusion means, or the like can be used, but it is preferable to use the dropping means. This is because the air remaining in the recess 40c can be effectively expelled by using the dropping means. The second thermosetting resin is preferably mixed with the fluorescent substance 80. This makes it possible to easily adjust the color tone of the surface mount type light emitting device.

The second thermosetting resin is heated and cured to form a second resin molded product (seventh step).

This makes it possible to easily manufacture a surface mount type light emitting device. Further, the first resin molded body 40 and the second resin molded body 50 can be molded with a thermosetting resin, and a surface mount type light emitting device having high adhesion can be provided. Further, it is possible to provide a surface mount type light emitting device having excellent heat resistance, light resistance, adhesion and the like without peeling of the interface between the first resin molded body 40 and the second resin molded body 50. ..

The surface mount type light emitting device according to the first embodiment is shown in FIGS. 1 and 2. The description will be omitted where the same configuration as that of the surface mount type light emitting device according to the first embodiment is adopted.

The surface mount type light emitting device according to the first embodiment includes a light emitting element 10, a first resin molded body 40 on which the light emitting element 10 is placed, and a second resin molded body 50 that covers the light emitting element 10. The first resin molded body 40 integrally molds a first lead 20 for mounting the light emitting element 10 and a second lead 30 electrically connected to the light emitting element 10. The first resin molded body 40 has a recess 40c having a bottom surface 40a and a side surface 40b, and the opening of the recess 40c is wider than the bottom surface 40a, and the side surface 40b is provided with an inclination. ..

The light emitting element 10 is a GaN-based device that emits blue light. The light emitting element 10 has a first electrode 11 and a second electrode 12 on the same surface side, and is adhered to the first lead 20 face-up using a die bond resin (epoxy resin containing silver). There is. The first electrode 11 is electrically connected to the first lead 20 by using a gold wire 60. The second electrode 11 is also electrically connected to the second lead 30 by using a gold wire 60. Copper is used as the base material for the first lead 20 and the second lead 30, and the portion exposed from the first resin molded body 40 is silver-plated. The first lead 20 and the second lead 30 are made of a slightly thick plate (about 0.5 mm), and the back surfaces of the first lead 20 and the second lead 30 are exposed. The first resin molded body 40 includes 100 parts by weight of a mixture of an epoxy resin made of triglycidyl isocyanurate and an acid anhydride made of hexahydrophthalic anhydride in an equivalent ratio, 0.5 part by weight of DBU, and 1 part by weight of ethylene glycol. , 10 parts by weight of titanium oxide pigment and 50 parts by weight of glass fiber are added. Silicone resin is used for the second resin molded body 50. The second resin molded product 50 is uniformly mixed with a YAG-based phosphor 80 having a composition of (Y _0.8 Gd _0.2 ) ₃ Al ₅ O ₁₂ : Ce. The second resin molded body 50 is arranged in the recess 40c having the bottom surface 40a and the side surface 40b, and the surface of the second resin molded body 50 coincides with the upper surface of the recess 40c. As a result, the amount of YAG-based phosphor 80 for each product is made uniform. An insulating member 90 made of an epoxy resin sheet having a predetermined thickness is attached to the back surface side of the first lead 20 and the second lead 30.

The surface mount type light emitting device according to the first embodiment is manufactured by the following steps. FIG. 10 is a schematic cross-sectional view showing a manufacturing process of the surface mount type light emitting device according to the first embodiment.

Punching is performed on a predetermined lead frame, and a plurality of first leads 20 and second leads 30 are provided. The lead frame is fixed to the lower mold 121 heated to about 150 ° C. Similarly, the lead frame is sandwiched between the upper mold 120 heated to about 150 ° C. The sandwiching is a portion corresponding to the inner lead portions 20a and 30a and the outer lead portions 20b and 30b of the first lead 20 and the second lead 30. A tablet obtained by locking the above epoxy resin composition corresponding to the first resin molded product 40 is placed in the mold cylinder portion. This tablet is poured into the mold by a piston (transfer mold). The poured epoxy resin is temporarily cured by heating it in a mold at about 150 ° C. for about 3 minutes. Next, the upper mold 120 and the lower mold 121 are separated, and the semi-cured product of the epoxy resin composition is taken out from the mold. After taking it out, it is further heated at about 150 ° C. for about 3 hours to be finally cured. As a result, a lead frame obtained by molding the first resin molded body 40 is obtained from the completely cured product of the above epoxy resin composition integrally molded with the lead frame. The first resin molded body 40 forms a recess 40c having a bottom surface 40a and a side surface 40b, and the lead frame is exposed on the bottom surface 40a. The outer lead portions 20b and 30b of the lead frame are plated.

Next, the light emitting element 10 is die-bonded to the bottom surface 40a of the recess 40c. A wire 60 is attached to the first electrode 11 of the light emitting element 10 and the first inner lead portion 20a of the first lead 20, and the second electrode 12 and the second inner lead portion 30a of the second lead 30, respectively. Use to connect electrically.

Next, a silicone resin corresponding to the second resin molded product 50, which is a uniformly mixed YAG-based phosphor 80, is dropped onto the upper surface of the recess 40c. The YAG-based phosphor 80 precipitates due to the viscosity of the silicone resin or the like. When the YAG-based phosphor 80 is precipitated, the YAG-based phosphor can be arranged around the light emitting element 10, and a surface mount type light emitting device having a predetermined color tone can be provided. After dropping the silicone resin, it is cured to form a second resin molded product 50.

Finally, the lead frame is cut out at a predetermined position to form the first outer lead portion 20b and the second outer lead portion 30b. As a result, the surface mount type light emitting device according to the first embodiment can be manufactured.

The surface mount type light emitting device of the present invention can be used for lighting equipment, displays, backlights for mobile phones, flashlights for cameras, auxiliary light sources for moving images, and the like.

10 Light emitting element 11 1st electrode 12 2nd electrode 20 1st lead 20a 1st inner lead part 20b 1st outer lead part 30 2nd lead 30a 2nd inner lead part 30b 2nd outer lead Part 40 First resin molded body 40a Bottom surface 40b Side surface 40c Recess 50 Second resin molding body 60 Wire 70 Filler 80 Fluorescent material 90 Insulating member 100 Heat dissipation adhesive 110 Heat dissipation member 120 Upper mold 121 Lower mold 210 Light emitting element 220 Lead frame for mounting 230 Lead frame for connection 240 Mold 250 Translucent sealing resin

Claims (13)

A first thermosetting resin is used to connect the light emitting element, the first lead for mounting the light emitting element, and the second lead that is electrically connected to the light emitting element without mounting the light emitting element. A surface-mounted light emitting device having a first resin molded body integrally molded and a second resin molded body that coats a light emitting element with a second thermosetting resin.
The light emitting element has a light emitting wavelength of 420 nm or more and 490 nm or less.
The first resin molded body is formed with a recess having a bottom surface and a side surface, and the first lead is exposed from the bottom surface of the recessed portion of the first resin molded body, and the light emitting element is exposed in the exposed portion. Is placed,
The first resin molded body is formed of the same member between the first reed and the second reed, which is the bottom surface of the recess, and the side surface of the recess.
The back surface side opposite to the main surface side of the region where the light emitting element of the first lead is placed is exposed from the first resin molded body so that the heat from the light emitting element can be dissipated to the outside in the shortest distance. And
The back surface side of the second lead is exposed from the first resin molded body.
The first lead and the second lead are flat and flat.
The fully exposed portion on the back surface side of the first lead, the fully exposed portion on the back surface side of the second lead, and the back surface side of the first resin molded product are substantially on the same plane.
The fully exposed portion on the back surface side of the first lead is a continuous flat plate that is substantially coplanar, and the fully exposed portion on the back surface side of the second lead is a continuous flat plate that is substantially coplanar. It is in the shape
The first resin molded product has a width wider than the width of the first lead in the lateral direction and the width of the second lead in the lateral direction in a plan view.
The first resin molded product is made of an epoxy resin having triglycidyl isocyanurate and an acid anhydride, and is mixed with a reflective substance.
The second resin molded body is a surface-mounted light emitting device made of a silicone resin or a modified silicone resin and mixed with a fluorescent substance. A first thermosetting resin is used to connect the light emitting element, the first lead for mounting the light emitting element, and the second lead that is electrically connected to the light emitting element without mounting the light emitting element. A surface-mounted light emitting device having a first resin molded body integrally molded and a second resin molded body that coats a light emitting element with a second thermosetting resin.
The light emitting element has a light emitting wavelength of 420 nm or more and 490 nm or less.
The first lead has a first inner lead portion and a first outer lead portion, and the first inner lead portion has a light emitting element mounted on the first inner lead portion and has a first light emitting element. It is electrically connected to the electrode, and the first outer lead portion is exposed from the first resin molded body.
The second lead has a second inner lead portion and a second outer lead portion, and the second inner lead portion has a second electrode and electricity of the light emitting element without mounting the light emitting element. The second outer lead portion is exposed from the first resin molded body.
The first resin molded body is formed with a recess having a bottom surface and a side surface, and a first inner lead portion is exposed from the bottom surface of the recessed portion of the first resin molded body, and a light emitting element is exposed in the exposed portion. Is placed,
In the first resin molded body, the space between the first inner lead portion and the second inner lead portion, which is the bottom surface of the recess, and the side surface of the recess are formed of the same member.
The back surface side opposite to the main surface side of the region where the light emitting element of the first inner lead portion is placed is exposed from the first resin molded body so that the heat from the light emitting element can be dissipated to the outside in the shortest distance. Has been
The back surface side of the second inner lead portion is exposed from the first resin molded body.
The first lead and the second lead are flat and flat.
The fully exposed portion on the back surface side of the first lead, the fully exposed portion on the back surface side of the second lead, and the back surface side of the first resin molded product are substantially on the same plane.
The fully exposed portion on the back surface side of the first lead is a continuous flat plate that is substantially coplanar, and the fully exposed portion on the back surface side of the second lead is a continuous flat plate that is substantially coplanar. It is in the shape
The first resin molded product has a width wider than the width of the first lead in the lateral direction and the width of the second lead in the lateral direction in a plan view.
The first resin molded body is made of an epoxy resin having triglycidyl isocyanurate and an acid anhydride, and a reflective substance is mixed, and the light emitted from the light emitting element is the light emitted from the first resin molded body. The bottom and sides of the recess are illuminated, reflected, and
The second resin molded body is a surface-mounted light emitting device made of a silicone resin or a modified silicone resin and mixed with a fluorescent substance. The surface mount type light emitting device according to claim 1 or 2, wherein the fluorescent substance is settled on the bottom surface side of the recess. The surface mount type light emitting device according to claim 2 , wherein the exposed portion on the back surface side of the first inner lead portion is arranged so as to come into contact with the heat radiating member. The method according to any one of claims 1 to 4, wherein the recess is provided with a wide slope in the opening direction, and the tilt angle of the recess is 95 ° or more and 150 ° or less as measured from the bottom surface. Surface mount type light emitting device. The surface mount type light emitting device according to any one of claims 1 to 5, wherein a titanium oxide pigment is mixed in the first resin molded product. A resin molded body for a surface-mounted light emitting device, in which a first lead on which a light emitting element is mounted and a second lead on which a light emitting element is not mounted are integrally molded using a thermosetting resin. ,
The resin molded body has a bottom surface and a side surface, and a recess serving as an arrangement region of the silicone resin or the modified silicone resin is formed, and the first lead and the second lead are exposed from the bottom surface of the recessed portion of the resin molded body. And
The first lead of the exposed portion includes a mounting region of a light emitting element having an emission wavelength of 420 nm or more and 490 nm or less, and the back surface side opposite to the main surface side of the region on which the light emitting element of the first lead is mounted. Is exposed from the resin molded body so that the heat from the light emitting element can be dissipated to the outside in the shortest distance when the surface mount type light emitting device is used.
The back surface side of the second lead of the exposed portion is exposed from the resin molded body.
The first lead and the second lead are flat and flat.
The fully exposed portion on the back surface side of the first lead, the fully exposed portion on the back surface side of the second lead, and the back surface side of the resin molded product are substantially on the same plane.
The fully exposed portion on the back surface side of the first lead is a continuous flat plate that is substantially coplanar, and the fully exposed portion on the back surface side of the second lead is a continuous flat plate that is substantially coplanar. It is in the shape
The resin molded body has a width wider than the width of the first lead in the lateral direction and the width of the second lead in the lateral direction in a plan view.
The resin molded body is formed of the same member between the first reed and the second reed, which is the bottom surface of the recess, and the side surface of the recess.
The resin molded body is made of an epoxy resin having triglycidyl isocyanurate and an acid anhydride, and is characterized in that a reflective substance is mixed. A resin molded body for a surface-mounted light emitting device, in which a first reed for placing a light emitting element and a second lead on which a light emitting element is not placed are integrally molded using a thermosetting resin. ,
The first lead has a first inner lead portion and a first outer lead portion, the first inner lead portion is arranged in the resin molded body, and the first outer lead portion is made of resin. Exposed from the molded body
The second lead has a second inner lead portion and a second outer lead portion, the second inner lead portion is arranged on the resin molded body, and the second outer lead portion is resin molded. Exposed to the outside from the body
The resin molded body has a bottom surface and a side surface, and a recess is formed as a region for arranging the silicone resin or the modified silicone resin. From the bottom surface of the recessed portion of the resin molded body, a first inner lead portion and a second inner lead The part is exposed,
The first inner lead portion exposed from the bottom surface of the recess includes a mounting region for a light emitting element having an emission wavelength of 420 nm or more and 490 nm or less.
The back side of the first inner lead portion opposite to the main surface side of the area where the light emitting element is placed so that the heat from the light emitting element can be dissipated to the outside in the shortest distance when the surface mount type light emitting device is used. , Exposed from the resin molded body,
The back surface side of the second inner lead portion exposed from the bottom surface of the recess is exposed from the resin molded body.
The first lead and the second lead are flat and flat.
The fully exposed portion on the back surface side of the first lead, the fully exposed portion on the back surface side of the second lead, and the back surface side of the resin molded product are substantially on the same plane.
The fully exposed portion on the back surface side of the first lead is a continuous flat plate that is substantially coplanar, and the fully exposed portion on the back surface side of the second lead is a continuous flat plate that is substantially coplanar. It is in the shape
The resin molded body has a width wider than the width of the first lead in the lateral direction and the width of the second lead in the lateral direction in a plan view.
The resin molded body is formed of the same member between the first inner lead portion and the second inner lead portion, which is the bottom surface of the recess, and the side surface of the recess.
The resin molded body is made of an epoxy resin having triglycidyl isocyanurate and an acid anhydride, and a reflective substance is mixed, and the light emitted from the light emitting element is emitted to the bottom surface and the side surface of the recess of the resin molded body. A resin molded product characterized by being irradiated and reflected. The resin molded product according to claim 7 or 8, wherein a titanium oxide pigment is mixed with the thermosetting resin. The method according to any one of claims 7 to 9, wherein the recess is provided with an inclination having a wide opening in the opening direction, and the inclination angle of the recess is 95 ° or more and 150 ° or less as measured from the bottom surface. Resin molded body. A silicone resin or modified silicone having a bottom surface and side surfaces, which is formed by integrally molding a first lead for placing a light emitting element and a second lead on which the light emitting element is not placed using a thermosetting resin. A method for manufacturing a resin molded product for a surface-mounted light emitting device, in which a recess serving as a resin placement region is formed.
The first lead and the second lead are flat and flat.
The upper mold forms a recess corresponding to a recess of the resin molded body, the first lead has a first inner lead portion and a first outer lead portion, and the second lead has a second lead. It has two inner lead parts and a second outer lead part.
The first inner lead portion and the second inner lead portion, and the first outer lead portion and the second, including the mounting region of the light emitting element whose emission wavelength corresponding to the bottom surface of the recess of the resin molded body is 420 nm or more and 490 nm or less. The outer lead portion of the first inner lead portion is made of resin in order to dissipate heat from the light emitting element to the outside in the shortest distance when the back surface side of the mounting region of the light emitting element of the first inner lead portion is a surface-mounted light emitting device. The first step of being sandwiched between the upper mold and the lower mold so that it is exposed from the body,
A thermosetting resin mixed with a reflective substance is poured into the recessed portion sandwiched between the upper mold and the lower mold by a transfer molding process using an epoxy resin having triglycidyl isocyanurate and an acid anhydride. The second step and
It was poured between the first inner lead portion and the second inner lead portion, which is the bottom surface of the concave portion of the resin molded body, and on the side surface of the concave portion of the resin molded body, and the unevenness of the first lead and the second lead. The thermosetting resin poured so as to come into contact with the resin is heated and cured, and the fully exposed portion on the back surface side of the first lead, the fully exposed portion on the back surface side of the second lead, and the back surface of the resin molded product. The sides are substantially coplanar, and the entire exposed portion of the back side of the first lead remains a continuous flat plate that is substantially coplanar, and the entire back side of the second lead. The exposed portion remains a continuous flat plate that is substantially coplanar and has a width wider than the lateral width of the first lead and the lateral width of the second lead in plan view. A method for producing a resin molded product, which comprises a third step of molding the resin molded product as described above. A recess having a bottom surface and a side surface is formed by integrally molding a first lead for placing a light emitting element and a second lead on which the light emitting element is not placed using a first thermosetting resin. A surface having a first resin molded body, a light emitting element mounted on a first lead, and a second resin molded body that coats the light emitting element with a second thermosetting resin. It is a manufacturing method of a mountable light emitting device.
The first lead and the second lead are flat and flat.
The upper mold forms a recess corresponding to a recess of the first resin molded body, and the first lead has a first inner lead portion and a first outer lead portion, and a second The lead has a second inner lead portion and a second outer lead portion, and the first lead and the second lead are outward from the bottom surface of the recess in a plan view of the bottom surface of the recess from above. It extends in opposite directions, and the side surface extending along the extending direction has an uneven shape.
The first inner lead portion, the second inner lead portion, and the first outer lead portion including the mounting region of the light emitting element having a light emitting wavelength of 420 nm or more and 490 nm or less corresponding to the bottom surface of the concave portion of the first resin molded body. And the second outer lead portion is for dissipating heat from the light emitting element to the outside in the shortest distance when the back surface side of the mounting region of the light emitting element of the first inner lead portion is a surface-mounted light emitting device. , The first step of being sandwiched between the upper mold and the lower mold so as to be exposed from the first resin molded body,
A first thermosetting resin in which a reflective substance is mixed with an epoxy resin having triglycidyl isocyanurate and an acid anhydride in the recessed portion sandwiched between the upper mold and the lower mold is a transfer molding process. The second process, which is poured by
It was poured between the first inner lead portion and the second inner lead portion, which is the bottom surface of the concave portion of the first resin molded body, and on the side surface of the concave portion of the first resin molded body, and the first lead and The first thermosetting resin poured so as to come into contact with the unevenness of the second lead is heated and cured, and the fully exposed portion on the back surface side of the first lead and the entire back surface side of the second lead. The exposed portion and the back surface side of the first resin molded product are substantially on the same plane, and the entire exposed portion on the back surface side of the first lead remains in a continuous flat plate shape on substantially the same plane. The fully exposed portion on the back surface side of the second lead remains substantially in the same plane as a continuous flat plate, and the width of the first lead in the plan view in the lateral direction and the second lead. A third step in which the first resin molded body is molded so as to have a width wider than the width in the lateral direction of
The fourth process in which the upper mold is removed,
The light emitting element is placed on the first inner lead portion, and the first electrode of the light emitting element and the first inner lead portion are electrically connected to each other, and the second electrode of the light emitting element and the second The fifth step of electrically connecting the inner lead part of the
A sixth step of using a silicone resin or a modified silicone resin in the recess in which the light emitting element is placed and dropping a second thermosetting resin mixed with a fluorescent substance onto the upper surface of the recess.
A method for manufacturing a surface mount type light emitting device, comprising a seventh step of heating and curing the second thermosetting resin to form a second resin molded body. The method for manufacturing a surface mount type light emitting device according to claim 12, wherein the fluorescent substance mixed with the second thermosetting resin is precipitated and arranged around the light emitting element.

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