JP2008252148A - Package for light-emitting device and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a surface mount type light-emitting device having excellent light resistance and mass productivity. <P>SOLUTION: The surface mount type light-emitting device has: a light-emitting element 10; a circuit board 20 on which the light-emitting element 10 is placed; a wall section 50 that is formed on the circuit board 20 and reflects light from the light-emitting element 10; and a light-transmitting sealing member 70 for covering the light-emitting element 10. The wall section 50 is formed of a thermosetting resin, adheres to the circuit board 20, and is formed by transfer molding. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a surface-mounted light-emitting device used for a lighting fixture, a display, a backlight of a mobile phone, a moving image illumination auxiliary light source, other general consumer light sources, and a manufacturing method thereof.

  A surface-mounted light-emitting device using a light-emitting element emits light of a bright color that is small and power efficient. In addition, since this light emitting element is a semiconductor element, there is no fear of a broken ball. Further, it has excellent initial driving characteristics and is strong against vibration and repeated on / off lighting. Because of such excellent characteristics, light-emitting devices using light-emitting elements such as light-emitting diodes (LEDs) and laser diodes (LDs) are used as various light sources.

  FIG. 7 is a schematic cross-sectional view of a conventional surface mount light emitting device. The surface-mount light-emitting device includes an LED element 501, a substrate 502 on which the LED element 501 is mounted, a reflection frame 503 provided around the LED element 501, and a translucent resin 504 that covers the LED element 501. (For example, refer to the prior art in Patent Document 1). Since the surface mount type light emitting device in which the LED element 501 is mounted on the substrate 502 gives priority to mass production, the reflective frame 503 has a liquid crystal polymer, PBT (polybutylene terephthalate), PPS (polyphenylene sulfide), nylon, etc. A thermoplastic resin is often used. Further, the thermoplastic resin used for the reflection frame 503 needs to have heat resistance that can withstand reflow soldering heat. In addition, the reflection frame 503 formed on the substrate 502 is bonded using an adhesive 505. Since the thermoplastic resin used for the reflective frame 503 is generally difficult to adhere, adhesion is required. Therefore, an adhesive 505 is used to adhere the reflection frame 503 to the substrate 502. The reflective frame 503 using these thermoplastic resins is generally produced by injection molding. This injection molding method has become the mainstream for providing high-power surface-mounted light-emitting devices at low cost because of its good productivity. However, since the reflective frame 503 is generally warped during injection molding, an adhesive 505 having a certain thickness is required to correct this.

  In addition, as a different conventional method for manufacturing a light emitting diode, a first step of covering a LED element on a substrate on which a large number of LED elements are mounted with a translucent resin, and a transparent part of the LED element after the translucent resin is cured. A second step of removing the light-sensitive resin, a third step of filling the groove formed by the second step with the light-reflective resin, and the light-reflective resin after the curing of the light-reflective resin. A method of manufacturing a light emitting diode is disclosed, which includes a fourth step of cutting the substrate so as to leave it around and separating it into individual light emitting diodes (see, for example, Patent Document 1). Further, it is disclosed that the second step and the fourth step are performed using a dicing apparatus.

JP 2002-368281 A

  The thermoplastic resin used in the reflection frame 503 of the conventional surface-mount type light emitting device has an aromatic component in the molecule and thus has poor light resistance. Further, since the thermosetting resin used for the translucent resin 504 does not have a hydroxyl group or the like that improves adhesion at the molecular end, adhesion with the adhesive 505 used for adhesion to the substrate 502 is obtained. I have a problem I can't. In addition, the bonding method using the adhesive 505 provides a surface-mount light-emitting device with a precise and complicated shape by the method accuracy between the warp of the substrate 502 and the reflection frame 503, the positioning accuracy at the time of bonding, and the like. Is difficult. In addition, since a thermosetting resin is used for the translucent resin 504 and a thermoplastic resin is used for the reflective frame 503, it is difficult to match the thermal expansion coefficient. Problems such as peeling of the element 501, disconnection of the bonding wire, peeling of the reflection frame, and the like may occur, and there is a limit to improvement in manufacturing yield and product reliability. Furthermore, the output improvement of the LED element in recent years is remarkable, and as the output of the LED element 501 is increased, the light degradation of the reflection frame 503 has become remarkable. In particular, the adhesive interface between the translucent resin 504 and the reflective frame 503 is easily broken and peeled off due to poor adhesion. Further, discoloration due to light degradation proceeds even without peeling, and the lifetime of the light emitting device is greatly shortened.

  Further, in the conventional method of manufacturing a light emitting diode, in the method of removing the light transmitting resin by dicing and filling the groove with the light reflecting resin, the light transmitting resin is not removed at the time of dicing, or There is a problem that it is difficult to form a light-reflective resin because the substrate surface is not exposed cleanly, such as being removed together. In addition, even if it is desired to form the reflecting frame in a taper in order to increase the forward light output, there is a problem that the taper cannot be formed because the translucent resin is removed by dicing. In particular, there is also a problem that the translucent resin cannot be molded other than a rectangular parallelepiped.

  The circuit board can be easily mounted on both sides or in multiple layers. However, in the injection molding using a thermoplastic resin, wire breakage or peeling of the semiconductor chip occurs due to the resin pressure during molding. Since the adhesion between the circuit board and the thermoplastic resin is poor, there is a problem in that peeling occurs due to thermal shock such as reflow soldering heat and reliability cannot be obtained.

  In light of the above, an object of the present invention is to provide a surface-mounted light-emitting device that is rich in light resistance and excellent in mass productivity, and a method for manufacturing the same.

  In order to solve the above-mentioned problems, the present inventor has intensively studied, and as a result, the present invention has been completed.

  The present invention is a method of manufacturing a package in which a wall portion having an anchor effect is formed on a circuit board in which countersinks are inserted or through-holes are formed, and the upper mold is the wall portion A first step of sandwiching the circuit board between the upper mold and the lower mold, and thermosetting in the recessed part sandwiched between the upper mold and the circuit board. The present invention relates to a method of manufacturing a package for a light emitting device, comprising: a second step of pouring resin by transfer molding; and a third step of heating and curing the poured thermosetting resin to form the wall portion. .

A package for a light-emitting device, comprising: a circuit board on which a light-emitting element is mounted; and a wall portion formed on the circuit board for reflecting light from the light-emitting element. The wall portion is countersunk at the formation position, or a through hole is formed, and the wall portion is formed in close contact with the circuit board by transfer molding,
The wall portion is formed of a thermosetting resin containing a white pigment so that a reflectance at 460 nm is 50% or more, and relates to a package for a light emitting device.

  The present invention is configured as described above, and has an effect that it can provide a package for a light emitting device which is rich in light resistance and excellent in mass productivity, and a method for manufacturing the same.

  The present invention provides a light-emitting element, a circuit board on which the light-emitting element is mounted, a wall portion that is formed on the circuit board and reflects light from the light-emitting element, and a light-transmitting property that covers the light-emitting element And a sealing member, wherein the wall portion is formed of a thermosetting resin and the wall portion is in close contact with the circuit board. By using a thermosetting resin for the wall portion, it is possible to provide a surface mount light emitting device having excellent light resistance, heat resistance, and the like. Since the circuit board and the wall are reactively cured, the adhesion is high.

  The thermosetting resin and the translucent sealing resin are preferably those having no aromatic component in the molecule as much as possible. This is because the light resistance can be further improved.

  The wall part preferably has a reflectance of 70% or more of light emitted from the light emitting element. When adopting a configuration in which the light emitted from the light emitting element is emitted forward, it is preferable that the reflectance is higher. However, it is sufficient that at least a part is reflected by the wavelength of light emitted from the light emitting element.

  It is preferable that the light reflecting member is dispersed substantially uniformly on the wall portion. Provided to provide a difference from the fact that the light reflecting member settles before curing if it is a technique for forming a reflective frame by dropping a thermosetting resin containing a light reflecting member as in the prior art. It is a thing. Therefore, it does not require strict uniformity.

  The wall portion is preferably formed on an upper surface and / or a side surface of the circuit board. Thereby, a wall part with high position accuracy can be formed.

  The wall portion preferably has a tapered shape. As a result, forward light extraction can be improved.

  The circuit board may have an electronic element mounted on the upper surface or the lower surface. A complicated circuit can be formed. Further, peeling of the electronic element and the light emitting element and disconnection of the bonding wire do not occur.

  The circuit board can be further molded with the thermosetting resin on the lower surface side. This is because the electronic device can be protected from external obstacles and moisture.

  The wall is preferably formed by transfer molding. A complicated shape cannot be formed by injection molding, whereas a molded body having a complicated shape can be formed by transfer molding. In particular, it is possible to easily form a seal between the wall portion having the recess and the electronic element mounting portion. In other words, in the conventional injection molding using a thermoplastic resin, the bonding wire was disconnected or the light emitting element was peeled off due to the pressure of the resin at the time of injection, but in the transfer mold using the thermosetting resin, the resin pressure is extremely It is low, and the disconnection of the bonding wire and the peeling of the light emitting element are extremely difficult to occur.

  The thermosetting resin is preferably formed of at least one selected from the group consisting of epoxy resins, modified epoxy resins, silicone resins, modified silicone resins, acrylate resins, urethane resins, and polyimide resins. Among these, an epoxy resin, a silicone resin, and a modified silicone resin are preferable, and an epoxy resin is particularly preferable. As a result, it is possible to provide a surface-mounted light-emitting device that is excellent in heat resistance, light resistance, adhesion, and mass productivity.

  The thermosetting resin may be mixed with at least one selected from the group consisting of a filler, a diffusing agent, a pigment, a fluorescent material, a reflective material, a light shielding material, an ultraviolet absorber, and an antioxidant. Various materials are added to the thermosetting resin as required. For example, this is a case where a fluorescent material is mixed with a thermosetting resin using a resin material having high translucency. As a result, the light emitted to the side surface or the bottom surface side of the light emitting element is absorbed by the fluorescent material, and the light is converted and emitted, so that a desired emission color can be realized as the entire surface mount type light emitting device. For example, in order to uniformly disperse the emitted light, a filler, a diffusing agent, a reflective substance, or the like may be added to the side surface or the bottom surface side of the light emitting element. For example, a light shielding resin may be mixed in order to reduce the light output from the back side of the surface mount type light emitting device. In particular, a thermosetting resin in which an epoxy resin is mixed with titanium oxide, silica, and alumina is preferable. As a result, it is possible to provide a surface-mounted light-emitting device that has excellent heat resistance and high radiation efficiency from the light-emitting element. By mixing the filler, adjustment of the linear expansion coefficient is facilitated, and the linear expansion coefficient between the translucent sealing member and the wall portion can be approximated. When a large amount of filler is contained, deformation due to expansion during heating is reduced, and thus reliability suitable for a process including heat treatment such as reflow is easily obtained.

  The translucent sealing resin may be mixed with at least one selected from the group consisting of a filler, a diffusing agent, a pigment, a fluorescent material, a reflective material, an ultraviolet absorber, and an antioxidant. Various substances are added to the translucent sealing resin as required. For example, by mixing a fluorescent material with a light-transmitting sealing resin, a light emission color different from the light emission color emitted from the light emitting element can be realized. For example, white light can be realized by using a light emitting element that emits blue light and a fluorescent material that emits yellow light. In addition, a filler, a diffusing agent, or the like can be mixed in order to emit light uniformly.

  The circuit board is preferably provided with a heat sink. For example, a material having good thermal conductivity penetrating the top and bottom surfaces of the light emitting device is used as a heat sink, and the light emitting element is mounted thereon. In the light emitting element, all the portions that are not used for light emission by the consumed power become heat. A through hole is provided from the portion of the circuit board on which the light emitting element is placed to the bottom surface, and a material having good thermal conductivity is poured into or inserted into the through hole. The heat sink thus provided is formed so as to be exposed from the bottom surface of the light emitting device. As a result, heat can be efficiently radiated from within the light emitting device, so that the temperature inside the light emitting device can be lowered. Thereby, a light emitting device having excellent heat dissipation performance can be provided.

  The circuit board has a multilayer structure of two or more layers, and an electronic element can be mounted on at least one layer of the multilayer structure. Thereby, a circuit board having a complicated wiring pattern can also be used.

  The present invention is a package having a circuit board and a wall formed on the circuit board, wherein the wall is formed of a thermosetting resin, and the wall has a reflectance of 460 nm. 50% or more, and the wall portion relates to a package that is in close contact with the circuit board. It is a package used for a surface-mount light-emitting device, and since a wall portion that efficiently reflects light in the visible light region is formed of a thermosetting resin, a package with high light resistance can be provided. Of the light in the visible light region, the reflectance at 460 nm, which is light on the relatively short wavelength side, is preferably 50% or more, more preferably 70% or more.

  The present invention is a method of manufacturing a package having a circuit board on which a wall is formed, wherein the upper mold has a recess corresponding to the wall, and the upper mold and the lower mold A first step of sandwiching the circuit board, a second step of pouring a thermosetting resin into a recessed portion sandwiched between the upper mold and the circuit board by transfer molding, and the poured thermosetting resin And a third step of forming the wall by heating and curing the package. As a result, it is possible to provide a method for manufacturing a package with excellent mass productivity.

  The present invention is a method for manufacturing a surface-mounted light-emitting device in which a light-emitting element is placed on a circuit board on which a wall is formed, and the light-emitting element is covered with a light-transmitting sealing member, The upper mold has a recess corresponding to the wall, and is sandwiched between the upper mold and the circuit board in the first step of sandwiching the circuit board between the upper mold and the lower mold. A second step of pouring a thermosetting resin into the recessed portion by transfer molding, a third step of heating and curing the poured thermosetting resin, and molding the wall, and the circuit board. The present invention relates to a method for manufacturing a surface-mounted light-emitting device, which includes a fourth step of placing the light-emitting element and a fifth step of covering the light-emitting element with a light-transmitting sealing member. As a result, it is possible to provide a surface mount light emitting device with excellent mass productivity.

  In the fifth step, the translucent sealing member can be formed by transfer molding. This is because a translucent sealing member having a predetermined shape such as a convex lens shape or a Fresnel lens shape can be formed.

  The present invention is configured as described above, and has an effect that it is possible to provide a package, a surface-mounted light-emitting device, and a manufacturing method thereof, which are excellent in light resistance and excellent in mass productivity.

  Hereinafter, embodiments and examples of the surface-mounted light emitting device according to the present invention will be described. However, the present invention is not limited to this embodiment and example.

<First Embodiment>
<Surface mount type light emitting device>
A surface-mounted light-emitting device according to a first embodiment will be described with reference to the drawings. FIG. 1 is a schematic cross-sectional view showing the surface-mounted light emitting device according to the first embodiment. FIG. 2 is a schematic plan view showing the surface mounted light emitting device according to the first embodiment.

  The surface-mount light-emitting device according to the first embodiment covers the light-emitting element 10, the circuit board 20 on which the light-emitting element 10 is placed, the wall portion 50 that is molded around the light-emitting element 10, and the light-emitting element 10. Translucent sealing resin 70. The circuit board 20 is formed with a first printed wiring portion 30 and a second printed wiring portion 40 in order to obtain electrical connection with the light emitting element 10. The package 100 refers to the circuit board 20 on which the wall part 50 is formed.

  The light emitting element 10 has a pair of positive and negative first electrodes 11 and second electrodes 12 on the same surface side. In this specification, an electrode having a pair of positive and negative electrodes on the same surface side is described; however, an electrode having a pair of positive and negative electrodes from the upper surface and the lower surface of the light-emitting element can also be used. In this case, the electrode on the lower surface of the light emitting element is electrically connected to the first printed wiring portion 30 using an electrically conductive die bond member without using a wire.

  The first printed wiring portion 30 has a first external terminal portion 31. The light emitting element 10 is mounted on the first printed wiring portion 30 via a die bond member. The first printed wiring unit 30 is electrically connected to the first electrode 11 of the light emitting element 10 through the wire 60. The first external terminal portion 31 is exposed from the circuit board 20. The second printed wiring portion 40 has a second external terminal portion 41. The second printed wiring portion 40 is electrically connected to the second electrode 12 of the light emitting element 10 via the wire 60. The second external terminal portion 41 is exposed from the circuit board 20. The light emitting element 10 does not necessarily have to be placed on the first printed wiring section 30, and may be placed on the circuit board 20.

  In the portion where the light emitting element 10 is placed, a recess is formed by the wall 50 and the circuit board 20. The recess has a bottom surface (upper surface of the circuit board 20) and a side surface (side surface of the wall portion 50). The first printed wiring portion 30 is exposed from the bottom surface of the recess. The light emitting element 10 is mounted on the exposed portion via a die bond member. The wall 50 is formed by transfer molding. The wall portion 50 uses a thermosetting resin. The opening of the recess has a wider opening than the bottom surface, and the side surface can be tapered.

  The translucent sealing resin 70 is disposed in the recess so as to cover the light emitting element 10. The translucent sealing resin 70 uses a thermosetting resin. The translucent sealing resin 70 contains a fluorescent material 80. By using the translucent sealing member 70 having a slightly high viscosity, the fluorescent material 80 can be uniformly dispersed. Further, the fluorescent material 80 can be uniformly dispersed by shortening the time required from potting the translucent sealing member 70 to curing.

  In the present specification, the side on which the light emitting element 10 is placed is referred to as the upper side of the circuit board, and the opposite side is referred to as the lower side of the circuit board.

  The wall 50 and the translucent sealing resin 70 are made of thermosetting resin, and the physical properties such as the expansion coefficient are close to each other, so that the adhesion is extremely good. In addition, with the above structure, it is possible to provide a surface-mounted light-emitting device that is excellent in heat resistance, light resistance, and the like.

  Hereinafter, each component will be described in detail.

(Light emitting element)
The light emitting element 10 is formed by forming a semiconductor such as GaAlN, ZnS, ZnSe, SiC, GaP, GaAlAs, AlN, InN, AlInGaP, InGaN, GaN, or AlInGaN on the substrate as a light emitting layer. Examples of the semiconductor structure include a homo structure having a MIS junction, a PIN junction, and a PN junction, a hetero structure, and a double hetero structure. Various emission wavelengths can be selected from ultraviolet light to infrared light depending on the material of the semiconductor layer and the degree of mixed crystal. The light emitting layer may have a single quantum well structure or a multiple quantum well structure which is a thin film in which a quantum effect is generated.

  When considering use outdoors, it is preferable to use a gallium nitride-based compound semiconductor as a semiconductor material capable of forming a high-luminance light-emitting element. In red, gallium-aluminum-arsenic-based semiconductors and aluminum-indium- Although it is preferable to use a gallium / phosphorus-based semiconductor, various semiconductors can be used depending on the application.

  When a gallium nitride compound semiconductor is used, a material such as sapphire, spinel, SiC, Si, ZnO, or GaN single crystal is used for the semiconductor substrate. A sapphire substrate is preferably used to form gallium nitride with good crystallinity with high productivity. 10 examples of light-emitting elements using nitride-based compound semiconductors are shown. A buffer layer such as GaN or AlN is formed on the sapphire substrate. A first contact layer made of N or P-type GaN, an active layer made of an InGaN thin film having a quantum effect, a clad layer made of P or N-type AlGaN, and a second contact made of P or N-type GaN. It can be set as the structure which formed the contact layer in order. Gallium nitride-based compound semiconductors exhibit N-type conductivity without being doped with impurities. When forming a desired N-type gallium nitride semiconductor such as improving luminous efficiency, Si, Ge, Se, Te, C, etc. are preferably introduced as appropriate as N-type dopants.

  On the other hand, when a P-type gallium nitride semiconductor is formed, a P-type dopant such as Zn, Mg, Be, Ca, Sr, or Ba is doped. Since a gallium nitride based semiconductor is difficult to be converted to P-type only by doping with a P-type dopant, it is necessary to make it P-type by annealing it by heating in a furnace, low electron beam irradiation, plasma irradiation or the like after introducing the P-type dopant. The semiconductor wafer thus formed is partially etched to form positive and negative electrodes. After that, the light emitting element can be formed by cutting the semiconductor wafer into a desired size.

  A plurality of such light emitting elements 10 can be used as appropriate, and the color mixing property in white display can be improved by a combination thereof. For example, two light emitting elements 10 capable of emitting green light and one light emitting element 10 capable of emitting blue and red light can be provided. In order to use as a full-color light emitting device for a display device, it is preferable that a red light emission wavelength is 610 nm to 700 nm, a green light emission wavelength is 495 nm to 565 nm, and a blue light emission wavelength is 430 nm to 490 nm. In the surface-mounted light emitting device of the present invention, when emitting white mixed color light, the emission wavelength of the light emitting element is 400 nm or more in consideration of the complementary color relationship with the emission wavelength from the fluorescent material, deterioration of the translucent resin, and the like. 530 nm or less is preferable, and 420 nm or more and 490 nm or less is more preferable. In order to further improve the excitation and emission efficiency of the light emitting element and the fluorescent material, 450 nm or more and 475 nm or less are more preferable. Note that a light-emitting element having a main light emission wavelength in an ultraviolet region shorter than 400 nm or a short wavelength region of visible light can be used in combination with a member that is relatively difficult to be deteriorated by ultraviolet rays.

  The size of the light emitting element 10 can be □ 1 mm size, and □ 600 μm, □ 320 μm size, etc. can also be mounted.

  The separated light emitting element 10 may be face-down mounted as well as face-up mounted. In particular, the face-down mounting eliminates the need for a wire, so that the surface-mounted light-emitting device can be made thin.

(Circuit board)
The circuit board 20 includes a first printed wiring unit 30 and a second printed wiring unit 40. The first printed wiring portion 30 is electrically connected to the first external terminal portion 31, and the first external terminal portion 31 is exposed from the circuit board 20. The second printed wiring portion 40 is electrically connected to the second external terminal portion 41, and the second external terminal portion 41 is exposed from the circuit board 20. Each of the first external terminal 31 and the second external terminal 41 can be electrically connected to an external electrode. The first printed wiring portion 30 and the second printed wiring portion 40 are electrically insulated with a predetermined distance.

  The material of the circuit board 20 is a board-like hard material that is not easily deformed by reflow soldering heat. Among the substrate-like hard materials, insulating glass epoxy substrate, PBT substrate, polyimide substrate, aluminum nitride substrate, boron nitride substrate, silicon nitride substrate, alumina ceramic substrate, glass substrate, flexible glass substrate, conductive but resin-coated It is preferably formed of at least one selected from the group consisting of an aluminum substrate provided with insulation properties, a copper substrate, a hybrid substrate such as a composite substrate, and a glass epoxy substrate and an aluminum substrate are particularly preferable. In addition, a printed wiring silicon substrate, silicon carbide substrate, sapphire substrate, or the like can be used.

  The 1st printed wiring part 30 and the 2nd printed wiring part 40 can be comprised using electrical good conductors, such as iron, phosphor bronze, and a copper alloy. Moreover, in order to improve the reflectance of the light from the light emitting element 10, metal plating, such as silver, aluminum, copper, and gold | metal | money, can also be given to the surface of the 1st printed wiring part 30 and the 2nd printed wiring part 40. . Moreover, in order to improve the reflectance of the surface of the 1st printed wiring part 30 and the 2nd printed wiring part 40, it is preferable to make it smooth. Moreover, in order to improve heat dissipation, the area of the 1st printed wiring part 30 and the 2nd printed wiring part 40 can be enlarged. Thereby, the temperature rise of the light emitting element 10 can be effectively suppressed, and a relatively large amount of electricity can be passed through the light emitting element 10. Moreover, heat dissipation can be improved by making the 1st printed wiring part 30 and the 2nd printed wiring part 40 thick.

  The first printed wiring unit 30 and the second printed wiring unit 40 are a pair of positive and negative electrodes. The first printed wiring unit 30 and the second printed wiring unit 40 may be at least one each, but a plurality of the first printed wiring unit 30 and the second printed wiring unit 40 may be provided. In addition, when a plurality of light emitting elements 10 are mounted on the first printed wiring portion 30, it is necessary to provide a plurality of second printed wiring portions 40. As the pattern of the printed wiring portion, an arbitrary shape can be selected as necessary.

(Wall)
The wall part 50 uses a thermosetting resin. Regarding the light resistance, the thermosetting resin that is three-dimensionally crosslinked can easily change the composition without impairing the heat resistance, so that it is possible to easily eliminate aromatic components with poor light resistance. On the other hand, when the wall portion is formed of a thermoplastic resin, the heat resistance and the aromatic component are virtually synonymous, and the wall portion that can withstand reflow soldering heat cannot be obtained without the aromatic component.

  Further, since the thermosetting resin has excellent adhesion to the circuit board 20, the wall portion 50 can be formed directly on the circuit board 20 by transfer molding. Therefore, it is possible to omit the step of once forming the wall portion with a thermoplastic resin and then bonding it to the circuit board with an adhesive as in the prior art. The adhesion between the translucent sealing resin 70 and the wall 50 is very good. Since the translucent sealing resin 70 places importance on transparency, an amorphous resin typified by a thermally isotropic thermosetting resin is used. The wall 50 is also made of an amorphous resin represented by a thermally isotropic thermosetting resin. Thereby, the thermal stress of the translucent sealing resin 70 and the wall part 50 is reduced, and the peeling prevention effect is acquired. When the thermosetting resin used for the translucent sealing resin 70 and the wall portion 50 is made of the same chemical species, a chemical bond at the interface can be expected, so that a remarkable peeling prevention effect can be achieved. On the other hand, when a thermoplastic resin is used for the wall portion, the adhesion is lowered. Since thermoplastic resins are generally anisotropic, they have low adhesion to isotropic thermosetting resins and are easy to peel off.

  Furthermore, the thermosetting resin used for the wall portion 50 has a very low melt viscosity at the time of molding, and can be highly filled with a white pigment such as titanium oxide. Since the wall 50 reflects the light from the light emitting element 10 and emits it forward, it is preferable to reflect the light from the light emitting element 10. For example, when the light emitting element 10 having an emission peak wavelength at about 460 nm is used, the reflectance may be 50% or more, and particularly preferably 70% or more. Therefore, it is easy to set the visible light reflectance at 430 nm or more to 70% or more. By setting the visible light reflectance to 70% or more, a light emitting device with high radiation efficiency from a light emitting element that emits visible light can be provided. Further, the thermosetting resin can have a visible light reflectance of 70% or more when the amount of white pigment such as titanium oxide is only 430 nm or more by using a colorless and transparent resin raw material. In this case, a filler having a small thermal expansion coefficient such as alumina or silica can be filled to that extent, so adjustment of the thermal expansion coefficient according to the physical properties of the circuit board can be expected. However, when the wall portion 50 is formed in order to provide the translucent sealing member 70, the reflectance may be low.

  The taper of the wall portion 50 not only improves the radiation efficiency from the light emitting element 10, but also can expect the effect of condensing light from the light emitting device, so that the optical design becomes easy. Further, when transfer molding is performed on the wall 50 using a thermosetting resin, the mold releasability is improved, so that it is possible to suppress molding defects and shorten the molding cycle time, and light emitting devices with excellent mass productivity. Can be provided.

  In order to improve the adhesion between the wall portion 50 and the circuit board 20, an anchor effect can be obtained by setting a countersink or providing a through hole on the circuit board 20 side. The light emitting element 10 may be mounted either before or after the wall 50 is formed. The surface-mount light-emitting device can be obtained by molding the wall portion 50 and then cutting the wall portion 50 and the circuit board 20 into pieces. Alternatively, the circuit board 20 can be separated into pieces in advance, and then the surface-mounted light-emitting device can be manufactured by mounting the light-emitting element 10 or molding the wall portion 50.

  By forming the wall portion 50, the package forms a recess having a bottom surface (upper surface of the circuit board 20) and a side surface (side surface of the wall portion 50). The wall portion 50 is formed on the circuit board 20 having the first printed wiring portion 30 and the second printed wiring portion 40 extending outward from the bottom surface of the recess. The light emitting element 10 is placed on the first printed wiring portion 30 corresponding to the bottom surface of the recess.

  The concave portion is tapered (inclined) so as to have a wide opening in the opening direction. As a result, it is possible to improve the light extraction in the forward direction and the mold releasability at the time of transfer molding. Further, although the taper is preferably smooth, irregularities can be provided. This is because the unevenness of the interface between the wall 50 and the translucent sealing resin 70 can be improved by providing the unevenness. The inclination angle of the concave portion is preferably 95 ° or more and 150 ° or less, particularly preferably 100 ° or more and 120 ° or less, as measured from the bottom surface.

  The shape of the wall 50 on the upper side of the circuit board 20 is a rectangle, but may be an ellipse, a circle, a pentagon, a hexagon, or the like. The shape of the concave portion on the upper side of the circuit board is an ellipse, but may be a substantially circular shape, a rectangular shape, a pentagonal shape, a hexagonal shape, or the like. A cathode mark can also be attached to a predetermined position of the wall 50.

  The material of the wall part 50 is a thermosetting resin. Among thermosetting resins, it is preferably formed of at least one selected from the group consisting of epoxy resins, modified epoxy resins, silicone resins, modified silicone resins, acrylate resins, and urethane resins, particularly epoxy resins and modified epoxy resins. Silicone resins and modified silicone resins are preferred. For example, an epoxy resin composed of triglycidyl isocyanurate (Chemical Formula 1), hydrogenated bisphenol A diglycidyl ether (Chemical Formula 2), etc., hexahydrophthalic anhydride (Chemical Formula 3), 3-methylhexahydrophthalic anhydride (Chemical Formula 4) DBU (1,8) as a curing accelerator was added to 100 parts by weight of a colorless and transparent mixture obtained by dissolving and mixing an acid anhydride composed of 4-methylhexahydrophthalic anhydride (Chemical Formula 5) and the like in an epoxy resin in an equivalent amount. -Diazabicyclo (5,4,0) undecene-7) (Chemical Formula 6) 0.5 part by weight, ethylene glycol (Chemical Formula 7) as a cocatalyst 1 part by weight, titanium oxide pigment 10 parts by weight, glass fiber 50 It is possible to use a solid epoxy resin composition that is added by weight and partially cured by heating to be B-staged.

壁部５０は、パッケージとしての機能を有するため硬質のものが好ましい。壁部５０は遮光性物質を混合して、壁部５０を透過する光を低減することができる。一方、表面実装型発光装置からの光が主に前方及び側方に均一に出射されるように、フィラーや拡散剤を混合しておくこともできる。また、光の吸収を低減するために、暗色系の顔料よりも白色系の顔料を添加しておくこともできる。このように、壁部５０は、４３０ｎｍ以上の可視光線反射率を７０％以上とすることのみならず所定の機能を持たせるため、フィラー、拡散剤、顔料、蛍光物質、反射性物質、遮光性物質、紫外線吸収剤、酸化防止剤からなる群から選択される少なくとも１種を混合することもできる。

Since the wall part 50 has a function as a package, a hard thing is preferable. The wall 50 can be mixed with a light blocking material to reduce light transmitted through the wall 50. On the other hand, a filler or a diffusing agent can be mixed so that light from the surface-mounted light emitting device is emitted uniformly mainly forward and sideward. In order to reduce light absorption, a white pigment can be added to a dark pigment. As described above, the wall 50 has a predetermined function as well as a visible light reflectance of 430 nm or more of 70% or more, and therefore has a filler, a diffusing agent, a pigment, a fluorescent substance, a reflective substance, and a light shielding property. At least one selected from the group consisting of a substance, an ultraviolet absorber, and an antioxidant can also be mixed.

(Translucent sealing resin)
The translucent sealing resin 70 is provided to protect the light emitting element 10 from external force, dust, moisture, and the like from the external environment. Further, the light emitted from the light emitting element 10 can be efficiently emitted to the outside. The translucent sealing resin 70 is disposed in the recess of the wall 50. Moreover, the translucent sealing resin 70 can also be made into a predetermined lens shape.

  The material of the translucent sealing resin 70 is a thermosetting resin. Among thermosetting resins, it is preferably formed by at least one selected from the group consisting of epoxy resins, modified epoxy resins, silicone resins, modified silicone resins, acrylate resins, urethane resins, and polyimide resins, especially epoxy resins, Modified epoxy resins, silicone resins, and modified silicone resins are preferred. The translucent sealing resin 70 is preferably hard so as to protect the light emitting element 10. The translucent sealing resin 70 is preferably a resin having excellent heat resistance, weather resistance, and light resistance. The translucent sealing resin 70 is mixed with at least one selected from the group consisting of a filler, a diffusing agent, a pigment, a fluorescent material, a reflective material, an ultraviolet absorber, and an antioxidant to have a predetermined function. You can also The translucent sealing resin 70 may contain a diffusing agent. As specific diffusing agents, barium titanate, titanium oxide, aluminum oxide, silicon oxide, or the like can be suitably used. Moreover, an organic or inorganic coloring dye or coloring pigment can be contained for the purpose of cutting an undesired wavelength. Furthermore, the translucent sealing resin 70 can also contain a fluorescent material 80 that absorbs light from the light emitting element 10 and converts the wavelength.

(Fluorescent substance)
The fluorescent material 80 may be any material that absorbs light from the light emitting element 10 and converts the wavelength into light having a different wavelength. For example, nitride phosphors / oxynitride phosphors / sialon phosphors mainly activated by lanthanoid elements such as Eu and Ce, lanthanoid phosphors such as Eu, and transition metal elements such as Mn. Activated alkaline earth halogen apatite phosphor, alkaline earth metal borate halogen phosphor, alkaline earth metal aluminate phosphor, alkaline earth silicate phosphor, alkaline earth sulfide phosphor, Alkaline earth thiogallate phosphor, alkaline earth silicon nitride phosphor, germanate phosphor, rare earth aluminate phosphor, rare earth silicate phosphor mainly activated with lanthanoid elements such as Ce It is preferably at least one selected from organic and organic complexes mainly activated by a lanthanoid element such as Eu. As specific examples, the following phosphors can be used, but are not limited thereto.

Nitride phosphors mainly activated with lanthanoid elements such as Eu and Ce are M ₂ Si ₅ N ₈ : Eu, MAlSiN ₃ : Eu (M is selected from Sr, Ca, Ba, Mg, Zn) At least one type, and B may be contained). In addition to M ₂ Si ₅ N ₈ : Eu, MSi ₇ N ₁₀ : Eu, M _1.8 Si ₅ O _0.2 N ₈ : Eu, M _0.9 Si ₇ O _0.1 N ₁₀ : Eu (M Is at least one selected from Sr, Ca, Ba, Mg, and Zn.

An oxynitride phosphor mainly activated by a lanthanoid element such as Eu or Ce is MSi ₂ O ₂ N ₂ : Eu (M is at least one selected from Sr, Ca, Ba, Mg, Zn) Etc.).

Eu, sialon phosphors activated mainly with lanthanoid elements such as Ce _{is, M p / 2 Si 12-} p-q Al p + q O q N 16-p: Ce, M-Al-Si-O-N (M is at least one selected from Sr, Ca, Ba, Mg, and Zn. Q is 0 to 2.5, and p is 1.5 to 3).

Alkaline earth halogen apatite phosphors mainly activated by lanthanoid compounds such as Eu and transition metal elements such as Mn include M ₅ (PO ₄ ) ₃ X: R (M is Sr, Ca, Ba). X is at least one selected from F, Cl, Br and I. R is any one of Eu, Mn, Eu and Mn. Etc.).

The alkaline earth metal borate phosphor has M ₂ B ₅ O ₉ X: R (M is at least one selected from Sr, Ca, Ba, Mg, Zn. X is F, Cl , Br, or I. R is Eu, Mn, or any one of Eu and Mn.).

Alkaline earth metal aluminate phosphors include SrAl ₂ O ₄ : R, Sr ₄ Al ₁₄ O ₂₅ : R, CaAl ₂ O ₄ : R, BaMg ₂ Al ₁₆ O ₂₇ : R, BaMg ₂ Al ₁₆ O ₁₂ : R, BaMgAl ₁₀ O ₁₇ : R (R is Eu, Mn, or any one of Eu and Mn).

Examples of the alkaline earth sulfide phosphor include La ₂ O ₂ S: Eu, Y ₂ O ₂ S: Eu, and Gd ₂ O ₂ S: Eu.

Examples of rare earth aluminate phosphors mainly activated with lanthanoid elements such as Ce include Y ₃ Al ₅ O ₁₂ : Ce, (Y _0.8 Gd _0.2 ) ₃ Al ₅ O ₁₂ : Ce, Y _{3 (Al 0.8 Ga 0.2) 5 O} 12: Ce, and the like (Y, Gd) 3 (Al , Ga) YAG -based phosphor represented by the composition formula of _{5 O 12.} Further, there are Tb ₃ Al ₅ O ₁₂ : Ce, Lu ₃ Al ₅ O ₁₂ : Ce, etc. in which a part or all of Y is substituted with Tb, Lu or the like.

Other phosphors include ZnS: Eu, Zn ₂ GeO ₄ : Mn, MGa ₂ S ₄ : Eu (M is at least one selected from Sr, Ca, Ba, Mg, Zn. X is At least one selected from F, Cl, Br, and I).

  The phosphor described above contains at least one selected from Tb, Cu, Ag, Au, Cr, Nd, Dy, Co, Ni, and Ti instead of Eu or in addition to Eu as desired. You can also.

  Moreover, it is fluorescent substance other than the said fluorescent substance, Comprising: The fluorescent substance which has the same performance and effect can also be used.

  These phosphors can use phosphors having emission spectra in yellow, red, green, and blue by the excitation light of the light emitting element 10, and emit light in yellow, blue-green, orange, etc., which are intermediate colors thereof. A phosphor having a spectrum can also be used. By using these phosphors in various combinations, it is possible to manufacture surface-mounted light-emitting devices having various emission colors.

For example, using a GaN-based compound semiconductor that emits blue light, a Y ₃ Al ₅ O ₁₂ : Ce or (Y _0.8 Gd _0.2 ) ₃ Al ₅ O ₁₂ : Ce fluorescent material is irradiated to convert the wavelength. Do. A surface-mounted light-emitting device that emits white light by a mixed color of light from the light-emitting element 10 and light from the phosphor 60 can be provided.

For example, CaSi ₂ O ₂ N ₂ : Eu, which emits light from green to yellow, or SrSi ₂ O ₂ N ₂ : Eu, and (Sr, Ca) ₅ (PO ₄ ) ₃ Cl: Eu, which emits blue light as a phosphor. By using a phosphor 60 composed of (Ca, Sr) ₂ Si ₅ N ₈ : Eu that emits red light, a surface-mounted light-emitting device that emits white light with good color rendering can be provided. . This uses the three primary colors of red, blue, and green, so the desired white light can be achieved simply by changing the blend ratio of the first phosphor and the second phosphor. Can do.

(Other)
In the surface-mounted light-emitting device, a Zener diode can be further provided as a protective element. The Zener diode can be placed on the first printed wiring portion 30 on the bottom surface of the recess away from the light emitting element 10. Further, the Zener diode may be mounted on the first printed wiring portion 30 on the bottom surface of the recess, and the light emitting element 10 may be mounted thereon. Further, the protective element can be disposed on the front surface or the back surface of the circuit board 20. Further, the protective element can be disposed inside the wall portion 50. In addition to the 280 μm size, a □ 300 μm size can also be used.

The wire 60 is for electrically connecting the second electrode 12 and the second printed wiring portion 40 of the light emitting element 10 and the first electrode 11 and the first printed wiring portion 30 of the light emitting element 10. The wire 60 is required to have good ohmic properties, mechanical connectivity, electrical conductivity, and thermal conductivity with the electrode of the light emitting element 10. ^{0.01cal / (S) (cm 2} ) (℃ / cm) or more is preferred as the thermal conductivity is more preferably ^{0.5cal / (S) (cm 2} ) (℃ / cm) or more. A wire is stretched from just above the light emitting element 10 to the wire bonding area of the plated wiring pattern to establish conduction.

  By adopting the above configuration, the surface-mounted light-emitting device according to the present invention can be provided.

<Mounting state of surface mount type light emitting device>
A mounting state in which the surface mounted light emitting device is electrically connected to an external electrode is shown. FIG. 3 is a schematic cross-sectional view showing a mounted state of the surface-mounted light emitting device according to the first embodiment.

  The first external terminal portion 31 of the first printed wiring portion 30 and the second external terminal portion 41 of the second printed wiring portion 40 in the circuit board 20 are electrically connected to the external electrodes. .

<Second Embodiment>
A surface-mount light-emitting device according to a second embodiment will be described. The description of the parts having the same configuration as that of the surface-mounted light emitting device according to the first embodiment will be omitted. FIG. 4 is a schematic cross-sectional view showing a surface-mounted light-emitting device according to the second embodiment.

  In the surface mount light emitting device, a new printed wiring portion is provided below the circuit board 20 of the circuit board 20 and the electronic element 90 is mounted thereon. An arbitrary shape can be selected as necessary for the printed wiring pattern. The electronic element 90 is preferably selected from at least one selected from the group consisting of a Zener diode, a protective element such as a current limiting resistor, a capacitor, and various ICs. The package 100 can be molded and sealed at the same time when the wall 50 is molded by transfer molding. Accordingly, mass productivity can be secured and the reliability of the light emitting device can be improved.

  An electronic element 90 is mounted on the lower side of the circuit board 20 and covered with the same thermosetting resin as the wall portion 50 on the upper surface of the circuit board 20. Since the circuit board 20 can be mounted not only on the upper surface but also on the lower surface, it is easy to mount on both sides, so that electronic elements such as a withstand voltage protection element and a current limiting resistance element can be mounted. As a result, the circuit design burden of the electric product to be incorporated into the surface-mounted light emitting device can be reduced, and the circuit space of the electric product can be reduced. It is also possible to incorporate a protective element on the upper surface of the circuit board 20. It is also possible to place a protection element on the upper surface of the circuit board 20 and incorporate the protection element inside the wall portion 50.

  Moreover, the reliability of the electronic element under the circuit board 20 can be ensured by sealing the circuit using a thermosetting resin. Since the normal injection molding pressure of thermoplastic resin is very large and the resin viscosity is high, the mounting wire and the die bonding part are destroyed when molding and sealing the electronic element, and the yield of normal products is very low. In general, if a thermoplastic resin with poor adhesion is used, the circuit board and the thermoplastic resin may be peeled off due to thermal shock such as reflow soldering heat, or may be peeled off due to moisture absorption, causing wire opening and moisture intrusion. A light is generated. On the other hand, the thermosetting resin has a very low molding pressure during transfer molding, a low melt viscosity, and a high fluidity, so that the yield of normal products is good. Moreover, since the adhesiveness between the circuit board 20 and the wall portion 50 is excellent, peeling does not easily occur.

  The sealing on the lower side of the circuit board 20 can be molded and sealed simultaneously with the molding of the wall part 50 on the upper side of the circuit board 20. Therefore, it is possible to provide a surface-mounted light-emitting device that is excellent in mass productivity and easily and highly reliable. Further, if through holes are provided in the circuit board 20, it is possible to integrate the thermosetting resins above and below the circuit board 20. Thereby, adhesiveness can also be improved.

<Third Embodiment>
A surface-mount light-emitting device according to a third embodiment will be described. The description of the portion having the same configuration as that of the surface-mounted light emitting device according to the second embodiment is omitted. FIG. 5 is a schematic cross-sectional view showing a surface-mounted light emitting device according to the third embodiment.

  In the surface-mount light-emitting device, a second circuit board 110 different from the first circuit board 21 is provided below the first circuit board 21. The first circuit board 21 and the second circuit board 110 are electrically connected by the metal joint 120 through the through hole 22 to form a three-dimensional circuit. An electronic element 130 can be mounted on the second circuit board 110. A first electronic element 91 is provided on the lower side of the first circuit board 21, and a second electronic element 130 including a light emitting element is mounted on the bottom of the second circuit board 110. Can be arranged through the through hole 111. The second electronic element 130 can be a light emitting element, a zener diode, a protective element such as a current limiting resistor, a capacitor, various ICs, or the like. An arbitrary shape can be selected as necessary for the printed wiring pattern. The number, structure, and position of the external terminals 140 can be arbitrarily selected as necessary. Further, a three-dimensional circuit structure can be arbitrarily selected as necessary. The package 101 can be molded and sealed almost simultaneously when the wall 51 is molded by transfer molding. Accordingly, mass productivity can be secured, the reliability of the light emitting device can be improved, and a plurality of new functions can be provided.

  Since the fluorescent material 81 has a specific gravity greater than that of the translucent sealing resin 71, the fluorescent material 81 settles on the bottom surface side of the recess. Thereby, it can be brought close to a point light source.

  Although not shown, a three-dimensional circuit can be formed by attaching a new circuit board below the second circuit board 110 using a solder ball or other conductive means and repeating this. An electronic element can be mounted on each circuit board. Circuit boards can be connected in the vertical direction between the boards with solder balls or other conductive means, so that in addition to double-sided mounting, three-dimensional circuits can be formed, and complex functions such as driver circuits as well as single-function electronic elements Can also be installed. As a result, the circuit design burden of the electrical product incorporating the light emitting device can be greatly reduced, and the circuit space of the electrical product can be greatly reduced.

<Fourth embodiment>
A surface-mount light-emitting device according to a fourth embodiment will be described. The description of the parts having the same configuration as that of the surface-mounted light emitting device according to the first embodiment will be omitted. FIG. 6 is a schematic cross-sectional view showing a surface-mounted light-emitting device according to the fourth embodiment.

  This surface-mounted light-emitting device is mounted on a heat sink 150 in which the light-emitting element 13 is made of a material having good thermal conductivity and penetrates the circuit board 23 and is exposed to the bottom of the light-emitting device. The heat sink 150 can be obtained by forming a through hole in the circuit board 23 in advance so as to be directly under the light emitting element 13 and inserting a material having good thermal conductivity. This structure is applicable to all of the first to third embodiments. The shape of the heat sink 150 can be arbitrarily selected, but is preferably selected so as to be the shortest distance to the bottom of the light emitting device. The material of the heat sink is at least one selected from the group consisting of metals such as copper and aluminum, ceramics such as aluminum nitride, boron nitride, silicon nitride and alumina, and conductive organic adhesives such as silver paste and gold paste. Preferably, copper and aluminum are preferable. As a result, heat can be efficiently radiated from the inside of the light emitting device, so that the temperature inside the light emitting device can be lowered. Since many resin materials are deteriorated with time due to heat and promote light degradation, the lower the temperature in the light emitting device is, the longer the life is, so that the reliability of the light emitting device can be improved.

  A surface-mounted light-emitting device according to Example 1 is shown in FIGS. A description of the same configuration as that of the surface-mounted light-emitting device according to the first embodiment will be omitted.

  The surface-mount light-emitting device according to Example 1 includes a light-emitting element 10, a circuit board 20 on which the light-emitting element 10 is placed, a wall portion 50, and a translucent sealing resin 70 that covers the light-emitting element 10. The circuit board 20 includes a first printed wiring part 30 for mounting the light emitting element 10 and a second printed wiring part 40 electrically connected to the light emitting element 10. The wall portion 50 has a concave portion having a bottom surface and a side surface, and the opening of the concave portion is wider than the bottom surface, and the side surface is inclined.

The light emitting element 10 is a GaN-based one that emits blue light. The light emitting element 10 has a first electrode 11 and a second electrode 12 on the same surface side, and is bonded to the first printed wiring part 30 by face-up using a die bond resin (epoxy resin containing silver). Has been. The first electrode 11 is electrically connected to the first printed wiring unit 30 using a gold wire 60. The second electrode 12 is also electrically connected to the second printed wiring unit 40 using a gold wire 60. The first printed wiring unit 30 and the second printed wiring unit 40 are provided with wiring patterns at predetermined positions. The wall 50 is composed of 100 parts by weight of an epoxy resin composed of triglycidyl isocyanurate and an acid anhydride composed of hexahydrophthalic anhydride, 0.5 part by weight of DBU, 1 part by weight of ethylene glycol, titanium oxide pigment What added 10 weight part and 50 weight part of glass fiber is used. The translucent sealing resin 70 uses a silicone resin. The translucent sealing resin 70 is uniformly mixed with a YAG phosphor 80 having a composition of (Y _0.8 Gd _0.2 ) ₃ Al ₅ O ₁₂ : Ce. A translucent sealing resin 70 is disposed in a recess having a bottom surface and a side surface, and the surface of the translucent sealing resin 70 coincides with the top surface of the recess. Thereby, the amount of the YAG phosphor 80 for each product is made uniform.

  The surface-mounted light-emitting device of the present invention can be used for lighting fixtures, displays, mobile phone backlights, camera flashlights, moving image illumination auxiliary light sources, and the like.

It is a schematic sectional drawing which shows the surface mount type light-emitting device which concerns on 1st Embodiment. 1 is a schematic plan view showing a surface mount light emitting device according to a first embodiment. It is a schematic sectional drawing which shows the mounting state of the surface mounted light-emitting device which concerns on 1st Embodiment. It is a schematic plan view which shows the surface mounted light-emitting device which concerns on 2nd Embodiment. It is a schematic sectional drawing which shows the surface mount type light-emitting device which concerns on 3rd Embodiment. It is a schematic sectional drawing which shows the surface mount type light-emitting device which concerns on 4th Embodiment. It is a schematic sectional drawing which shows the conventional surface mount type light-emitting device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Light emitting element 11 1st electrode 12 2nd electrode 20 Circuit board 21 1st circuit board 22 Through hole 30 1st printed wiring part 31 External terminal part 40 2nd printed wiring part 41 External terminal part 50, 51 Wall part 60 Wire 70, 71 Translucent sealing resin 80, 81 Fluorescent substance 90 Electronic element 91 First electronic element 100, 101 Package 110 Second circuit board 111 Through hole 120 Metal joint 130 Electronic element 140 External terminal 150 Heat sink 501 LED element 502 Substrate 503 Reflection frame 504 Translucent resin 505 Adhesive

Claims (12)

A manufacturing method of a package in which a wall portion having an anchor effect is formed on a circuit board in which a countersink is inserted or a through hole is formed,
The upper mold has a recess corresponding to the wall portion, and a first step of sandwiching the circuit board between the upper mold and the lower mold,
A second step of pouring a thermosetting resin by transfer molding into a recessed portion sandwiched between the upper mold and the circuit board;
A third step of heating and curing the poured thermosetting resin and molding the wall;
A method for manufacturing a package for a light emitting device. The circuit substrate used in the first step is an insulating glass epoxy substrate, PBT substrate, polyimide substrate, aluminum nitride substrate, boron nitride substrate, silicon nitride substrate, alumina ceramic substrate, glass substrate, flexible glass substrate, or , Formed of at least one selected from the group consisting of an aluminum substrate, a copper substrate, and a hybrid substrate of a composite substrate, which are electrically conductive but provided with insulation by a resin coat. The method for manufacturing a package according to claim 1, wherein two printed wiring portions are formed. 3. The method of manufacturing a package according to claim 2, wherein in the second step, the thermosetting resin is transfer-molded on the first printed wiring portion and the second printed wiring portion. The thermosetting resin used in the second step contains a white pigment,
The package manufacturing method according to claim 1, wherein the wall portion formed in the third step has a reflectance of 460 nm of 50% or more. A package for a light-emitting device, comprising: a circuit board on which a light-emitting element is placed; and a wall portion formed on the circuit board for reflecting light from the light-emitting element,
The circuit board has a countersink in the position where the wall portion is formed, or a through hole is formed,
The wall is formed in close contact with the circuit board by transfer molding,
A package for a light emitting device, wherein the wall portion is formed of a thermosetting resin containing a white pigment so that a reflectance at 460 nm is 50% or more. The package according to claim 5, wherein the circuit board includes a printed wiring board, and the wall portion is formed on the printed wiring board. The package according to claim 5, wherein the wall portion has a tapered shape. The package according to claim 5, wherein an electronic element is mounted on an upper surface or a lower surface of the circuit board. The package according to claim 5, wherein the thermosetting resin is further molded on the lower surface side of the circuit board. The thermosetting resin is mixed with at least one selected from the group consisting of a filler, a diffusing agent, a pigment, a fluorescent material, a reflective material, a light shielding material, an ultraviolet absorber, and an antioxidant. The package according to any one of claims 5 to 9. The package according to claim 5, wherein the circuit board is provided with a heat sink. The package according to claim 5, wherein the circuit board has a multilayer structure of two or more layers, and an electronic element is mounted on at least one layer of the multilayer structure.

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