JP2005259972A - Surface-mounting led - Google Patents

Surface-mounting led Download PDF

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Publication number
JP2005259972A
JP2005259972A JP2004069311A JP2004069311A JP2005259972A JP 2005259972 A JP2005259972 A JP 2005259972A JP 2004069311 A JP2004069311 A JP 2004069311A JP 2004069311 A JP2004069311 A JP 2004069311A JP 2005259972 A JP2005259972 A JP 2005259972A
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Prior art keywords
frame
transparent resin
led
shaped member
led chip
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JP2005259972A5 (en
Inventor
Yasumasa Morita
康正 森田
Isato Oba
勇人 大場
Konosuke Nakada
幸之助 中田
Minoru Tanaka
稔 田中
Akifumi Ochiai
昭文 落合
Kazunobu Sumi
和宣 角
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Stanley Electric Co Ltd
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Stanley Electric Co Ltd
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Priority to JP2004069311A priority Critical patent/JP2005259972A/en
Publication of JP2005259972A publication Critical patent/JP2005259972A/en
Publication of JP2005259972A5 publication Critical patent/JP2005259972A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Abstract

<P>PROBLEM TO BE SOLVED: To provide a surface-mounting LED capable of preventing separation between a frame member and a sealing resin constituting a transparent resin unit, and permitting to effect the eutectic bonding of LED chips by a simple constitution. <P>SOLUTION: The surface-mounting LED 10 comprises a pair of lead frames 11, 12, having a chip mounting unit 11a and a bonding unit 12a which are exposed on the bottom of a recess 13a of the frame member 13 while being turned to the lower surface of the frame member, an LED chip 14 connected to the upper part of the chip mounting unit in the recess of the frame member and whose surface is connected to the bonding unit, and the transparent resin unit 15 filled into the recess of the frame member while the surface-mounting LED 10 is constituted so that the frame member is constituted of a highly heat resistant thermo-curing transparent resin which constitutes principally the transparent resin unit. The LED chip is bonded to the surface of the chip mounting unit by eutectic bonding. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、ＬＥＤチップからの光を蛍光体層を介して出射させて、ＬＥＤチップからの光と蛍光体層からの蛍光とを混色させて、外部に出射するようにした表面実装型ＬＥＤに関するものである。   The present invention relates to a surface-mounted LED in which light from an LED chip is emitted through a phosphor layer, and the light from the LED chip and fluorescence from the phosphor layer are mixed and emitted to the outside. Is.

従来、白色ＬＥＤとして、青色ＬＥＤチップからの光を蛍光体層で黄色光に変換して、青色ＬＥＤチップからの青色光と混色することにより、外部に白色光を出射するようにした白色ＬＥＤが知られている。
このような白色ＬＥＤは、例えば図４に示すように構成されている。
即ち、図４において、白色ＬＥＤ１は、一対のリードフレーム２，３と、これらのリードフレーム２，３を所定位置に保持するように一体成形された枠状部材４と、この枠状部材４の凹陥部４ａ内に露出する一方のリードフレーム２のチップ実装部２ａ上に実装された青色ＬＥＤチップ５と、上記枠状部材４の凹陥部４ａ内にて青色ＬＥＤチップ５を包囲するように充填された蛍光体を混入した透明樹脂部６と、から構成されている。 Conventionally, as a white LED, a white LED that emits white light to the outside by converting light from a blue LED chip into yellow light by a phosphor layer and mixing it with blue light from a blue LED chip is used. Are known.
Such a white LED is configured, for example, as shown in FIG.
That is, in FIG. 4, the white LED 1 includes a pair of lead frames 2 and 3, a frame-shaped member 4 integrally formed so as to hold the lead frames 2 and 3 in a predetermined position, and the frame-shaped member 4. The blue LED chip 5 mounted on the chip mounting portion 2a of one lead frame 2 exposed in the recessed portion 4a and the blue LED chip 5 are filled so as to surround the recessed portion 4a of the frame-like member 4 And a transparent resin portion 6 mixed with the phosphor.

上記リードフレーム２，３は、それぞれその先端にチップ実装部２ａ及びボンディング部３ａを備えるように、銅等の導電性材料から形成されていると共に、他端が、枠状部材４の側面から下面に回り込んで、表面実装のための接続部２ｂ，３ｂを構成している。   The lead frames 2 and 3 are formed of a conductive material such as copper so as to have a chip mounting portion 2a and a bonding portion 3a at their tips, respectively, and the other end extends from the side surface of the frame-like member 4 to the bottom surface. The connection portions 2b and 3b for surface mounting are formed.

上記枠状部材４は、上記リードフレーム２，３に対してインサート成形等により一体に形成されており、上面中央に、すり鉢状に上方に向かって拡る凹陥部４ａを備えている。
ここで、上記凹陥部４ａの底部にて、上記リードフレーム２，３の先端２ａ，３ａが露出するようになっている。
また、上記枠状部材４は、反射率を考慮し、一般にナイロン系熱可塑性樹脂、例えばガラスフィラーと酸化チタンを添加した白色のポリフタルアミド（ＰＰＡ）樹脂が使用される。 The frame-like member 4 is integrally formed with the lead frames 2 and 3 by insert molding or the like, and has a concave portion 4a that expands upward in the shape of a mortar at the center of the upper surface.
Here, the tips 2a and 3a of the lead frames 2 and 3 are exposed at the bottom of the recessed portion 4a.
The frame-like member 4 is generally made of a nylon-based thermoplastic resin such as a white polyphthalamide (PPA) resin to which glass filler and titanium oxide are added in consideration of the reflectance.

上記ＬＥＤチップ５は、上記枠状部材４の凹陥部４ａ内にて、一方のリードフレーム２の先端のチップ実装部２ａ上に接合されると共に、その上面に設けられた電極が、隣接する他方のリードフレーム３の先端のボンディング部３ａに対してボンディングワイヤ７により電気的に接続されるようになっている。   The LED chip 5 is bonded to the chip mounting portion 2a at the tip of one lead frame 2 in the recessed portion 4a of the frame-shaped member 4, and the electrode provided on the upper surface thereof is adjacent to the other. The lead wire 3 is electrically connected to the bonding portion 3a at the tip of the lead frame 3 by a bonding wire 7.

ここで、上記青色ＬＥＤチップ５は、例えば主として窒化物系半導体材料から構成されており、上記リードフレーム２，３を介して駆動電圧が印加されたとき、４２０乃至４８０ｎｍにピーク波長を有する光を発するようになっている。   Here, the blue LED chip 5 is mainly composed of, for example, a nitride-based semiconductor material, and emits light having a peak wavelength at 420 to 480 nm when a driving voltage is applied through the lead frames 2 and 3. It comes to emit.

上記透明樹脂部６は、微粒子状の蛍光体６ａを混入した例えば透明エポキシ樹脂等から構成されており、上記枠状部材４の凹陥部４ａ内に充填され、硬化されている。
そして、この透明樹脂部６に、青色ＬＥＤチップ５からの青色光が入射することにより、蛍光体６ａが励起され、蛍光体６ａから黄色光を発生させると共に、これらの混色による白色光が外部に出射するようになっている。 The transparent resin portion 6 is made of, for example, a transparent epoxy resin mixed with a fine particle-like phosphor 6a, and is filled in the recessed portion 4a of the frame-like member 4 and cured.
Then, when the blue light from the blue LED chip 5 is incident on the transparent resin portion 6, the phosphor 6 a is excited to generate yellow light from the phosphor 6 a, and white light due to these mixed colors is externally emitted. It comes out.

ここで、蛍光体６ａは、例えばセリウム，ガドリニウム等をドープしたＹＡＧ蛍光体や、このようなＹＡＧ蛍光体にてイットリウムを他の元素に置換したもの、あるいはオルトシリケート誘導体等が使用され、５３０乃至５９０ｎｍにピーク波長を有する蛍光を発するようになっている。   Here, as the phosphor 6a, for example, a YAG phosphor doped with cerium, gadolinium, or the like, a yttrium substituted with such a YAG phosphor, or an orthosilicate derivative is used. It emits fluorescence having a peak wavelength at 590 nm.

このような構成の白色ＬＥＤ１によれば、一対のリードフレーム２，３を介して青色ＬＥＤチップ５に駆動電圧が印加されると、青色ＬＥＤチップ５が発光し、この光が透明樹脂部６に混入された蛍光体６ａに入射することにより、蛍光体６ａが励起されて黄色光を発生させる。
そして、白色ＬＥＤ１は、この黄色光を、青色ＬＥＤチップ５からの青色光と混色させることにより、白色光として、直接に、あるいは枠状部材４の凹陥部４ａの側面で反射して、外部に出射させることになる。 According to the white LED 1 having such a configuration, when a driving voltage is applied to the blue LED chip 5 through the pair of lead frames 2 and 3, the blue LED chip 5 emits light, and this light is transmitted to the transparent resin portion 6. By entering the mixed phosphor 6a, the phosphor 6a is excited to generate yellow light.
The white LED 1 is mixed with the blue light from the blue LED chip 5 so that the white LED 1 is reflected as white light directly or on the side surface of the recessed portion 4a of the frame-like member 4 to the outside. It will be emitted.

ところで、このような構成の白色ＬＥＤ１においては、以下のような問題がある。
即ち、封止樹脂である凹陥部４ａに充填される透明樹脂部６を構成するエポキシ樹脂が、枠状部材４を構成するＰＰＡ樹脂と熱膨張係数が異なることから、使用に伴って、その界面に剥離が生ずることになる。このため、青色ＬＥＤチップ５からの青色光または透明樹脂部６からの黄色光あるいは混色による白色光が枠状部材４の凹陥部４ａの内面との境界領域に進んだ場合、透明樹脂部６と枠状部材４との間に間隙が生ずることから、この境界面による反射効率が著しく低下しすることになり、白色ＬＥＤ１における白色光の取出し効率が低下するので、信頼性が損なわれてしまう。 Incidentally, the white LED 1 having such a configuration has the following problems.
That is, since the epoxy resin constituting the transparent resin portion 6 filled in the recessed portion 4a which is a sealing resin has a different thermal expansion coefficient from the PPA resin constituting the frame-like member 4, its interface is increased with use. Peeling will occur. For this reason, when blue light from the blue LED chip 5, yellow light from the transparent resin portion 6 or white light due to color mixing proceeds to the boundary region with the inner surface of the recessed portion 4a of the frame-like member 4, the transparent resin portion 6 and Since a gap is generated between the frame member 4 and the frame member 4, the reflection efficiency due to the boundary surface is remarkably lowered, and the white light extraction efficiency of the white LED 1 is lowered, so that the reliability is impaired.

また、青色ＬＥＤチップ５とリードフレーム２のチップ実装部２ａを良好に接合するためには、Ａｕ−Ｓｎ共晶接合という方法があるが、枠状部材４を構成するＰＰＡ樹脂の耐熱性が２８０℃程度までであることから、共晶接合を行なうために必要な３００℃程度の温度に対する耐熱性を得ることができなかった。   Further, in order to satisfactorily bond the blue LED chip 5 and the chip mounting portion 2a of the lead frame 2, there is a method called Au—Sn eutectic bonding, but the heat resistance of the PPA resin constituting the frame-like member 4 is 280. Since it is up to about 0 ° C., heat resistance to a temperature of about 300 ° C. necessary for performing eutectic bonding cannot be obtained.

このような問題は、青色ＬＥＤチップだけでなく、他の色を発光するＬＥＤチップからの光と蛍光体の励起光の混色光である他の色の光を出射するＬＥＤにおいても、またリードフレームの代わりにチップ基板を使用したＬＥＤにおいても、同様に存在する。   Such a problem occurs not only in a blue LED chip, but also in an LED that emits light of another color, which is a mixed color light of an LED chip that emits another color and excitation light of a phosphor, and a lead frame. This also exists in the LED using a chip substrate instead of.

本発明は、以上の点から、簡単な構成により、枠状部材と透明樹脂部を構成する封止樹脂との間の剥離を防止すると共に、ＬＥＤチップの共晶接合が行なわれ得るようにした、表面実装型ＬＥＤを提供することを目的としている。   From the above points, the present invention prevents the peeling between the frame-shaped member and the sealing resin constituting the transparent resin portion with a simple configuration, and allows eutectic bonding of the LED chip to be performed. The object is to provide a surface-mounted LED.

上記目的は、本発明によれば、ＬＥＤチップを収容すべき凹陥部を備えた枠状部材と、この枠状部材の凹陥部の底部に露出するチップ実装部及びボンディング部を有し且つ上記枠状部材の下面に回り込む一対のリードフレームと、上記枠状部材の凹陥部内にて上記チップ実装部上に接合され且つその表面が上記ボンディング部に対して接続されるＬＥＤチップと、上記枠状部材の凹陥部内に充填される透明樹脂部と、を含んでいる表面実装型ＬＥＤであって、上記枠状部材が、主として透明樹脂部を構成する高耐熱の熱硬化性透明樹脂から構成されており、上記ＬＥＤチップが、上記チップ実装部の表面に対して共晶接合されていることを特徴とする、表面実装型ＬＥＤにより、達成される。   According to the present invention, the above object has a frame-like member having a recessed portion that should accommodate an LED chip, a chip mounting portion and a bonding portion that are exposed at the bottom of the recessed portion of the frame-like member, and the frame. A pair of lead frames that wrap around the lower surface of the shaped member; an LED chip that is joined to the chip mounting portion in the recessed portion of the frame-like member and whose surface is connected to the bonding portion; and the frame-like member A surface-mount type LED including a transparent resin portion filled in the recessed portion, wherein the frame-shaped member is mainly composed of a high heat-resistant thermosetting transparent resin constituting the transparent resin portion. This is achieved by a surface-mounted LED, wherein the LED chip is eutectic bonded to the surface of the chip mounting portion.

本発明による表面実装型ＬＥＤは、好ましくは、上記枠状部材が、熱硬化性透明樹脂に酸化チタン及び／またはガラスフィラーを添加した材料から構成されている。   In the surface-mounted LED according to the present invention, preferably, the frame member is made of a material obtained by adding titanium oxide and / or glass filler to a thermosetting transparent resin.

本発明による表面実装型ＬＥＤは、好ましくは、上記枠状部材を構成する材料が、さらに酸化防止剤を添加されている。   In the surface-mount type LED according to the present invention, preferably, the material constituting the frame-like member is further added with an antioxidant.

本発明による表面実装型ＬＥＤは、好ましくは、上記透明樹脂部が、蛍光体を混入した透明樹脂により構成されており、上記ＬＥＤチップからの出射光により蛍光体を励起させて、出射光と励起光との混色光を外部に出射する。   In the surface-mount type LED according to the present invention, preferably, the transparent resin portion is made of a transparent resin mixed with a phosphor, and the phosphor is excited by the emitted light from the LED chip to be excited with the emitted light. Light of mixed color with light is emitted to the outside.

本発明による表面実装型ＬＥＤは、好ましくは、上記ＬＥＤチップが、青色ＬＥＤチップである。   In the surface mount type LED according to the present invention, preferably, the LED chip is a blue LED chip.

本発明による表面実装型ＬＥＤは、好ましくは、上記枠状部材が、上記一対のリードフレームに対してインサート成形により一体に構成されている。   In the surface-mounted LED according to the present invention, preferably, the frame-shaped member is integrally formed with the pair of lead frames by insert molding.

上記構成によれば、ＬＥＤチップに駆動電流が流れることにより、ＬＥＤチップから光が出射する。そして、ＬＥＤチップから出射した光は、透明樹脂部を介して直接に、あるいは枠状部材の凹陥部の内壁面で反射されて、外部に出射する。   According to the above configuration, light is emitted from the LED chip when a drive current flows through the LED chip. And the light radiate | emitted from LED chip is reflected by the inner wall surface of the recessed part of a frame-shaped member directly via a transparent resin part, and is radiate | emitted outside.

この場合、枠状部材が、その凹陥部内に充填される封止樹脂である透明樹脂部を構成する材料と同じ材料を主として使用して、例えばインサート成形によりリードフレームに対して一体に形成されている。従って、これらの枠状部材と透明樹脂部の熱膨張係数がほぼ同じであることから、枠状部材及び透明樹脂部がＬＥＤチップの駆動により発生する熱によって温度変化しても、枠状部材と透明樹脂部が互いに剥離してしまうようなことがなく、信頼性が確保され得ることになる。   In this case, the frame-shaped member is formed integrally with the lead frame, for example, by insert molding, mainly using the same material as the material constituting the transparent resin portion which is the sealing resin filled in the recessed portion. Yes. Accordingly, since the thermal expansion coefficients of these frame-shaped members and the transparent resin portion are almost the same, even if the temperature of the frame-shaped member and the transparent resin portion is changed by the heat generated by driving the LED chip, The transparent resin parts do not peel from each other, and reliability can be ensured.

また、枠状部材が主として高耐熱の熱硬化性透明樹脂から構成されているので、枠状部材が耐熱性を有していることから、一方のリードフレームのチップ実装部に対してＬＥＤチップを実装する際に、例えばＡｕ−Ｓｎ共晶等の共晶接合を行なったとしても、共晶接合を行なうために必要な温度（例えば３００℃）において上記枠状部材が影響を受けるようなことがなく、確実に共晶接合を行なうことが可能である。   In addition, since the frame-shaped member is mainly composed of a highly heat-resistant thermosetting transparent resin, the frame-shaped member has heat resistance. Therefore, the LED chip is attached to the chip mounting portion of one lead frame. When mounting, even if eutectic bonding such as Au-Sn eutectic is performed, the frame-shaped member may be affected at a temperature (for example, 300 ° C.) necessary for eutectic bonding. Thus, eutectic bonding can be reliably performed.

上記枠状部材が、熱硬化性透明樹脂に酸化チタン及び／またはガラスフィラーを添加した材料から構成されている場合には、熱硬化性透明樹脂を使用して、枠状部材に適した反射率を有する例えば白色の材料を得ることができる。   When the frame-shaped member is made of a material in which titanium oxide and / or glass filler is added to a thermosetting transparent resin, the reflectance suitable for the frame-shaped member is obtained using the thermosetting transparent resin. For example, a white material can be obtained.

上記枠状部材を構成する材料が、さらに酸化防止剤を添加されている場合には、この酸化防止剤によって経時変化による樹脂変色が防止されることになり、樹脂変色による反射率の低下が抑制され得ることになる。   When the material constituting the frame-like member is further added with an antioxidant, this antioxidant prevents resin discoloration due to aging, and suppresses a decrease in reflectance due to resin discoloration. Will be able to.

上記透明樹脂部が、蛍光体を混入した透明樹脂により構成されており、上記ＬＥＤチップからの出射光により蛍光体を励起させて、出射光と励起光との混色光を外部に出射する場合には、ＬＥＤチップからの出射光と透明樹脂部に混入された蛍光体の励起光との混色光、例えば白色光を外部に出射させることができる。   When the transparent resin portion is made of a transparent resin mixed with a phosphor, and the phosphor is excited by the light emitted from the LED chip and the mixed light of the emitted light and the excitation light is emitted to the outside. Can emit mixed color light of the emitted light from the LED chip and the excitation light of the phosphor mixed in the transparent resin portion, for example, white light to the outside.

上記ＬＥＤチップが、青色ＬＥＤチップである場合には、ＬＥＤチップからの青色光と透明樹脂部に混入された蛍光体の励起光、例えば黄色光との混色光、例えば白色光を外部に出射させることができる。   When the LED chip is a blue LED chip, the mixed light of the blue light from the LED chip and the excitation light of the phosphor mixed in the transparent resin part, for example, yellow light, for example, white light is emitted to the outside. be able to.

このようにして、本発明によれば、枠状部材を構成する材料が主として透明樹脂部と同じ材料から構成されていることにより、互いにほぼ同じ熱膨張係数を有しているので、温度変化によって枠状部材と透明樹脂部とが互いに剥離してしまうようなことがない。従って、信頼性の高い表面実装型ＬＥＤが得られることになる。
また、枠状部材が高耐熱材料から構成されていることにより、枠状部材の凹陥部内に露出している一方のリードフレームのチップ実装部にＬＥＤチップを実装する際に、例えばＡｕ−Ｓｎ共晶等の共晶接合を行なったとしても、枠状部材が共晶接合に必要な例えば３００℃程度の温度で耐熱性を有しているので、枠状部材に影響を与えることなく、共晶接合を確実に行なうことができる。 Thus, according to the present invention, the material constituting the frame-shaped member is mainly composed of the same material as that of the transparent resin portion, and thus has substantially the same thermal expansion coefficient. The frame-shaped member and the transparent resin portion do not peel off from each other. Therefore, a highly reliable surface mount type LED can be obtained.
In addition, since the frame-shaped member is made of a high heat-resistant material, when mounting the LED chip on the chip mounting portion of one lead frame exposed in the recessed portion of the frame-shaped member, for example, Au-Sn Even if eutectic bonding such as crystal is performed, the frame-shaped member has heat resistance at a temperature of, for example, about 300 ° C. necessary for eutectic bonding, so that the eutectic is not affected without affecting the frame-shaped member. Bonding can be performed reliably.

以下、この発明の好適な実施形態を図１を参照しながら、詳細に説明する。
尚、以下に述べる実施形態は、本発明の好適な具体例であるから、技術的に好ましい種々の限定が付されているが、本発明の範囲は、以下の説明において特に本発明を限定する旨の記載がない限り、これらの態様に限られるものではない。 Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to FIG.
The embodiments described below are preferable specific examples of the present invention, and thus various technically preferable limitations are given. However, the scope of the present invention particularly limits the present invention in the following description. As long as there is no description of the effect, it is not restricted to these aspects.

図１は、本発明による表面実装型白色ＬＥＤの一実施形態の構成を示している。
図１において、表面実装型白色ＬＥＤ１０は、一対のリードフレーム１１，１２と、これらのリードフレーム１１，１２を所定位置に保持するように一体成形された枠状部材１３と、この枠状部材１３の凹陥部１３ａ内に露出する一方のリードフレーム１１のチップ実装部１１ａ上に実装された青色ＬＥＤチップ１４と、上記枠状部材１３の凹陥部１３ａ内にて青色ＬＥＤチップ１４を包囲するように充填された蛍光体を混入した透明樹脂部１５と、から構成されている。 FIG. 1 shows the configuration of an embodiment of a surface-mounted white LED according to the present invention.
In FIG. 1, the surface-mount white LED 10 includes a pair of lead frames 11 and 12, a frame-like member 13 integrally formed so as to hold the lead frames 11 and 12 in a predetermined position, and the frame-like member 13. The blue LED chip 14 mounted on the chip mounting portion 11a of one lead frame 11 exposed in the recessed portion 13a and the blue LED chip 14 is surrounded in the recessed portion 13a of the frame-like member 13. And a transparent resin portion 15 mixed with a filled phosphor.

上記リードフレーム１１及び１２は、それぞれその上記凹陥部１３ａ内に露出する先端にチップ実装部１１ａ及びボンディング部１２ａを備えるように、アルミニウム等の導電性材料から形成されていると共に、他端が、枠状部材１３の側面から下面に回り込んで、表面実装のための接続部１１ｂ及び１２ｂを構成している。   Each of the lead frames 11 and 12 is formed of a conductive material such as aluminum so that the tip mounting portion 11a and the bonding portion 12a are provided at the tip exposed in the recessed portion 13a. Connecting portions 11b and 12b for surface mounting are formed by going from the side surface of the frame-shaped member 13 to the lower surface.

上記枠状部材１３は、上記リードフレーム１１，１２に対してインサート成形により一体に形成されており、上面中央に、すり鉢状に上方に向かって拡る凹陥部１３ａを備えている。
ここで、上記凹陥部１３ａの底部にて、上記リードフレーム１１，１２の先端のチップ実装部１１ａ及びボンディング部１２ａが露出するようになっている。 The frame-shaped member 13 is integrally formed with the lead frames 11 and 12 by insert molding, and has a concave portion 13a that expands upward in a mortar shape at the center of the upper surface.
Here, the chip mounting portion 11a and the bonding portion 12a at the tips of the lead frames 11 and 12 are exposed at the bottom of the recessed portion 13a.

また、上記枠状部材１３は、本発明に基づいて、主として後述する透明樹脂部１５を構成する材料、即ち高耐熱の熱硬化性透明樹脂、例えば透明エポキシ樹脂から構成され、さらに例えばガラスフィラーと酸化チタンを添加されると共に、酸化防止剤を添加されている。
ここで、上記ガラスフィラー及び酸化チタンは、枠状部材１３の反射率を向上させるためのものであり、また酸化防止剤は、熱硬化性透明樹脂の酸化による樹脂変色を防止し、反射率の低下を抑制するものである。 The frame-shaped member 13 is mainly composed of a material constituting the transparent resin portion 15 described later, that is, a high heat-resistant thermosetting transparent resin, for example, a transparent epoxy resin, based on the present invention. Titanium oxide is added and an antioxidant is added.
Here, the glass filler and titanium oxide are for improving the reflectance of the frame-like member 13, and the antioxidant prevents resin discoloration due to oxidation of the thermosetting transparent resin, and the reflectance is reduced. It suppresses the decrease.

上記枠状部材１３は、前述したリードフレーム１１，１２に対してインサート成形されるが、その際、例えば主たる構成材料である透明エポキシ材料に関して、所謂Ｂステージ状態で反応を停止させて、粉末状に粉砕したものを押し固めたタブレットを形成した後、このタブレットを使用して所謂トランスファーモールドにより成形される。   The frame-like member 13 is insert-molded with respect to the lead frames 11 and 12 described above. At this time, for example, with respect to the transparent epoxy material which is the main constituent material, the reaction is stopped in a so-called B-stage state, and the powder-like member After forming a tablet in which the pulverized product is pressed and hardened, the tablet is molded by a so-called transfer mold.

上記ＬＥＤチップ５は、上記枠状部材１３の凹陥部１３ａ内にて、一方のリードフレーム１３の先端のチップ実装部１３ａ上に接合されると共に、その表面に設けられた電極が、隣接して凹陥部１３ａ内に露出する他方のリードフレーム１２の先端のボンディング部１２ａに対してボンディングワイヤ１６により電気的に接続されるようになっている。   The LED chip 5 is bonded to the chip mounting portion 13a at the tip of one lead frame 13 in the recessed portion 13a of the frame-shaped member 13, and an electrode provided on the surface thereof is adjacent to the LED chip 5. The bonding wire 16 is electrically connected to the bonding portion 12a at the tip of the other lead frame 12 exposed in the recessed portion 13a.

ここで、上記ＬＥＤチップ１４は、所謂青色ＬＥＤチップであって、例えば主として窒化物系半導体材料から構成されており、駆動電圧が印加されたとき、４２０乃至４８０ｎｍにピーク波長を有する光を発するようになっている。   Here, the LED chip 14 is a so-called blue LED chip, which is mainly composed of, for example, a nitride-based semiconductor material, and emits light having a peak wavelength at 420 to 480 nm when a driving voltage is applied. It has become.

さらに、上記ＬＥＤチップ１４は、上記チップ実装部１１ａに対して、例えばＡｕ−Ｓｎ共晶等の共晶接合によって接合されるようになっている。その際、枠状部材１３が前述したように主として高耐熱の熱硬化性透明樹脂から構成されていることにより、共晶接合に必要な温度（例えば３００℃）において耐熱性を有しているので、枠状部材１３に影響を与えることなく、ＬＥＤチップ１４のチップ実装部１１ａに対する共晶接合が行なわれ得る。   Further, the LED chip 14 is bonded to the chip mounting portion 11a by eutectic bonding such as Au-Sn eutectic. At that time, the frame-shaped member 13 is mainly composed of a highly heat-resistant thermosetting transparent resin as described above, and therefore has heat resistance at a temperature required for eutectic bonding (for example, 300 ° C.). The eutectic bonding to the chip mounting portion 11a of the LED chip 14 can be performed without affecting the frame-shaped member 13.

上記透明樹脂部１５は、微粒子状の蛍光体１５ａを混入した高耐熱の熱硬化性透明樹脂、例えば透明エポキシ樹脂等から構成されており、上記枠状部材１３の凹陥部１３ａ内に充填され、硬化されている。
そして、この透明樹脂部１５に、ＬＥＤチップ１４からの青色光が入射することにより、蛍光体１５ａが励起され、蛍光体１５ａから黄色光を発生させると共に、これらの混色による白色光が外部に出射するようになっている。 The transparent resin portion 15 is made of a highly heat-resistant thermosetting transparent resin mixed with particulate phosphor 15a, such as a transparent epoxy resin, and is filled in the recessed portion 13a of the frame-shaped member 13, It is cured.
When the blue light from the LED chip 14 is incident on the transparent resin portion 15, the phosphor 15 a is excited to generate yellow light from the phosphor 15 a, and white light due to these mixed colors is emitted to the outside. It is supposed to be.

ここで、蛍光体１５ａは、例えばセリウム，ガドリニウム等をドープしたＹＡＧ蛍光体や、このようなＹＡＧ蛍光体にてイットリウムを他の元素に置換したもの、あるいはオルトシリケート誘導体等が使用され、５３０乃至５９０ｎｍにピーク波長を有する蛍光を発するようになっている。   Here, as the phosphor 15a, for example, a YAG phosphor doped with cerium, gadolinium or the like, a yttrium substituted with such a YAG phosphor, or an orthosilicate derivative is used. It emits fluorescence having a peak wavelength at 590 nm.

本発明実施形態による表面実装型白色ＬＥＤ１０は、以上のように構成されており、製造の際には、以下のようにして製造される。
即ち、まず、リードフレーム１１，１２に対して枠状部材１３がインサート成形される。
その後、枠状部材１３の凹陥部１３ａ内にて、リードフレーム１１のチップ実装部１１ａ上にＬＥＤチップ１４が共晶接合によって接合されると共に、リードフレーム１２のボンディング部１２ａに対してワイヤボンディングされる。
次に、枠状部材１３の凹陥部１３ａ内に、蛍光体１５ａを混入した高耐熱の熱硬化性透明樹脂が充填され、硬化されることにより、透明樹脂部１５が形成され、表面実装型ＬＥＤ１０が完成する。 The surface-mounted white LED 10 according to the embodiment of the present invention is configured as described above, and is manufactured as follows in the manufacturing process.
That is, first, the frame-shaped member 13 is insert-molded with respect to the lead frames 11 and 12.
Thereafter, the LED chip 14 is bonded to the chip mounting portion 11 a of the lead frame 11 by eutectic bonding in the recessed portion 13 a of the frame-shaped member 13 and wire bonded to the bonding portion 12 a of the lead frame 12. The
Next, the recessed portion 13a of the frame-shaped member 13 is filled with a highly heat-resistant thermosetting transparent resin mixed with the phosphor 15a and cured to form the transparent resin portion 15, and the surface mount LED 10 Is completed.

このような構成の表面実装型ＬＥＤ１０によれば、一対のリードフレーム１１，１２を介してＬＥＤチップ１４に駆動電圧が印加されると、ＬＥＤチップ１４が発光して、青色光が出射する。
そして、ＬＥＤチップ１４から出射する青色光の一部が、透明樹脂部１５に混入された蛍光体１５ａに入射することにより、蛍光体１５ａが励起されて、黄色光を発生させる。
この黄色光が、ＬＥＤチップ１４からの青色光と混色されることにより、白色光となって、透明樹脂部１５を通って、透明樹脂部１５の上面から外部に出射することになる。 According to the surface-mounted LED 10 having such a configuration, when a driving voltage is applied to the LED chip 14 via the pair of lead frames 11 and 12, the LED chip 14 emits light and emits blue light.
Then, a part of the blue light emitted from the LED chip 14 enters the phosphor 15a mixed in the transparent resin portion 15, whereby the phosphor 15a is excited and yellow light is generated.
The yellow light is mixed with the blue light from the LED chip 14 to become white light, which is emitted from the upper surface of the transparent resin portion 15 to the outside through the transparent resin portion 15.

このようにして、本発明実施形態による表面実装型白色ＬＥＤ１０によれば、枠状部材１３を構成する主材料が、透明樹脂部１５を構成する材料と同じであることから、枠状部材１３と透明樹脂部１５の熱膨張係数が殆ど同じである。従って、ＬＥＤチップ１４の駆動により発生する熱によって、枠状部材１３及び透明樹脂部１５の温度が変化したとしても、枠状部材１３及び透明樹脂部１５が互いに剥離してしまうようなことがなく、信頼性の高い表面実装型ＬＥＤ１０が得られることになる。   Thus, according to the surface-mounted white LED 10 according to the embodiment of the present invention, since the main material constituting the frame-shaped member 13 is the same as the material constituting the transparent resin portion 15, The thermal expansion coefficient of the transparent resin portion 15 is almost the same. Therefore, even if the temperature of the frame-shaped member 13 and the transparent resin portion 15 changes due to the heat generated by driving the LED chip 14, the frame-shaped member 13 and the transparent resin portion 15 do not peel off from each other. Thus, a highly reliable surface-mounted LED 10 can be obtained.

また、枠状部材１３が高耐熱材料から構成されていることにより、枠状部材１３の凹陥部１３ａ内に露出しているリードフレーム１１のチップ実装部１１ａに対してＬＥＤチップ１３を共晶接合する場合、枠状部材１３の材料が共晶接合に必要な温度（例えば３００℃）にて耐熱性を有しているので、枠状部材１３に影響を与えることなく、共晶接合が行なわれ得ることになる。従って、ＬＥＤチップ１４がリードフレーム１１のチップ実装部１１ａに対して良好に接合され得ることになる。   Further, since the frame-shaped member 13 is made of a high heat-resistant material, the LED chip 13 is eutectic bonded to the chip mounting portion 11a of the lead frame 11 exposed in the recessed portion 13a of the frame-shaped member 13. In this case, since the material of the frame member 13 has heat resistance at a temperature required for eutectic bonding (for example, 300 ° C.), eutectic bonding is performed without affecting the frame member 13. Will get. Therefore, the LED chip 14 can be satisfactorily bonded to the chip mounting portion 11a of the lead frame 11.

上述した実施形態においては、ＬＥＤチップ１４として、青色ＬＥＤチップを使用しているが、これに限らず、他の色の光を出射するＬＥＤチップであってもよい。   In the above-described embodiment, a blue LED chip is used as the LED chip 14. However, the LED chip 14 is not limited to this, and may be an LED chip that emits light of other colors.

このようにして、本発明によれば、簡単な構成により、枠状部材と透明樹脂部を構成する封止樹脂との間の剥離を防止すると共に、ＬＥＤチップの共晶接合が行なわれ得るようにした、表面実装型ＬＥＤが提供され得る。   As described above, according to the present invention, it is possible to prevent peeling between the frame-shaped member and the sealing resin constituting the transparent resin portion and to perform eutectic bonding of the LED chip with a simple configuration. A surface mount LED can be provided.

本発明による表面実装型白色ＬＥＤの一実施形態を示す概略断面図である。It is a schematic sectional drawing which shows one Embodiment of the surface mount type white LED by this invention. 従来の表面実装型白色ＬＥＤの一例の構成を示す概略断面図である。It is a schematic sectional drawing which shows the structure of an example of the conventional surface mount type white LED.

符号の説明Explanation of symbols

１０ 表面実装型白色ＬＥＤ
１１，１２ リードフレーム
１１ａ チップ実装部
１１ｂ，１２ｂ 接続部
１２ａ ボンディング部
１３ 枠状部材
１３ａ 凹陥部
１４ ＬＥＤチップ
１５ 透明樹脂部
１５ａ 蛍光体
１６ ボンディングワイヤ 10 Surface mounted white LED
DESCRIPTION OF SYMBOLS 11, 12 Lead frame 11a Chip mounting part 11b, 12b Connection part 12a Bonding part 13 Frame member 13a Recessed part 14 LED chip 15 Transparent resin part 15a Phosphor 16 Bonding wire

Claims (6)

ＬＥＤチップを収容すべき凹陥部を備えた枠状部材と、この枠状部材の凹陥部の底部に露出するチップ実装部及びボンディング部を有し且つ上記枠状部材の下面に回り込む一対のリードフレームと、上記枠状部材の凹陥部内にて上記チップ実装部上に接合され且つその表面が上記ボンディング部に対して接続されるＬＥＤチップと、上記枠状部材の凹陥部内に充填される透明樹脂部と、を含んでいる表面実装型ＬＥＤであって、
上記枠状部材が、主として透明樹脂部を構成する高耐熱の熱硬化性透明樹脂から構成されており、
上記ＬＥＤチップが、上記チップ実装部の表面に対して共晶接合されていることを特徴とする、表面実装型ＬＥＤ。 A pair of lead frames having a frame-shaped member having a recessed portion to receive the LED chip, and having a chip mounting portion and a bonding portion exposed at the bottom of the recessed portion of the frame-shaped member and wrapping around the lower surface of the frame-shaped member An LED chip bonded on the chip mounting portion in the recessed portion of the frame-shaped member and having a surface connected to the bonding portion, and a transparent resin portion filled in the recessed portion of the frame-shaped member A surface-mount type LED including:
The frame-shaped member is mainly composed of a high heat-resistant thermosetting transparent resin that constitutes the transparent resin portion,
A surface-mounted LED, wherein the LED chip is eutectic bonded to the surface of the chip mounting portion. 上記枠状部材が、熱硬化性透明樹脂に酸化チタン及び／またはガラスフィラーを添加した材料から構成されていることを特徴とする、請求項１に記載の表面実装型ＬＥＤ。   The surface-mounted LED according to claim 1, wherein the frame-shaped member is made of a material obtained by adding titanium oxide and / or glass filler to a thermosetting transparent resin. 上記枠状部材を構成する材料が、さらに酸化防止剤を添加されていることを特徴とする、請求項２に記載の表面実装型ＬＥＤ。   The surface-mount LED according to claim 2, wherein the material constituting the frame-like member is further added with an antioxidant. 上記透明樹脂部が、蛍光体を混入した透明樹脂により構成されており、
上記ＬＥＤチップからの出射光により蛍光体を励起させて、出射光と励起光との混色光を外部に出射することを特徴とする、請求項１から３の何れかに記載の表面実装型ＬＥＤ。 The transparent resin part is composed of a transparent resin mixed with a phosphor,
4. The surface-mount type LED according to claim 1, wherein the phosphor is excited by light emitted from the LED chip, and mixed color light of the emitted light and the excitation light is emitted to the outside. 5. . 上記ＬＥＤチップが、青色ＬＥＤチップであることを特徴とする、請求項１から４の何れかに記載の面実装型ＬＥＤ。   The surface-mount type LED according to claim 1, wherein the LED chip is a blue LED chip. 上記枠状部材が、上記一対のリードフレームに対してインサート成形により一体に構成されていることを特徴とする、請求項１から５の何れかに記載の表面実装型ＬＥＤ。   6. The surface mount type LED according to claim 1, wherein the frame-shaped member is integrally formed with the pair of lead frames by insert molding.
JP2004069311A 2004-03-11 2004-03-11 Surface-mounting led Pending JP2005259972A (en)

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