JP5294741B2 - RESIN MOLDED BODY, SURFACE MOUNTED LIGHT EMITTING DEVICE AND METHOD FOR PRODUCING THEM - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a long-life surface mount type light-emitting device having excellent mass productivity, and to provide a forming body used for the surface mount type light-emitting device. <P>SOLUTION: The surface mount type light-emitting device has a light-emitting element 100 and first and second resin forming bodies 40, 50. In the first resin forming body 40, a substrate 10 on which the light-emitting element 100 is placed and first and second leads 20, 30 electrically connected to the light-emitting element 100 are formed integrally. In the second resin forming body 50, the light-emitting element 100 is covered. In the first resin forming body 40, a recess 40c having a bottom surface 40a and a side 40b is formed. The first and second leads 20, 30 are exposed from the bottom surface 40a of the recess 40c of the first resin forming body 40. The first and second resin forming bodies 40, 50 are made of a thermosetting resin. <P>COPYRIGHT: (C)2009,JPO&amp;INPIT

Description

  The present invention relates to a surface-mounted light-emitting device used for a lighting fixture, a display, a backlight of a mobile phone, a moving image illumination auxiliary light source, other general consumer light sources, a resin molded body suitable for the surface-mounted light-emitting device, and a manufacturing method thereof.

  A surface-mounted light-emitting device using a light-emitting element emits light of a bright color that is small and power efficient. In addition, since this light emitting element is a semiconductor element, there is no fear of a broken ball. Further, it has excellent initial driving characteristics and is strong against vibration and repeated on / off lighting. Because of such excellent characteristics, light-emitting devices using light-emitting elements such as light-emitting diodes (LEDs) and laser diodes (LDs) are used as various light sources.

  FIG. 23 is a schematic plan view showing a conventional surface mount light emitting device. FIG. 24 is a schematic cross-sectional view showing a conventional surface mount light emitting device. A conventional surface mount light emitting device includes a light emitting element 510, a mounting lead frame 520 for mounting the light emitting element 510, a connection lead frame 530 connected to the light emitting element 510 via a conductor, and most of each lead frame. And a molded body 540 for covering (see, for example, Patent Document 1). In this surface-mounted light-emitting device, a thermoplastic resin such as a liquid crystal polymer, PPS (polyphenylene sulfide), or nylon is often used as the light-shielding resin for the molded body 540 because the mass productivity is given priority. In general, since the thermoplastic resin used for the molded body 540 needs to have heat resistance that can withstand reflow soldering heat, engineering polymers such as semi-aromatic polyamide, liquid crystal polymer, and PPS are used. In general, thermoplastic resins are produced by injection molding. This injection molding method has become the mainstream for providing high-power surface-mounted light-emitting devices at low cost because of its good productivity.

JP 11-0877780 A (Claims, [0020])

  Although these thermoplastic engineering polymers used for the molded body 540 of the conventional surface-mounted light-emitting device have excellent heat resistance, they have an aromatic component in the molecule and thus have poor light resistance. In addition, since it does not have a hydroxyl group or the like for improving adhesiveness at the molecular end, there is a problem that the adhesion with the lead frames 520 and 530 and the translucent sealing resin 550 cannot be obtained. Furthermore, the output improvement of the light emitting element is remarkable in recent years, and the light deterioration of the molded body 540 becomes remarkable as the output of the light emitting element is increased. In particular, the adhesive interface between the translucent sealing resin 550 and the thermoplastic engineering polymer molded body 540 is easily broken and peeled off due to poor adhesion. Further, discoloration due to light deterioration proceeds even without peeling, and the lifetime of the light emitting device is greatly shortened.

  In order to solve these problems, there is also a technique in which the molded body is made of an inorganic material that does not deteriorate light, such as ceramics. However, it is difficult to insert a lead frame with good thermal conductivity in a molded body using this ceramic, and the thermal resistance value cannot be lowered. Further, since the expansion coefficient differs from that of the translucent sealing resin by one order or more, reliability has not been obtained.

  In view of the above, an object of the present invention is to provide a surface-mounted light-emitting device having a long life and excellent mass productivity and a molded body used for the surface-mounted light-emitting device. Moreover, it aims at providing those manufacturing methods with easy manufacture.

  In order to solve the above-mentioned problems, the present inventor has intensively studied and as a result, the present invention has been completed.

  The present invention is a method of manufacturing a resin molded body in which a recess having a bottom surface and a side surface is formed by integrally molding a base, a first lead, and a second lead. A recess corresponding to the recess of the resin molded body is formed, the first lead has a first inner lead portion and a first outer lead portion, and the second lead is a second inner lead. And a second outer lead portion, the first inner lead portion and the second inner lead portion corresponding to the bottom surface of the concave portion of the resin molded body, and the first outer lead portion and the second outer lead. A first step of sandwiching the lead portion between the upper die and the lower die, a second step of pouring a thermosetting resin into the recessed portion sandwiched between the upper die and the lower die by a transfer mold, The molded thermoset resin is heated and cured to form a resin molding. A third step of forming a method for producing a resin molded article having.

  Prior to the first step, a step of placing the protective element on the first lead and the second lead may be included.

  The present invention includes a first resin molded body in which a recess having a bottom surface and a side surface is formed by integrally molding a base, a first lead, and a second lead, and is placed on the base. And a second resin molded body covered with the light emitting element, wherein the upper mold has a recess corresponding to the recess of the first resin molded body. The first lead has a first inner lead portion and a first outer lead portion, and the second lead has a second inner lead portion and a second outer lead portion. A first inner lead portion and a second inner lead portion corresponding to the bottom surface of the concave portion of the first resin molded body, and the first outer lead portion and the second outer lead portion as an upper mold. In the first step to be sandwiched between the lower mold and the recessed portion sandwiched between the upper mold and the lower mold A second step of pouring the thermosetting resin of 1 with a transfer mold, a third step of heating and curing the poured first thermosetting resin, and molding the first resin molding, A fourth step of removing the upper mold; and placing the light emitting element on the base, electrically connecting the first electrode of the light emitting element and the first inner lead portion, and A fifth step of electrically connecting the second electrode and the second inner lead portion, a sixth step of disposing a second thermosetting resin in the recess where the light emitting element is placed, And a seventh step of forming a second resin molded body by heating and curing the thermosetting resin, and a method for manufacturing the surface-mounted light-emitting device.

  Prior to the first step, a step of placing the protective element on the first lead and the second lead may be included.

  The seventh step can be a step of casting the second thermosetting resin with a transfer mold and curing it by heating to mold the second resin molded body.

  The present invention relates to a first resin molded body formed by integrally molding a light emitting element; a first lead and a second lead electrically connected to the light emitting element; and a second coated with the light emitting element. The first resin molded body has a recess having a bottom surface and a side surface, and the first resin molded body has a first surface from the bottom surface of the recess. The lead and the second lead are exposed, and the light-emitting element is mounted face-down on the exposed first and second leads, opposite to the side electrically connected to the light-emitting element. The back side of at least one of the first lead and the second lead is exposed from the first resin molded body, and the first resin molded body and the second resin molded body are thermosetting resins. Yes, the first resin molding is a filler, a diffusing agent, a reflective material, a light-shielding material And at least one selected is contained from the group consisting of the first resin molding, relates to a surface mounted light emitting device is molded by transfer molding.

  The first resin molded body is preferably formed by at least one selected from the group consisting of epoxy resins, modified epoxy resins, silicone resins, modified silicone resins, acrylate resins, and urethane resins.

  The second resin molded body may contain at least one selected from the group consisting of a filler, a diffusing agent, a pigment, a fluorescent material, a reflective material, an ultraviolet absorber, and an antioxidant.

  In the surface-mount light-emitting device, a protective element is placed on either the first lead or the second lead, and the protective element can be covered with the first resin molding.

  As described above, the present invention has an effect of being excellent in mass productivity.

  The present invention relates to a first resin molding formed by integrally molding a light emitting element; a base on which the light emitting element is placed; and a first lead and a second lead electrically connected to the light emitting element. And a second resin molded body on which the light emitting element is coated, wherein the first resin molded body has a recess having a bottom surface and a side surface. The first lead and the second lead are exposed from the bottom surface of the concave portion of the resin molded body, and the first resin molded body and the second resin molded body are thermosetting resins. The present invention relates to a surface mount light emitting device. This thermosetting resin is preferably one having no aromatic component in the molecule as much as possible.

  As a result, a surface mount light emitting device having excellent heat resistance and light resistance can be provided.

  Moreover, peeling of the interface with the second resin molded body can be prevented by using the first resin molded body as a thermosetting resin. This is because, unlike the thermoplastic resin, the thermosetting resin has a large number of reactive functional groups on the surface, so that a strong adhesive interface can be formed with the second resin molded body. And since the isotropic thermal expansion / contraction behavior similar to that of the first resin molding can be obtained by using the second resin molding as a thermosetting resin, the thermal stress at the adhesive interface due to temperature change can be reduced. Further reduction can be achieved. Next, by making the second resin molded body the same type of thermosetting resin as the first resin molded body, not only the adhesion force is improved by reducing the interfacial tension, but also the curing reaction proceeds at the interface, resulting in extremely strong adhesion. It becomes possible to obtain sex. Regarding the light resistance, the thermosetting resin that is three-dimensionally crosslinked can easily change the composition without impairing the heat resistance, so that it is possible to easily eliminate aromatic components with poor light resistance. On the other hand, in a thermoplastic resin, heat resistance and an aromatic component are virtually synonymous, and a molded product that can withstand reflow soldering heat cannot be obtained without the aromatic component. Therefore, by making the first resin molded body and the second resin molded body into a thermosetting resin, the surface has an inherently strong adhesive interface, is excellent in peel resistance with little light deterioration, and has little secular change. A mounted light emitting device can be obtained.

  The second resin molded body is disposed in the recess in which the light emitting element is placed. Thus, the light emitting element can be easily covered. In addition, since the refractive index of the light emitting element and the refractive index in the air are greatly different, the light emitted from the light emitting element is not efficiently output to the outside, whereas the second resin molded body covers the light emitting element. By doing so, the light emitted from the light emitting element can be efficiently output to the outside. In addition, the light emitted from the light emitting element is applied to the bottom and side surfaces of the recess, reflected, and emitted to the main surface side on which the light emitting element is placed. Thereby, the light emission output on the main surface side can be improved. Furthermore, since the first lead is made of metal rather than covering the bottom surface of the recess with the first resin molding, the light reflection efficiency from the light emitting element can be increased.

  For example, an epoxy resin can be used for the first resin molding and a hard silicone resin can be used for the second resin molding.

  The present invention relates to a first resin molding formed by integrally molding a light emitting element; a base on which the light emitting element is mounted; and a first lead and a second lead electrically connected to the light emitting element. And a second resin molded body that covers the light emitting element, wherein the first lead has a first inner lead portion and a first outer lead portion. The first inner lead portion is electrically connected to the first electrode of the light emitting element, and the first outer lead portion is exposed from the first resin molded body, and the second lead Has a second inner lead portion and a second outer lead portion, and the second inner lead portion is electrically connected to the second electrode of the light emitting element, and the second outer lead portion. The lead portion is exposed from the first resin molded body, and the first resin molded body And the second resin molded body in a surface mount-type light-emitting device is a thermosetting resin. This thermosetting resin is preferably one having no aromatic component in the molecule as much as possible. As a result, it is possible to provide a surface mount light emitting device having excellent heat resistance, light resistance, and adhesion. Moreover, since the first resin molded body and the second resin molded body are molded using the thermosetting resin, peeling of the interface between the first resin molded body and the second resin molded body is prevented. Can do. Furthermore, since the first lead and the second lead having a predetermined length are used after being bent, it is easy to be electrically connected to the external electrode, and can be used as it is mounted on an existing lighting fixture or the like. .

  It is preferable that the base is exposed from the bottom surface of the concave portion of the first resin molded body, and the light emitting element is placed on the exposed portion. Accordingly, heat from the light emitting element is directly transmitted to the base, so that the heat dissipation effect can be enhanced.

  The bottom surface of the base is preferably exposed from the first resin molded body. When a current is applied to the surface mount light emitting device, light is emitted and the light emitting element generates heat. With this configuration, this heat can be efficiently released to the outside. In particular, since heat from the light emitting element can be radiated to the outside at the shortest distance, it can be radiated extremely efficiently.

  The back surface side of at least one of the first lead and the second lead opposite to the side electrically connected to the light emitting element may be exposed from the first resin molded body. Thereby, the heat generated from the light emitting element can be efficiently radiated to the outside. Further, since the first lead and the second lead function as electrodes, they can be very easily connected to the external electrode. In particular, when the thick first lead and the second lead are used, even if it is not easy to bend these leads, it is easy to mount. In addition, since the first lead and the second lead are sandwiched between the predetermined molds in the manufacturing process, the generation of burrs can be reduced and the mass productivity can be improved. However, the entire back side of the first lead and the second lead does not need to be exposed, and only the part where it is desired to suppress the occurrence of burrs may be exposed.

  It is preferable that the exposed portion on the back surface side of the first lead and the exposed portion on the back surface side of the second lead are substantially on the same plane. Thereby, the stability at the time of mounting of a surface mount light-emitting device can be improved. In addition, since the exposed portion is on the same plane, it is only necessary to mount and mount the surface mount light emitting device on the external electrode on the flat plate using solder, thereby improving the mountability of the surface mount light emitting device. Can do. Furthermore, molding with a mold becomes extremely easy.

  The exposed part on the back surface side of the base may be arranged so that the heat dissipation member contacts. In addition to the surface mount light emitting device, the heat dissipating member can be disposed as an external member, and the heat dissipating member can be attached integrally with the surface mount light emitting device. Thereby, since the heat generated from the light emitting element is radiated to the outside through the heat radiating member, the heat dissipation can be further improved. Moreover, when arrange | positioning a heat radiating member as an external member, the mounting position of a surface mounted light-emitting device can be determined easily.

  The first resin molded body is formed by a transfer mold. A complicated shape cannot be formed by injection molding, whereas a molded body having a complicated shape can be formed by transfer molding. In particular, the first resin molded body having a recess can be easily molded.

  The first resin molded body is preferably formed by at least one selected from the group consisting of epoxy resins, modified epoxy resins, silicone resins, modified silicone resins, acrylate resins, and urethane resins. Among these, an epoxy resin, a silicone resin, and a modified silicone resin are preferable, and an epoxy resin is particularly preferable. As a result, it is possible to provide a surface-mounted light-emitting device that is excellent in heat resistance, light resistance, adhesion, and mass productivity. Moreover, since the direction using a thermosetting resin for the first resin molded body can reduce the deterioration of the first resin molded body, compared to the case of using a thermoplastic resin for the first resin molded body, The lifetime of the surface mount light emitting device can be extended.

  The first resin molded body may contain at least one selected from the group consisting of a filler, a diffusing agent, a pigment, a fluorescent material, a reflective material, a light shielding material, an ultraviolet absorber, and an antioxidant. . Various substances are added according to the requirements of the first resin molding. For example, this is a case where a highly light-transmitting resin is used for the first resin molded body and a fluorescent material is mixed into the first resin molded body. As a result, the light emitted to the side surface or the bottom surface side of the light emitting element is absorbed by the fluorescent material, and the light is converted and emitted, so that a desired emission color can be realized as the entire surface mount type light emitting device. For example, in order to uniformly disperse the emitted light, a filler, a diffusing agent, a reflective substance, or the like may be added to the side surface or the bottom surface side of the light emitting element. For example, a light shielding resin may be mixed in order to reduce the light output from the back side of the surface mount type light emitting device. In particular, the first resin molded body is preferably one in which titanium oxide, silica, and alumina are mixed in an epoxy resin. As a result, a surface mount light emitting device having excellent heat resistance can be provided.

  The second resin molded body may contain at least one selected from the group consisting of a filler, a diffusing agent, a pigment, a fluorescent material, a reflective material, an ultraviolet absorber, and an antioxidant. Various substances are added according to the requirements of the second resin molding. For example, a light emission color different from the light emission color emitted from the light emitting element can be realized by mixing a fluorescent material with the second resin molded body. For example, white light can be realized by using a light emitting element that emits blue light and a fluorescent material that emits yellow light. In addition, a filler, a diffusing agent, or the like can be mixed in order to emit light uniformly.

  In the surface-mount light-emitting device, a protective element is placed on either the first lead or the second lead, and the protective element can be covered with the first resin molding. Thereby, a highly reliable surface-mount light-emitting device can be provided. In addition, since the protective element can be placed in the first resin molded body, light from the light emitting element is not blocked.

  The present invention relates to a first resin molded body formed by integrally molding a light emitting element; a first lead and a second lead electrically connected to the light emitting element; and a second coated with the light emitting element. The first resin molded body has a recess having a bottom surface and a side surface, and the first resin molded body has a first surface from the bottom surface of the recess. The lead and the second lead are exposed, and the light-emitting element is mounted face-down on the exposed first lead and second lead. The first resin molded body and the second resin molded body Relates to a surface-mounted light-emitting device that is a thermosetting resin. Since the light-emitting element is mounted face-down, the thickness of the second resin molding can be reduced, and the surface-mounted light-emitting device can be downsized.

  It is preferable that at least one back side of the first lead and the second lead opposite to the side electrically connected to the light emitting element is exposed from the first resin molded body. Accordingly, heat from the light emitting element is directly transmitted to the base, so that the heat dissipation effect can be enhanced.

  The first resin molded body is formed by a transfer mold. A complicated shape cannot be formed by injection molding, whereas a molded body having a complicated shape can be formed by transfer molding. In particular, the first resin molded body having a recess can be easily molded.

  The first resin molded body is preferably formed by at least one selected from the group consisting of epoxy resins, modified epoxy resins, silicone resins, modified silicone resins, acrylate resins, and urethane resins. Among these, an epoxy resin, a silicone resin, and a modified silicone resin are preferable, and an epoxy resin is particularly preferable. As a result, it is possible to provide a surface-mounted light-emitting device that is excellent in heat resistance, light resistance, adhesion, and mass productivity.

  The first resin molded body may contain at least one selected from the group consisting of a filler, a diffusing agent, a pigment, a fluorescent material, a reflective material, a light shielding material, an ultraviolet absorber, and an antioxidant. . Thereby, various functions can be given to the 1st resin fabrication object.

  The second resin molded body may contain at least one selected from the group consisting of a filler, a diffusing agent, a pigment, a fluorescent material, a reflective material, an ultraviolet absorber, and an antioxidant. Thereby, a 2nd resin molding can be given various functions.

  In the surface-mount light-emitting device, a protective element is placed on either the first lead or the second lead, and the protective element can be covered with the first resin molding. Thereby, a highly reliable surface-mount light-emitting device can be provided. In addition, since the protective element can be placed in the first resin molded body, light from the light emitting element is not blocked.

  The present invention is a resin molded body formed by integrally molding a base, a first lead, and a second lead, and the first lead includes a first inner lead portion and a first outer lead portion. And the first inner lead portion is disposed in the resin molded body, the first outer lead portion is exposed from the resin molded body, and the second lead is connected to the second inner lead portion. A second outer lead portion, the second inner lead portion is disposed in the resin molded body, the second outer lead portion is exposed from the resin molded body, and the resin molded body is A concave portion having a bottom surface and a side surface is formed, and the first inner lead portion and the second inner lead portion are exposed from the bottom surface of the concave portion of the resin molded body, and the resin molded body is made of a thermosetting resin. It is related with a certain resin molding. Thereby, the resin molded body excellent in heat resistance, light resistance, adhesiveness, etc. can be provided compared with the case where a resin molded body is shape | molded using a thermoplastic resin. In addition, a structure in which the light emitting element can be easily placed can be obtained.

  The present invention is a resin molded body formed by integrally molding a base, a first lead, and a second lead, and the first lead includes a first inner lead portion and a first outer lead portion. And the first inner lead portion is disposed in the resin molded body, the first outer lead portion is exposed from the resin molded body, and the second lead is connected to the second inner lead portion. A second outer lead portion, the second inner lead portion is disposed on the resin molded body, and the second outer lead portion is exposed to the outside from the resin molded body. Is formed with a recess having a bottom surface and a side surface, the first inner lead portion and the second inner lead portion are exposed from the bottom surface of the recess of the molded resin body, and the main surface side where the recess is formed The back side of the base opposite to is exposed from the resin molding Cage, the resin molded article, a resin molded body is a thermosetting resin. Thereby, the resin molded body excellent in heat resistance, light resistance, adhesiveness, etc. can be provided compared with the case where a resin molded body is shape | molded using a thermoplastic resin. In addition, a structure in which the light emitting element can be easily placed can be obtained. Moreover, the heat which generate | occur | produces from a light emitting element can be thermally radiated outside by exposing a base from a resin molding.

  The present invention is a resin molded body formed by integrally molding a first lead and a second lead, and the first lead has a first inner lead portion and a first outer lead portion. The first inner lead portion is disposed in the resin molded body, the first outer lead portion is exposed from the resin molded body, and the second lead is connected to the second inner lead portion and the second inner lead portion. An outer lead portion, the second inner lead portion is disposed in the resin molded body, the second outer lead portion is exposed from the resin molded body, and the resin molded body has a bottom surface and a side surface. The resin molded body relates to a resin molded body that is a thermosetting resin. Thereby, the resin molded body excellent in heat resistance, light resistance, adhesiveness, etc. can be provided compared with the case where a resin molded body is shape | molded using a thermoplastic resin.

  It is preferable that the exposed portion on the back surface side of the first lead and the exposed portion on the back surface side of the second lead are substantially on the same plane. As a result, it is possible to provide a surface-mounted light-emitting device using a resin molded body having good stability and easy mounting. Furthermore, it is easy to mold with a mold.

  The thermosetting resin is preferably at least one selected from the group consisting of an epoxy resin, a modified epoxy resin, a silicone resin, a modified silicone resin, an acrylate resin, and a urethane resin. As a result, it is possible to provide a resin molded body that is inexpensive and has good mass productivity, excellent heat resistance, and light resistance.

  The resin molded body is formed by a transfer mold. Thereby, it is possible to form a concave portion having a complicated shape that is difficult to mold by injection molding.

  The resin molded body may contain at least one selected from the group consisting of fillers, diffusing agents, pigments, fluorescent substances, reflective substances, light-shielding substances, ultraviolet absorbers, and antioxidants. Thereby, the resin molding according to a request | requirement can be provided. For example, when a resin molded body having an action of diffusing light is desired, a filler and a diffusing agent are mixed. Further, when a surface-mounted light emitting device having a desired color tone by converting the wavelength is desired, a fluorescent material is mixed. In addition, in order to efficiently extract light from the light emitting element to the main surface side, a light shielding substance is mixed when it is desired to suppress transmission of light to the back surface side.

  In the resin molded body, a protective element is placed on either the first lead or the second lead, and the protective element can be covered with the first resin molded body. Thereby, a highly reliable surface-mount light-emitting device can be provided. In addition, since the protective element can be placed in the first resin molded body, light from the light emitting element is not blocked.

  The present invention is a method of manufacturing a resin molded body in which a recess having a bottom surface and a side surface is formed by integrally molding a base, a first lead, and a second lead. A recess corresponding to the recess of the resin molded body is formed, the first lead has a first inner lead portion and a first outer lead portion, and the second lead is a second inner lead. And a second outer lead portion, the first inner lead portion and the second inner lead portion corresponding to the bottom surface of the concave portion of the resin molded body, and the first outer lead portion and the second outer lead. A first step of sandwiching the lead portion between the upper die and the lower die, a second step of pouring a thermosetting resin into the recessed portion sandwiched between the upper die and the lower die by a transfer mold, The molded thermoset resin is heated and cured to form a resin molding. A third step of forming a method for producing a resin molded article having.

  As a result, since the first inner lead portion and the second inner lead portion are sandwiched between the upper die and the lower die in the first step, it is possible to suppress fluttering of these leads during transfer molding. It is possible to produce a resin molded body that is free from burrs. Further, the main surface side of the base corresponding to the portion on which the light emitting element is placed can be exposed. Furthermore, since the main surface side and back surface side of the base corresponding to the bottom surface of the recess are exposed, heat can be radiated from the back surface side when the light emitting element is placed, and heat dissipation can be improved.

  Moreover, since the thermosetting resin is transfer-molded, a resin molded body having a concave portion having a complicated shape can be manufactured. In addition, a resin molded article excellent in mass productivity, heat resistance, light resistance, adhesion, and the like can be produced. The thermoplastic resin is solidified by heating to a melting temperature and cooling. Therefore, the thermoplastic resin and the thermosetting resin are different in the cooling process and are different in whether they can be solidified reversibly. Moreover, the thermoplastic resin has a high viscosity at the time of processing and cannot form a complicated shape.

  Prior to the first step, a step of placing the protective element on the first lead and the second lead may be included. The protective element may be disposed inside the resin molded body or may be disposed outside the resin molded body. When the protective element is disposed inside the resin molded body, since the thermosetting resin is used for transfer molding, the wire connecting the protective element and the lead is hardly broken.

  The present invention includes a first resin molded body in which a recess having a bottom surface and a side surface is formed by integrally molding a base, a first lead, and a second lead, and is placed on the base. And a second resin molded body covered with the light emitting element, wherein the upper mold has a recess corresponding to the recess of the first resin molded body. The first lead has a first inner lead portion and a first outer lead portion, and the second lead has a second inner lead portion and a second outer lead portion. A first inner lead portion and a second inner lead portion corresponding to the bottom surface of the concave portion of the first resin molded body, and the first outer lead portion and the second outer lead portion as an upper mold. In the first step to be sandwiched between the lower mold and the recessed portion sandwiched between the upper mold and the lower mold A second step of pouring the thermosetting resin of 1 with a transfer mold, a third step of heating and curing the poured first thermosetting resin, and molding the first resin molding, A fourth step of removing the upper mold; and placing the light emitting element on the base, electrically connecting the first electrode of the light emitting element and the first inner lead portion, and A fifth step of electrically connecting the second electrode and the second inner lead portion, a sixth step of disposing a second thermosetting resin in the recess where the light emitting element is placed, And a seventh step of forming a second resin molded body by heating and curing the thermosetting resin, and a method for manufacturing the surface-mounted light-emitting device. In particular, since a thermosetting resin is used for the first resin molded body and the second resin molded body, the first resin molded body and the second resin molded body are used in comparison with the case where a thermoplastic resin and a thermosetting resin are used. Adhesiveness with a resin molding can be improved. Further, when the first resin molded body is manufactured by the transfer mold, the occurrence of burrs becomes a problem because of good resin fluidity, but no burrs are generated because these leads are firmly sandwiched between the upper mold and the lower mold. Since the sandwiched lead is exposed, the light emitting element can be placed on the exposed portion, or the electrode and the lead of the light emitting element can be connected with a wire or the like.

  Prior to the first step, a step of placing the protective element on the first lead and the second lead may be included. The protective element may be disposed inside the resin molded body or may be disposed outside the resin molded body. When the protective element is disposed inside the resin molded body, since the thermosetting resin is used for transfer molding, the wire connecting the protective element and the lead is hardly broken.

  The seventh step may be a step of pouring the second thermosetting resin by a transfer mold and curing it by heating to mold the second resin molded body. Thereby, the 2nd resin molding can be made into predetermined shapes, such as lens shape.

  The thermosetting resin, the first thermosetting resin, and the second thermosetting resin are at least one selected from the group consisting of epoxy resins, modified epoxy resins, silicone resins, modified silicone resins, acrylate resins, and urethane resins. A seed resin is preferred. As a result, a surface-mounted light-emitting device with good mass productivity can be manufactured. In addition, since it has high fluidity and is easy to be heated and cured, it is possible to provide a surface mount light emitting device having excellent moldability and excellent heat resistance and light resistance.

  Since the surface-mounted light-emitting device and the molded body used for the surface-mounted light-emitting device according to the present invention are configured as described above, there is an effect of having a long life and excellent mass productivity.

  Hereinafter, a surface-mounted light-emitting device, a resin molded body, and a manufacturing method thereof according to the present invention will be described with reference to embodiments and examples. However, the present invention is not limited to this embodiment and example.

<First Embodiment>
<Surface mount type light emitting device>
A surface-mounted light-emitting device according to a first embodiment will be described with reference to the drawings. FIG. 1 is a schematic cross-sectional view showing the surface-mounted light emitting device according to the first embodiment. FIG. 2 is a schematic plan view showing the surface mounted light emitting device according to the first embodiment. FIG. 1 is a schematic cross-sectional view taken along the line II of FIG.

  The surface-mounted light emitting device according to the first embodiment includes a light emitting element 100, a first resin molded body 40 on which the light emitting element 100 is placed, and a second resin molded body 50 that covers the light emitting element 100. Have The first resin molded body 40 is integrally formed with the base 10 on which the light emitting element 100 is placed and the first lead 20 and the second lead 30 that are electrically connected to the light emitting element 100. ing.

  The light emitting element 100 includes a pair of positive and negative first electrodes 101 and second electrodes 102 on the same surface side. In this specification, an electrode having a pair of positive and negative electrodes on the same surface side is described; however, an electrode having a pair of positive and negative electrodes from the upper surface and the lower surface of the light-emitting element can also be used. In this case, the electrode on the lower surface of the light emitting element is electrically connected to the base 10 using an electrically conductive die bond member without using a wire, and the base 10 and the first lead 20 or the second lead are connected. Connect electrically.

  The light emitting element 100 is mounted on the base 10 via a die bond member. The base 10 is preferably a member having better thermal conductivity than the first resin molded body 40 in order to improve heat dissipation. For example, a metal member subjected to silver plating or the like.

  The first lead 20 has a first inner lead portion 20a and a first outer lead portion 20b. The first inner lead portion 20 a is electrically connected to the first electrode 101 of the light emitting element 100 through the wire 60. The first outer lead portion 20 b is exposed from the first resin molded body 40. The first lead 20 is exposed on the back side of the first resin molded body 40 in addition to the portion exposed to the outside of the side surface of the first resin molded body 40 being called a first outer lead portion 20b. The portion may be referred to as a first outer lead portion 20b, and the first outer lead portion 20b may be a portion that is electrically connected to the external electrode. Since the first lead 20 is connected to the external electrode, a metal member is used.

  The second lead 30 has a second inner lead portion 30a and a second outer lead portion 30b. The second inner lead portion 30 a is electrically connected to the second electrode 102 of the light emitting element 100 through the wire 60. The second outer lead portion 30 b is exposed from the first resin molded body 40. The second lead 30 is exposed on the back side of the second resin molded body 40 in addition to the portion exposed to the outside of the side surface of the second resin molded body 40 being called the second outer lead portion 30b. The portion may be referred to as a second outer lead portion 30b, and the second outer lead portion 30b may be a portion that is electrically connected to the external electrode. The second lead 30 uses a metal member to connect to the external electrode. An insulating member 90 can also be provided in the vicinity of the first lead 20 and the second lead 30 on the back surface side so that the first lead 20 and the second lead 30 are not short-circuited.

  The 1st resin molding 40 forms the recessed part 40c which has the bottom face 40a and the side surface 40b. The base 10 is exposed from the bottom surface 40 a of the recess 40 c of the first resin molded body 40. The first resin molded body 40 is molded by a transfer mold. The first resin molded body 40 uses a thermosetting resin. The opening of the recess 40c is preferably wider than the bottom surface 40a, and the side surface 40b is preferably provided with an inclination. The concave portion 40c of the first resin molded body 40 preferably has a shape that is surrounded on all sides, but a wall portion may be formed only on two opposite sides.

  The 2nd resin molding 50 is arrange | positioned in the recessed part 40c so that the light emitting element 100 may be coat | covered. The second resin molded body 50 uses a thermosetting resin. The second resin molded body 50 contains a fluorescent material 80. The fluorescent material 80 is uniformly dispersed in the second resin molded body 50. However, the fluorescent material 80 may have a specific gravity larger than that of the second resin molded body 50 and may be allowed to settle to the bottom surface 40a side of the recess 40c.

  In this specification, the side on which the light emitting element 100 is placed is called a main surface side, and the opposite side is called a back surface side.

  The first resin molded body 40 and the second resin molded body 50 use a thermosetting resin, and have very good adhesion because physical properties such as an expansion coefficient are approximated. In addition, with the above structure, it is possible to provide a surface-mounted light-emitting device that is excellent in heat resistance, light resistance, and the like.

  Hereinafter, each component will be described in detail.

<Light emitting element>
The light emitting element 100 is formed by forming a semiconductor such as GaAlN, ZnS, ZnSe, SiC, GaP, GaAlAs, AlN, InN, AlInGaP, InGaN, GaN, or AlInGaN on a substrate as a light emitting layer. Examples of the semiconductor structure include a homo structure having a MIS junction, a PIN junction, and a PN junction, a hetero structure, and a double hetero structure. Various emission wavelengths can be selected from ultraviolet light to infrared light depending on the material of the semiconductor layer and the degree of mixed crystal. The light emitting layer may have a single quantum well structure or a multiple quantum well structure which is a thin film in which a quantum effect is generated.

  When considering use outdoors, it is preferable to use a gallium nitride-based compound semiconductor as a semiconductor material capable of forming a high-luminance light-emitting element. In red, gallium-aluminum-arsenic-based semiconductors and aluminum-indium- Although it is preferable to use a gallium / phosphorus-based semiconductor, various semiconductors can be used depending on the application.

  When a gallium nitride compound semiconductor is used, a material such as sapphire, spinel, SiC, Si, ZnO, or GaN single crystal is used for the semiconductor substrate. A sapphire substrate is preferably used to form gallium nitride with good crystallinity with high productivity. 100 examples of light-emitting elements using a nitride-based compound semiconductor are shown. A buffer layer such as GaN or AlN is formed on the sapphire substrate. A first contact layer made of N or P-type GaN, an active layer made of an InGaN thin film having a quantum effect, a clad layer made of P or N-type AlGaN, and a second contact made of P or N-type GaN. A structure in which contact layers are sequentially formed can be employed. Gallium nitride-based compound semiconductors exhibit N-type conductivity without being doped with impurities. When forming a desired N-type gallium nitride semiconductor such as improving luminous efficiency, Si, Ge, Se, Te, C, etc. are preferably introduced as appropriate as N-type dopants.

  On the other hand, when a P-type gallium nitride semiconductor is formed, a P-type dopant such as Zn, Mg, Be, Ca, Sr, or Ba is doped. Since a gallium nitride based semiconductor is difficult to be converted to P-type only by doping with a P-type dopant, it is necessary to make it P-type by annealing it by heating in a furnace, low electron beam irradiation, plasma irradiation or the like after introducing the P-type dopant. The semiconductor wafer thus formed is partially etched to form positive and negative electrodes. Thereafter, the light emitting element can be formed by cutting the semiconductor wafer into a desired size.

  A plurality of such light-emitting elements 100 can be used as appropriate, and the color mixing property in white display can be improved by a combination thereof. For example, two light emitting elements 100 capable of emitting green light and one light emitting element 100 capable of emitting blue and red light can be provided. In order to use as a full color light emitting device for a display device, it is preferable that a red light emission wavelength is 610 nm to 700 nm, a green light emission wavelength is 495 nm to 565 nm, and a blue light emission wavelength is 430 nm to 490 nm. In the surface-mounted light emitting device of the present invention, when emitting white mixed color light, the emission wavelength of the light emitting element is 400 nm or more in consideration of the complementary color relationship with the emission wavelength from the fluorescent material, deterioration of the translucent resin, and the like. 530 nm or less is preferable, and 420 nm or more and 490 nm or less is more preferable. In order to further improve the excitation and emission efficiency of the light emitting element and the fluorescent material, 450 nm or more and 475 nm or less are more preferable. Note that a light-emitting element having a main light emission wavelength in an ultraviolet region shorter than 400 nm or a short wavelength region of visible light can be used in combination with a member that is relatively difficult to be deteriorated by ultraviolet rays.

  The size of the light emitting element 100 can be □ 1 mm size, and □ 600 μm, □ 320 μm size, etc. can also be mounted.

  The light emitting element 100 can be mounted face-up or face-down. Moreover, what mounted the light emitting element 100 in the submount board | substrate can also be used.

<First resin molding>
The 1st resin molding 40 has the recessed part 40c which has the bottom face 40a and the side surface 40b. The first resin molded body 40 is formed by integrally molding the base 10 disposed on the bottom surface 40a of the recess 40c, the first lead 20 and the second lead 30 extending outward from the bottom surface 40a of the recess 40c. The base 10 forms a part of the bottom surface 40a of the recess 40c. The first inner lead portion 20a of the first lead 20 forms a part of the bottom surface 40a of the recess 40c. The second inner lead portion 30a of the second lead 30 forms a part of the bottom surface 40a of the recess 40c. The base 10 is separated from the first inner lead portion 20a and the second inner lead portion 30a by a predetermined distance, but may be connected to one side if not conductive. The light emitting element 100 is placed on the base 10 corresponding to the bottom surface 40a of the recess 40c. The base 10, the first inner lead portion 20a, the second inner lead portion 30a, the first outer lead portion 20b, and the second outer lead portion 30b corresponding to the bottom surface 40a of the recess 40c are formed of the first resin. The molded body 40 is exposed. The first lead 20 and the second lead 30 on the back side are exposed. Thereby, it can electrically connect from the back side.

  The recess 40c is inclined so as to have a wide opening in the opening direction. Thereby, the extraction of light in the forward direction can be improved. However, it is possible to form a cylindrical recess without providing an inclination. Moreover, although it is preferable that the inclination is smooth, unevenness can be provided. By providing the unevenness, the adhesion at the interface between the first resin molded body 40 and the second resin molded body 50 can be improved. The inclination angle of the recess 40c is preferably 95 ° or more and 150 ° or less, particularly preferably 100 ° or more and 120 ° or less, as measured from the bottom surface. The recess 40c preferably forms the side surface 40b so as to surround the four sides, but it may be provided only on the two sides facing each other. It is because the 2nd resin molding 50 can be fixed in the recessed part 40c using a thermosetting resin. The first resin molded body 40 preferably has a light reflectance of 460 nm of 50% or more, and more preferably 70% or more. However, since the 1st resin molding 40 should just be what can reflect the light of the light emitting element 10 efficiently, what reflects 30% or more of the light from the light emitting element 10 is preferable. More preferably, it is 50% or more, More preferably, it is 70% or more.

  The shape on the main surface side of the first resin molded body 40 is a rectangle, but may be an ellipse, a circle, a pentagon, a hexagon, or the like. The shape on the main surface side of the recess 40c is an ellipse, but may be a substantially circular shape, a rectangular shape, a pentagonal shape, a hexagonal shape, or the like. In certain cases, a cathode mark is attached.

  The material of the first resin molded body 40 is a thermosetting resin. Among thermosetting resins, it is preferably formed of at least one selected from the group consisting of epoxy resins, modified epoxy resins, silicone resins, modified silicone resins, acrylate resins, and urethane resins, particularly epoxy resins and modified epoxy resins. Silicone resins and modified silicone resins are preferred. For example, an epoxy resin composed of triglycidyl isocyanurate (Chemical Formula 1), hydrogenated bisphenol A diglycidyl ether (Chemical Formula 2), etc., hexahydrophthalic anhydride (Chemical Formula 3), 3-methylhexahydrophthalic anhydride (Chemical Formula 4) DBU (1,8) as a curing accelerator was added to 100 parts by weight of a colorless and transparent mixture obtained by dissolving and mixing an acid anhydride composed of 4-methylhexahydrophthalic anhydride (Chemical Formula 5) and the like in an epoxy resin in an equivalent amount. -Diazabicyclo (5,4,0) undecene-7) (Chemical Formula 6) 0.5 part by weight, ethylene glycol (Chemical Formula 7) as a cocatalyst 1 part by weight, titanium oxide pigment 10 parts by weight, glass fiber 50 It is possible to use a solid epoxy resin composition that is added by weight and partially cured by heating to be B-staged.

第１の樹脂成形体４０は、パッケージとしての機能を有するため硬質のものが好ましい。また、第１の樹脂成形体４０は透光性の有無を問わないが、用途等に応じて適宜設計することは可能である。例えば、第１の樹脂成形体４０に遮光性物質を混合して、第１の樹脂成形体４０を透過する光を低減することができる。一方、表面実装型発光装置からの光が主に前方及び側方に均一に出射されるように、フィラーや拡散剤を混合しておくこともできる。また、光の吸収を低減するために、暗色系の顔料よりも白色系の顔料を添加しておくこともできる。このように、第１の樹脂成形体４０は、所定の機能を持たせるため、フィラー、拡散剤、顔料、蛍光物質、反射性物質、遮光性物質、紫外線吸収剤、酸化防止剤からなる群から選択される少なくとも１種を混合することもできる。

Since the 1st resin molding 40 has a function as a package, a hard thing is preferable. In addition, the first resin molded body 40 may or may not be translucent, but can be appropriately designed according to the application. For example, a light shielding substance can be mixed in the first resin molded body 40 to reduce light transmitted through the first resin molded body 40. On the other hand, a filler or a diffusing agent can be mixed so that light from the surface-mounted light emitting device is emitted uniformly mainly forward and sideward. In order to reduce light absorption, a white pigment can be added to a dark pigment. As described above, the first resin molded body 40 has a predetermined function, so that the first resin molded body 40 is selected from the group consisting of fillers, diffusing agents, pigments, fluorescent substances, reflective substances, light-shielding substances, ultraviolet absorbers, and antioxidants. It is also possible to mix at least one selected.

<Base>
The base 10 mounts the light emitting element 100. The base 10 is preferably exposed from the recess 40c of the first resin molded body 40, but may be buried. The base 10 can be configured using a good electrical conductor such as iron, phosphor bronze, copper alloy or the like. In addition, in order to improve the reflectance of light from the light emitting element 100, the surface of the base 10 can be subjected to metal plating such as silver, aluminum, copper or gold. Moreover, in order to improve the reflectance of the surface of the base 10, smoothing is preferable. Further, the area of the base 10 can be increased in order to improve heat dissipation. Accordingly, the temperature rise of the light emitting element 100 can be effectively suppressed, and a relatively large amount of electricity can be passed through the light emitting element 100. Moreover, heat dissipation can be improved by making the base 10 thick. Moreover, by making the base 10 thick, the deflection of the base 10 is reduced, and the light emitting element 100 can be easily mounted. On the contrary, the surface mount type light emitting device can be made thin by making the base 10 into a thin flat plate shape. The shape of the base 10 is not particularly limited, and may be a flat cylindrical shape, a substantially rectangular parallelepiped shape, a substantially cubic shape, or the like, and may be formed with a recess.

<First lead and second lead>
The first lead 20 has a first inner lead portion 20a and a first outer lead portion 20b. The first inner lead portion 20 a is exposed from the bottom surface 40 a of the concave portion 40 c of the first resin molded body 40. The exposed first inner lead portion 20 a is electrically connected to the first electrode 101 of the light emitting element 100 through the wire 60. The exposed portion of the first inner lead portion 20a only needs to have an area for electrical connection with the light emitting element 100, but a larger area is preferable from the viewpoint of reflection efficiency. The first outer lead portion 20 b is a portion exposed from the first resin molded body 40 excluding a portion electrically connected to the light emitting element 100. The first outer lead portion 20b is electrically connected to the external electrode.

  The second lead 30 has a second inner lead portion 30a and a second outer lead portion 30b. The second inner lead portion 30 a is exposed from the bottom surface 40 a of the concave portion 40 c of the first resin molded body 40. The exposed second inner lead portion 30b only needs to have an area electrically connected to the second electrode 102 of the light emitting element 100, but a larger area is preferable from the viewpoint of reflection efficiency. The first outer lead portion 20b and the second outer lead portion 30b on the back surface side are exposed and form substantially the same plane. As a result, the mounting stability of the surface-mounted light-emitting device can be improved. Moreover, in order to prevent the back surfaces of the first inner lead portion 20a and the second inner lead portion 30a from being short-circuited by solder during soldering, the electrically insulating insulating member 90 can be thinly coated. The insulating member 90 is resin or the like. Further, by using the insulating base 10, the distance between the first lead 20 and the second lead 30 can be increased, and a short circuit can be prevented more effectively.

  The 1st lead | read | reed 20 and the 2nd lead | read | reed 30 can be comprised using electrical good conductors, such as iron, phosphor bronze, and a copper alloy. In addition, in order to improve the reflectance of light from the light emitting element 100, the surface of the first lead 20 and the second lead 30 can be subjected to metal plating such as silver, aluminum, copper or gold. Moreover, in order to improve the reflectance of the surface of the 1st lead | read | reed 20 and the 2nd lead | read | reed 30, it is preferable to make it smooth. Alternatively, the first lead 20 and the second lead 30 having higher thermal conductivity than the first resin molded body 40 can be used. In order to improve heat dissipation, the areas of the first lead 20 and the second lead 300 can be increased. Accordingly, the temperature rise of the light emitting element 100 can be effectively suppressed, and a relatively large amount of electricity can be passed through the light emitting element 100. Moreover, heat dissipation can be improved by making the first lead 20 and the second lead 30 thick. In this case, since the forming process such as bending the first lead 20 and the second lead 30 is difficult, it is cut into a predetermined size. Further, by making the first lead 20 and the second lead 30 thick, the deflection of the first lead 20 and the second lead 30 is reduced, and the wire 60 can be easily connected. On the contrary, by forming the first lead 20 and the second lead 30 into a thin flat plate shape, a bending process can be easily performed, and the first lead 20 and the second lead 30 can be formed into a predetermined shape.

  The first lead 20 and the second lead 30 are a pair of positive and negative electrodes. The first lead 20 and the second lead 30 may be at least one each, but a plurality of them may be provided. In addition, when mounting a plurality of light emitting elements 100 on the base 10, it is necessary to provide a plurality of first leads 20 and second leads 30.

<Second resin molding>
The second resin molded body 50 is provided to protect the light emitting element 100 from external force, dust, moisture, and the like from the external environment. Further, light emitted from the light emitting element 100 can be efficiently emitted to the outside. The second resin molded body 50 is disposed in the recess 40 c of the first resin molded body 40.

  The material of the second resin molded body 50 is a thermosetting resin. Among thermosetting resins, it is preferably formed of at least one selected from the group consisting of epoxy resins, modified epoxy resins, silicone resins, modified silicone resins, acrylate resins, and urethane resins, particularly epoxy resins and modified epoxy resins. Silicone resins and modified silicone resins are preferred. The second resin molded body 50 is preferably a hard one to protect the light emitting element 100. The second resin molded body 50 is preferably made of a resin having excellent heat resistance, weather resistance, and light resistance. The second resin molded body 50 is mixed with at least one selected from the group consisting of a filler, a diffusing agent, a pigment, a fluorescent material, a reflective material, an ultraviolet absorber, and an antioxidant in order to have a predetermined function. You can also The second resin molding 50 may contain a diffusing agent. As a specific diffusing agent, barium titanate, titanium oxide, aluminum oxide, silicon oxide, or the like can be suitably used. Moreover, an organic or inorganic coloring dye or coloring pigment can be contained for the purpose of cutting an undesired wavelength. Further, the second resin molded body 50 can also contain a fluorescent material 80 that absorbs light from the light emitting element 100 and converts the wavelength.

(Fluorescent substance)
The fluorescent material 80 may be any material that absorbs light from the light emitting element 100 and converts the wavelength of the light into light having a different wavelength. For example, nitride phosphors / oxynitride phosphors / sialon phosphors mainly activated by lanthanoid elements such as Eu and Ce, lanthanoid elements such as Eu, and transition metal elements such as Mn. Activated alkaline earth halogen apatite phosphor, alkaline earth metal borate halogen phosphor, alkaline earth metal aluminate phosphor, alkaline earth silicate phosphor, alkaline earth sulfide phosphor, Alkaline earth thiogallate phosphor, alkaline earth silicon nitride phosphor, germanate phosphor, rare earth aluminate phosphor, rare earth silicate phosphor mainly activated with lanthanoid elements such as Ce It is preferably at least one selected from organic and organic complexes mainly activated by a lanthanoid element such as Eu. As specific examples, the following phosphors can be used, but are not limited thereto.

Nitride-based phosphors mainly activated with lanthanoid elements such as Eu and Ce are M ₂ Si ₅ N ₈ : Eu, CaAlSiN ₃ : Eu (M is selected from Sr, Ca, Ba, Mg, Zn) At least one or more). In addition to M ₂ Si ₅ N ₈ : Eu, MSi ₇ N ₁₀ : Eu, M _1.8 Si ₅ O _0.2 N ₈ : Eu, M _0.9 Si ₇ O _0.1 N ₁₀ : Eu (M Is at least one selected from Sr, Ca, Ba, Mg, and Zn.

An oxynitride phosphor mainly activated by a lanthanoid element such as Eu or Ce is MSi ₂ O ₂ N ₂ : Eu (M is at least one selected from Sr, Ca, Ba, Mg, Zn) Etc.).

Eu, sialon phosphors activated mainly with lanthanoid elements such as Ce _{is, M p / 2 Si 12-} p-q Al p + q O q N 16-p: Ce, M-Al-Si-O-N (M is at least one selected from Sr, Ca, Ba, Mg, and Zn. Q is 0 to 2.5, and p is 1.5 to 3).

Alkaline earth halogen apatite phosphors mainly activated by lanthanoid compounds such as Eu and transition metal elements such as Mn include M ₅ (PO ₄ ) ₃ X: R (M is Sr, Ca, Ba). X is at least one selected from F, Cl, Br and I. R is any one of Eu, Mn, Eu and Mn. Etc.).

The alkaline earth metal borate phosphor has M ₂ B ₅ O ₉ X: R (M is at least one selected from Sr, Ca, Ba, Mg, Zn. X is F, Cl , Br, or I. R is Eu, Mn, or any one of Eu and Mn.).

Alkaline earth metal aluminate phosphors include SrAl ₂ O ₄ : R, Sr ₄ Al ₁₄ O ₂₅ : R, CaAl ₂ O ₄ : R, BaMg ₂ Al ₁₆ O ₂₇ : R, BaMg ₂ Al ₁₆ O ₁₂ : R, BaMgAl ₁₀ O ₁₇ : R (R is Eu, Mn, or any one of Eu and Mn).

Examples of the alkaline earth sulfide phosphor include La ₂ O ₂ S: Eu, Y ₂ O ₂ S: Eu, and Gd ₂ O ₂ S: Eu.

Examples of rare earth aluminate phosphors mainly activated with lanthanoid elements such as Ce include Y ₃ Al ₅ O ₁₂ : Ce, (Y _0.8 Gd _0.2 ) ₃ Al ₅ O ₁₂ : Ce, Y _{3 (Al 0.8 Ga 0.2) 5 O} 12: Ce, and the like (Y, Gd) 3 (Al , Ga) YAG -based phosphor represented by the composition formula of _{5 O 12.} Further, there are Tb ₃ Al ₅ O ₁₂ : Ce, Lu ₃ Al ₅ O ₁₂ : Ce, etc. in which a part or all of Y is substituted with Tb, Lu or the like.

Other phosphors include ZnS: Eu, Zn ₂ GeO ₄ : Mn, MGa ₂ S ₄ : Eu (M is at least one selected from Sr, Ca, Ba, Mg, Zn. X is At least one selected from F, Cl, Br, and I).

  The phosphor described above contains at least one selected from Tb, Cu, Ag, Au, Cr, Nd, Dy, Co, Ni, and Ti instead of Eu or in addition to Eu as desired. You can also.

  Moreover, it is fluorescent substance other than the said fluorescent substance, Comprising: The fluorescent substance which has the same performance and effect can also be used.

  These phosphors can use phosphors having emission spectra in yellow, red, green, and blue by the excitation light of the light emitting element 10, and emit light in yellow, blue-green, orange, etc., which are intermediate colors thereof. A phosphor having a spectrum can also be used. By using these phosphors in various combinations, it is possible to manufacture surface-mounted light-emitting devices having various emission colors.

For example, using a GaN-based compound semiconductor that emits blue light, a Y ₃ Al ₅ O ₁₂ : Ce or (Y _0.8 Gd _0.2 ) ₃ Al ₅ O ₁₂ : Ce fluorescent material is irradiated to convert the wavelength. Do. A surface-mount light-emitting device that emits white light with a mixed color of light from the light-emitting element 100 and light from the phosphor 80 can be provided.

For example, CaSi ₂ O ₂ N ₂ : Eu or SrSi ₂ O ₂ N ₂ : Eu that emits light from green to yellow, and (Sr, Ca) ₅ (PO ₄ ) ₃ Cl: Eu that emits blue light as a phosphor. By using a phosphor 80 composed of Ca ₂ Si ₅ N ₈ : Eu or CaAlSiN ₃ : Eu that emits red light, a surface-mounted light-emitting device that emits white light with good color rendering can be provided. . This uses the three primary colors of red, blue, and green, so the desired white light can be achieved simply by changing the blend ratio of the first phosphor and the second phosphor. Can do.

(Other)
In the surface-mounted light-emitting device, a Zener diode can be further provided as a protective element. The Zener diode can be placed on the base 10 as well as the light emitting element 100, and can be placed on the first lead 20 on the bottom surface 40a of the recess 40c apart from the light emitting element 100. Further, the Zener diode may be mounted on the first lead 20 on the bottom surface 40a of the recess 40c, and the light emitting element 100 may be mounted thereon. Further, the protective element can be placed on the front or back surface of the first lead or the second lead and covered with a translucent sealing member, or can be covered with the first resin molding 40. . In addition to the 280 μm size, a □ 300 μm size can also be used.

The wire 60 is for electrically connecting the second electrode 102 and the second lead 30 of the light emitting element 100 and the first electrode 101 and the first lead 20 of the light emitting element 100. The wire 60 is required to have good ohmic properties, mechanical connectivity, electrical conductivity, and thermal conductivity with the electrode of the light emitting element 100. ^{0.01cal / (S) (cm 2} ) (℃ / cm) or more is preferred as the thermal conductivity is more preferably ^{0.5cal / (S) (cm 2} ) (℃ / cm) or more. A wire is stretched from just above the light emitting element 100 to the wire bonding area of the plated wiring pattern to establish electrical continuity.

  By adopting the above configuration, the surface-mounted light-emitting device according to the present invention can be provided.

<Mounting state of surface mount type light emitting device>
A mounting state in which the surface mounted light emitting device is electrically connected to an external electrode is shown. FIG. 3 is a schematic cross-sectional view showing a mounted state of the surface-mounted light emitting device according to the first embodiment.

  A heat dissipating member 210 can be provided on the back surface side of the surface mount light emitting device via a heat dissipating adhesive 200. The heat radiation adhesive 200 preferably has a higher thermal conductivity than the material of the first resin molding 40. As the material of the heat radiation adhesive 200, an electrically insulating epoxy resin, silicone resin, or the like can be used. The material of the heat dissipating member 210 is preferably aluminum, copper, tungsten, gold or the like having good thermal conductivity. In addition, the heat radiating member 210 can be provided through the heat radiating adhesive 200 so as to contact only the base 10. Thereby, the eutectic metal containing solder with better thermal conductivity can be used as the heat radiation adhesive 200. Since the back surface side of the surface-mounted light-emitting device is flat, stability during mounting on the heat dissipation member 210 can be maintained. In particular, since the base 10 and the heat radiating member 210 are provided so as to take the shortest distance from the light emitting element 100, the heat dissipation is high.

  The first outer lead portion 20b of the first lead 20 and the second outer lead portion 30b of the second lead 30 are electrically connected to the external electrode. Since the first lead 20 and the second lead 30 are thick flat plates, they are electrically connected so as to be sandwiched between the external electrode and the heat dissipation member 210. Lead-free solder is used for electrical connection between the first outer lead portion 20b and the second outer lead portion 30b and the external electrode. In addition, electrical connection can be made so that the first outer lead portion 20b and the like are placed on the external electrode.

<Second Embodiment>
A surface-mount light-emitting device according to a second embodiment will be described. The description of the parts having the same configuration as that of the surface-mounted light emitting device according to the first embodiment will be omitted. FIG. 4 is a schematic plan view showing a surface-mounted light emitting device according to the second embodiment.

  In this surface-mount light-emitting device, the first lead 21 and the second lead 31 are provided with irregularities to increase the contact area with the first resin molded body 41. Thereby, it is possible to prevent the first lead 21 and the second lead 31 from being detached from the first resin molded body 41. The base 11 can be similarly provided with irregularities.

<Third Embodiment>
A surface-mount light-emitting device according to a third embodiment will be described. The description of the parts having the same configuration as that of the surface-mounted light emitting device according to the first embodiment will be omitted. FIG. 5 is a schematic cross-sectional view showing a surface-mounted light emitting device according to the third embodiment.

  In this surface mount type light emitting device, thin plates are used for the base 12, the first lead 22, and the second lead 32. Thereby, a smaller and thinner surface-mounted light-emitting device can be provided. The thin flat plate shape may be a rectangular shape as shown in the first embodiment, or may be a shape provided with unevenness as shown in the second embodiment.

<Fourth embodiment>
A surface-mount light-emitting device according to a fourth embodiment will be described. The description of the portion having the same configuration as that of the surface-mounted light emitting device according to the third embodiment is omitted. FIG. 6 is a schematic cross-sectional view showing a surface-mounted light-emitting device according to the fourth embodiment.

  In the surface mount light emitting device, the first lead 23 and the second lead 33 are bent toward the main surface. Since the first lead 23 and the second lead 33 are thin, this can be easily bent. Thereby, at the time of mounting, solder crawls up to the bent first outer lead portion 23b and second outer lead portion 33b and can be firmly fixed. In the transfer molding process in which the first resin is poured, the first inner lead portion 23a and the second inner lead portion 33b are sandwiched between the upper mold and the lower mold, so that the first inner lead section 23a and the second inner lead section 33b Even if the inner lead part 33b of 2 is thin, a burr | flash does not arise.

<Fifth embodiment>
A surface-mount light-emitting device according to a fifth embodiment will be described. The description of the portion having the same configuration as that of the surface-mounted light emitting device according to the third embodiment is omitted. FIG. 7 is a schematic cross-sectional view showing a surface-mounted light emitting device according to a fifth embodiment. FIG. 8 is a schematic cross-sectional view showing a mounted state of the surface mount light emitting device according to the fifth embodiment.

  In this surface-mounted light-emitting device, the first outer lead portion 24b and the second outer lead portion 34b are bent toward the main surface side and further bent outward. Thereby, since the surface-mounted light emitting device is sandwiched between the heat radiating member 210 and the external electrode, it is easy to mount and the mounting stability can be improved. Further, the connection position between the first lead 24 and the second lead 34 and the external electrode can be made higher than the fixing position between the first lead 24 and the second lead 34 and the heat radiation member 210. As a result, the entire surface-mounted light-emitting device excluding the light-emitting surface can be hidden from the mounting substrate, so that the mounting substrate itself can be efficiently used as a reflector. In addition, the surface of the external electrode and the top surface of the surface mount light emitting device can be substantially coplanar.

<Sixth Embodiment>
A surface-mount light-emitting device according to a sixth embodiment will be described. The description of the parts having the same configuration as that of the surface-mounted light emitting device according to the first embodiment will be omitted. FIG. 9 is a schematic cross-sectional view showing a surface-mounted light emitting device according to the sixth embodiment. FIG. 10 is a schematic plan view showing a surface-mounted light emitting device according to the sixth embodiment.

  This surface-mount light-emitting device is formed so that the first lead 25 and the second lead 35 do not protrude from the first resin molded body 45 when viewed from above. Thereby, a smaller surface-mounted light-emitting device can be provided. The base 15, the first lead 25, and the second lead 35 are thick plate-like ones, but thin plate-like ones can also be used. Further, the base 15, the first lead 25, and the second lead 35 can have a rectangular shape as shown in the first embodiment, and have irregularities as shown in the second embodiment. The provided shape can also be used.

<Seventh embodiment>
A surface-mount light-emitting device according to a seventh embodiment will be described. The description of the parts having the same configuration as that of the surface-mounted light emitting device according to the first embodiment will be omitted. FIG. 11 is a schematic cross-sectional view showing a surface-mounted light-emitting device according to a seventh embodiment. FIG. 12 is a schematic plan view showing a surface-mounted light emitting device according to the seventh embodiment.

  This surface-mounted light-emitting device has a shape in which the base 16 protrudes from the first lead 26 and the second lead 36 when viewed from the side of the cross section. Thereby, the heat dissipation effect can be further enhanced. It can also be easily incorporated into other devices. The side surface of the first inner lead portion 26 a and the side surface of the second inner lead portion 36 a can also have a shape corresponding to the shape of the side surface of the base 16. The first outer lead portion 26 b and the second outer lead portion 36 b protrude outward from the first resin molded body 46.

<Eighth Embodiment>
A surface-mounted light-emitting device according to an eighth embodiment will be described. The description of the parts having the same configuration as that of the surface-mounted light emitting device according to the first embodiment will be omitted. FIG. 13 is a schematic cross-sectional view showing a surface-mounted light-emitting device according to the eighth embodiment. FIG. 14 is a schematic plan view showing a surface-mounted light-emitting device according to the eighth embodiment. FIG. 15 is a schematic bottom view showing the surface-mounted light emitting device according to the eighth embodiment. FIG. 16 is a schematic cross-sectional view showing the middle of the manufacturing process of the surface-mounted light-emitting device according to the eighth embodiment.

  This surface-mounted light-emitting device has a shape in which the base 17 protrudes from the first lead 27 and the second lead 37 when viewed from the side of the cross section. Thereby, the heat dissipation effect can be further enhanced. It can also be easily incorporated into other devices. The first outer lead portion 27b and the second outer lead portion 37b protrude outward from the first resin molded body 47, and are bent toward the bottom surface side of the surface mount light emitting device. This is because the electrical connection portion can be widened by bending. The first lead 27 and the second lead 37 can be provided with cuts to facilitate bending. The first outer lead portion 27b and the second outer lead portion 37b can be bent to have substantially the same height as the bottom surface of the base 17. As well as improving heat dissipation, mounting stability can also be improved.

  The light emitting elements 105 and 106 are placed on the base 17. The light emitting elements 105 and 106 may show the same emission color or may show different emission colors. In addition, the protective element 107 is placed on the first lead 27. Thereby, the light emitting elements 105 and 106 can be protected from overcurrent. Alternatively, a light-emitting element 105 that emits blue light, which is the three primary colors of light, a light-emitting element 106 that emits green light, and a light-emitting element 107 that emits red light can also be used. Thus, all colors can be emitted, and the characteristics of the light-emitting element 107 can be prevented from being deteriorated by heat generated from the light-emitting elements 105 and 106. The first resin molded body 47 may be substantially square when viewed from above. Further, the concave portion of the first resin molded body 47 can be substantially circular as viewed from above. The base 17 is exposed on the bottom surface side of the surface mount light emitting device.

<Method for Manufacturing Surface Mount Type Light Emitting Device>
A method for manufacturing a surface-mounted light-emitting device according to the present invention will be described. This manufacturing method is about the surface-mounted light-emitting device described above. FIGS. 17A to 17E are schematic cross-sectional views illustrating manufacturing steps of the surface mount light emitting device according to the first embodiment.

  The base 10 corresponding to the bottom surface 40a of the concave portion 40c of the first resin molded body 40, the first inner lead portion 20a and the second inner lead portion 30a, and the first outer lead portion 20b and the second outer lead portion. 30b is sandwiched between the upper mold 320 and the lower mold 321 (first step).

  The upper mold 320 has a recess corresponding to the recess of the first resin molded body. The portion of the upper mold 320 corresponding to the bottom surface 40a of the recess 40c of the first resin molded body 40 is formed so as to contact the base 10, the first inner lead portion 20a, and the second inner lead portion 30a. Has been.

  The first thermosetting resin is poured into the recessed portion sandwiched between the upper mold 320 and the lower mold 321 by the transfer molding process (second process).

  In the transfer molding process, a pellet-shaped first thermosetting resin having a predetermined size is placed in a predetermined container. Pressure is applied to the predetermined container. The molten first thermosetting resin is poured into a recessed portion sandwiched between the upper mold 320 and the lower mold 321 connected from the predetermined container. The upper mold 320 and the lower mold 321 are warmed to a predetermined temperature, and the poured first thermosetting resin is cured. This series of processes is called a transfer molding process.

  Since the first inner lead portion 20a and the second inner lead portion 30a are sandwiched, the first inner lead portion 20a and the second inner lead portion 30a do not flutter when the first thermosetting resin is poured. , The generation of burrs can be suppressed.

  The poured first thermosetting resin is heated and cured to form the first resin molded body 40 (third step).

  Thereby, the 1st resin molding 40 using a thermosetting resin is shape | molded. Thereby, a package excellent in heat resistance, light resistance, adhesion, and the like can be provided. Moreover, the 1st resin molding 40 using the thermosetting resin which has the recessed part 40c which has the bottom face 40a and the side surface 40b can be provided.

  The upper mold 320 and the lower mold 321 are removed (fourth process).

  In order to mount the light emitting element 100, the upper mold 320 and the lower mold 321 are removed. When the curing is insufficient, the post-curing is performed to improve the mechanical strength of the resin molded body 40 to such an extent that no problem is caused in work.

  The light emitting element 100 is placed on the base 10. The first electrode 101 included in the light emitting element 100 and the first inner lead portion 20a are electrically connected. The second electrode 102 of the light emitting element 100 and the second inner lead portion 20b are electrically connected (fifth step).

  The first electrode 101 and the first inner lead portion 20 a are electrically connected via the wire 60. However, when the light emitting element 100 has electrodes on the upper surface and the lower surface, the base 10 and the first inner lead portion 20a are electrically connected. Further, the second electrode 102 and the second inner lead portion 30 a are electrically connected through the wire 60.

  A second thermosetting resin is placed in the recess 40c where the light emitting element 100 is placed (sixth step).

  As a method for arranging the second thermosetting resin, a dropping unit, an injection unit, an extrusion unit, a transfer mold, or the like can be used, but it is preferable to use a dropping unit. This is because the air remaining in the recess 40c can be effectively expelled by using the dropping means. The second thermosetting resin is preferably mixed with the fluorescent material 80 in advance. This makes it easy to adjust the color tone of the surface-mounted light emitting device.

  The second thermosetting resin is heated and cured to form the second resin molded body 50 (seventh step).

  As a result, the surface mount light emitting device can be easily manufactured. Moreover, the 1st resin molding 40 and the 2nd resin molding 50 can be shape | molded with a thermosetting resin, and a surface mount type light-emitting device with high adhesiveness can be provided. In addition, it is difficult to cause peeling at the interface between the first resin molded body 40 and the second resin molded body 50, and it is possible to provide a surface-mounted light emitting device having excellent heat resistance, light resistance, adhesion, and the like. it can.

<Ninth embodiment>
A surface-mount light-emitting device according to a ninth embodiment will be described. The description of the parts having the same configuration as that of the surface-mounted light emitting device according to the first embodiment will be omitted. FIG. 18 is a schematic cross-sectional view showing a surface-mounted light-emitting device according to the ninth embodiment. FIG. 19 is a schematic plan view showing a surface-mounted light-emitting device according to the ninth embodiment. FIG. 20 is a schematic perspective view showing a surface-mounted light emitting device according to the ninth embodiment. 21A to 21D are schematic cross-sectional views illustrating manufacturing steps of the surface-mounted light emitting device according to the ninth embodiment. FIG. 21A is a schematic plan view showing a lead frame. FIG. 21B is a schematic cross-sectional view showing a state in which the lead frame is sandwiched between molds. FIG. 21C is a schematic cross-sectional view showing the first resin molded body 48 in which the light emitting element 108 is placed on the base 18. FIG. 21D is a schematic cross-sectional view showing a state in which the first resin molded body 48 is sandwiched between molds.

  The surface-mount light-emitting device according to the ninth embodiment includes a light-emitting element 108, a first resin molded body 48 on which the light-emitting element 108 is placed, and a second resin molded body 58 that covers the light-emitting element 108. Have The first resin molded body 48 is integrally formed with the base 18 for mounting the light emitting element 108, the first lead 28, and the second lead 38 electrically connected to the light emitting element 108. doing. This surface-mounted light-emitting device can be used as a side-emitting type.

  The light emitting element 108 is placed on the base 18 via a die bond member. The base 18 is preferably a member having better thermal conductivity than the first resin molded body 48 in order to enhance heat dissipation.

  The first lead 28 has a first inner lead portion 28a and a first outer lead portion 28b. The first inner lead portion 28 a is electrically connected to the first electrode of the light emitting element 108 through the wire 68. The first outer lead portion 28 b is exposed from the first resin molded body 48.

  The second lead 38 has a second inner lead portion 38a and a second outer lead portion 38b. The second inner lead portion 38 a is electrically connected to the second electrode of the light emitting element 108 through the wire 68. The second outer lead portion 38 b is exposed from the first resin molded body 48.

  This surface-mounted light-emitting device is a side-emitting type. Therefore, at the time of mounting, the first lead 28 and the second lead 38 are preferably in contact with each other in order to be electrically connected to a portion to be a mounting surface.

  The first resin molded body 48 has a recess 48c having a bottom surface 48a and a side surface 48b. The concave portion 48 has side surfaces 48b only on two opposite sides. The base 18 is exposed from the bottom surface 48 a of the recess 48 c of the first resin molded body 48. The first inner lead portion 28 a of the first lead 28 is exposed from the bottom surface 48 a of the concave portion 48 c of the first resin molded body 48. The first resin molded body 48 is molded by a transfer mold. The first resin molded body 48 uses a thermosetting resin. The opening of the recess 48c is preferably wider than the bottom surface 48a, and the side surface 48b is preferably provided with an inclination. The first resin molded body 48 also has protrusions on the back side. Thereby, it has installation stability at the time of mounting in a side light emission type.

  The 2nd resin molding 58 is arrange | positioned in the recessed part 48c so that the light emitting element 108 may be coat | covered. The second resin molded body 58 uses a thermosetting resin. The second resin molded body 58 contains a fluorescent material 88. The fluorescent substance 88 is uniformly dispersed in the second resin molded body 58. However, the fluorescent substance 88 may have a specific gravity larger than that of the second resin molded body 58 and may be allowed to settle to the bottom surface 48a side of the recess 48c. The second resin molded body 58 forms a lens shape.

  The first resin molded body 48 and the second resin molded body 58 are made of thermosetting resin, and have very good adhesion because physical properties such as an expansion coefficient are approximated. In addition, with the above structure, it is possible to provide a surface-mounted light-emitting device that is excellent in heat resistance, light resistance, and the like. Furthermore, a thin side-emitting surface-mounted light-emitting device can be provided.

  Since the manufacturing method of this surface-mounted light emitting device is similar to the manufacturing method of the first embodiment, a part of it is omitted.

  A lead frame having a predetermined shape capable of mounting a plurality of light emitting elements 108 is prepared. The base 18, the first lead 28, and the second lead 38 are used. These leads are sandwiched between the upper mold 322 and the lower mold 323.

  Next, the first thermosetting resin is poured by a transfer mold to form the first resin molded body 48. After molding the first resin molded body 48, the light emitting element 108 is placed on the base 18 and electrically connected to the first lead 28 and the second lead 38.

  Next, the first resin molded body 48 is sandwiched between the upper mold 324 and the lower mold 325. A second thermosetting resin is poured into the sandwiched mold by a transfer mold. After the second thermosetting resin is heated and cured to form the second resin molded body 58, the upper mold 324 and the lower mold 325 are removed.

  Finally, a plurality of light emitting elements 108 are cut out individually to obtain a plurality of surface mount light emitting devices.

  Accordingly, a side-emitting surface-mounted light-emitting device having a lens shape can be easily manufactured.

<Tenth Embodiment>
A surface-mount light-emitting device according to a tenth embodiment will be described. The description of the portion having the same configuration as that of the surface-mounted light emitting device according to the third embodiment is omitted. FIG. 22 is a schematic cross-sectional view showing a surface-mounted light-emitting device according to the tenth embodiment.

  In this surface mount type light emitting device, a heat radiating member 99 is incorporated in a first resin molded body 49. The heat dissipating member 99 is disposed on the back surface of the base 19. As a result, it is possible to provide a surface-mounted light-emitting device that integrally includes the heat dissipation member 99. Further, it is not necessary to provide the heat dissipating member 99 as a separate member, and it is not necessary to consider the adhesion between the surface mount light emitting device and the heat dissipating member 99. Moreover, the heat radiating member 99 can be made substantially flush with the back surface side of the first resin molded body 49, and the stability of the surface mount light emitting device can be improved. The first outer lead portion 29b and the second outer lead portion 39b are bent into a predetermined shape. The heat dissipating member 99 may be an electrically insulating member having a thermal conductivity higher than that of the first resin molded body 49.

  In the surface mount light emitting device, the first inner lead portion 29a and the second inner lead portion 39a are sandwiched between the upper mold and the lower mold, and a predetermined recess is formed between the first inner lead portion 29a and the first inner lead portion 29a. 2 on the main surface side and the back surface side of the inner lead portion 39a. Thereby, the removal of the first inner lead portion 29a and the second inner lead portion 39a can be prevented more effectively. In addition, a surface-mounted light emitting device having a predetermined thickness can be provided.

  A surface-mounted light-emitting device according to Example 1 is shown in FIGS. A description of the same configuration as that of the surface-mounted light-emitting device according to the first embodiment will be omitted.

  The surface-mount light-emitting device according to Example 1 includes a light-emitting element 100, a first resin molded body 40 on which the light-emitting element 100 is placed, and a second resin molded body 50 that covers the light-emitting element 100. The first resin molded body 40 is integrally formed with the base 10 on which the light emitting element 100 is placed and the first lead 20 and the second lead 30 that are electrically connected to the light emitting element 100. ing. The 1st resin molding 40 has the recessed part 40c which has the bottom face 40a and the side surface 40b, the opening part of the recessed part 40c has a wider opening than the bottom face 40a, and the side surface 40b is inclined. .

The light emitting device 100 is a GaN-based one that emits blue light. The light-emitting element 100 includes a first electrode 101 and a second electrode 102 on the same surface side. The light emitting element 100 is bonded to the base 10 face-up using a die bond resin (epoxy resin containing silver). The first electrode 101 is electrically connected to the first lead 20 using a gold wire 60. The second electrode 102 is also electrically connected to the second lead 30 using the gold wire 60. The base 10, the first lead 20, and the second lead 30 use copper as a base material, and silver plating is applied to a portion exposed from the first resin molded body 40. The base 10, the first lead 20 and the second lead 30 are slightly thick plates (about 0.5 mm), and the back surfaces of the base 10, the first lead 20 and the second lead 30 are exposed. doing. The first resin molding 40 is composed of 100 parts by weight of an epoxy resin made of triglycidyl isocyanurate and an acid anhydride made of hexahydrophthalic anhydride, 0.5 part by weight of DBU, and 1 part by weight of ethylene glycol. , 10 parts by weight of titanium oxide pigment and 50 parts by weight of glass fiber are used. The second resin molded body 50 uses a silicone resin. A YAG phosphor 80 having a composition of (Y _0.8 Gd _0.2 ) ₃ Al ₅ O ₁₂ : Ce is uniformly mixed in the second resin molded body 50. The 2nd resin molding 50 is arrange | positioned at the recessed part 40c which has the bottom face 40a and the side surface 40b, and the surface of the 2nd resin molded object 50 corresponds with the upper surface of the recessed part 40c. Thereby, the amount of the YAG phosphor 80 for each product is made uniform. An insulating member 90 made of an epoxy resin sheet having a predetermined thickness is attached to the back surfaces of the first lead 20 and the second lead 30.

  The surface-mount light-emitting device according to Example 1 is manufactured through the following steps. FIG. 17 is a schematic cross-sectional view illustrating the manufacturing process of the surface-mounted light emitting device according to the first embodiment.

  A predetermined lead frame is punched to provide a plurality of bases 10, first leads 20, and second leads 30. The lead frame is fixed to the lower mold 321 heated to about 150 ° C. Similarly, the lead frame is sandwiched between upper molds 320 heated to about 150 ° C. The sandwiching is a portion corresponding to the base 10, the inner lead portions 20 a and 30 a and the outer lead portions 20 b and 30 b of the first lead 20 and the second lead 30. A tablet obtained by compressing the epoxy resin composition corresponding to the first resin molded body 40 is placed in the mold cylinder portion. The tablet is poured into the mold by a piston (transfer mold). The poured epoxy resin is pre-cured by heating at about 150 ° C. for about 3 minutes in a mold. Next, the upper mold 320 and the lower mold 321 are divided, and the semi-cured product of the epoxy resin composition is taken out from the mold. After taking out, the film is further cured by heating at about 150 ° C. for about 3 hours. As a result, a lead frame obtained by molding the first resin molded body 40 with a completely cured product of the above-described epoxy resin composition molded integrally with the lead frame is obtained. The first resin molding 40 has a recess 40c having a bottom surface 40a and a side surface 40b, and the lead frame is exposed on the bottom surface 40a. Plating is performed on portions corresponding to the outer lead portions 20b and 30b of the lead frame.

  Next, the light emitting element 100 is die-bonded to the bottom surface 40a of the recess 40c. The first electrode 101 and the first inner lead portion 20 a of the first lead 20, and the second electrode 102 and the second inner lead portion 30 a of the second lead 30 of the light emitting element 100 are respectively gold wires 60. Electrically connect using

  Next, a silicone resin corresponding to the second resin molded body 50, in which the YAG phosphor 80 is uniformly mixed, is dropped onto the upper surface of the recess 40c. The YAG phosphor 80 is precipitated due to the viscosity of the silicone resin. When the YAG phosphor 80 settles, the YAG phosphor 80 can be disposed around the light emitting element 100, and a surface-mounted light emitting device having a predetermined color tone can be provided. The silicone resin is dropped and then cured to form the second resin molded body 50.

  Finally, the lead frame is cut out at a predetermined position to form the first outer lead portion 20b and the second outer lead portion 30b. As a result, the surface-mounted light-emitting device according to Example 1 can be manufactured.

  The surface-mounted light-emitting device of the present invention can be used for lighting fixtures, displays, mobile phone backlights, camera flashlights, moving image illumination auxiliary light sources, and the like.

It is a schematic sectional drawing which shows the surface mount type light-emitting device which concerns on 1st Embodiment. 1 is a schematic plan view showing a surface mount light emitting device according to a first embodiment. It is a schematic sectional drawing which shows the mounting state of the surface mounted light-emitting device which concerns on 1st Embodiment. It is a schematic plan view which shows the surface mounted light-emitting device which concerns on 2nd Embodiment. It is a schematic sectional drawing which shows the surface mount type light-emitting device which concerns on 3rd Embodiment. It is a schematic sectional drawing which shows the surface mount type light-emitting device which concerns on 4th Embodiment. It is a schematic sectional drawing which shows the surface mount type light-emitting device which concerns on 5th Embodiment. It is a schematic sectional drawing which shows the mounting state of the surface mounted light-emitting device which concerns on 5th Embodiment. It is a schematic sectional drawing which shows the surface mount-type light-emitting device concerning 6th Embodiment. It is a schematic plan view which shows the surface mounted light-emitting device which concerns on 6th Embodiment. It is a schematic sectional drawing which shows the surface mount-type light-emitting device concerning 7th Embodiment. It is a schematic plan view which shows the surface mounted light-emitting device which concerns on 7th Embodiment. It is a schematic sectional drawing which shows the surface mount-type light-emitting device concerning 8th Embodiment. It is a schematic plan view which shows the surface mounted light-emitting device which concerns on 8th Embodiment. It is a schematic bottom view which shows the surface mounted light-emitting device which concerns on 8th Embodiment. It is a schematic sectional drawing which shows the middle of the manufacturing process of the surface mounted light-emitting device which concerns on 8th Embodiment. (A)-(e) is a schematic sectional drawing which shows the manufacturing process of the surface mounted light-emitting device which concerns on 1st Embodiment. It is a schematic sectional drawing which shows the surface mount-type light-emitting device concerning 9th Embodiment. 19 is the same as FIG. It is a schematic plan view which shows the surface mount-type light-emitting device based on 9th Embodiment. It is a schematic perspective view which shows the surface mount type light-emitting device which concerns on 9th Embodiment. (A)-(d) is a schematic sectional drawing which shows the manufacturing process of the surface mounted light-emitting device which concerns on 9th Embodiment. (A) is a schematic plan view showing a lead frame. (B) is a schematic sectional drawing which shows the state which pinched | interposed the lead frame with the metal mold | die. (C) is a schematic sectional view showing a first resin molded body 48 in which the light emitting element 108 is placed on the base 18. (D) is a schematic sectional drawing which shows the state which pinched | interposed the 1st resin molding 40 with the metal mold | die. It is a schematic sectional drawing which shows the surface mount type light-emitting device concerning 10th Embodiment. It is a schematic plan view which shows the conventional surface mount type light-emitting device. It is a schematic sectional drawing which shows the conventional surface mount type light-emitting device.

Explanation of symbols

10, 11, 12, 13, 14, 15, 16, 17, 18, 19 Base 20, 21, 22, 23, 24, 25, 26, 27, 28, 29 First lead 20a, 21a, 22a, 23a, 24a, 25a, 26a, 27a, 28a, 29a First inner lead portion 20b, 21b, 22b, 23b, 24b, 25b, 26b, 27b, 28b, 29b First outer lead portion 30, 31, 32, 33, 34, 35, 36, 37, 38, 39 Second lead 30a, 31a, 33a, 34a, 35a, 36a, 37a, 38a, 39a Second inner lead portion 30b, 31b, 33b, 34b, 35b, 36b, 37b, 38b, 39b 2nd outer lead part 40, 41, 45, 46, 47, 48, 49 1st resin molding 40a, 48a Bottom surface 40b, 48b Side surface 40c, 48c Recess 50, 58 Second resin molded body 60 Wire 70 Filler 80, 88 Fluorescent substance 90 Insulating member 99 Heat radiating member 100, 105, 106, 108 Light emitting element 107 Protective element (light emitting element)
DESCRIPTION OF SYMBOLS 101 1st electrode 102 2nd electrode 200 Thermal radiation adhesive 210 Thermal radiation member 320,322,324 Upper metal mold 321,323,325 Lower mold 510 Light emitting element 520 Lead frame for mounting 530 Lead frame for wiring 540 Molding Body 550 Translucent sealing resin

Claims (7)

Manufacture of a resin molded body formed by integrally molding a base, a first lead, and a second lead and having a recess having a bottom surface and a side surface with a light reflectance of 460 nm of 70% or more A method,
Placing a protective element on either the first lead or the second lead;
The upper mold has a recess corresponding to the recess of the resin molded body, the first lead has a first inner lead portion and a first outer lead portion, and the second lead is a second lead. The first inner lead portion, the second inner lead portion , the base , and the first outer portion corresponding to the bottom surface of the concave portion of the resin molded body. A first step of sandwiching the lead portion and the second outer lead portion between the upper die and the lower die,
A silicone resin or a modified silicone resin thermosetting resin to which a white pigment such as a filler or a diffusing agent and a titanium oxide pigment is added is poured into a recessed portion sandwiched between an upper mold and a lower mold by a transfer mold, A second step of disposing the protective element inside the resin molded body;
A third step of heating and curing the poured silicone resin or modified silicone resin thermosetting resin to form a resin molded body;
The manufacturing method of the resin molding which has this. Manufacture of a resin molded body formed by integrally molding a base, a first lead, and a second lead and having a recess having a bottom surface and a side surface with a light reflectance of 460 nm of 70% or more A method,
Placing a protective element on either the first lead or the second lead;
The upper mold has a recess corresponding to the recess of the resin molded body, and the first and second leads and the base corresponding to the bottom surface of the recess of the resin molded body are connected to the upper mold and the lower mold. A first step sandwiched between and,
A silicone resin or a modified silicone resin thermosetting resin to which a white pigment such as a filler or a diffusing agent and a titanium oxide pigment is added is poured into a recessed portion sandwiched between an upper mold and a lower mold by a transfer mold, A second step of disposing the protective element inside the resin molded body;
A third step of heating and curing the poured silicone resin or modified silicone resin thermosetting resin to form a resin molded body;
The manufacturing method of the resin molding which has this. 3. The method for producing a resin molded body according to claim 1, wherein the base has a surface plated with silver, aluminum, copper, or gold. A first resin molded body in which a recess having a bottom surface and a side surface is formed by integrally molding the base, the first lead, and the second lead, and 420 nm or more and 490 nm placed on the base. A surface that includes a light emitting element having a light emission wavelength and a second resin molded body covered with the light emitting element, and the first resin molded body reflects 70% or more of light from the light emitting element. A method of manufacturing a mounting light emitting device,
Placing a protective element on either the first lead or the second lead;
The upper die has a recess corresponding to the recess of the first resin molded body, the first lead has a first inner lead portion and a first outer lead portion, and a second lead The lead has a second inner lead portion and a second outer lead portion, and a first inner lead portion, a second inner lead portion, and a base corresponding to the bottom surface of the concave portion of the first resin molded body. A first step of sandwiching the base and the first outer lead portion and the second outer lead portion between the upper die and the lower die;
Transfer mold with a first thermosetting resin of silicone resin or modified silicone resin in which a filler or a diffusing agent and a white pigment of titanium oxide pigment are added to a recessed portion sandwiched between an upper mold and a lower mold And a second step of disposing the protective element inside the first resin molded body,
A third step of heating and curing the poured first silicone resin or modified silicone resin to mold the first resin molded body; and
A fourth step of removing the upper mold;
The light emitting element is mounted on the base, the first electrode of the light emitting element and the first inner lead portion are electrically connected, and the second electrode and the second inner lead portion of the light emitting element are connected to each other. A fifth step of electrically connecting
A sixth step of disposing a second thermosetting resin of silicone resin or modified silicone resin in the recess where the light emitting element is placed;
A seventh step of heating and curing the second thermosetting resin of the silicone resin or the modified silicone resin, and molding the second resin molded body;
A method of manufacturing a surface-mounted light-emitting device having A first resin molded body in which a recess having a bottom surface and a side surface is formed by integrally molding the base, the first lead, and the second lead, and 420 nm or more and 490 nm placed on the base. A surface that includes a light emitting element having a light emission wavelength and a second resin molded body covered with the light emitting element, and the first resin molded body reflects 70% or more of light from the light emitting element. A method of manufacturing a mounting light emitting device,
Placing a protective element on either the first lead or the second lead;
The upper mold has a recess corresponding to the recess of the first resin molded body, and the first lead, the second lead, and the base corresponding to the bottom surface of the recess of the first resin molded body are A first step of sandwiching between a mold and a lower mold;
Transfer mold with a first thermosetting resin of silicone resin or modified silicone resin in which a filler or a diffusing agent and a white pigment of titanium oxide pigment are added to a recessed portion sandwiched between an upper mold and a lower mold And a second step of disposing the protective element inside the first resin molded body,
A third step of heating and curing the poured first silicone resin or modified silicone resin to mold the first resin molded body; and
A fourth step of removing the upper mold;
The light emitting element is mounted on the base, the first electrode of the light emitting element and the first lead are electrically connected, and the second electrode and the second lead of the light emitting element are electrically connected. A fifth step of connecting;
A sixth step of disposing a second thermosetting resin of silicone resin or modified silicone resin in the recess where the light emitting element is placed;
A seventh step of heating and curing the second thermosetting resin of the silicone resin or the modified silicone resin, and molding the second resin molded body;
A method of manufacturing a surface-mounted light-emitting device having The seventh step is a step of pouring the second thermosetting resin with a transfer mold, curing it by heating, and molding the second resin molded body. Manufacturing method of the surface mount type light emitting device. 6. The surface-mount light-emitting device according to claim 4, wherein the base has a surface plated with silver, aluminum, copper, or gold. Method.

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