JPH07106638A - Manufacture of light emitting diode chip - Google Patents

Abstract

PURPOSE:To increase the yield in manufacture while lowering the taping cost by filling, drying and curing the sealing synthetic resin and dicing individual light emitting diode under a state where a laminate of a material board and a material frame plate is applied to the surface of a film stretched over a ring body. CONSTITUTION:A material frame plate is bonded through an adhesive to the upper surface of a material board to produce a laminate 13 which is then applied to the surface of a film 15 stretched on the inside of a rigid ring body 14 made of a metal plate, for example. Each frame is then filled with a sealing synthetic resin. At the time of filling, the film 15 is sucked and the planarity of the laminate 13 is corrected. It is then placed in a heating furnace in order to dry and cure the sealing synthetic resin. Subsequently, individual light emitting diode chips are diced by means of a high speed rotary dicing cutter under a state where the laminate 13 is applied to the film 15. Thus diced LED chip is picked up by means of a vacuum suction collect prior to taping work.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a light emitting diode, which is a chip type light emitting diode suitable for surface mounting.

[0002]

2. Description of the Related Art A chip type light emitting diode 1 of this type is
As described in Japanese Utility Model Application Laid-Open No. 5-4529, and as shown in FIGS. 1 to 3, a pair of left and right upper surface electrodes 3, 4 are provided on the upper surface of a chip-type insulating substrate 2 made of a heat-resistant material such as glass epoxy resin or ceramic. A pair of left and right lower surface electrodes 5a, 6 on the lower surface.
a is formed respectively, and through-hole electrodes 5b connecting one upper surface electrode 3 and one lower surface electrode 5a, and the other upper surface electrode 4 and the other lower surface electrode 6a are formed on both left and right end surfaces of the insulating substrate 2. While forming a through-hole electrode 6b to be connected, the semiconductor chip 7 die-bonded to the one upper surface electrode 3 and the other upper surface electrode 4 are connected by wire bonding with a metal wire 8, and further, the insulating substrate Two
A frame body 9 made of non-transparent synthetic resin is fixed to the upper surface of the above, and a transparent or semitransparent synthetic resin 10 for sealing is filled in the frame body 9.

In the manufacture of this chip type light emitting diode, conventionally, a material substrate in which a large number of insulating substrates 2 constituting one chip type light emitting diode are integrated is prepared in advance. The upper surface electrodes 3 and 4 and the lower surface electrodes 5a and 6 are respectively provided on the insulating substrate.
a and the through-hole electrodes 5b and 6b are formed respectively, and then die bonding of the semiconductor chip 7 and wire bonding with the metal wire 8 are performed, while one chip type light emitting diode is formed on the upper surface of the material substrate. The material frame plates in which a large number of the frame bodies 9 to be integrated are stuck together with an adhesive to form a laminated plate, and the sealing synthetic resin 10 is provided in each frame body 9 of the material frame plate among the laminated plates. A method is used in which after filling and sealing and drying the synthetic resin 10, the laminated plate is cut into each chip type light emitting diode 1.

[0004]

However, the conventional manufacturing method is as follows. When the material frame plate is attached to the material substrate with an adhesive, this laminated plate is warped and deformed due to the difference in the coefficient of thermal expansion between the material substrate and the material frame plate. By sealing the synthetic resin 10 for sealing into each frame 9 in the material frame plate and cutting each light emitting diode of the laminated plate in a state of being warped and deformed, sealing is performed. When the synthetic resin 10 for filling is filled, the synthetic resin 10 for sealing often overflows from the inside of the frame body 9, and the shape of the light emitting diode after cutting becomes an inclined and distorted shape. Therefore, the product yield rate is low. ． When drying and curing the sealing synthetic resin 10 filled in each frame 9 of the material frame plate of the laminated plate,
Since a plurality of laminated plates cannot be stacked and the plurality of laminated plates must be arranged in a plane, a large space is required for the drying / curing, so that the equipment becomes large. ． When the laminated plate is cut into each chip type light emitting diode 1, each chip type light emitting diode 1 becomes disjointed. Therefore, the chip type light emitting diodes 1 are arranged on the carrier tape at appropriate pitch intervals along the longitudinal direction thereof. Thus, the so-called taping work of accommodating the chip type light emitting diodes one by one in the recessed and formed component storage portion is extremely difficult, and the cost required for taping increases significantly. There was a problem to say.

The present invention has a technical object to provide a manufacturing method which solves these problems.

[0006]

In order to achieve this technical object, the present invention provides a "material substrate in which a large number of insulating substrates constituting one light emitting diode are integrated, and an electrode is provided for each insulating substrate. After being formed, a material frame plate in which a large number of frame bodies constituting one light emitting diode are integrated is laminated to the material substrate to form a laminated plate, and each frame in the material frame plate of the laminated plate is formed. In the manufacturing method, in which the sealing synthetic resin is filled in, then, the sealing synthetic resin is dried and cured, and the laminated plate is cut into each light emitting diode. A laminated plate laminated with a body plate is attached to the surface of a film stretched on the inside of a ring body, and in this state, the synthetic resin for sealing is filled into each of the frame bodies, and this sealing is performed. Drying and curing of synthetic resin for normal use For cutting of each light-emitting diode of the laminates. Adopting a way of saying ".

[0007]

[Operation] In this way, by sticking the laminated plate obtained by laminating the material substrate and the material frame body plate to the surface of the film stretched inside the ring body, the material frame of the laminated plate can be obtained. At the time of filling the synthetic resin for sealing into each frame in the body plate, a flat plate having a large number of vacuum suction holes is brought into contact with the back surface of the film, and the flat film is vacuumed against the flat plate. By adsorbing, it is possible to easily correct the laminated plate stuck to the front surface side of the film into a flat shape, in other words, in the laminated plate, in both the material substrate and the material frame body plate. Even if there is a curved warp deformation due to the difference in thermal expansion, this curved warp deformation can be easily corrected to a flat shape, and in this state, it is sealed in each frame of the material frame plate. Since it can be filled with a synthetic resin for stopping, It is possible to reliably reduce resin overflow.

When the laminated plate is cut into individual light emitting diodes, a flat plate having a large number of vacuum suction holes is brought into contact with the back surface of the film in the same manner as above.
By vacuum-sucking the film to the flat plate, the laminated plate attached to the front surface side of the film can be easily corrected into a flat form, so that the shape of the light emitting diode after cutting is inclined. It is possible to reliably prevent a distorted shape.

Moreover, when the sealing synthetic resin is dried and cured, the ring bodies supporting the film can be stacked in multiple stages by using a magazine rack or the like, so that a large number of sheets can be dried in a narrow space. -It can be cured. Furthermore, by cutting each light emitting diode of the laminated plate in a state where the laminated plate is adhered to the film, the light emitting diodes after cutting do not become disjointed, so that each light emitting diode It is possible to easily align and tape the tape-shaped magazine in a certain direction.

[0010]

As described above, when the chip type light emitting diode is manufactured, the yield rate of the product can be greatly improved, and
The equipment can be downsized, and the cost required for taping each chip type diode can be significantly reduced.

[0011]

Embodiments of the present invention will be described below with reference to the drawings of FIGS. In FIG. 4, reference numeral 11 denotes a material substrate formed by integrating a large number of insulating substrates 2 constituting one chip type light emitting diode 1 shown in FIGS. Further, reference numeral 12 denotes a material frame plate which is formed by integrating a large number of frame bodies 9 constituting the one chip type light emitting diode 1.

On the surface of the material substrate 11, both upper surface electrodes 3 and 4 and both lower surface electrodes 5 are provided at respective positions of the respective insulating substrates 2.
After forming a and 6a and both through-hole electrodes 5b and 6b, respectively, die bonding of the semiconductor chip 7 and wire bonding with the metal wire 8 are performed. The die bonding of the semiconductor chip 7 and the wire bonding with the metal wire 8 may be performed after the material frame plate 12 to be described later is bonded.

Then, the material frame plate 12 is bonded to the upper surface of the material substrate 11 with an adhesive to form a laminated plate 13, as shown in FIGS. Next, as shown in FIGS. 8 and 9, the laminated plate 13 is attached to the surface of the film 15 stretched inside the rigid ring body 14 such as a metal plate, and then in this state, The synthetic resin 10 for sealing is filled in each frame 9 in the material frame plate 12 of the laminated plate 13 by injection from the dispenser nozzle 16.

When the synthetic resin 10 for sealing is filled, a flat plate 18 having a large number of vacuum suction holes 17 is brought into contact with the back surface of the film 15 and the film 15 is attached to the flat plate 18. By vacuum adsorbing, the laminated plate 13 adhered to the front surface side of the film 15 can be corrected into a flat shape. In other words, the laminated plate 1
3, even if there is a curved warp deformation as shown by the chain double-dashed line in FIG. 6 due to the difference in thermal expansion between both the material substrate 11 and the material frame plate 12, this warp deformation is caused by the planar deformation. Each frame 9 in the material frame plate 12 can be corrected to
The sealing synthetic resin 10 can be filled therein.

When the filling of the sealing synthetic resin 10 is completed, the sealing synthetic resin 10 is placed in a heating oven to dry and cure the sealing synthetic resin 10.
As shown in, by using a magazine rack 19 and stacking and accommodating the magazine rack 19 in multiple stages, it is possible to dry and cure a large number of sheets in a narrow space.

Then, the sealing synthetic resin 10 is dried.
When the curing is completed, the laminated plate 13 is replaced with the laminated plate 13
11 is still attached to the film 15 as shown in FIG.
As shown in FIG.
1, each chip type light emitting diode 1 is cut, and each chip type light emitting diode 1 cut here is still attached to the film 15.
It can be prevented from falling apart.

The laminated plate 13 is attached to each chip type light emitting diode 1 by the dicing cutters 20 and 21.
Also in the case of cutting into individual pieces, similar to the case where the sealing synthetic resin 10 is filled, a flat plate 18 having a large number of vacuum suction holes 17 formed therein is brought into contact with the back surface of the film 15, and the flat plate 18 is cut. On the other hand, by vacuum-adsorbing the film 15, the laminated plate 13 attached to the surface side of the film 15 can be straightened.

Next, each chip type light emitting diode 1
As shown in FIG. 12, after being picked up by vacuum suction by the vacuum suction collet 23 by pushing up the needle-shaped body 22 or the like, the carrier tape 25 transferred to the feed roller 24 is fixed in the component storage portion 25a. The tapering work of loading one by one in a state aligned in the direction is performed.

[Brief description of drawings]

FIG. 1 is a perspective view of a chip type light emitting diode.

FIG. 2 is a sectional view taken along line II-II of FIG.

FIG. 3 is a sectional view taken along line III-III in FIG.

FIG. 4 is a perspective view of a material substrate and a material frame plate.

FIG. 5 is a perspective view of a laminated plate in which the material substrate and the material frame plate are attached to each other.

FIG. 6 is a side view of FIG.

FIG. 7 is an enlarged sectional view taken along line VII-VII of FIG.

FIG. 8 is a perspective view showing a state in which the laminated plate is attached to a film.

9 is a sectional view taken along line IX-IX in FIG.

FIG. 10 is a perspective view showing a magazine rack.

FIG. 11 is a perspective view showing a state in which the laminated plate is cut into individual light emitting diodes.

FIG. 12 is a cross-sectional view showing a state in which a light emitting diode in a film is taped to a carrier tape.

[Explanation of symbols]

 1 Chip type light emitting diode 2 Insulating substrate 3,4 Electrode 7 Semiconductor chip 8 Metal wire 9 Frame 10 Synthetic resin for sealing 11 Material substrate 12 Material frame plate 13 Laminated plate 14 Ring body 15 Film 16 Dispenser nozzle 18 Vacuum adsorption Flat plate 19 Magazine rack 20,21 Dicing cutter 23 Vacuum suction collet 25 Carrier tape

Claims (1)

[Claims] 1. A frame for constituting one light emitting diode after forming an electrode for each insulating substrate on a material substrate in which a large number of insulating substrates constituting one light emitting diode are integrated. A material frame body plate in which a large number of bodies are integrated is laminated to form a laminated plate, and a synthetic resin for sealing is filled in each frame body in the material frame body plate of the laminated plate,
Then, after drying and curing the synthetic resin for sealing, the laminated plate, in the manufacturing method so as to be cut for each light emitting diode, a laminated plate obtained by bonding the material substrate and the material frame plate, Affixed to the surface of the film stretched inside the ring body, in this state, filling the sealing synthetic resin into each of the frame body, and drying and curing of the sealing synthetic resin, and the A method of manufacturing a chip type light emitting diode, which comprises cutting each light emitting diode of a laminated plate.